NLU2G16MUTCG

NLU2G16 Dual Non-Inverting Buffer The NLU2G16 MiniGatet is an advanced high−speed CMOS dual non−inverting buffer in ultra−small footprint. The NLU2G16 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. www.onsemi.com Features High Speed: tPD = 3.5 ns (Typ) @ VCC = 5.0 V Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C Power Down Protection Provided on inputs Balanced Propagation Delays Overvoltage Tolerant (OVT) Input and Output Pins Ultra−Small Packages These are Pb−Free Devices MARKING DIAGRAMS M C M E UDFN6 1.0 x 1.0 CASE 517BX R • • • • • • • M 1 UDFN6 1.2 x 1.0 CASE 517AA 1 IN A1 1 6 OUT Y1 UDFN6 1.45 x 1.0 CASE 517AQ GND 5 2 VCC 1 C, 4, R, E = Device Marking M = Date Code IN A2 3 4 OUT Y2 ORDERING INFORMATION Figure 1. Pinout (Top View) IN A1 1 OUT Y1 IN A2 1 OUT Y2 See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Figure 2. Logic Symbol PIN ASSIGNMENT 1 IN A1 2 GND 3 IN A2 4 OUT Y2 5 VCC 6 OUT Y1 FUNCTION TABLE A Y L H L H © Semiconductor Components Industries, LLC, 2016 July, 2016 − Rev. 6 1 Publication Order Number: NLU2G16/D NLU2G16 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage −0.5 to +7.0 V VIN DC Input Voltage −0.5 to +7.0 V DC Output Voltage −0.5 to +7.0 V VIN < GND −20 mA VOUT < GND ±20 mA VOUT Parameter IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Source/Sink Current ±12.5 mA ICC DC Supply Current Per Supply Pin ±25 mA IGND DC Ground Current per Ground Pin ±25 mA TSTG Storage Temperature Range −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias 150 °C MSL FR ILATCHUP Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in ±500 Latchup Performance Above VCC and Below GND at 125°C (Note 2) mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 1.65 5.5 V VCC Positive DC Supply Voltage VIN Digital Input Voltage 0 5.5 V Output Voltage 0 5.5 V −55 +125 °C 0 0 100 20 ns/V VOUT TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 2 NLU2G16 DC ELECTRICAL CHARACTERISTICS Symbol VIH VIL VOH VOL Parameter VCC (V) Conditions Low−Level Input Voltage Low−Level Input Voltage High−Level Output Voltage Low−Level Output Voltage TA = 25 5C Min Typ TA = +855C Max Min 1.65 0.75 x VCC 0.75 x VCC 2.3 to 5.5 0.70 x VCC 0.70 x VCC Max TA = −555C to +1255C Min Max V 1.65 0.25 x VCC 0.25 x VCC 0.25 x VCC 2.3 to 5.5 0.30 x VCC 0.30 x VCC 0.30 x VCC VIN = VIH or VIL IOH = −50 mA 2.0 3.0 4.5 1.9 2.9 4.4 VIN = VIH or VIL IOH = −4 mA IOH = −8 mA 3.0 4.5 2.58 3.94 VIN = VIH or VIL IOL = 50 mA 2.0 3.0 4.5 VIN = VIH or VIL IOL = 4 mA IOL = 8 mA 2.0 3.0 4.5 Unit 1.9 2.9 4.4 1.9 2.9 4.4 2.48 3.80 2.34 3.66 V V V 0 0 0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 V IIN Input Leakage Current 0 v VIN v 5.5 V 0 to 5.5 ±0.1 ±1.0 ±1.0 mA ICC Quiescent Supply Current VIN = 5.5 V or GND 5.5 1.0 10 40 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 nS) TA = 25 5C TA = +855C TA = −555C to +1255C Symbol Parameter VCC (V) Test Condition Typ Max Max Unit tPLH, tPHL Propagation Delay, Input A to Output Y 3.0 to 3.6 CL = 15 pF 4.5 7.1 8.5 10 ns CL = 50 pF 6.4 10.6 12 14.5 4.5 to 5.5 CL = 15 pF 3.5 5.5 6.5 8.0 CL = 50 pF 4.5 7.5 8.5 10 4.0 10 10 10 CIN Input Capacitance CPD Power Dissipation Capacitance (Note 3) Min 5.0 8.0 Min Max Min pF pF 3. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no−load dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC. www.onsemi.com 3 NLU2G16 SWITCHING WAVEFORMS TEST POINT VCC 50% OUTPUT A GND DEVICE UNDER TEST tPHL tPLH 50% VCC CL * Y *Includes all probe and jig capacitance Figure 3. Switching Waveforms Figure 4. Test Circuit ORDERING INFORMATION Package Shipping† NLU2G16MUTCG UDFN6, 1.2 x 1.0, 0.4P (Pb−Free) 3000 / Tape & Reel NLU2G16AMUTCG UDFN6, 1.45 x 1.0, 0.5P (Pb−Free) 3000 / Tape & Reel NLU2G16CMUTCG UDFN6, 1.0 x 1.0, 0.35P (Pb−Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). www.onsemi.com 4 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN6, 1.2x1.0, 0.4P CASE 517AA−01 ISSUE D 1 SCALE 8:1 EDGE OF PACKAGE 2X 0.10 C ÉÉ ÉÉ ÉÉ L1 E DETAIL A Bottom View (Optional) TOP VIEW 2X EXPOSED Cu 0.10 C (A3) 0.10 C A1 A 10X 0.08 C ÉÉÉ ÉÉÉ A3 DETAIL B Side View (Optional) 5X XM L 3 X M L2 b 0.10 C A B 0.05 C 6 = Specific Device Code = Date Code *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 4 e NOTE 3 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.30 0.40 0.00 0.15 0.40 0.50 GENERIC MARKING DIAGRAM* C A1 6X DIM A A1 A3 b D E e L L1 L2 MOLD CMPD SEATING PLANE SIDE VIEW 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B D PIN ONE REFERENCE DATE 03 SEP 2010 MOUNTING FOOTPRINT* BOTTOM VIEW 6X 6X 0.42 0.40 PITCH 0.22 1.07 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON22068D 6 PIN UDFN, 1.2X1.0, 0.4P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN6, 1.45x1.0, 0.5P CASE 517AQ ISSUE O 1 SCALE 4:1 A B D DATE 15 MAY 2008 L L NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. L1 PIN ONE REFERENCE 0.10 C ÉÉÉ ÉÉÉ DETAIL A E OPTIONAL CONSTRUCTIONS ÉÉ ÉÉ EXPOSED Cu TOP VIEW 0.10 C DETAIL B MOLD CMPD DETAIL B 0.05 C 6X DIM A A1 A2 b D E e L L1 OPTIONAL CONSTRUCTIONS A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.07 REF 0.20 0.30 1.45 BSC 1.00 BSC 0.50 BSC 0.30 0.40 −−− 0.15 MOUNTING FOOTPRINT 0.05 C A1 SIDE VIEW A2 e 6X C SEATING PLANE 6X 0.30 PACKAGE OUTLINE L 1.24 3 1 DETAIL A 6X 0.53 6 4 6X BOTTOM VIEW b 0.10 C A B 0.05 C NOTE 3 1 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. GENERIC MARKING DIAGRAM* XM X M = Specific Device Code = Date Code *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. DOCUMENT NUMBER: DESCRIPTION: 98AON30313E UDFN6, 1.45x1.0, 0.5P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN6, 1x1, 0.35P CASE 517BX ISSUE O SCALE 4:1 PIN ONE REFERENCE 2X 0.10 C 2X 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D ÉÉ ÉÉ ÉÉ DATE 18 MAY 2011 E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 0.05 C SIDE VIEW A1 C SEATING PLANE RECOMMENDED SOLDERING FOOTPRINT* 5X e 5X 0.48 L 6X 0.22 3 1 L1 1.18 6 4 6X BOTTOM VIEW b 0.10 M C A B 0.05 M C NOTE 3 0.53 1 PKG OUTLINE 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. GENERIC MARKING DIAGRAM* XM 1 X = Specific Device Code M = Date Code *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. DOCUMENT NUMBER: DESCRIPTION: 98AON56787E UDFN6, 1x1, 0.35P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. 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