NLV7SZ98DFT2G

DATA SHEET www.onsemi.com Configurable Multifunction Gate NL7SZ98 MARKING DIAGRAMS 6 The NL7SZ98 is an advanced high−speed CMOS multifunction gate. The device allows the user to choose logic functions MUX, AND, OR, NAND, NOR, INVERT and BUFFER. The device has Schmitt−trigger inputs, thereby enhancing noise immunity. Features • • • • • • • • • 1 XXXMG G 1 6 Designed for 1.65 V to 5.5 V VCC Operation 3.3 ns tPD at VCC = 5 V (Typ) Inputs/Outputs Overvoltage Tolerant up to 5.5 V IOFF Supports Partial Power Down Protection Sink 24 mA at 3.0 V Available in SC−88, SC-74 and UDFN6 Packages Chip Complexity < 100 FETs NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant SC−88/SC70−6/ SOT−363 CASE 419B−02 1 1 SC−74 CASE 318F−05 XXX MG G 1 UDFN6, 1.45x1.0, 0.5P CASE 517AQ UDFN6, 1x1, 0.35P CASE 517BX XM XM 1 XXX = Specific Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location or may not be present) *Date Code orientation and/or position may vary depending upon manufacturing location. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. © Semiconductor Components Industries, LLC, 2014 July, 2022 − Rev. 7 1 Publication Order Number: NL7SZ98/D NL7SZ98 B 1 6 C GND 2 5 VCC A 3 4 Y B 1 6 C GND 2 5 VCC A 3 4 Y UDFN6 (SC−88 / SC−74) Figure 1. Pinout (Top View) A Y B C Figure 2. Function Diagram PIN ASSIGNMENT FUNCTION TABLE* Pin Function Input Output 1 B A B C Y 2 GND L L L H 3 A L L H H 4 Y L H L L 5 VCC L H H H 6 C H L L H H L H L H H L L H H H L *To select a logic function, please refer to “Logic Configurations section”. www.onsemi.com 2 NL7SZ98 LOGIC CONFIGURATIONS VCC B B Y A A 1 6 2 5 3 4 VCC C A Y C Y A 1 6 2 5 3 4 C Y C Figure 3. 2−Input MUX with Output Inverted Figure 4. 2−Input NAND (When B = “L”) VCC VCC A C A C B Y A 1 6 2 5 3 4 Y C C Y B Y B Y C 1 6 2 5 3 4 C Y Figure 5. 2−Input NOR with Input C Inverted (When B = “H”) Figure 6. 2−Input NAND with Input C Inverted (When A = “L”) VCC VCC B C B Y 1 6 2 5 3 4 C C Y Y Figure 7. 2−Input NOR (When A =”H”) 6 2 5 3 4 C Y Figure 8. Buffer (When A = “L” and B = “H”) VCC B B 1 Y 1 6 2 5 3 4 Y Figure 9. Inverter (When A = C = “L”) www.onsemi.com 3 NL7SZ98 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage (NLV) −0.5 to +7.0 −0.5 to +6.5 V VIN DC Input Voltage (NLV) −0.5 to +7.0 −0.5 to +6.5 V VOUT Parameter DC Output Voltage (NLV) Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) −0.5 to VCC + 0.5 −0.5 to +7.0 −0.5 to +7.0 V DC Output Voltage Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) −0.5 to VCC + 0.5 −0.5 to +6.5 −0.5 to +6.5 V VIN < GND −50 mA VOUT < GND −50 mA IIK DC Input Diode Current IOK DC Output Diode Current IOUT DC Output Source/Sink Current $50 mA DC Supply Current per Supply Pin or Ground Pin $100 mA −65 to +150 °C 260 °C ICC or IGND TSTG Storage Temperature Range TL Lead Temperature, 1 mm from Case for 10 Secs TJ Junction Temperature Under Bias +150 °C qJA Thermal Resistance (Note 2) SC−88 SC−74 UDFN6 377 320 154 °C/W PD Power Dissipation in Still Air SC−88 SC−74 UDFN6 332 390 812 mW MSL FR VESD ILATCHUP Moisture Sensitivity Level 1 Flammability Rating Oxygen Oxygen Index: 28 to 34 ESD Withstand Voltage (Note 3) UL 94 V−0 @ 0.125 in Human Body Mode Charged Device Model (NLV) Charged Device Model >2000 >200 N/A V (NLV) $500 $100 mA Latchup Performance (Note 4) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Applicable to devices with outputs that may be tri−stated. 2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow per JESD51−7. 3. CDM tested to EIA/JESD22−C101−F. JEDEC recommends that ESD qualification to EIA/JESD22−A115−A (Machine Model) be discontinued per JEDEC/JEP172A. 4. Tested to EIA/JESD78 Class II. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Positive DC Supply Voltage VIN DC Input Voltage VOUT DC Output Voltage TA Operating Free−Air Temperature tr, tf Input Rise or Fall Rate Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V Min Max Unit 1.65 5.5 V 0 5.5 V 0 5.5 V −55 +125 °C 0 0 0 0 No Limit No Limit No Limit No Limit nS/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 4 NL7SZ98 DC ELECTRICAL CHARACTERISTICS Symbol VT+ Parameter Condition Positive Input Threshold Voltage (NLV) Positive Input Threshold Voltage VT− Negative Input Threshold Voltage (NLV) Negative Input Threshold Voltage VH Negative Input Threshold Voltage (NLV) Negative Input Threshold Voltage VOH TA = 255C −405C v TA v 855C −555C v TA v 1255C VCC (V) Min Typ Max Min Max Min Max Unit 1.65 0.79 − 1.16 − 1.16 − 1.16 V 2.3 1.11 − 1.56 − 1.56 − 1.56 3.0 1.5 − 1.87 − 1.87 − 1.87 4.5 2.16 − 2.74 − 2.74 − 2.74 5.5 2.61 − 3.33 − 3.33 − 3.33 1.65 − − 1.4 − 1.4 − 1.4 2.3 − − 1.8 − 1.8 − 1.8 3.0 − − 2.2 − 2.2 − 2.2 4.5 − − 3.1 − 3.1 − 3.1 5.5 − − 3.6 − 3.6 − 3.6 1.65 0.35 − 0.62 0.35 − 0.35 − 2.3 0.58 − 0.87 0.58 − 0.58 − 3.0 0.84 − 1.19 0.84 − 0.84 − 4.5 1.41 − 1.9 1.41 − 1.41 − 5.5 1.78 − 2.2 1.78 − 1.78 − 1.65 0.2 − − 0.2 − 0.2 − 2.3 0.4 − − 0.4 − 0.4 − 3.0 0.6 − − 0.6 − 0.6 − 4.5 1.0 − − 1.0 − 1.0 − 5.5 1.2 − − 1.2 − 1.2 − 1.65 0.3 − 0.62 0.3 0.62 0.3 0.62 2.3 0.4 − 0.8 0.4 0.8 0.4 0.8 3.0 0.53 − 0.87 0.53 0.87 0.53 0.87 4.5 0.71 − 1.04 0.71 1.04 0.71 1.04 5.5 0.8 − 1.2 0.8 1.2 0.8 1.2 1.65 0.1 0.1 0.9 0.48 0.9 0.1 0.9 2.3 0.25 0.25 1.1 0.75 1.1 0.25 1.1 3.0 0.4 0.4 1.2 0.93 1.2 0.4 1.2 4.5 0.6 0.6 1.5 1.2 1.5 0.6 1.5 5.5 0.7 0.7 1.7 1.4 1.7 0.7 1.7 High−Level Output Voltage IOH = −50 mA 1.65 to 5.5 VCC − 0.1 VCC − VCC − 0.1 − VCC − 0.1 − VIN = VIH or VIL IOH = −4 mA 1.65 1.20 1.52 − 1.20 − 1.20 − IOH = −8 mA 2.3 1.9 2.1 − 1.9 − 1.9 − IOH = −16 mA 3 2.4 2.7 − 2.4 − 2.4 − IOH = −24 mA 3 2.3 2.5 − 2.3 − 2.3 − IOH = −32 mA 4.5 3.8 4 − 3.8 − 3.8 − www.onsemi.com 5 V V V V V V NL7SZ98 DC ELECTRICAL CHARACTERISTICS VCC (V) −405C v TA v 855C −555C v TA v 1255C Min Typ Max Min Max Min Max Unit 1.65 to 5.5 − − 0.1 − 0.1 − 0.1 V IOL = 4 mA 1.65 − 0.08 0.45 − 0.45 − 0.45 IOL = 8 mA 2.3 − 0.2 0.3 − 0.3 − 0.4 IOL = 16 mA 3 − 0.28 0.4 − 0.4 − 0.5 IOL = 24 mA 3 − 0.38 0.55 − 0.55 − 0.55 IOL = 32 mA 4.5 − 0.42 0.55 − 0.55 − 0.65 Symbol Parameter VOL Low−Level Output Voltage IOL = 100 mA VIN = VIH or VIL IIN TA = 255C Condition Input Leakage Current VIN = 5.5 V or GND 1.65 to 5.5 − − +0.1 − +1.0 − +1.0 mA IOFF Power Off Leakage Current VIN = 5.5 V or VOUT = 5.5 V 0 − − 1.0 − 10 − 10 mA ICC Quiescent Supply Current VIN = 5.5 V or GND 5.5 − − 1.0 − 10 − 10 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. AC ELECTRICAL CHARACTERISTICS TA = 255C Symbol Parameter tPLH, tPHL Propagation Delay, (A or B or C) to Y (Figures 10 and 11) −405C v TA v 855C −555C v TA v 1255C VCC (V) Min Typ Max Min Max Min Max Unit RL = 1 kW, CL = 30 pF 1.65 to 1.95 − 8.6 14.4 − 14.4 − 14.4 ns RL = 500 W, CL = 30 pF 2.3 to 2.7 − 5.1 8.3 − 8.3 − 8.3 RL = 500 W, CL = 50 pF 3.0 to 3.6 − 3.9 6.3 − 6.3 − 6.3 4.5 to 5.5 − 3.3 5.1 − 5.1 − 5.1 Condition CAPACITIVE CHARACTERISTICS Symbol CIN Parameter Condition Typical Unit Input Capacitance VCC = 5.5 V, VIN = 0 V or VCC 2.5 pF COUT Output Capacitance VCC = 5.5 V, VIN = 0 V or VCC 4.0 pF CPD Power Dissipation Capacitance (Note 5) 10 MHz, VCC = 3.3 V, VIN = 0 V or VCC 10 MHz, VCC = 5.0 V, VIN = 0 V or VCC 16 19.5 pF 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD • VCC2 • fin + ICC • VCC. www.onsemi.com 6 NL7SZ98 OPEN 2 x VCC Test Switch Position tPLH / tPHL Open tPLZ / tPZL 2 x VCC 50 500 500 tPHZ / tPZH GND 50 500 500 GND R1 OUTPUT DUT RL RT CL, pF RL, W R1 , W See AC Characteristics Table X = Don’t Care CL * CL includes probe and jig capacitance RT is ZOUT of pulse generator (typically 50 W) f = 1 MHz Figure 10. Test Circuit tr = 3 ns tf = 3 ns 90% 90% Vmi INPUT Vmi INPUT Vmi 10% 10% tPHL Vmi GND GND tPZL tPLH Vmo OUTPUT VCC VCC tPLZ ~VCC VOH Vmo OUTPUT Vmo VOL + VY VOL VOL tPLH OUTPUT tPHL Vmo tPZH VOH Vmo tPHZ VOH VOH − VY Vmo OUTPUT VOL ~0 V Figure 11. Switching Waveforms Vmo, V VCC, V Vmi, V tPLH, tPHL tPZL, tPLZ, tPZH, tPHZ VY, V 1.65 to 1.95 VCC / 2 VCC / 2 VCC / 2 0.15 2.3 to 2.7 VCC / 2 VCC / 2 VCC / 2 0.15 3.0 to 3.6 VCC / 2 VCC / 2 VCC / 2 0.3 4.5 to 5.5 VCC / 2 VCC / 2 VCC / 2 0.3 www.onsemi.com 7 NL7SZ98 ORDERING INFORMATION Device Shipping† Package NL7SZ98DFT2G SC−88 (Pb−Free) MP Q4 3000 / Tape & Reel NLV7SZ98DFT2G* SC−88 (Pb−Free) MP Q4 3000 / Tape & Reel NL7SZ98DBVT1G (In Development) SC−74 (Pb−Free) AP Q4 3000 / Tape & Reel NL7SZ98MU1TCG (In Development) UDFN6, 1.45 x 1.0, 0.5P (Pb−Free) TBD Q4 3000 / Tape & Reel NL7SZ98MU3TCG (In Development) UDFN6, 1.0 x 1.0, 0.35P (Pb−Free) TBD Q4 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable. Pin 1 Orientation in Tape and Reel www.onsemi.com 8 NL7SZ98 PACKAGE DIMENSIONS www.onsemi.com 9 NL7SZ98 PACKAGE DIMENSIONS SC−88/SC70−6/SOT−363 CASE 419B−02 ISSUE Y 2X aaa H D D H A D 6 5 GAGE PLANE 4 1 2 L L2 E1 E DETAIL A 3 aaa C 2X bbb H D 2X 3 TIPS e B 6X A2 A ccc C A1 SIDE VIEW DIM A A1 A2 b C D E E1 e L L2 aaa bbb ccc ddd b ddd TOP VIEW 6X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END. 4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY AND DATUM H. 5. DATUMS A AND B ARE DETERMINED AT DATUM H. 6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP. 7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDITION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OF THE FOOT. C M C A-B D DETAIL A SEATING PLANE END VIEW c MILLIMETERS MIN NOM MAX −−− −−− 1.10 0.00 −−− 0.10 0.70 0.90 1.00 0.15 0.20 0.25 0.08 0.15 0.22 1.80 2.00 2.20 2.00 2.10 2.20 1.15 1.25 1.35 0.65 BSC 0.26 0.36 0.46 0.15 BSC 0.15 0.30 0.10 0.10 RECOMMENDED SOLDERING FOOTPRINT* 6X 6X 0.30 0.66 2.50 0.65 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 10 INCHES NOM MAX −−− 0.043 −−− 0.004 0.035 0.039 0.008 0.010 0.006 0.009 0.078 0.086 0.082 0.086 0.049 0.053 0.026 BSC 0.010 0.014 0.018 0.006 BSC 0.006 0.012 0.004 0.004 MIN −−− 0.000 0.027 0.006 0.003 0.070 0.078 0.045 NL7SZ98 PACKAGE DIMENSIONS SC−74 CASE 318F−05 ISSUE N D 6 HE 1 5 4 2 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318F−01, −02, −03, −04 OBSOLETE. NEW STANDARD 318F−05. E b e c A 0.05 (0.002) q L A1 SOLDERING FOOTPRINT* 2.4 0.094 0.95 0.037 1.9 0.074 0.95 0.037 0.7 0.028 1.0 0.039 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 11 DIM A A1 b c D E e L HE q MIN 0.90 0.01 0.25 0.10 2.90 1.30 0.85 0.20 2.50 0° MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.37 0.50 0.18 0.26 3.00 3.10 1.50 1.70 0.95 1.05 0.40 0.60 2.75 3.00 10° − MIN 0.035 0.001 0.010 0.004 0.114 0.051 0.034 0.008 0.099 0° INCHES NOM 0.039 0.002 0.015 0.007 0.118 0.059 0.037 0.016 0.108 − MAX 0.043 0.004 0.020 0.010 0.122 0.067 0.041 0.024 0.118 10° NL7SZ98 PACKAGE DIMENSIONS UDFN6, 1.45x1.0, 0.5P CASE 517AQ ISSUE O A B D PIN ONE REFERENCE 0.10 C L1 ÉÉÉ ÉÉÉ ÉÉÉ DETAIL A E OPTIONAL CONSTRUCTIONS ÉÉ ÉÉ EXPOSED Cu TOP VIEW 0.10 C DETAIL B OPTIONAL CONSTRUCTIONS A 0.05 C MOLD CMPD DETAIL B 0.05 C 6X L L A1 A2 SIDE VIEW e 6X C SEATING PLANE L 3 1 DETAIL A 6 4 6X b 0.10 C A B 0.05 C BOTTOM VIEW NOTE 3 MOUNTING FOOTPRINT 6X 0.30 PACKAGE OUTLINE 1.24 6X 0.53 1 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 12 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. DIM A A1 A2 b D E e L L1 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.07 REF 0.20 0.30 1.45 BSC 1.00 BSC 0.50 BSC 0.30 0.40 −−− 0.15 NL7SZ98 PACKAGE DIMENSIONS UDFN6, 1x1, 0.35P CASE 517BX ISSUE O PIN ONE REFERENCE 2X 0.10 C 2X ÉÉÉ ÉÉÉ ÉÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 0.05 C SIDE VIEW A1 C e 5X SEATING PLANE RECOMMENDED SOLDERING FOOTPRINT* L 3 1 5X L1 0.48 6 4 BOTTOM VIEW 6X 6X 0.22 1.18 b 0.10 M C A B 0.05 M C NOTE 3 0.53 1 PKG OUTLINE 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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