NLV27WZ125USG

DATA SHEET www.onsemi.com Dual Buffer with 3-State Outputs MARKING DIAGRAMS NL27WZ125 US8 US SUFFIX CASE 493 The NL27WZ125 is a high performance dual noninverting buffer operating from a 1.65 V to 5.5 V supply. Commercial Features • • • • • • • • • XXXX ALYW Designed for 1.65 V to 5.5 V VCC Operation 2.4 ns tPD at VCC = 5 V (typ) Inputs/Outputs Overvoltage Tolerant up to 5.5 V IOFF Supports Partial Power Down Protection Source/Sink 24 mA at 3.0 V Available in US8, UDFN8 and UQFN8 Packages Chip Complexity < 100 FETs NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant OE1 EN A1 OE2 EN A2 XX M G NLV Prefix UDFN8, 1.45x1.0 MU3 SUFFIX CASE 517BZ XM 1 UDFN8, 1.95x1.0 MU1 SUFFIX CASE 517CA 1 UQFN8, 1.4x1.2 MQ2 SUFFIX CASE 523AS Y1 Y2 Figure 1. Logic Symbol 1 8 UQFN8, 1.6x1.6 MQ1 SUFFIX CASE 523AN X, XX, XXXX A L Y W M G XM XM 1 1 XX MG = Specific Device Code = Assembly Location = Lot Code = Year Code = Week Code = Date Code = Pb−Free Package ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 7 of this data sheet. © Semiconductor Components Industries, LLC, 2011 March, 2022 − Rev. 13 1 Publication Order Number: NL27WZ125/D NL27WZ125 OE1 1 8 VCC A1 2 7 OE2 Y2 3 6 Y1 GND 4 5 OE1 1 8 VCC A1 2 7 OE2 Y2 3 6 Y1 OE1 7 GND 4 8 A2 US8 4 5 Y2 5 VCC 1 OE2 GND A1 6 A2 2 Y1 3 A2 UQFN8 UDFN8 Figure 2. Pinout PIN ASSIGNMENT (US8 / UDFN8) PIN ASSIGNMENT (UQFN8) FUNCTION TABLE Input Output Pin Function Pin Function 1 OE1 1 OE2 OEn An Yn 2 A1 2 Y1 L L L 3 Y2 3 A2 L H H 4 GND 4 GND H X Z 5 A2 5 Y2 6 Y1 6 A1 7 OE2 7 OE1 8 VCC 8 VCC www.onsemi.com 2 X = Don’t Care n = 1, 2 NL27WZ125 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage NLV −0.5 to +7.0 −0.5 to +6.5 V VIN DC Input Voltage NLV −0.5 to +7.0 −0.5 to +6.5 V VOUT Characteristics DC Output Voltage (NLV) Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) −0.5 to VCC + 0.5 −0.5 to +7.0 −0.5 to +7.0 V DC Output Voltage Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) −0.5 to VCC + 0.5 −0.5 to +6.5 −0.5 to +6.5 V VIN < GND −50 mA VOUT < GND −50 mA IIK DC Input Diode Current IOK DC Output Diode Current IOUT DC Output Source/Sink Current ±50 mA DC Supply Current per Supply Pin or Ground Pin ±100 mA −65 to +150 °C ICC or IGND TSTG Storage Temperature Range TL Lead Temperature, 1 mm from Case for 10 secs 260 °C TJ Junction Temperature Under Bias +150 °C qJA Thermal Resistance (Note 2) US8 UQFN8 UDFN8 250 210 231 °C/W PD Power Dissipation in Still Air US8 UQFN8 UDFN8 500 595 541 mW Level 1 − MSL Moisture Sensitivity FR Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in − ESD Withstand Voltage (Note 3) Human Body Model Charged Device Model 2000 1000 V ±100 mA VESD ILatchup Latchup Performance (Note 4) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Applicable to devices with outputs that may be tri−stated. 2. Measured with minimum pad spacing on an FR4 board, using 10mm−by−1inch, 2 ounce copper trace no air flow per JESD51−7. 3. HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to EIA/JESD22−C101−F. JEDEC recommends that ESD qualification to EIA/JESD22−A115−A (Machine Model) be discontinued per JEDEC/JEP172A. 4. Tested to EIA/JESD78 Class II. RECOMMENDED OPERATING CONDITIONS Symbol Characteristics VCC Positive DC Supply Voltage VIN DC Input Voltage VOUT TA tr , tf DC Output Voltage Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) Operating Temperature Range Input Rise and Fall Time VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V Min Max Unit 1.65 5.5 V 0 5.5 V 0 0 0 VCC 5.5 5.5 −55 +125 °C 0 0 0 0 20 20 10 5 ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 3 NL27WZ125 DC ELECTRICAL CHARACTERISTICS Symbol VIH VIL TA = 255C −555C 3 TA 3 1255C VCC (V) Min Typ Max Min Max Units High−Level Input Voltage (NLV) 1.65 to 1.95 0.75 x VCC − − 0.75 x VCC − V 2.3 to 5.5 0.70 x VCC − − 0.70 x VCC − High−Level Input Voltage 1.65 to 1.95 0.65 x VCC − − 0.65 x VCC − 2.3 to 5.5 0.70 x VCC − − 0.70 x VCC − Low−Level Input Voltage (NLV) 1.65 to 1.95 − − 0.25 x VCC − 0.25 x VCC 2.3 to 5.5 − − 0.30 x VCC − 0.30 x VCC Low−Level Input Voltage 1.65 to 1.95 − − 0.35 x VCC − 0.35 x VCC Parameter Condition V V V 2.3 to 5.5 − − 0.30 x VCC − 0.30 x VCC VOH High−Level Output Voltage VIN = VIH or VIL IOH = −100 mA IOH = −4 mA IOH = −8 mA IOH = −12 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 VCC 1.4 2.1 2.4 2.7 2.5 4.0 − − − − − − − VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 − − − − − − − VOL Low−Level Output Voltage VIN = VIH or VIL IOL = 100 mA IOL = 4 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 − − − − − − − − 0.08 0.2 0.22 0.28 0.38 0.42 0.1 0.24 0.3 0.4 0.4 0.55 0.55 − − − − − − − 0.1 0.24 0.3 0.4 0.4 0.55 0.55 Input Leakage Current VIN = 5.5 V or GND 1.65 to 5.5 − − ±0.1 − ±1.0 mA IOFF Power Off Leakage Current VIN = 5.5 V or VOUT = 5.5 V 0 − − 1.0 − 10 mA ICC Quiescent Supply Current VIN = VCC or GND 5.5 − − 1.0 − 10 mA IOZ 3−State Output Leakage VIN = VIL or VIH VOUT = 0 V to 5.5 V 1.65 to 5.5 − − ±0.5 − ±5 mA IIN V V Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 4 NL27WZ125 AC ELECTRICAL CHARACTERISTICS Symbol tPLH, tPHL VCC (V) Typ Max Min Max Units − 6.0 12.0 − 13.0 ns − 3.5 7.5 − 8.0 3.0 to 3.6 − 2.6 5.2 − 5.5 4.5 to 5.5 − 2.0 4.5 − 4.8 CL = 50 pF, RL = 500 W R1 = Open − 3.0 5.7 − 6.0 − 2.4 5.0 − 5.3 RL = 500 W, CL = 50 pF − 0.08 1.0 − 1.0 4.5 to 5.5 − 0.05 0.8 − 0.8 1.65 to 1.95 − 6.5 14.0 − 15.0 2.3 to 2.7 − 3.7 8.5 − 9.0 3.0 to 3.6 − 2.8 6.2 − 6.5 4.5 to 5.5 − 2.1 5.5 − 5.8 1.65 to 1.95 − 4.2 12.0 − 13.0 2.3 to 2.7 − 3.1 8.0 − 8.5 3.0 to 3.6 − 2.6 5.7 − 6.0 4.5 to 5.5 − 2.6 4.7 − 5.0 4.5 to 5.5 Output to Output Skew tPZH, tPZL Output Enable Time, OE to Y tPHZ, tPLZ Output Enable Time, OE to Y Condition 1.65 to 1.95 CL = 15 pF, RL = 1 MW R1 = Open 2.3 to 2.7 3.0 to 3.6 tOSLH, tOSHL −555C 3 TA 3 1255C Min Parameter Propagation Delay, A to Y TA = 255C 3.0 to 3.6 ns ns ns CAPACITIVE CHARACTERISTICS Symbol CIN Parameter Condition Typical Units Input Capacitance VCC = 5.5 V, VIN = 0 V or VCC 2.5 pF COUT Output Capacitance VCC = 5.5 V, VIN = 0 V or VCC 2.5 pF CPD Power Dissipation Capacitance (Note 5) 10 MHz, VCC = 3.3 V, VIN = 0 V or VCC 10 MHz, VCC = 5.5 V, VIN = 0 V or VCC 9 11 pF 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD  VCC  fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD  VCC2  fin + ICC  VCC. www.onsemi.com 5 NL27WZ125 OPEN 2 x VCC Test Switch Position tPLH / tPHL Open tPLZ / tPZL 2 x VCC 50 500 500 tPHZ / tPZH GND 50 500 500 GND R1 OUTPUT DUT RL RT CL, pF RL, W R1 , W See AC Characteristics Table X = Don’t Care CL * CL includes probe and jig capacitance RT is ZOUT of pulse generator (typically 50 W) f = 1 MHz Figure 3. Test Circuit tr = 3 ns tf = 3 ns 90% 90% Vmi INPUT Vmi INPUT Vmi 10% 10% tPHL Vmi GND GND tPZL tPLH Vmo OUTPUT VCC VCC tPLZ ~VCC VOH Vmo OUTPUT Vmo VOL + VY VOL VOL tPLH OUTPUT tPHL Vmo tPZH VOH Vmo tPHZ VOH VOH − VY Vmo OUTPUT VOL ~0 V Figure 4. Switching Waveforms Vmo, V VCC, V Vmi, V tPLH, tPHL 1.65 to 1.95 VCC/2 VCC/2 VCC/2 0.15 2.3 to 2.7 VCC/2 VCC/2 VCC/2 0.15 3.0 to 3.6 VCC/2 VCC/2 VCC/2 0.3 4.5 to 5.5 VCC/2 VCC/2 VCC/2 0.3 www.onsemi.com 6 tPZL, tPLZ, tPZH, tPHZ VY, V NL27WZ125 DEVICE ORDERING INFORMATION Packages Specific Device Code Pin 1 Orientation (See below) Shipping† NL27WZ125USG US8 M0 Q4 3000 / Tape & Reel NL27WZ125USG−F22190** US8 M0 Q4 3000 / Tape & Reel Device NLV27WZ125USG* US8 M0 Q4 3000 / Tape & Reel NL27WZ125MQ1TCG (In Development) UQFN8, 1.6 x 1.6, 0.5P TBD TBD 3000 / Tape & Reel NL27WZ125MU1TCG (In Development) UDFN8, 1.95 x 1.0, 0.5P TBD TBD 3000 / Tape & Reel NL27WZ125MU3TCG (In Development) UDFN8, 1.45 x 1.0, 0.35P TBD TBD 3000 / Tape & Reel NL27WZ125MQ2TCG (In Development) UQFN8, 1.4 x 1.2, 0.4P TBD TBD 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. ** Please refer to NLV specifications for this device. Pin 1 Orientation in Tape and Reel www.onsemi.com 7 NL27WZ125 PACKAGE DIMENSIONS US8 US SUFFIX CASE 493−02 ISSUE B −X− A 8 J −Y− 5 B DETAIL E L 1 4 R G P NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055”) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTER−LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203 MM. (300−800 “). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002 “). S U C −T− SEATING PLANE 0.10 (0.004) M H 0.10 (0.004) T K D N R 0.10 TYP T X Y V M F DETAIL E SOLDERING FOOTPRINT* 3.8 0.015 0.50 0.0197 1.8 0.07 0.30 0.012 1.0 0.0394 SCALE 8:1 *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 8 mm Ǔ ǒinches DIM A B C D F G H J K L M N P R S U V MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC NL27WZ125 PACKAGE DIMENSIONS UDFN8, 1.45x1, 0.35P CASE 517BZ ISSUE O ÉÉ ÉÉ PIN ONE REFERENCE 2X 0.10 C 2X 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X 0.48 e/2 e 1 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.45 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 L 8X 0.22 4 L1 1.18 8 5 BOTTOM VIEW 8X 0.53 b 0.10 M C A B 0.05 M C NOTE 3 1 PKG OUTLINE 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 9 NL27WZ125 PACKAGE DIMENSIONS UDFN8, 1.95x1, 0.5P CASE 517CA ISSUE O PIN ONE REFERENCE 2X 0.10 C 2X ÉÉ ÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X e/2 e 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.95 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 0.49 L 8X 0.30 4 1 L1 1.24 8 5 BOTTOM VIEW 8X b 0.10 M C A B 0.05 M C 0.54 NOTE 3 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 10 1 PKG OUTLINE NL27WZ125 PACKAGE DIMENSIONS UQFN8, 1.4x1.2, 0.4P CASE 523AS ISSUE A PIN ONE REFERENCE 2X 2X 0.10 C L1 ÉÉ ÉÉ 0.10 C DETAIL A E ALTERNATE CONSTRUCTIONS EXPOSED Cu (A3) A MOLD CMPD DETAIL B 0.05 C ALTERNATE CONSTRUCTION 0.05 C A1 SIDE VIEW L2 DETAIL A DIM A A1 A3 b D E e L L1 L2 ÉÉ ÇÇ TOP VIEW DETAIL B 8X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM THE TERMINAL TIP. L L A B D 2 C SOLDERING FOOTPRINT* SEATING PLANE 1.61 0.55 L 4 1 e 8 1.40 6 BOTTOM VIEW MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.40 BSC 1.20 BSC 0.40 BSC 0.20 0.40 −−− 0.15 0.30 0.50 6X 1 7X 0.45 b 0.10 M C A B 0.05 M C NOTE 3 8X 0.25 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 11 NL27WZ125 PACKAGE DIMENSIONS UQFN8, 1.6x1.6, 0.5P CASE 523AN ISSUE O A B D PIN ONE REFERENCE 2X 0.10 C ÉÉ ÉÉ EXPOSED Cu E A1 ÇÇ ÉÉ ÉÉ MOLD CMPD A3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. DETAIL B DIM A A1 A3 b D E e L L1 L3 OPTIONAL CONSTRUCTION 2X 0.10 C TOP VIEW L1 (A3) DETAIL B L3 A 0.05 C b 0.05 C SIDE VIEW (0.10) C A1 SEATING PLANE (0.15) 8X L 1.70 OPTIONAL CONSTRUCTION 1 DETAIL A 0.50 PITCH 1 e 5 3 SOLDERING FOOTPRINT* DETAIL A 8X L3 MILLIMETERS MIN MAX 0.45 0.60 0.00 0.05 0.13 REF 0.15 0.25 1.60 BSC 1.60 BSC 0.50 BSC 0.35 0.45 −−− 0.15 0.25 0.35 0.35 1.70 7 8 8X b 7X 0.10 C A B BOTTOM VIEW 0.05 C 0.25 8X 0.53 NOTE 3 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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