NLAS5123MUR2G

NLAS5123 SPDT, 1 W RON Switch The NLAS5123 is a low RON SPDT analog switch. This device is designed for low operating voltage, high current switching of speaker output for cell phone applications. It can switch a balanced stereo output. The NLAS5123 can handle a balanced microphone/ speaker/ringtone generator in a monophone mode. The device contains a break−before−make (BBM) feature. http://onsemi.com MARKING DIAGRAMS Features • Single Supply Operation: • • • • 1.65 V to 5.5 V VCC Function Directly from LiON Battery RON Typical = 1.0  @ VCC = 4.5 V Low Static Power These are Pb−Free Devices WDFN6 MN SUFFIX CASE 506AS WM G 1 W = Specific Device Code M = Date Code G = Pb−Free Device Typical Applications • Cell Phone Speaker/Microphone Switching • Ringtone−Chip/Amplifier Switching • Stereo Balanced (Push−Pull) Switching UDFN6 MU SUFFIX CASE 517AA 1 XM G X = Specific Device Code M = Date Code G = Pb−Free Device Important Information • Continuous Current Rating Through each Switch ±300 mA • 1.2 x 1.0 x 0.4P mm 6−Lead Thin DFN Package PIN ASSIGNMENTS NO 1 6 IN GND 2 5 VCC NC 3 4 COM (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. © Semiconductor Components Industries, LLC, 2010 November, 2010 − Rev. 4 1 Publication Order Number: NLAS5123/D NLAS5123 COM NC NO IN Figure 1. Input Equivalent Circuit PIN DESCRIPTION Pin Name TRUTH TABLE Description Control Input Function NC, NO, COM Data Ports L NC Connected to COM IN Control Input H NO Connected to COM H = HIGH Logic Level. L = LOW Logic Level. MAXIMUM RATINGS Symbol Rating Value Unit −0.5 to +6.0 V −0.5 to VCC +0.5 V −0.5 to +6.0 V Continuous DC Current from COM to NC/NO ±300 mA Ianl−pk1 Peak Current from COM to NC/NO, 10 Duty Cycles (Note 1) ±500 mA Iclmp Continuous DC Current into COM/NC/NO with respect to VCC or GND ±100 mA VCC Positive DC Supply Voltage VIS Analog Input Voltage (VNO, VNC, or VCOM) VIN Digital Select Input Voltage Ianl1 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Defined as 10% ON, 90% off duty cycle. RECOMMENDED OPERATING CONDITIONS Symbol Rating Min Max Unit 1.65 5.5 V VCC Positive DC Supply Voltage VIS Analog Input Voltage (NC, NO, COM) 0 VCC V VIN Digital Select Input Voltage (IN) 0 VCC V TA Operating Temperature Range −40 85 °C tr, tf Input Rise or Fall Time, SELECT 20 10 ns/V VCC = 3.0 V VCC = 5.5 V http://onsemi.com 2 NLAS5123 DC ELECTRICAL CHARACTERISTICS Symbol Parameter VCC (V) Test Conditions VIH HIGH Level Input Voltage 2.7 4.5 VIL LOW Level Input Voltage 2.7 4.5 IIN Input Leakage Current 0 v VIN v 5.5 V IOFF OFF State Leakage Current (Note 7) 0 v NO, NC, COM v VCC 5.5 ION ON State Leakage Current (Note 7) 0 v NO, NC, COM v VCC 5.5 RON Switch On Resistance (Note 2) IO = 100 mA, VIS = 0 V to VCC ICC TA = +25°C Min Typ TA = −40°C to +85°C Max Min Max 2.0 2.4 Unit V 0.6 0.8 V ±0.1 ±1 A −2.0 +2.0 ±20 nA −4.0 +4.0 ±40 nA 2.7 1.7 2.0  IO = 100 mA, VIS = 0 V to VCC 4.5 1.0 1.2 VIN = VCC or GND, IOUT = 0 5.5 0.5 1.0 On Resistance Match Between Channels (Notes 2, 3, 4) IA = 100 mA, VIS = 1.5 V IA = 100 mA, VIS = 2.5 V 2.7 0.15 4.5 0.12 On Resistance Flatness (Notes 2, 3, 5) IA = 100 mA, VIS = 0 V to VCC IA = 100 mA, VIS = 0 V to VCC 2.7 0.4 4.5 0.3 Quiescent Supply Current All Channels ON or OFF 0−5.5 A Analog Signal Range RON Rflat  0.15  0.4 2. Measured by the voltage drop between NC/NO and COM pins at the indicated current through the switch. On Resistance is determined by the lower of the voltages on the two (NO, NC, COM). 3. Parameter is characterized but not tested in production. 4. RON = RON max − RON min measured at identical VCC, temperature and voltage levels. 5. Flatness is defined as the difference between the maximum and minimum value of On Resistance over the specified range of conditions. 6. Guaranteed by Design. 7. This parameter is guaranteed by design but not tested. The bus switch contributes no propagation delay other than the RC delay of the On Resistance of the switch and the 50 pF load capacitance, when driven by an ideal voltage source (zero output impedance). http://onsemi.com 3 NLAS5123 AC ELECTRICAL CHARACTERISTICS Symbol Parameter Test Conditions VCC (V) TA = +25°C Min Typ TA = −40°C to +85°C Max Min Max tPHL tPLH Propagation Delay Bus−to−Bus (Note 9) VIN = VIH or VIL 2.7 4.5 2.0 0.3 tON Output Enable Time Turn On Time (COM to NO or NC) VIS = 1.5 V, RL = 50 , CL = 35 pF VIS = 3.0 V, RL = 50 , CL = 35 pF 2.7 30 35 4.5 20 25 Output Disable Time Turn Off Time (COM to NO, NC) VIS = 1.5V, RL = 50 , CL = 35 pF VIS = 3.0 V, RL = 50 , CL = 35 pF 2.7 20 25 4.5 15 20 Break Before Make Time (Note 8) VIS = 1.5V, RL = 50 , CL = 35 pF tOFF tBBM Q Charge Injection (Note 8) CL = 1.0 nF, VGEN = 0 V RGEN = 0  OIRR Off Isolation (Note 10) Xtalk Unit Figure # ns 2.7 0.5 0.5 4.5 0.5 0.5 ns 3, 4 ns 3, 4 ns 2 2.7 4.5 26 48 pC 6 RL = 50  f = 1.0 MHz 2.7 − 5.5 −62 dB 5 Crosstalk RL = 50  f = 1.0 MHz 2.7 − 5.5 −70 dB 7 BW −3 dB Bandwidth RL = 50  2.7 − 5.5 55 MHz 8 THD Total Harmonic Distortion (Note 8) RL = 600  0.5 VP−P f = 20 Hz to 20 kHz 2.7 − 5.5 0.012 % 9 8. Guaranteed by Design. 9. This parameter is guaranteed by design but not tested. The bus switch contributes no propagation delay other than the RC delay of the On Resistance of the switch and the 50 pF load capacitance, when driven by an ideal voltage source (zero output impedance). 10. Off Isolation = 20 log10 [VCOM/VNO,NC]. CAPACITANCE (Note 11) Symbol Parameter Test Conditions Typ Max Unit CIN Select Pin Input Capacitance VCC = 0 V, f = 1 MHz 2.0 pF CNC/NO NC, NO Port Off Capacitance VCC = 4.5 V, f = 1 MHz 20 pF CCOM COM Port Capacitance when Switch is Enabled VCC = 4.5 V, f = 1 MHz 55 pF 11. TA = +25°C, f = 1 MHz, Capacitance is characterized but not tested in production. http://onsemi.com 4 NLAS5123 VCC DUT VCC Input Output GND VOUT 0.1 F 50  tBMM 35 pF 90% 90% of VOH Output Switch Select Pin GND Figure 2. tBBM (Time Break−Before−Make) VCC Input DUT VCC 0.1 F 50% Output VOUT Open 50% 0V 50  VOH 90% 35 pF 90% Output VOL Input tON tOFF Figure 3. tON/tOFF VCC VCC Input DUT Output 50% 0V 50  VOUT Open 50% VOH 35 pF Output Input tOFF Figure 4. tON/tOFF http://onsemi.com 5 10% 10% VOL tON NLAS5123 50  DUT Reference Transmitted Input Output 50  Generator 50  Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction. ǒVVOUT Ǔ for VIN at 100 kHz IN VOUT Ǔ for VIN at 100 kHz to 50 MHz VONL = On Channel Loss = 20 Log ǒ VIN VISO = Off Channel Isolation = 20 Log Bandwidth (BW) = the frequency 3 dB below VONL VCT = Use VISO setup and test to all other switch analog input/outputs terminated with 50  Figure 5. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/VONL DUT VCC VIN Output Open GND CL Output Off VIN Figure 6. Charge Injection: (Q) http://onsemi.com 6 On Off VOUT NLAS5123 0 0 −10 −0.5 −20 −1 −1.5 −40 BW (dB) XT (dB) −30 −50 −60 −2 −2.5 −3 −70 −80 −3.5 −90 −4 −100 0.01 0.1 1 10 −4.5 0.01 100 0.1 FREQUENCY (MHz) Figure 8. Bandwidth vs. Frequency 0.01 1.9 0.009 1.7 0.008 85°C 1.5 0.007 0.006 RON () THD (%) 100 FREQUENCY (MHz) Figure 7. Cross Talk vs. Frequency @ VCC = 4.5 V 0.005 0.004 0.003 25°C 1.3 1.1 −40°C 0.9 0.002 0.7 0.001 0 10 100 1000 10000 100000 0.5 0 0.5 1 1.5 2 2.5 FREQUENCY (Hz) VIS (V) Figure 9. Total Harmonic Distortion Figure 10. On−Resistance vs. Input Voltage @ VCC = 2.7 V 1.2 3 1.6 1 85°C 0.8 25°C 2.7 V 1.4 RON () RON () 10 1 −40°C 0.6 0.4 3.0 V 1.2 1.0 3.6 V 4.5 V 0.8 0.2 5.5 V 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.6 4.5 0 1 2 3 4 5 VIS (V) VIS (V) Figure 11. On−Resistance vs. Input Voltage @ VCC = 4.5 V Figure 12. On−Resistance vs. Input Voltage http://onsemi.com 7 6 NLAS5123 DEVICE ORDERING INFORMATION Device Nomenclature Circuit Indicator Technology Device Function Package Suffix Tape & Reel Suffix NLAS5123MNR2G NL AS 5123 MN NLAS5123MUR2G NL AS 5123 MU Device Order Number Package Type Tape & Reel Size† 2 WDFN6 (Pb−Free) 3000 / Tape & Reel 2 UDFN6 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 8 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WDFN6 1.2x1.0, 0.4P CASE 506AS ISSUE D DATE 27 AUG 2013 SCALE 4:1 D L A B L NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L1 ÍÍÍ ÍÍÍ ÍÍÍ DETAIL A E PIN ONE REFERENCE 0.10 C 2X 2X ALTERNATE TERMINAL CONSTRUCTIONS ÉÉ ÉÉ ÉÉ EXPOSED Cu 0.10 C ÇÇ ÉÉ A1 ALTERNATE CONSTRUCTIONS A3 0.08 C XM A1 C SEATING PLANE X M 4X DETAIL A e 5X = Specific Device Code = Date Code *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. L 3 1 MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.30 0.40 0.00 0.15 0.40 0.50 GENERIC MARKING DIAGRAM* A 7X A3 DETAIL B DETAIL B 0.10 C MOLD CMPD DIM A A1 A3 b D E e L L1 L2 L2 MOUNTING FOOTPRINT* 6X 6 4 BOTTOM VIEW b 0.22 6X 0.10 C A 0.05 C STYLE 1: PIN 1. 2. 3. 4. 5. 6. 6X 0.42 B NOTE 3 DRAIN DRAIN GATE SOURCE DRAIN DRAIN 0.40 PITCH 1.07 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON21223D WDFN6, 1.2 X 1.0, 0.4 P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN6, 1.2x1.0, 0.4P CASE 517AA−01 ISSUE D 1 SCALE 8:1 EDGE OF PACKAGE 2X 0.10 C ÉÉ ÉÉ ÉÉ L1 E DETAIL A Bottom View (Optional) TOP VIEW 2X EXPOSED Cu 0.10 C (A3) 0.10 C A1 A 10X 0.08 C ÉÉÉ ÉÉÉ A3 DETAIL B Side View (Optional) 5X XM L 3 X M L2 b 0.10 C A B 0.05 C 6 = Specific Device Code = Date Code *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 4 e NOTE 3 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.30 0.40 0.00 0.15 0.40 0.50 GENERIC MARKING DIAGRAM* C A1 6X DIM A A1 A3 b D E e L L1 L2 MOLD CMPD SEATING PLANE SIDE VIEW 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B D PIN ONE REFERENCE DATE 03 SEP 2010 MOUNTING FOOTPRINT* BOTTOM VIEW 6X 6X 0.42 0.40 PITCH 0.22 1.07 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON22068D 6 PIN UDFN, 1.2X1.0, 0.4P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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