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NCV891334MW50R2G

NCV891334MW50R2G

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    VDFN12

  • 描述:

    IC REG CTRLR BUCK 12DFN

  • 数据手册
  • 价格&库存
NCV891334MW50R2G 数据手册
NCV891234, NCV891334 2 MHz Low-IQ Dual-Mode Step-Down Regulator for Automotive The NCV891x34 is a Dual Mode regulator intended for Automotive, battery−connected applications that must operate with up to a 45 V input supply. Hybrid Low Power Mode allows the NCV891x34 to operate either as a PWM Buck Converter or as a Low Drop−Out Linear Regulator, and the NCV891x34 is suitable for systems with Low Noise and Low Quiescent Current requirements often encountered in automotive driver information systems. A reset (with fixed delay) and a fault pin (flagging low input voltage and high temperature warnings) simplify interfacing with a microcontroller. Two pins are provided to synchronize switching to a clock, or to another NCV891x34. The NCV891x34 also provides several protection features expected in automotive power supply systems such as current limit, short circuit protection, and thermal shutdown. In addition, the high switching frequency produces low output voltage ripple even when using small inductor values and an all−ceramic output filter capacitor – forming a space−efficient switching regulator solution. www.onsemi.com 1 DFN12 MW SUFFIX CASE 506CE MARKING DIAGRAM 891x34 XX ALYWG G Features • • • • • • • • • • • • 40 mA Iq in Light Load Condition 2.0 A Maximum Output Current in PWM Mode in NCV891234 3.0 A Maximum Output Current in PWM Mode in NCV891334 Internal N−channel Power Switch VIN Operating Range 3.7 V to 36 V, Withstands Load Dump to 45 V Logic Level Enable Pin can be Tied to Battery Fixed Output Voltage of 5.0 V or 3.3 V with ±2% Accuracy 2 MHz Free−running Switching Frequency Input and Output Synchronization Pins NCV Prefix for Automotive Requiring Site and Control Changes Wettable Flanks DFN (pin edge plating) These Devices are Pb−Free and are RoHS Compliant Typical Applications • • • • Safety−Vision Systems Audio, Infotainment Instrumentation Telematics 891x34XX = Specific Device Code x = 2, 3 XX = 33, 50 A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Device (Note: Microdot may be in either location) PIN CONNECTIONS VIN 1 SW VIN2 BST DRV VOUT SYNCO EN RSTB SYNCI GND CDRV FLTB DBST VIN VIN NCV891x34 SW L1 VOUT (Top View) CBST CIN VIN2 BST DRV VOUT DFW COUT ORDERING INFORMATION See detailed ordering and shipping information on page 10 of this data sheet. SYNCO SYNCO EN RESET ENABLE RSTB SYNCI SYNCI GND FLTB FAULT Figure 1. Application Schematic © Semiconductor Components Industries, LLC, 2016 June, 2016 − Rev. 0 1 Publication Order Number: NCV891334/D NCV891234, NCV891334 CDRV VIN CIN DBST SW VIN L1 VIN 2 CBST 3.3 V Reg DRV PWM LOGIC Low Oscillator ON DFW BST OFF Enable Sync Out Sync In VOUT + SYNCO SYNCO comp + S + − EN 2A, 3A detector + − TSD EN + Soft−Start SYNCI RESET SYNCI VOLTAGES MONITORS RSTB Switcher Supply ON MODE SELECTION LINEAR REGULATOR ON OVLD + − RESET VOUT + GND Logic FLTB NCV891234, NCV891334 Fault Detection Figure 2. Simplified Block Diagrams www.onsemi.com 2 FAULT COUT NCV891234, NCV891334 Table 1. PIN FUNCTION DESCRIPTION Pin No. Pin Name Description 1 VIN Input voltage from battery. Place an input filter capacitor in close proximity to this pin. 2 VIN2 Input voltage pin – must be connected to VIN (pin 1) 3 DRV Output voltage to provide a regulated voltage to the Power Switch gate driver. 4 SYNCO 5 RSTB Reset function. Open drain output, pulling down to ground when the output voltage is out of regulation. 6 GND Battery return, and output voltage ground reference. 7 FLTB Fault flag indicating various fault conditions for the part 8 SYNCI Synchronization input. Connecting an external clock to this pin synchronizes switching to the rising edge of the SYNCI signal. 9 EN This TTL compatible Enable input allows the direct connection of Battery as the enable signal. Grounding this input stops switching and reduces quiescent current draw to a minimum. 10 VOUT Output voltage feedback and LDO output. Feedback of output voltage used for regulation, as well as LDO output in LDO mode. 11 BST Bootstrap input provides drive voltage higher than VIN to the N−channel Power Switch for minimum switch Rdson and highest efficiency. 12 SW Switching node of the Regulator. Connect the output inductor and cathode of the freewheeling diode to this pin. EPAD Out−of−phase synchronization output. Turn−on of the Power Switch causes the SYNCO signal to fall (and rise half a switching period later). Connect to Pin 6 (electrical ground) and to a low thermal resistance path to the ambient temperature environment. Table 2. ABSOLUTE MAXIMUM RATINGS Rating Symbol Min/Max Voltage VIN Max Voltage VIN to SW Min/Max Voltage SW Min Voltage SW − 20 ns Value Unit −0.3 to 45 V 45 V −0.7 to 40 V −3.0 V −0.3 to 40 V Min/Max Voltage BST −0.3 to 43 V Min/Max Voltage BST to SW −0.3 to 3.6 V Min/Max Voltage SYNCI, RSTB and FLTB −0.3 to 6 V Min/Max Voltage VOUT −0.3 to 18 V Min/Max Voltage DRV, SYNCO −0.3 to 3.6 V 35 °C/W −55 to +150 °C Min/Max Voltage EN Thermal Resistance, DFN12−4x4 Junction–to–Ambient (Note 1) RθJA Storage Temperature Range Operating Junction Temperature Range ESD Withstand Voltage (Note 2) − Human Body Model Moisture Sensitivity Peak Reflow Soldering Temperature (Note 3) TJ −40 to +150 °C VESD 2.0 kV MSL Level 1 260 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Value based on 4 layers of 645 mm2 (or 1 in2) of 1 oz copper thickness on FR4 PCB substrate. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) Latchup Current Maximum Rating: v150 mA per JEDEC standard: JESD78 3. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D www.onsemi.com 3 NCV891234, NCV891334 Table 3. ELECTRICAL CHARACTERISTICS VIN = 4.5 to 28 V, VEN = 5 V, VBST = VSW + 3 V, CDRV = 0.1 mF, for typical values TJ = 25°C, min/max values are valid for TJ = −40°C to 150°C unless noted otherwise, and are guaranteed by test, design or statistical correlation (Notes 4, 5) Typ Max Unit Iq 40 49 mA VIN = 13.2 V, VEN = 0 V, 25°C IqSD 9 12 mA UVLO Start Threshold VIN rising VUVLSTT 4.1 4.5 V UVLO Stop Threshold VIN falling VUVLSTP 3.1 3.7 V VUVLOHY 0.4 1.4 V tSS 0.8 1.4 2.0 ms 4.9 3.234 5.0 3.3 5.1 3.366 2.0 1.0 2.2 1.1 Parameter Test Conditions Symbol VIN = 13.2 V, IOUT = 100 mA, 25°C Min QUIESCENT CURRENT Quiescent Current, enabled Quiescent Current, shutdown UNDERVOLTAGE LOCKOUT – VIN (UVLO) UVLO Hysteresis SOFT−START (SS) Soft−Start Completion Time OUTPUT VOLTAGE 100 mA < IOUT < 2.5 A 5.0 V option 3.3 V option VOUTreg 4.5 < VIN < 18 V 20 V < VIN < 28 V FSW FSW(HV) 1.8 0.9 Frequency Foldback Threshold VIN rising VIN falling VFLDUP VFLDDN 18.4 18 Frequency Foldback Hysteresis VFLDHY 0.2 INtoL 3 Output Voltage during regulation V OSCILLATOR Frequency MHz VIN FREQUENCY FOLDBACK MONITOR V 20 19.8 0.3 0.4 V 40 mA MODE TRANSITION Normal to Low−Iq mode Current Threshold ms Mode Transition Duration Switcher to Linear Linear to Switcher Minimum time in Normal Mode before starting to monitor output current Linear to switcher transition at high Vin at low Vin tSWtoLIN tLINtoSW 300 1 tSWblank 500 2 ms V VLINtoSW(HV) VLINtoSW(LV) 19 3.6 Current Limit Threshold NCV891334 ILIM 3.9 4.4 4.9 A Current Limit Threshold NCV891234 ILIM 2.9 3.25 3.6 A 180 360 mW 10 mA 70 ns VOUT = 3.3 V 28 4.5 PEAK CURRENT LIMIT POWER SWITCH ON Resistance Leakage current VIN to SW VBST = VSW + 3.0 V RDSON VSW = 0, −40°C v TJ v 85°C ILKSW Minimum ON Time Measured at SW pin tONMIN Minimum OFF Time Measured at SW pin At FSW = 2 MHz (normal) At FSW = 500 kHz (max duty ratio) tOFFMIN 45 ns 30 30 50 70 4. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area. 5. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. www.onsemi.com 4 NCV891234, NCV891334 Table 3. ELECTRICAL CHARACTERISTICS VIN = 4.5 to 28 V, VEN = 5 V, VBST = VSW + 3 V, CDRV = 0.1 mF, for typical values TJ = 25°C, min/max values are valid for TJ = −40°C to 150°C unless noted otherwise, and are guaranteed by test, design or statistical correlation (Notes 4, 5) Parameter Test Conditions Symbol Min Typ Max Unit 4.5 < VIN < 18 V 20 V < VIN < 28V Sramp Sramp(HV) 1.45 0.65 2.0 1.0 2.8 1.3 A/ms SLOPE COMPENSATION Ramp Slope (With respect to switch current) LOW POWER LINEAR REGULATOR Line Regulation IOUT = 5 mA, 6 V < VIN < 18 V VREG(line) 5 25 mV Load Regulation VIN = 13.2 V, 0.1 mA < IOUT < 50 mA VREG(load) 5 35 mV VOUT(ripple) = 0.5 Vp−p, F = 100 Hz PSRR 65 ILIN(lim) 50 80 mA VOUT = VOUTreg(typ) + 10% ICL(OUT) 0.5 1.0 1.5 mA VOUT = 0 V, 4.5 V < VIN < 18 V VOUT = 0 V, 20 V < VIN < 28 V FSWAF FSWAFHV FSWHIC 450 225 24 550 275 32 650 325 40 Power Supply Rejection Current Limit Output clamp current dB SHORT CIRCUIT DETECTOR kHz Switching frequency in short−circuit condition Analog Foldback Analog foldback – high VIN Hiccup Mode RESET 1 Leakage current into RSTB pin Output voltage threshold at which the RSTB signal goes low VOUT decreasing 5.0 V option 3.3 V option VRESET Hysteresis on RSTB threshold VOUT increasing 5.0 V option 3.3 V option VREShys From VOUT < VRESET to RSTB pin going low tfilter 10 Restart Delay time From VOUT > VRESET + VREShys to high RSTB tdelay 14 Low RSTB voltage RRSTBpullup = VOUTreg/1 mA, VOUT > 1 V VRSTBlow Noise−filtering delay mA V 4.50 2.97 4.625 3.05 4.75 3.14 25 17 60 40 100 66 mV 16 25 ms 18 ms 0.4 V GATE VOLTAGE SUPPLY (DRV pin) VDRV 3.1 3.3 3.5 V DRV UVLO START Threshold VDRVSTT 2.7 2.9 3.05 V DRV UVLO STOP Threshold VDRVSTP 2.5 2.8 3.0 V DRV UVLO Hysteresis VDRVHYS 50 200 mV VDRV = 0 V IDRVLIM 21 50 mA Overvoltage Stop Threshold VIN increasing VOVSTP 36.5 37.7 39.0 V Overvoltage Start Threshold VIN decreasing VOVSTT 36.0 37.3 38.8 V VOVHY 0.25 0.40 0.50 V Logic low threshold voltage VENlow 0.8 Logic high threshold voltage VENhigh EN pin input current IENbias Output Voltage DRV Current Limit VIN OVERVOLTAGE SHUTDOWN MONITOR Overvoltage Hysteresis ENABLE (EN) 0.2 V 2 V 1 mA 4. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area. 5. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. www.onsemi.com 5 NCV891234, NCV891334 Table 3. ELECTRICAL CHARACTERISTICS VIN = 4.5 to 28 V, VEN = 5 V, VBST = VSW + 3 V, CDRV = 0.1 mF, for typical values TJ = 25°C, min/max values are valid for TJ = −40°C to 150°C unless noted otherwise, and are guaranteed by test, design or statistical correlation (Notes 4, 5) Parameter Test Conditions Symbol Min VSYNCI = 5 V RHsynci 50 Typ Max Unit 200 kW 2 V SYNCHRONIZATION SYNCI pin input resistance to GND High threshold voltage VHsynci Low threshold voltage VLsynci 0.8 V 40 ns Minimum high pulse width VSYNCI > VHsynci(max) tHsynci Minimum low pulse width VSYNCI < VLsynci(min) tLsynci 40 Fsynci 1.8 Synchronization frequency Master reassertion time SYNCO pulse duty ratio SYNCO pulse transition time (rise and fall) Time from last rising SYNCI edge to first unsynchronized turn−on. ns 2.5 650 CSYNCO(load) = 40 pF DSYNCO CSYNCO(load) = 40 pF, 10−90% ttran(SYNCO) 40 MHz ns 60 4 % ns FLTB Leakage current into FLTB pin Low FLTB voltage RFLTBpullup = VOUTreg/1 mA, VOUT > 1 V Low Voltage Indicator threshold VIN decreasing VIN increasing VFLTBlow 1 mA 0.4 V V Low Voltage Indicator Threshold Hysteresis VLVIdown VLVIup 6.8 6.95 7.1 7.47 7.4 8.0 VLVIhys 0.15 0.37 0.6 V °C Temperature Warning Threshold Temperature increasing Temperature decreasing Temperature Warning Threshold Hysteresis TWARN to TSD margin TWARNup TWARNdown 140 120 158 175 170 TWARNhys 5 20 °C TWARNmargin 8 20 °C °C THERMAL SHUTDOWN Activation Temperature Reset temperature Hysteresis TSD 155 190 TSDrestart 135 185 THYS 5 20 °C 4. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area. 5. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. www.onsemi.com 6 NCV891234, NCV891334 APPLICATION INFORMATION Hybrid Low−Power Mode A high−frequency switch−mode regulator is not very efficient in light load conditions, making it difficult to achieve low−Iq requirements for sleep−mode operation. To remedy this, the NCV891x34 includes a low−Iq linear regulator that turns on at light load, while the PWM regulator turns off, ensuring a high−efficiency low−power operation. Another advantage of the low−power mode is the tight regulation free of voltage ripple usually associated with low−Iq switchers in light load conditions. In either mode, the NCV891x34 meets the 2% output voltage regulation specification. At initial start−up the NCV891x34 will soft−start into PWM converter mode regardless of output current. During a 300 ms period, the NCV891x34 will assess the level of output current. The NCV891x34 will not make the assessment if RSTB is low. If the output current is above the INtol threshold, the NCV891x34 will stay in PWM mode. Otherwise, the NCV891x34 will transition to low power mode. It will stay in this low−power mode until the output current exceeds the ILIN(lim) limit: it then transitions back to PWM converter mode. This low−power mode to PWM mode transition happens within 2 ms. The transient response is not affected by the mode change. Once the NCV891x34 has transitioned to switcher mode, a 500 ms blanking period will occur. After the blanking period, the NCV891x34 will reassess the output current level. If the output current level is below the INtoL threshold, the NCV891x34 will enter low−Iq mode. If the NCV891x34 is in low−power mode and in normal battery range, it will transition to switcher mode when VIN increases above VLINtoSW(HV), regardless of the output current. Similarly, if the NCV891x34 is in PWM mode and VIN is higher than VFLDUP, it will not transition to low−power mode even if the output current becomes lower than INtoL. At low input voltage, the NCV891x34 stays in low−power mode down to VLINtoSW(LV) if it entered this mode while in normal battery range. However it may not enter low−power mode below 8 V depending on the charge of the bootstrap capacitor (see Bootstrap section for details). 100 Mode Transition Range 90 80 70 PWM Mode 60 NCV891334 Only EFFICIENCY (%) Low Power Mode 50 5.0 V 40 30 3.3 V 20 10 INtoL 0 0.001 ILIN(lim) 0.01 0.1 OUTPUT CURRENT (A) Figure 3. Measured NCV891334 Efficiency at VIN = 12 V with Hybrid Low Power Mode www.onsemi.com 7 1 NCV891234, NCV891334 Input Voltage While the NCV891x34 can withstand input voltages up to 45 V, an overvoltage monitoring circuit automatically terminates switching if the input voltage exceeds VOVSTP (see Figure 4). To avoid skipping switching pulses and entering an uncontrolled mode of operation, the switching frequency is reduced by a factor of 2 when the input voltage exceeds the VIN Frequency Foldback threshold (see Figure 4). Frequency reduction is automatically terminated when the input voltage drops back below the VIN Frequency Foldback threshold. This also helps to limit the power lost in switching and generating the drive voltage for the Power Switch. An Undervoltage Lockout (UVLO) circuit monitors the input, can inhibit switching, and resets the Soft−start circuit if there is insufficient voltage for proper regulation. Depending on the output voltage and load at the output, the NCV891x34 may lose regulation and run in drop−out mode before reaching the UVLO threshold: refer to the Minimum Vin calculation tool for details. When the input voltage drops low enough that the part cannot regulate because it reaches its maximum duty cycle, the switching frequency is divided down by up to 4 (with a minimum frequency of 500 kHz). This helps lower the minimum voltage at which the regulator loses regulation. FSW (MHz) 2 1 Frequency folds back if drop−out mode 3.5 18 20 36 39 45 V IN (V) Figure 4. NCV891x34 Switching Frequency Profile vs. Input Voltage Soft−Start Slope Compensation Once the NCV891x34 is enabled or is released from a fault condition, the DRV voltage will be established and the part will enter soft−start. A soft−start circuit ramps the switching regulator error amplifier reference voltage to the final valuewithin the soft−start completion time, t(ss). During soft−start, the average switching frequency is lower until the output voltage approaches regulation. A fixed slope compensation signal is generated internally and added to the sensed current to avoid increased output voltage ripple due to bifurcation of inductor ripple current at duty cycles above 50%. The fixed amplitude of the slope compensation signal requires the inductor to be greater than a minimum value, depending on output voltage, in order to avoid sub−harmonic oscillations. The recommended inductor values are 2.2 or 3.3 mH, although higher values are possible. Current Limiting Due to the ripple on the inductor current, the average output current of a buck converter is lower than the peak current setpoint of the regulator. Figure 6 shows – for a 2.2 mH inductor – how the variation of inductor peak current with input voltage affects the maximum DC current the NCV891x34 can deliver to a load. Figure 5. NCV891x34 Soft−start www.onsemi.com 8 NCV891234, NCV891334 3.5 3.0 VOUT = 3.3 V NCV891334 VOUT = 5.0 V NCV891334 BUCK OUTPUT CURRENT (A) 2.5 2.0 VOUT = 3.3 V NCV891234 VOUT = 5.0 V NCV891234 1.5 1.0 0.5 0 0 5 10 15 20 INPUT VOLTAGE (V) 25 30 35 Figure 6. Worst Case NCV891x34 Load Current Capability with a 2.2 mH Inductor Short Circuit Protection low for a 16 ms delay time after the output goes back to regulation, simplifying the connection to a micro−controller. The RSTB pin is also pulled low immediately in case of VIN overvoltage, Thermal shutdown, VIN UVLO or DRV UVLO. During severe output overloads or short circuits, the NCV891x34 automatically reduces its switching frequency to FSWAF under normal operating conditions and to FSWAFHV during foldback. This creates duty cycles small enough to limit the peak current in the power components, while maintaining the ability to automatically reestablish the output voltage if the overload is removed. In more severe short−circuit conditions where the inductor current is still too high after the switching frequency has fully folded back, the regulator enters a hiccup mode that further reduces the power dissipation and protects the system. In hiccup mode, the frequency is further reduced to FSWHIC. Feedback Loop All components of the feedback loop (output voltage sensing, error amplifier and compensation) are integrated inside the NCV891x34, and are optimized to ensure regulation and sufficient phase and gain margin for the recommended conditions of operation. Recommended conditions and components: • Input: car battery • Output: 3.3 V or 5 V, with output current up to 3 A • Output capacitor: one to three parallel ceramic 10 mF capacitors • Inductor: 2.2 mH to 3.3 mH RESET function The RSTB pin is pulled low when the output voltage falls below 7.5% of the nominal regulation level, and floats when the output is properly regulated. A pull−up resistor tied to the output is needed to generate a logic high signal on this open drain pin. The pin can be left unconnected when not used. When the output voltage drops out of regulation, the pin goes low after a short noise−filtering delay (tfilter). It stays With these operating conditions and components, the open loop transfer function has a phase margin greater than 50°. www.onsemi.com 9 NCV891234, NCV891334 Bootstrap At the DRV pin an internal regulator provides a ground−referenced voltage to an external capacitor (CDRV), to allow fast recharge of the external bootstrap capacitor (CBST) used to supply power to the power switch gate driver. If the voltage at the DRV pin goes below the DRV UVLO Threshold VDRVSTP, switching is inhibited and the Soft−start circuit is reset, until the DRV pin voltage goes back up above VDRVSTT. The NCV891x34 monitors the bootstrap capacitor, and always ensures it stays charged no matter what the operating conditions are. As a result, the additional charging current for the bootstrap capacitor may prevent the regulator from entering Low−Iq mode at low input voltage. Practically, the 5 V output version does not enter Low−Iq mode for input voltages below 8 V. Synchronization starts within 2.5 ms of the RSTB Low−to−High transition. A rising edge at the SYNCI pin causes an NCV891x34 to immediately turn on the power switch. If another rising edge does not arrive at the SYNCI pin within the Master Reassertion Time, the NCV891x34 controls its own switching frequency, allowing uninterrupted operation in the event that the clock is turned off. If internal conditions or excessive input voltage cause an NCV891x34 to fold back its switching frequency, the main oscillator switching frequency is no longer derived from the frequency received at the SYNCI pin. Under these conditions, the SYNCO pin is held low. An external pulldown resistor is not required at the SYNCI pin if it is unused. The SYNCO pin is a buffered output (no pull−up resistor needed), and must be left unconnected when not used. Enable FLTB Function The NCV891x34 is designed to accept either a logic level signal or battery voltage as an Enable signal. However if voltages above 40 V are expected, EN should be tied to VIN through a 10 kW resistor in order to limit the current flowing into the overvoltage protection of the pin. EN low induces a shutdown mode which shuts off the regulator and minimizes its supply current to 9 mA typical by disabling all functions. Upon enabling, voltage is established at the DRV pin, followed by a soft−start of the switching regulator output. The FLTB pin is pulled low when one of the following conditions is detected: • Low Input Voltage (below the LVI threshold, see parametric table) • High Temperature (above the TWARN threshold, see parametric table) A pull−up resistor tied to the output is needed to generate a logic high signal on this open drain pin. The pin can be left unconnected when not used. There is a short noise−filtering delay (tfilter) to avoid false reporting. Synchronization Two NCV891x34 can be synchronized out−of−phase to one another by connecting the SYNCO pin of one to the SYNCI pin of the other. Any number of NCV891x34 can also be synchronized to an external clock. If a part does not have its switching frequency controlled by the SYNCI input, it drives the SYNCO pin low when it turns on the power switch, and drives it high half a switching period later. When the switching frequency is controlled by the SYNCI input, the SYNCO pin is held low. Thermal Shutdown A thermal shutdown circuit inhibits switching, resets the Soft−start circuit, and removes DRV voltage if internal temperature exceeds a safe level. Switching is automatically restored when temperature returns to a safe level. Exposed Pad The exposed pad (EPAD) on the back of the package must be electrically connected to the electrical ground (GND pin) for proper, noise−free operation. ORDERING INFORMATION Device Output NCV891234MW50R2G 5.0 V NCV891234MW33R2G 3.3 V NCV891334MW50R2G 5.0 V NCV891334MW33R2G 3.3 V Package Shipping† DFN−12 With wettable flanks 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 10 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN12, 4x4, 0.65P CASE 506CE ISSUE O 1 DATE 23 FEB 2012 SCALE 2:1 A B D L L L1 PIN ONE REFERENCE 2X 0.15 C 2X ÇÇÇ ÇÇÇ ÇÇÇ 0.15 C DETAIL A E ALTERNATE TERMINAL CONSTRUCTIONS ÉÉ ÇÇ ÇÇ EXPOSED Cu TOP VIEW DETAIL B 0.10 C DETAIL B ALTERNATE CONSTRUCTION A 0.08 C (A3) NOTE 4 A1 SIDE VIEW 0.10 DETAIL A K SEATING PLANE C C A B M D2 1 6 0.10 C A B M E2 12X L 12 7 e 12X 0.05 C NOTE 3 MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.25 0.35 4.00 BSC 3.30 3.50 4.00 BSC 2.40 2.60 0.65 BSC 0.20 −−− 0.30 0.50 −−− 0.15 GENERIC MARKING DIAGRAM* XXXXXX XXXXXX ALYWG G *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. SOLDERING FOOTPRINT* 12X 3.54 DIM A A1 A3 b D D2 E E2 e K L L1 XXXXXX= Specific Device Code A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package (*Note: Microdot may be in either location) b 0.10 C A B BOTTOM VIEW 0.63 4.30 2.64 0.65 PITCH MOLD CMPD NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMESNION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 12X 0.36 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON78622E 12 PIN DFN, 4X4, 0.65P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. 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