NLAST4501
Single SPST Analog Switch
The NLAST4501 is an analog switch manufactured in sub−micron
silicon−gate CMOS technology. It achieves very low RON while
maintaining extremely low power dissipation. The device is a bilateral
switch suitable for switching either analog or digital signals, which
may vary from zero to full supply voltage.
The NLAST4501 is a low voltage, TTL (low threshold) compatible
device, pin for pin compatible with the MAX4501.
The Enable pin is compatible with standard TTL level outputs when
supply voltage is nominal 5.0 V. It is also over−voltage tolerant,
making it a very useful logic level translator.
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Features
1
•
•
•
•
•
Guaranteed RON of 32 at 5.5 V
Low Power Dissipation: ICC = 2 A
Low Threshold Enable pin TTL compatible at 5.0 V
TTL version and pin for pin with NLAS4501
Provides Voltage translation for many different voltage levels
3.3 to 5.0 V, Enable pin may go as high as 5.5 V
1.8 to 3.3 V
1.8 to 2.5 V
Improved version of MAX4501 (at any voltage between 2 and 5.5 V)
•
• Chip Complexity: FETs = 11
• Pb−Free Packages are Available
COM
NO
GND
1
A3 M G
G
SC70−5/SC−88A/SOT−353
DF SUFFIX
CASE 419A
1
A3AYW G
G
1
TSOP−5
DT SUFFIX
CASE 483
1
A3 = Specific Device Code
M = Date Code*
A = Assembly Location
Y = Year
W = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position and underbar
may vary depending upon manufacturing location.
5
VCC
PIN ASSIGNMENT
2
3
MARKING
DIAGRAMS
4
ENABLE
Pin
Function
1
COM
2
NO
3
GND
4
ENABLE
5
VCC
Figure 1. Pinout (Top View)
FUNCTION TABLE
On/Off Enable Input
State of Analog Switch
L
H
Off
On
ORDERING INFORMATION
See detailed ordering and shipping information on page 8 of
this data sheet.
© Semiconductor Components Industries, LLC, 2006
May, 2006 − Rev. 4
1
Publication Order Number:
NLAST4501/D
NLAST4501
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Positive DC Supply Voltage
VCC
0.5 to 7.0
V
Digital Input Voltage (Enable)
VIN
0.5 to 7.0
V
Analog Output Voltage (VNO or VCOM)
VIS
0.5 to VCC 0.5
V
IIK
20
mA
TSTG
65 to 150
_C
Lead Temperature, 1 mm from Case for 10 Seconds
TL
260
_C
Junction Temperature under Bias
TJ
150
_C
SC70−5/SC−88A (Note 1)
TSOP−5
JA
350
230
_C/W
SC70−5/SC−88A
TSOP−5
PD
150
200
mW
MSL
Level 1
FR
UL 94 V−0 @ 0.125 in
VESD
> 2000
> 100
N/A
V
ILatchup
300
mA
DC Current, Into or Out of Any Pin
Storage Temperature Range
Thermal Resistance
Power Dissipation in Still Air at 85_C
Moisture Sensitivity
Flammability Rating
Oxygen Index: 30% − 35%
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Latchup Performance
Above VCC and Below GND at 85_C (Note 5)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Min
Max
Unit
Positive DC Supply Voltage
VCC
2.0
5.5
V
Digital Input Voltage (Enable)
VIN
GND
5.5
V
Static or Dynamic Voltage Across an Off Switch
VIO
GND
VCC
V
Analog Input Voltage (NO, COM)
VIS
GND
VCC
V
Operating Temperature Range, All Package Types
TA
55
125
_C
tr, tf
0
0
100
20
ns/V
Vcc = 3.3 V 0.3 V
Vcc = 5.0 V 0.5 V
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
TJ = 80_C
1,032,200
TJ = 90_C
80
TJ = 100_C
Time, Years
TJ = 110_C
Time, Hours
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
TJ = 120_C
Junction
Temperature °C
NORMALIZED FAILURE RATE
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
TJ = 130_C
Input Rise or Fall Time,
(Enable Input)
1
1
10
100
1000
TIME, YEARS
Figure 2. Failure Rate vs. Time Junction Temperature
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2
NLAST4501
DC CHARACTERISTICS − Digital Section (Voltages Referenced to GND)
Guaranteed Max Limit
Symbol
VCC
*55_C to 25_C
t85_C
t125_C
Unit
Minimum High−Level Input
Voltage, Enable Inputs
VIH
3.0
4.5
5.5
1.4
2.0
2.0
1.4
2.0
2.0
1.4
2.0
2.0
V
Maximum Low−Level Input
Voltage, Enable Inputs
VIL
3.0
4.5
5.5
0.53
0.8
0.8
0.53
0.8
0.8
0.53
0.8
0.8
V
Parameter
Condition
Maximum Input Leakage
Current, Enable Inputs
VIN = 5.5 V or GND
IIN
0 V to 5.5 V
0.1
1.0
1.0
A
Maximum Quiescent Supply
Current (per package)
Enable and VIS = VCC or GND
ICC
5.5
1.0
1.0
2.0
A
DC ELECTRICAL CHARACTERISTICS − Analog Section
Guaranteed Max Limit
Parameter
Condition
Symbol
VCC
*55_C to 25_C
t85_C
t125_C
Unit
RON
3.0
4.5
5.5
45
30
25
50
35
30
55
40
35
Maximum ON Resistance
(Figures 8 − 12)
VIN = VIH
VIS = VCC to GND
IIsI = 10.0mA
ON Resistance Flatness
VIN = VIH
IIsI = 10.0 mA
VIS = 1 V, 2 V, 3.5 V
RFLAT(ON)
4.5
4
4
5
Off Leakage Current, Pin 2
(Figure 3)
VIN = VIL
VNO = 1.0 V, VCOM = 4.5 V or
VCOM = 1.0 V and VNO 4.5 V
INO(OFF)
5.5
1
10
100
nA
Off Leakage Current, Pin 1
(Figure 3)
VIN = VIL
VNO = 4.5 V or 1.0 V
VCOM = 1.0 V or 4.5 V
ICOM(OFF)
5.5
1
10
100
nA
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
Guaranteed Max Limit
VCC
Parameter
Test Conditions
Symbol
(V)
Turn−On Time
RL = 300 CL = 35 pF
(Figures 4, 5, and 13)
tON
Turn−Off Time
RL = 300 CL = 35 pF
(Figures 4, 5, and 13)
tOFF
*55_C to 25_C
Min
Typ
Max
2.0
3.0
4.5
5.5
7.0
5.0
4.5
4.5
14
10
9
9
2.0
3.0
4.5
5.5
11.0
7.0
5.0
5.0
22
14
10
10
t85_C
Min
Typ
t125_C
Max
Min
Typ
Max
Unit
16
12
11
11
16
12
11
11
ns
24
16
12
12
24
16
12
12
ns
Typical @ 25, VCC = 5.0 V
Maximum Input Capacitance, Select Input
Analog I/O (switch off)
Common I/O (switch off)
Feedthrough (switch on)
CIN
CNO or CNC
CCOM(OFF)
CCOM(ON)
8
10
10
20
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3
pF
NLAST4501
ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted)
Parameter
Condition
VCC
Limit
Symbol
V
25°C
Unit
Maximum On−Channel −3dB Bandwidth
or Minimum Frequency Response
VIS = 0 dBm
VIS centered between VCC and GND
(Figures 6 and 14)
BW
3.0
4.5
5.5
190
200
220
MHz
Maximum Feedthrough On Loss
VIS = 0 dBm @ 10 kHz
VIS centered between VCC and GND
(Figure 6)
VONL
3.0
4.5
5.5
2
2
2
dB
Off−Channel Isolation
f = 100 kHz; VIS = 1 V RMS
VIS centered between VCC and GND
(Figures 6 and 15)
VISO
3.0
4.5
5.5
93
dB
Charge Injection
Enable Input to Common I/O
VIS = VCC to GND, FIS = 20 kHz
tr = tf = 3 ns
RIS = 0 , CL = 1000 pF
Q = CL * VOUT
(Figures 7 and 16)
Q
3.0
5.5
1.5
3.0
pC
Total Harmonic Distortion
THD Noise
FIS = 20 Hz to 1 MHz, RL = Rgen = 600 , CL = 50 pF
VIS = 3.0 VPP sine wave
VIS = 5.0 VPP sine wave
(Figure 17)
THD
3.3
5.5
0.3
0.15
%
1.00E+05
1.00E+04
1.00E+03
LEAKAGE (pA)
1.00E+02
1.00E+01
ICOM(ON)
1.00E+00
1.00E−01
1.00E−02
1.00E−03
ICOM(OFF)
1.00E−04
1.00E−05
INO(OFF)
1.00E−06
1.00E−07
−55
−35
−15
5
25
45
65
85
105 125 145
TEMPERATURE (_C)
Figure 3. Switch Leakage vs. Temperature
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4
NLAST4501
VCC
DUT
VCC
Input
NO
50%
50%
0V
COM
VOUT
0.1 F
300
VOH
35 pF
90%
90%
Output
VOL
Input
tON
tOFF
Figure 4. tON/tOFF
VCC
VCC
Input
DUT
300
NO
50%
50%
0V
COM
VOUT
VOH
35 pF
Output
Input
tOFF
Figure 5. tON/tOFF
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5
10%
10%
VOL
tON
NLAST4501
DUT
Reference
Transmitted
COM
NO
50 Generator
50
Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is
the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction.
VVOUT
for VIN at 100 kHz
IN
VOUT
for VIN at 100 kHz to 50 MHz
VONL = On Channel Loss = 20 Log
VIN
VISO = Off Channel Isolation = 20 Log
Bandwidth (BW) = the frequency 3 dB below VONL
Figure 6. Off Channel Isolation/On Channel Loss (BW)/Crosstalk
(On Channel to Off Channel)/VONL
DUT
NO
VCC
VIN
COM
GND
CL
Output
Off
VIN
Figure 7. Charge Injection: (Q)
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6
On
Off
VOUT
NLAST4501
80
80
70
70
60
VCC = 2.0
50
50
RON ()
RON ()
60
40
VCC = 2.5
30
−55°C
30
25°C
VCC = 3.0
20
40
20
85°C
VCC = 4.5
10
10
0
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
125°C
0
5
0.2
0.4
0.6
0.8
1
1.2 1.4
1.6
1.8
VCOM (VOLTS)
VIS (VOLTS)
Figure 8. RON vs. VCOM and VCC (@255C)
Figure 9. RON vs. VCOM and Temperature,
VCC = 2.0 V
45
2
30
40
20
25
RON ()
RON ()
30
−55°C
20
25°C
15
10
15
125°C
25°C
85°C
10
85°C
5
125°C
5
0
−55°C
25
35
0
0.2 0.4 0.6 0.8 1
1.2 1.4 1.6 1.8
2
0
2.2 2.4
0
0.3
0.6
0.9
1.2 1.5
1.8
2.1
2.4
2.7
VCOM (VOLTS)
VCOM (VOLTS)
Figure 10. RON vs. VCOM and Temperature,
VCC = 2.5 V
Figure 11. RON vs. VCOM and Temperature,
VCC = 3.0 V
3
35.0
18
30.0
16
−55°C
25°C
25.0
12
TIME (nS)
RON ()
14
85°C
10
8
15.0
4
5.0
2
0.0
2.0
0
tON
10.0
125°C
6
20.0
tOFF
0
0.4 0.8 1.2 1.6
2
2.4 2.8 3.2 3.6
4
4.4
3.0
4.5
5.0
5.5
VCC (V)
VCOM (VOLTS)
Figure 12. RON vs. VCOM and Temperature,
VCC = 4.5 V
Figure 13. Switching Time vs. Supply Voltage,
T = 255C
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7
NLAST4501
0
0
0
BANDWIDTH (dB/Div)
Phase (Degrees)
5
VCC = 5.0 V
TA = 25°C
10
100
1
10
OFF ISOLATION (dB/Div)
10
PHASE (Degrees)
Bandwidth (On − Loss)
−50
VCC = 5.0 V
TA = 25°C
−100
10
100 300
100
1
100 300
10
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 14. ON Channel Bandwidth and Phase
Shift Over Frequency
Figure 15. Off Channel Isolation
100
1.60
1.40
10
VCC = 5.0 V
1.20
0.80
THD (%)
Q (pC)
1.00
VCC = 3.0 V
1
3.3 V
0.60
0.1
0.40
5.5 V
0.20
0.00
0.0
0.01
1.0
2.0
3.6
3.0
VCOM (V)
4.0
4.5
10
5.0
100
1000
10000
100000
1000000
FREQUENCY (Hz)
Figure 16. Charge Injection vs. VCOM
Figure 17. THD vs. Frequency
ORDERING INFORMATION
Device Nomenclature
Device
Circuit
Indicator
Technology
Device
Function
Package
Suffix
Tape &
Reel
Suffix
NLAST4501DFT2
Shipping†
SC−88A/SOT−353/
SC70
DF
NLAST4501DFT2G
Package
NL
AST
T2
4501
NLAST4501DTT1
SC−88A/SOT−353/
SC70
(Pb−Free)
3000/Tape & Reel
TSOP−5
DT
NLAST4501DTT1G
T1
TSOP−5
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
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8
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
SCALE 2:1
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DATE 17 JAN 2013
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
B
M
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
J
GENERIC MARKING
DIAGRAM*
C
K
H
XXXMG
G
SOLDER FOOTPRINT
0.50
0.0197
XXX = Specific Device Code
M
= Date Code
G
= Pb−Free Package
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
mm Ǔ
ǒinches
STYLE 1:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 2:
PIN 1. ANODE
2. EMITTER
3. BASE
4. COLLECTOR
5. CATHODE
STYLE 3:
PIN 1. ANODE 1
2. N/C
3. ANODE 2
4. CATHODE 2
5. CATHODE 1
STYLE 4:
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
5. GATE 2
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
3. EMITTER 1
4. COLLECTOR
5. COLLECTOR 2/BASE 1
STYLE 7:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 8:
PIN 1. CATHODE
2. COLLECTOR
3. N/C
4. BASE
5. EMITTER
STYLE 9:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42984B
STYLE 5:
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
4. CATHODE 3
5. CATHODE 4
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
SC−88A (SC−70−5/SOT−353)
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSOP−5
CASE 483
ISSUE N
5
1
SCALE 2:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
D 5X
NOTE 5
2X
DATE 12 AUG 2020
0.20 C A B
0.10 T
M
2X
0.20 T
5
B
1
4
2
B
S
3
K
DETAIL Z
G
A
A
TOP VIEW
DIM
A
B
C
D
G
H
J
K
M
S
DETAIL Z
J
C
0.05
H
C
SIDE VIEW
SEATING
PLANE
END VIEW
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
0.95
0.037
MILLIMETERS
MIN
MAX
2.85
3.15
1.35
1.65
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0_
10 _
2.50
3.00
1.9
0.074
5
5
XXXAYWG
G
1
1
Analog
2.4
0.094
XXX = Specific Device Code
A
= Assembly Location
Y
= Year
W = Work Week
G
= Pb−Free Package
1.0
0.039
XXX MG
G
Discrete/Logic
XXX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98ARB18753C
TSOP−5
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
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