NLAS3899BMNTXG

NLAS3899B Dual DPDT Low RON, Low Capacitance Switch The NLAS3899B is a dual DPDT analog switch designed for low power audio and dual SIM card applications. The low RON of 3.0  (typical) is ideal for routing audio signals to or from a moderately high impedance load. In addition, the low CON of 20 pF (typical) gives the NLAS3899B a high bandwidth of 280 MHz, perfect for dual SIM card applications. http://onsemi.com MARKING DIAGRAMS Features • • • • • • • ÇÇ ÇÇ 16 • Single Supply Operation 1 1.65 to 4.3 V VCC Function Directly from Li−Ion Battery Low ON Resistance (3.0  Typical Across VCC) Low CON (20 pF Typical) Bandwidth 280 MHz Maximum Breakdown Voltage: 5.5 V Low Static Power Interfaces with 1.8 V Chipset These are Pb−Free Devices AAMG G WQFN16 CASE 488AP 1 ÇÇÇ ÇÇÇ 16 1 QFN16 CASE 485AE 1 NLAS 3899 ALYW Typical Applications • • • • XX A M L Y W G Cell Phone Speaker/Microphone Switching Ringtone−Chip/Amplifier Switching Dual SIM Card Data Switching Four Unbalanced (Single−Ended) Switches Important Information • ESD Protection: • • • = Specific Device Code = Assembly Location = Date Code/Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) Human Body Model (HBM) 1000 V − All Pins Human Body Model (HBM) 5000 V − I/O to GND Continuous Current Rating Through each Switch ±300 mA Conforms to: JEDEC MO−220, Issue H, Variation VEED−6 Package: ♦ 1.8 x 2.6 x 0.75 mm WQFN16 Pb−Free ♦ 3.0 x 3.0 x 0.9 mm QFN16 Pb−Free COMA NOA Vcc NCD 16 15 14 13 NCA 1 12 COMD A−B IN 2 11 NOD NOB 3 10 C−D IN COMB 4 9 NCC 5 6 7 8 NCB GND NOCCOMC ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. © Semiconductor Components Industries, LLC, 2012 August, 2012 − Rev. 1 1 Publication Order Number: NLAS3899B/D NLAS3899B COM NC NO IN Figure 1. Input Equivalent Circuit PIN DESCRIPTION QFN PIN # Symbol Name and Function 1, 3, 5, 7, 9, 11, 13, 15 NO A−D, NC A−D Independent Channels 2, 10 A−B IN, C−D IN 4, 8, 12, 16 COM A−D Controls 6 GND Ground (V) 14 VCC Positive Supply Voltage Common Channels TRUTH TABLE IN NO NC H ON OFF* L OFF* ON *High impedance. OPERATING CONDITIONS MAXIMUM RATINGS Symbol Pins Parameter Value Positive DC Supply Voltage Condition Unit VCC VCC −0.5 to +5.5 V VIS NOx, NCx, or COMx Analog Signal Voltage −0.5 to VCC + 0.5 V Control Input Voltage −0.5 to 5.5 VIN A−B IN, C−D IN IIS_CON NOx, NCx, or COMx Analog Signal Continuous Current ±300 Closed Switch mA IIS_PK NOx, NCx, or COMx Analog Signal Peak Current ±500 10% Duty Cycle mA IIN A−B IN, C−D IN Control Input Current ±20 mA −65 to 150 °C TSTG Storage Temperature Range V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 2 NLAS3899B RECOMMENDED OPERATING CONDITIONS Symbol Pins VCC VCC VIS NOx, NCx, or COMx VIN A−B IN, C−D IN Parameter Value Positive DC Supply Voltage Condition Unit 1.65 to 4.3 V Analog Signal Voltage GND to VCC V Control Input Voltage GND to 4.3 V TA Operating Temperature Range −40 to +85 °C tr, tf Input Rise or Fall Time 20 VCC = 1.6 V − 2.7 V 10 VCC = 3.0 V − 4.5 V ns/V Minimum and maximum values are guaranteed through test or design across the Recommended Operating Conditions, where applicable. Typical values are listed for guidance only and are based on the particular conditions listed for each section, where applicable. These conditions are valid for all values found in the characteristics tables unless otherwise specified in the test conditions. ESD PROTECTION Pins Description Minimum Voltage All Pins Human Body Model 1 kV I/O to GND Human Body Model 5 kV http://onsemi.com 3 NLAS3899B DC Electrical Characteristics Typical: T = 25°C; VCC = 3.0 V CONTROL INPUT (Typical: T = 25°C; VCC = 3.0 V) Min 1.3 1.6 Symbol Pins VIH A−B IN, C−D IN Control Input High 3.0 4.3 VIL A−B IN, C−D IN Control Input Low 3.0 4.3 IIN A−B IN, C−D IN Control Input Leakage Parameter Test Conditions 0 v VIN v VCC −405C to +855C VCC (V) 4.3 Typ Max Unit V ±0.1 0.5 0.6 V ±1.0 A SUPPLY CURRENT AND LEAKAGE (Typical: T = 25°C; VCC = 3.0 V) VCC (V) −405C to +855C Symbol Pins Parameter Typ Max Unit INO/NC (OFF) NCx, NOx OFF State Leakage VIN = VIL or VIH VNC/NO = 0.3 V VCOM = 4.0 V 4.3 ±10 ±300 nA ICOM (ON) COMx ON State Leakage VIN = VIL or VIH VNO = 0.3 V or 4.0 V with VNC floating or VNC = 0.3 V or 4.0 V with VNO floating VCOM = 0.3 V or 4.0 V 4.3 ±10 ±300 nA ICC VCC Quiescent Supply VIN and VIS = VCC or GND ID = 0 A 1.65 − 4.3 ±1.0 ±2.0 A IOFF A−B IN, C−D IN Power Off Leakage 0 ±0.5 ±2.0 A Test Conditions VIN = 4.3 V or GND Min ON RESISTANCE (Typical: T = 25°C; VCC = 3.0 V) Parameter VCC (V) −405C to +855C Typ Max Unit 2.5 3.0 3.6 4.3 3.0 2.6 2.5 2.2 4.0 3.0 3.0 2.5  ION = −100 mA VIS = 0 to VCC 3.0 4.3 0.8 1.1  ION = −100 mA VIS = 0 to VCC 3.0 4.3 0.8 0.7  Symbol Pins Test Conditions RON NOx, NCx COMx ON Resistance ION = −100 mA VIS = 0 to VCC RFLAT NOx, NCx COMx RON Flatness RON NOx, NCx COMx RON Matching http://onsemi.com 4 Min NLAS3899B AC ELECTRICAL CHARACTERISTICS TIMING/FREQUENCY (Typical: T = 25°C; VCC = 3.0 V, RL = 50 , CL = 35 pF, f = 1 MHz) Symbol Pins tON IN to NCx or NOx Turn On Time tOFF IN to NCx or NOx Turn Off Time tBBM IN to NCx or NOx Break Before Make BW Parameter −3dB Bandwidth Test Conditions VCC (V) Typ Max Unit 2.3 − 4.3 30 40 ns 2.3 − 4.53 20 30 ns 3.0 CL = 5 pF −405C to +855C Min 2 1.65 − 4.3 15 ns 280 MHz ISOLATION AND THD (Typical: T = 25°C; VCC = 3.0 V, RL = 50 , CL = 5 pF, f = 1 MHz) Symbol Pins Q Parameter Test Conditions VCC (V) −405C to +855C Min Typ Max Unit Charge Injection VIN = VCC to GND RIS = 0 , CL = 1.0 nF Q = CL − ΔVOUT 1.65 − 4.3 111 pC THD Total Harmonic Distortion FIS = 20 Hz to 20 kHz RL = Rgen = 600 , CL = 1.0 pF VIS = 1.0 VPP 3.0 0.007 % VONL Maximum Feedthrough On Loss VIN = 0 dBm @ 100 kHz to 50 MHz VIN centered between VCC & GND 1.65 − 4.3 −0.06 dB Off Isolation VIN = 0 VNO or VNC (pk−pk) = 1.0 V 1.65 − 4.3 −67 dB Non−Adjacent Chan- VNO or VNC (pk−pk) = 1.0 V nel 1.65 − 4.3 −100 dB OIRR NOx Xtalk COMx to COMy CAPACITANCE (Typical: T = 25°C; VCC = 3.0 V, RL = 50 , CL = 5 pF, f = 1 MHz) Symbol Pins CIN A−B IN, C−D IN Control Input Parameter CON NCx to COMx Through Switch COFF NCx NOx Unselected Port Test Conditions VCC (V) −405C to +855C Min Typ Max Unit 0V 5.0 pF VIN = 0V 3.0 V 20 pF VIS = 3.0V, VIN = 3.0V 3.0 V 10 pF http://onsemi.com 5 NLAS3899B 0.014 0.00035 0.012 4.3 V @ 25°C 4.3 V @ 25°C 0.00030 0.010 3.6 V @ 25°C 0.00025 3.6 V @ 25°C ICC (A) ICC (A) 0.008 0.006 0.00020 0.004 3.0 V @ 25°C 3.0 V @ 25°C 0.00015 0.002 0.00010 0 −0.002 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Vin (V) Vin (V) Figure 2. ICC vs. Vin Figure 3. (Expanded View) ICC vs. Vin VCC DUT VCC Input Output GND VOUT 0.1 F 50  tBMM 35 pF 90% 90% of VOH Output Switch Select Pin GND Figure 4. tBBM (Time Break−Before−Make) VCC DUT VCC 0.1 F Input Output VOUT Open 50  50% 50% 0V VOH 35 pF 90% 90% Output VOL Input tON Figure 5. tON/tOFF VCC VCC Input DUT Output 50% 50% 0V 50  VOUT Open tOFF VOH 35 pF Output 10% VOL Input Figure 6. tON/tOFF http://onsemi.com 6 tOFF 10% tON NLAS3899B 50  DUT Reference Transmitted Input Output 50  Generator 50  Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction. ǒVVOUT Ǔ for VIN at 100 kHz IN VOUT Ǔ for VIN at 100 kHz to 50 MHz VONL = On Channel Loss = 20 Log ǒ VIN VISO = Off Channel Isolation = 20 Log Bandwidth (BW) = the frequency 3 dB below VONL VCT = Use VISO setup and test to all other switch analog input/outputs terminated with 50  Figure 7. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/VONL DUT VCC VIN Output Open GND CL Output Off VIN Figure 8. Charge Injection: (Q) http://onsemi.com 7 On Off VOUT NLAS3899B DEVICE ORDERING INFORMATION Package Type Tape & Reel Size† NLAS3899BMNTBG WQFN16 (Pb−Free) 3000 / Tape & Reel NLAS3899BMNTWG QFN16 (Pb−Free) 3000 / Tape & Reel NLAS3899BMNTXG QFN16 (Pb−Free) 3000 / Tape & Reel Device Order Number †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 8 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS QFN16 3x3, 0.5P CASE 485AE ISSUE C 1 SCALE 2:1 ÇÇ ÇÇ ÇÇ PIN 1 LOCATION D A B L1 DETAIL A ALTERNATE TERMINAL CONSTRUCTIONS E ÉÉÉ ÉÉÉ EXPOSED Cu TOP VIEW 0.10 C 16X L A1 SIDE VIEW DETAIL A 5 SEATING PLANE XXXXX XXXXX ALYWG G 9 E2 1 b 0.10 C A B 16X A L Y W G 12 16 e e/2 NOTE 3 RECOMMENDED SOLDERING FOOTPRINT* 13 BOTTOM VIEW MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.18 0.30 3.00 BSC 1.25 1.55 3.00 BSC 1.25 1.55 0.50 BSC 0.20 −−− 0.30 0.50 0.00 0.15 GENERIC MARKING DIAGRAM* 8 K 0.05 C C D2 4 16X MOLD CMPD ALTERNATE CONSTRUCTIONS A 0.08 C ÉÉ ÉÉ ÇÇ DIM A A1 A3 b D D2 E E2 e K L L1 A3 A1 DETAIL B (A3) DETAIL B NOTE 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. OUTLINE MEETS JEDEC DIMENSIONS PER MO−220, VARIATION VEED−6. L L 0.15 C 0.15 C DATE 24 JUN 2016 3.30 PACKAGE OUTLINE 16X 0.65 1.55 1 = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 1.55 3.30 16X 0.30 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON14949D QFN16 3X3, 0.5P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WQFN16, 1.8x2.6, 0.4P CASE 488AP−01 ISSUE B DATE 25 JUN 2008 1 SCALE 5:1 PIN 1 REFERENCE 2X 2X L A D ÉÉÉ ÉÉÉ ÉÉÉ DETAIL A ALTERNATE TERMINAL CONSTRUCTIONS E ÉÉ ÉÉ EXPOSED Cu 0.15 C B MILLIMETERS MIN MAX 0.70 0.80 0.00 0.050 0.20 REF 0.15 0.25 1.80 BSC 2.60 BSC 0.40 BSC 0.30 0.50 0.00 0.15 0.40 0.60 MOUNTING FOOTPRINT C A3 8 0.562 0.0221 15 X L 9 e 1 DIM A A1 A3 b D E e L L1 L2 SEATING PLANE A1 4 A1 ÇÇ ÉÉ ALTERNATE CONSTRUCTIONS 0.08 C DETAIL A A3 MOLD CMPD DETAIL B A DETAIL B 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. EXPOSED PADS CONNECTED TO DIE FLAG. USED AS TEST CONTACTS. L1 0.15 C 0.10 C L 0.400 0.0157 0.225 0.0089 1 12 2.900 0.1142 16 L2 16 X b 0.463 0.0182 0.10 C A B 0.05 C NOTE 3 1.200 0.0472 2.100 0.0827 SCALE 20:1 DOCUMENT NUMBER: DESCRIPTION: 98AON20790D WQFN16, 1.8 X 2.6, 0.4P mm Ǔ ǒinches Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative