NL17SG17
Schmitt Buffer
The NL17SG17 MiniGatet is an advanced high−speed CMOS
Schmitt Buffer in ultra−small footprint.
The NL17SG17 input structures provides protection when voltages
up to 4.6 V are applied.
www.onsemi.com
Features
Wide Operating VCC Range: 0.9 V to 3.6 V
MARKING
DIAGRAMS
High Speed: tPD = 3.7 ns (Typ) at VCC = 3.0 V, CL = 15 pF
Low Power Dissipation: ICC = 0.5 mA (Max) at TA = 25°C
SOT−953
CASE 527AE
4.6 V Overvoltage Tolerant (OVT) Input Pins
A
Ultra−Small Packages
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
1
GND
2
NC
3
5
4
VCC
OUT Y
NC
1
IN A
2
GND
3
4
VCC
SC−88A
DF SUFFIX
CASE 419A
M
G
1
6
VCC
IN A
2
5
NC
UDFN6
1.45 x 1.0
CASE 517AQ
M
M
OUT Y
Figure 2. SC−88A
(Top View)
NC
UDFN6
1.0 x 1.0
CASE 517BX
M
Figure 1. SOT−953
(Top Thru View)
5
A
= Specific Device Code
(A with 90 degree clockwise rotation)
T
IN A
M
1
5
•
•
•
•
•
•
AN M G
G
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
PIN ASSIGNMENT
GND
3
4
OUT Y
Figure 3. UDFN6
(Top View)
OUT Y
IN A
SOT−953
SC−88A
UDFN6
NC
NC
1
IN A
2
GND
IN A
IN A
3
NC
GND
GND
4
OUT Y
OUT Y
OUT Y
5
VCC
VCC
NC
6
VCC
Figure 4. Logic Symbol
FUNCTION TABLE
A Input
Y Output
L
H
L
H
ORDERING INFORMATION
See detailed ordering and shipping information on page 5 of
this data sheet.
© Semiconductor Components Industries, LLC, 2015
July, 2015 − Rev. 6
1
Publication Order Number:
NL17SG17/D
NL17SG17
MAXIMUM RATINGS
Symbol
Parameter
VCC
DC Supply Voltage
VIN
DC Input Voltage
VOUT
DC Output Voltage
IIK
DC Input Diode Current
Value
Unit
−0.5 to +5.5
V
−0.5 to +4.6
V
−0.5 to VCC + 0.5
−0.5 to +4.6
V
VIN < GND
−20
mA
VOUT < GND
Output at High or Low State
Power−Down Mode (VCC = 0 V)
IOK
DC Output Diode Current
−20
mA
IOUT
DC Output Source/Sink Current
±20
mA
ICC
DC Supply Current per Supply Pin
±20
mA
IGND
DC Ground Current per Ground Pin
±20
mA
TSTG
Storage Temperature Range
−65 to +150
°C
260
°C
+150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
TJ
Junction Temperature Under Bias
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
Level 1
Oxygen Index: 28 to 34
ESD Withstand Voltage
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
>2000
>100
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
VCC
Positive DC Supply Voltage
0.9
3.6
V
VIN
Digital Input Voltage
0.0
3.6
V
0.0
0.0
VCC
3.6
V
−55
+125
°C
0
No Limit
ns/V
VOUT
TA
Dt / DV
Output Voltage
Output at High or Low State
Power−Down Mode (VCC = 0 V)
Operating Temperature Range
Input Transition Rise or Fail Rate
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
www.onsemi.com
2
NL17SG17
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
VT+
Positive−Going
Input Threshold
Voltage
−555C 3 TA 3 1255C
TA = 255C
VCC
(V)
Min
Typ
Max
Min
Max
0.9
0.64
0.7
0.86
0.62
0.87
1.1
0.73
0.81
0.95
0.71
1
1.4
0.86
0.94
1.16
0.84
1.2
1.65
0.95
1.06
1.25
0.94
1.3
2.3
1.22
1.36
1.6
1.18
1.65
3.0
1.51
1.8
2.05
1.38
2.1
0.9
0.09
0.23
0.30
0.08
0.33
1.1
0.15
0.33
0.39
0.12
0.43
1.4
0.3
0.47
0.54
0.25
0.55
1.65
0.35
0.6
0.65
0.3
0.65
2.3
0.55
0.85
0.88
0.5
0.88
3.0
0.95
1.13
1.16
0.9
1.16
0.9
0.15
0.5
0.75
0.2
0.8
1.1
0.15
0.5
0.75
0.2
0.8
1.4
0.15
0.5
0.75
0.2
0.8
1.65
0.15
0.5
0.75
0.2
0.8
2.3
0.15
0.5
0.75
0.2
0.8
3.0
0.25
0.65
0.85
0.3
0.9
IOH = −20 mA
0.9
0.75
0.75
IOH = −0.3 mA
1.1 to 1.3
0.75 x
VCC
0.75 x
VCC
IOH = −1.7 mA
1.4 to 1.6
0.75 x
VCC
0.75 x
VCC
IOH = −3.0 mA
1.65 to
1.95
VCC −
0.45
VCC −
0.45
IOH = −4.0 mA
2.3 to 2.7
2.0
2.0
IOH = −8.0 mA
3.0 to 3.6
2.48
2.48
IOL = 20 mA
0.9
0.1
0.1
IOL = 0.3 mA
1.1 to 1.3
0.25 x
VCC
0.25 x
VCC
IOL = 1.7 mA
1.4 to 1.6
0.25xV
CC
0.25 x
VCC
Condition
Unit
V
VT−
VH
VOH
VOL
Negative−Going
Input Threshold
Voltage
Hysteresis Voltage
High−Level
Output Voltage
Low−Level Output Voltage
VIN =
VIH
or
VIL
VIN =
VIH or
VIL
V
V
V
IOL = 3.0 mA
1.65 to
1.95
0.45
0.45
IOL = 4.0 mA
2.3 to 2.7
0.4
0.4
IOL = 8.0 mA
3.0 to 3.6
0.4
0.4
V
IIN
Input Leakage
Current
0 ≤ VIN ≤ 3.6 V
0 to 3.6
±0.1
±1.0
mA
ICC
Quiescent Supply Current
VIN = VCC or GND
3.6
0.5
10.0
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
www.onsemi.com
3
NL17SG17
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
TA =
−555C to +1255C
TA = 25 5C
Symbol
Parameter
Test Condition
VCC (V)
Min
Typ
Max
Min
Max
Unit
tPLH,
tPHL
Propagation Delay,
A to Y
CL = 10 pF,
RL = 1 MW
0.9
−
27.3
−
−
−
ns
1.1 to 1.3
−
13.0
22.6
1.0
35.9
1.4 to 1.6
−
7.5
10.5
1.0
11.3
1.65 to 1.95
−
6.0
7.8
1.0
8.2
2.3 to 2.7
−
4.3
5.4
1.0
5.8
3.0 to 3.6
−
3.5
4.4
1.0
4.6
0.9
−
29.5
−
−
−
1.1 to 1.3
−
14.3
25.1
1.0
41.8
1.4 to 1.6
−
8.0
11.5
1.0
12.6
1.65 to 1.95
−
6.3
8.4
1.0
8.7
2.3 to 2.7
−
4.6
5.7
1.0
6.1
3.0 to 3.6
−
3.7
4.6
1.0
5.0
0.9
−
40.5
−
−
−
1.1 to 1.3
−
19.6
35.7
1.0
58.1
1.4 to 1.6
−
10.7
15.8
1.0
17.6
1.65 to 1.95
−
7.8
10.7
1.0
11.7
2.3 to 2.7
−
5.4
6.9
1.0
8.1
3.0 to 3.6
−
4.3
5.2
1.0
6.1
CL = 15 pF,
RL = 1 MW
CL = 30 pF,
RL = 1 MW
ns
ns
CIN
Input Capacitance
0 to 3.6
3
−
−
−
pF
CO
Output Capacitance
VO = GND
0
3
−
−
−
pF
CPD
Power Dissipation
Capacitance (Note 5)
f = 10 MHz
0.9 to 3.6
4
−
−
−
pF
−
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load
dynamic power consumption; PD = CPD VCC2 fin + ICC VCC.
www.onsemi.com
4
NL17SG17
VCC
Input A
50%
50%
GND
tPLH
tPHL
VOH
Output Y
50% VCC
VOL
Figure 5. Switching Waveform
VCC
PULSE
GENERATOR
DUT
RT
CL
RL
RT = ZOUT of pulse generator (typically 50 W)
Figure 6. Test Circuit
ORDERING INFORMATION
Package
Shipping†
NL17SG17P5T5G
SOT−953
(Pb−Free)
8000 / Tape & Reel
NL17SG17DFT2G
SC−88A
(Pb−Free)
3000 / Tape & Reel
NL17SG17AMUTCG
UDFN6 1.45x1 mm
(Pb−Free)
3000 / Tape & Reel
NL17SG17CMUTCG*
UDFN6 1x1 mm
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*In Development
MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC).
www.onsemi.com
5
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
SCALE 2:1
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DATE 17 JAN 2013
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
B
M
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
J
GENERIC MARKING
DIAGRAM*
C
K
H
XXXMG
G
SOLDER FOOTPRINT
0.50
0.0197
XXX = Specific Device Code
M
= Date Code
G
= Pb−Free Package
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
mm Ǔ
ǒinches
STYLE 1:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 2:
PIN 1. ANODE
2. EMITTER
3. BASE
4. COLLECTOR
5. CATHODE
STYLE 3:
PIN 1. ANODE 1
2. N/C
3. ANODE 2
4. CATHODE 2
5. CATHODE 1
STYLE 4:
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
5. GATE 2
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
3. EMITTER 1
4. COLLECTOR
5. COLLECTOR 2/BASE 1
STYLE 7:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 8:
PIN 1. CATHODE
2. COLLECTOR
3. N/C
4. BASE
5. EMITTER
STYLE 9:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42984B
STYLE 5:
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
4. CATHODE 3
5. CATHODE 4
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
SC−88A (SC−70−5/SOT−353)
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6, 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
1
SCALE 4:1
A
B
D
DATE 15 MAY 2008
L
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
L1
PIN ONE
REFERENCE
0.10 C
ÉÉÉ
ÉÉÉ
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
ÉÉ
ÉÉ
EXPOSED Cu
TOP VIEW
0.10 C
DETAIL B
MOLD CMPD
DETAIL B
0.05 C
6X
DIM
A
A1
A2
b
D
E
e
L
L1
OPTIONAL
CONSTRUCTIONS
A
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.07 REF
0.20
0.30
1.45 BSC
1.00 BSC
0.50 BSC
0.30
0.40
−−−
0.15
MOUNTING FOOTPRINT
0.05 C
A1
SIDE VIEW
A2
e
6X
C
SEATING
PLANE
6X
0.30
PACKAGE
OUTLINE
L
1.24
3
1
DETAIL A
6X
0.53
6
4
6X
BOTTOM VIEW
b
0.10 C A B
0.05 C
NOTE 3
1
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
GENERIC
MARKING DIAGRAM*
XM
X
M
= Specific Device Code
= Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER:
DESCRIPTION:
98AON30313E
UDFN6, 1.45x1.0, 0.5P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−953
CASE 527AE
ISSUE E
DATE 02 AUG 2011
SCALE 4:1
X
Y
D
5
PIN ONE
INDICATOR
A
4
HE
E
1
2 3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
DIM
A
b
C
D
E
e
HE
L
L2
L3
C
TOP VIEW
SIDE VIEW
e
L
5X
5X
L3
5X
L2
MILLIMETERS
MIN
NOM
MAX
0.34
0.37
0.40
0.10
0.15
0.20
0.07
0.12
0.17
0.95
1.00
1.05
0.75
0.80
0.85
0.35 BSC
0.95
1.00
1.05
0.175 REF
0.05
0.10
0.15
−−−
−−−
0.15
GENERIC
MARKING DIAGRAM*
5X
BOTTOM VIEW
XM
b
1
0.08 X Y
X
M
SOLDERING FOOTPRINT*
*This information is generic. Please refer
to device data sheet for actual part
marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
5X
0.35
5X
0.20
= Specific Device Code
= Month Code
PACKAGE
OUTLINE
1.20
1
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON26457D
SOT−953
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Email Requests to: orderlit@onsemi.com
onsemi Website: www.onsemi.com
◊
TECHNICAL SUPPORT
North American Technical Support:
Voice Mail: 1 800−282−9855 Toll Free USA/Canada
Phone: 011 421 33 790 2910
Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative
工商网监
湘ICP备2023018690号
