Noninverting 3-State Buffer
MC74VHC1G125,
MC74VHC1GT125
The MC74VHC1G125 / MC74VHC1GT125 is a single
non−inverting 3−state buffer in tiny footprint packages. The
MC74VHC1G125 has CMOS−level input thresholds while the
MC74VHC1GT125 has TTL−level input thresholds.
The internal circuit is composed of three stages, including a buffered
3−state output which provides high noise immunity and stable output.
The input structures provide protection when voltages up to 5.5 V
are applied, regardless of the supply voltage. This allows the device to
be used to interface 5 V circuits to 3 V circuits. The output structures
also provide protection when VCC = 0 V and when the output voltage
exceeds VCC. These input and output structures help prevent device
destruction caused by supply voltage − input/output voltage mismatch,
battery backup, hot insertion, etc.
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MARKING
DIAGRAMS
Features
•
•
•
•
•
•
•
•
•
Designed for 2.0 V to 5.5 V VCC Operation
3.5 ns tPD at 5 V (typ)
Inputs/Outputs Over−Voltage Tolerant up to 5.5 V
IOFF Supports Partial Power Down Protection
Source/Sink 8 mA at 3.0 V
Available in SC−88A, SC−74A, TSOP−5, SOT−553, SOT−953 and
UDFN6 Packages
Chip Complexity < 100 FETs
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
OE
EN
A
SC−88A
DF SUFFIX
CASE 419A
XX MG
G
SC−74A
DBV SUFFIX
CASE 318BQ
XXX MG
G
TSOP−5
DT SUFFIX
CASE 483
5
1
5
1
SOT−553
XV5 SUFFIX
CASE 463B
SOT−953
P5 SUFFIX
CASE 527AE
1
XX MG
G
XX MG
G
XM
1
UDFN6
1.45 x 1.0
CASE 517AQ
XM
UDFN6
1.2 x 1.0
CASE 517AA
XM
Y
Figure 1. Logic Symbol
1
UDFN6
1.0 x 1.0
CASE 517BX
XX
M
G
XM
1
= Specific Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 9 of this data sheet.
© Semiconductor Components Industries, LLC, 2012
September, 2020 − Rev. 19
1
Publication Order Number:
MC74VHC1G125/D
MC74VHC1G125, MC74VHC1GT125
VCC
OE
1
5
A
VCC
A
5
1
OE
1
6
VCC
A
2
5
NC
GND
3
4
Y
GND
2
2
GND
Y
4
3
Y
OE
4
3
SOT−953
(SC−88A/SOT−553/
TSOP−5/ SC−74A)
UDFN6
Figure 2. Pinout (Top View)
PIN ASSIGNMENT
(SC−88A/SOT−553/ TSOP−5/SC−74A)
PIN ASSIGNMENT (SOT−953)
PIN ASSIGNMENT (UDFN)
Pin
Function
Pin
Function
Pin
Function
1
OE
1
A
1
OE
2
A
2
GND
2
A
3
GND
3
OE
3
GND
4
Y
4
Y
4
Y
5
VCC
5
VCC
5
NC
6
VCC
FUNCTION TABLE
Input
Output
OE
A
Y
L
L
L
L
H
H
H
X
Z
X = Don’t Care
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2
MC74VHC1G125, MC74VHC1GT125
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
TSOP−5, SC−88A (NLV)
SC−74A, SC−88A, UDFN6, SOT−553, SOT−953
−0.5 to +7.0
−0.5 to +6.5
V
VIN
DC Input Voltage
TSOP−5, SC−88A (NLV)
SC−74A, SC−88A, UDFN6, SOT−553, SOT−953
−0.5 to +7.0
−0.5 to +6.5
V
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (VCC = 0 V)
−0.5 to VCC + 0.5
−0.5 to +7.0
−0.5 to +7.0
V
DC Output Voltage
Active−Mode (High or Low State)
SC−74A, SC−88A, UDFN6, SOT−553, SOT−953
Tri−State Mode (Note 1)
Power−Down Mode (VCC = 0 V)
−0.5 to VCC + 0.5
−0.5 to +6.5
−0.5 to +6.5
V
VIN < GND
−20
mA
VOUT < GND
−20
mA
VOUT
Characteristics
DC Output Voltage
TSOP−5, SC−88A (NLV)
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IOUT
DC Output Source/Sink Current
±25
mA
DC Supply Current per Supply Pin or Ground Pin
±50
mA
−65 to +150
°C
ICC or IGND
TSTG
Storage Temperature Range
TL
Lead Temperature, 1 mm from Case for 10 secs
260
°C
TJ
Junction Temperature Under Bias
+150
°C
qJA
Thermal Resistance (Note 2)
SC−88A
SC−74A
SOT−553
SOT−953
UDFN6
377
320
324
254
154
°C/W
PD
Power Dissipation in Still Air
SC−88A
SC−74A
SOT−553
SOT−953
UDFN6
332
390
386
491
812
mW
Level 1
−
MSL
Moisture Sensitivity
FR
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
−
ESD Withstand Voltage (Note 3)
Human Body Model
Charged Device Model
2000
1000
V
$100
mA
VESD
ILatchup
Latchup Performance (Note 4)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Applicable to devices with outputs that may be tri−stated.
2. Measured with minimum pad spacing on an FR4 board, using 10mm−by−1inch, 2 ounce copper trace no air flow per JESD51−7.
3. HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to EIA/JESD22−C101−F. JEDEC recommends that ESD qualification to
EIA/JESD22−A115−A (Machine Model) be discontinued per JEDEC/JEP172A.
4. Tested to EIA/JESD78 Class II.
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3
MC74VHC1G125, MC74VHC1GT125
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
VCC
Positive DC Supply Voltage
VIN
DC Input Voltage
VOUT
TA
tr , tf
Min
Max
Unit
2.0
5.5
V
0
5.5
V
DC Output Voltage
TSOP−5, SC−88A (NLV)
0
VCC
V
DC Output Voltage
SC−74A, SC−88A, UDFN6, SOT−553, SOT−953
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (VCC = 0 V)
0
0
0
VCC
5.5
5.5
−55
+125
Operating Temperature Range
Input Rise and Fall Time
TSOP−5, SC−88A (NLV)
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
0
0
100
20
Input Rise and Fall Time
SC−74A, SC−88A, UDFN6, SOT−553, SOT−953
VCC = 2.0 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
0
0
0
0
20
20
10
5
°C
ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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4
MC74VHC1G125, MC74VHC1GT125
DC ELECTRICAL CHARACTERISTICS (MC74VHC1G125)
Symbol
VIH
VIL
Parameter
Test
Conditions
High−Level Input
Voltage
Low−Level Input
Voltage
TA = 25°C
−40°C ≤ TA ≤ 85°C
−55°C ≤ TA ≤ 125°C
VCC
(V)
Min
Typ
Max
Min
Max
Min
Max
Unit
2.0
1.5
−
−
1.5
−
1.5
−
V
3.0
2.1
−
−
2.1
−
2.1
−
4.5
3.15
−
−
3.15
−
3.15
−
5.5
3.85
−
−
3.85
−
3.85
−
2.0
−
−
0.5
−
0.5
−
0.5
3.0
−
−
0.9
−
0.9
−
0.9
4.5
−
−
1.35
−
1.35
−
1.35
V
5.5
−
−
1.65
−
1.65
−
1.65
VOH
High−Level Output
Voltage
VIN = VIH or VIL
IOH = −50 mA
IOH = −50 mA
IOH = −50 mA
IOH = −4 mA
IOH = −8 mA
2.0
3.0
4.5
3.0
4.5
1.9
2.9
4.4
2.58
3.94
2.0
3.0
4.5
−
−
−
−
−
−
−
1.9
2.9
4.4
2.48
3.80
−
−
−
−
−
1.9
2.9
4.4
2.34
3.66
−
−
−
−
−
VOL
Low−Level Output
Voltage
VIN = VIH or VIL
IOL = 50 mA
IOL = 50 mA
IOL = 50 mA
IOL = 4 mA
IOL = 8 mA
2.0
3.0
4.5
3.0
4.5
−
−
−
−
−
0.0
0.0
0.0
−
−
0.1
0.1
0.1
0.36
0.36
−
−
−
−
−
0.1
0.1
0.1
0.44
0.44
−
−
−
−
−
0.1
0.1
0.1
0.52
0.52
IIN
Input Leakage
Current
VIN = 5.5 V or
GND
2.0
to 5.5
−
−
±0.1
−
±1.0
−
$1.0
mA
IOZ
3−State Output
Leakage Current
VOUT = 0 V to
5.5 V
5.5
−
−
±0.25
−
$2.5
−
$2.5
mA
IOFF
Power Off Leakage
Current
VIN = 5.5 V or
VOUT = 5.5 V
0
−
−
1.0
−
10
−
10
mA
ICC
Quiescent Supply
Current
VIN = VCC or
GND
5.5
−
−
1.0
−
20
−
40
mA
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5
V
V
MC74VHC1G125, MC74VHC1GT125
DC ELECTRICAL CHARACTERISTICS (MC74VHC1GT125)
Symbol
VIH
VIL
Parameter
Test
Conditions
High−Level Input
Voltage
Low−Level Input
Voltage
TA = 25°C
−40°C ≤ TA ≤ 85°C
−55°C ≤ TA ≤ 125°C
VCC
(V)
Min
Typ
Max
Min
Max
Min
Max
Unit
2.0
1.0
−
−
1.0
−
1.0
−
V
3.0
1.4
−
−
1.4
−
1.4
−
4.5
2.0
−
−
2.0
−
2.0
−
5.5
2.0
−
−
2.0
−
2.0
−
2.0
−
−
0.28
−
0.28
−
0.28
3.0
−
−
0.45
−
0.45
−
0.45
4.5
−
−
0.8
−
0.8
−
0.8
V
5.5
−
−
0.8
−
0.8
−
0.8
VOH
High−Level Output
Voltage
VIN = VIH or VIL
IOH = −50 mA
IOH = −50 mA
IOH = −50 mA
IOH = −4 mA
IOH = −8 mA
2.0
3.0
4.5
3.0
4.5
1.9
2.9
4.4
2.58
3.94
2.0
3.0
4.5
−
−
−
−
−
−
−
1.9
2.9
4.4
2.48
3.80
−
−
−
−
−
1.9
2.9
4.4
2.34
3.66
−
−
−
−
−
VOL
Low−Level Output
Voltage
VIN = VIH or VIL
IOL = 50 mA
IOL = 50 mA
IOL = 50 mA
IOL = 4 mA
IOL = 8 mA
2.0
3.0
4.5
3.0
4.5
−
−
−
−
−
0.0
0.0
0.0
−
−
0.1
0.1
0.1
0.36
0.36
−
−
−
−
−
0.1
0.1
0.1
0.44
0.44
−
−
−
−
−
0.1
0.1
0.1
0.52
0.52
IIN
Input Leakage Current
VIN = 5.5 V or
GND
2.0
to 5.5
−
−
±0.1
−
±1.0
−
$1.0
mA
IOZ
3−State Output
Leakage Current
VOUT = 0 V to
5.5 V
5.5
−
−
±0.25
−
$2.5
−
$2.5
mA
IOFF
Power Off Leakage
Current
VIN = 5.5 V or
VOUT = 5.5 V
0
−
−
1.0
−
10
−
10
mA
ICC
Quiescent Supply
Current
VIN = VCC or
GND
5.5
−
−
1.0
−
20
−
40
mA
ICCT
Increase in Quiescent Supply Current
per Input Pin
One Input: VIN
= 3.4 V; Other
Input at VCC or
GND
5.5
−
−
1.35
−
1.5
−
1.65
mA
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6
V
V
MC74VHC1G125, MC74VHC1GT125
AC ELECTRICAL CHARACTERISTICS
TA = 25°C
Symbol
Parameter
Conditions
VCC (V)
Min
Typ
tPLH,
tPHL
Propagation Delay,
A to Y
(Figures 3 and 4)
CL = 15 pF
3.0 to 3.6
−
−
CL = 50 pF
CL = 15 pF
4.5 to 5.5
CL = 50 pF
tPZL,
tPZH
Output Enable
Time, OE to Y
(Figures 3 and 4)
CL = 15 pF
3.0 to 3.6
CL = 50 pF
CL = 15 pF
4.5 to 5.5
CL = 50 pF
tPLZ,
tPHZ
Output Disable
Time, OE to Y
(Figures 3 and 4)
CL = 15 pF
3.0 to 3.6
CL = 50 pF
CL = 15 pF
4.5 to 5.5
CL = 50 pF
CIN
COUT
Input Capacitance
Output Capacitance
Output in
High
Impedance
State
−40°C ≤ TA ≤ 85°C
Max
Min
4.5
8.0
6.4
11.5
−
3.5
−
−
−55°C ≤ TA ≤ 125°C
Max
Min
Max
Unit
−
9.5
−
12.0
ns
−
13.0
−
16.0
5.5
−
6.5
−
8.5
4.5
7.5
−
8.5
−
10.5
4.5
8.0
−
9.5
−
11.5
−
6.4
11.5
−
13.0
−
15.0
−
3.5
5.1
−
6.0
−
8.5
−
4.5
7.1
−
8.0
−
10.5
−
6.5
9.7
−
11.5
−
14.5
−
8.0
13.2
−
15.0
−
18.0
−
4.8
6.8
−
8.0
−
10.0
−
7.0
8.8
−
10.0
−
12.0
−
4.0
10
−
10
−
10
pF
−
6.0
−
−
−
−
−
pF
ns
ns
Typical @ 25°C, VCC = 5.0 V
CPD
8.0
Power Dissipation Capacitance (Note 5)
pF
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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7
MC74VHC1G125, MC74VHC1GT125
OPEN
VCC
Test
Switch
Position
CL, pF
RL, W
tPLH / tPHL
Open
See AC Characteristics Table
X
tPLZ / tPZL
VCC
1k
tPHZ / tPZH
GND
1k
GND
RL
OUTPUT
DUT
RT
X = Don’t Care
CL *
CL includes probe and jig capacitance
RT is ZOUT of pulse generator (typically 50 W)
f = 1 MHz
Figure 3. Test Circuit
tr = 3 ns
tf = 3 ns
90%
90%
Vmi
INPUT
Vmi
INPUT
Vmi
10%
10%
tPHL
Vmi
GND
GND
tPZL
tPLH
Vmo
OUTPUT
VCC
VCC
tPLZ
Vmo
OUTPUT
Vmo
VOL + VY
VOL
VOL
tPLH
OUTPUT
tPHL
Vmo
~VCC
VOH
tPZH
VOH
Vmo
tPHZ
VOH
VOH − VY
Vmo
OUTPUT
VOL
~0 V
Figure 4. Switching Waveforms
Vmo, V
VCC, V
Vmi, V
tPLH, tPHL
3.0 to 3.6
VCC/2
VCC/2
VCC/2
0.3
4.5 to 5.5
VCC/2
VCC/2
VCC/2
0.3
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8
tPZL, tPLZ, tPZH, tPHZ
VY, V
MC74VHC1G125, MC74VHC1GT125
ORDERING INFORMATION
Packages
Specific Device Code
Pin 1 Orientation
(See below)
Shipping†
M74VHC1G125DFT1G
SC−88A
W0
Q2
3000 / Tape & Reel
M74VHC1G125DFT2G
SC−88A
W0
Q4
3000 / Tape & Reel
NLVVHC1G125DFT1G*
SC−88A
W0
Q2
3000 / Tape & Reel
M74VHC1GT125DF1G
SC−88A
W1
Q2
3000 / Tape & Reel
M74VHC1GT125DF2G
SC−88A
W1
Q4
3000 / Tape & Reel
NLVVHC1GT125DF1G*
SC−88A
W1
Q2
3000 / Tape & Reel
NLVVHC1GT125DF2G*
SC−88A
W1
Q4
3000 / Tape & Reel
MC74VHC1G125DBVT1G
SC−74A
W0
Q4
3000 / Tape & Reel
MC74VHC1GT125DBVT1G
SC−74A
W1
Q4
3000 / Tape & Reel
M74VHC1G125DTT1G
TSOP−5
W0
Q4
3000 / Tape & Reel
M74VHC1GT125DT1G
TSOP−5
W1
Q4
3000 / Tape & Reel
NLVVHC1GT125DT1G*
TSOP−5
W1R
Q4
3000 / Tape & Reel
MC74VHC1G125XV5T2G
(In Development)
SOT−553
TBD
Q4
4000 / Tape & Reel
MC74VHC1GT125XV5T2G
(In Development)
SOT−553
TBD
Q4
4000 / Tape & Reel
MC74VHC1G125P5T5G
SOT−953
T
Q2
8000 / Tape & Reel
MC74VHC1GT125P5T5G
(In Development)
SOT−953
TBD
Q2
8000 / Tape & Reel
MC74VHC1G125MU1TCG
(In Development)
UDFN6, 1.45 x 1.0, 0.5P
TBD
Q4
3000 / Tape & Reel
MC74VHC1GT125MU1TCG
UDFN6, 1.45 x 1.0, 0.5P
D
Q4
3000 / Tape & Reel
MC74VHC1GT125MU2TCG
UDFN6, 1.2 x 1.0, 0.4P
7
Q4
3000 / Tape & Reel
MC74VHC1G125MU3TCG
(In Development)
UDFN6, 1.0 x 1.0, 0.35P
TBD
Q4
3000 / Tape & Reel
MC74VHC1GT125MU3TCG
UDFN6, 1.0 x 1.0, 0.35P
L
Q4
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
Pin 1 Orientation in Tape and Reel
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9
MC74VHC1G125, MC74VHC1GT125
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
M
B
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
J
C
K
H
SOLDER FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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10
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
MC74VHC1G125, MC74VHC1GT125
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
5X
b
0.20 C A B
E1
5
M
4
1
2
E
3
B
0.05
A1
L
DETAIL A
e
A
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
TOP VIEW
A
SIDE VIEW
C
DETAIL A
c
SEATING
PLANE
END VIEW
DIM
A
A1
b
c
D
E
E1
e
L
M
MILLIMETERS
MIN
MAX
0.90
1.10
0.01
0.10
0.25
0.50
0.10
0.26
2.85
3.15
2.50
3.00
1.35
1.65
0.95 BSC
0.20
0.60
0_
10 _
RECOMMENDED
SOLDERING FOOTPRINT*
0.95
PITCH
2.40
5X
1.00
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
11
MC74VHC1G125, MC74VHC1GT125
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE M
D 5X
NOTE 5
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
0.20 C A B
0.10 T
M
2X
0.20 T
B
5
1
4
2
B
S
3
K
DETAIL Z
G
A
A
TOP VIEW
DIM
A
B
C
D
G
H
J
K
M
S
DETAIL Z
J
C
0.05
H
SIDE VIEW
C
SEATING
PLANE
END VIEW
MILLIMETERS
MIN
MAX
2.85
3.15
1.35
1.65
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0_
10 _
2.50
3.00
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
12
MC74VHC1G125, MC74VHC1GT125
PACKAGE DIMENSIONS
SOT−553, 5 LEAD
CASE 463B
ISSUE C
D
−X−
5
A
4
1
e
2
L
E
−Y−
3
b
HE
DIM
A
b
c
D
E
e
L
HE
c
5 PL
0.08 (0.003)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
M
X Y
MILLIMETERS
NOM
MAX
0.55
0.60
0.22
0.27
0.13
0.18
1.60
1.65
1.20
1.25
0.50 BSC
0.10
0.20
0.30
1.55
1.60
1.65
MIN
0.50
0.17
0.08
1.55
1.15
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
13
INCHES
NOM
0.022
0.009
0.005
0.063
0.047
0.020 BSC
0.004
0.008
0.061
0.063
MIN
0.020
0.007
0.003
0.061
0.045
MAX
0.024
0.011
0.007
0.065
0.049
0.012
0.065
MC74VHC1G125, MC74VHC1GT125
PACKAGE DIMENSIONS
SOT−953
CASE 527AE
ISSUE E
X
D
PIN ONE
INDICATOR
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
A
Y
4
HE
E
1
2 3
DIM
A
b
C
D
E
e
HE
L
L2
L3
C
TOP VIEW
SIDE VIEW
e
L
5X
5X
L3
MILLIMETERS
MIN
NOM
MAX
0.34
0.37
0.40
0.10
0.15
0.20
0.07
0.12
0.17
0.95
1.00
1.05
0.75
0.80
0.85
0.35 BSC
0.95
1.00
1.05
0.175 REF
0.05
0.10
0.15
−−−
−−−
0.15
SOLDERING FOOTPRINT*
5X
0.35
5X
0.20
5X
L2
5X
BOTTOM VIEW
b
PACKAGE
OUTLINE
0.08 X Y
1.20
1
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
14
MC74VHC1G125, MC74VHC1GT125
PACKAGE DIMENSIONS
UDFN6, 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
A
B
D
L
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
L1
PIN ONE
REFERENCE
0.10 C
ÉÉÉ
ÉÉÉ
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
ÉÉÉ
ÉÉÉ
EXPOSED Cu
TOP VIEW
0.10 C
DETAIL B
MOLD CMPD
DETAIL B
0.05 C
6X
DIM
A
A1
A2
b
D
E
e
L
L1
OPTIONAL
CONSTRUCTIONS
A
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.07 REF
0.20
0.30
1.45 BSC
1.00 BSC
0.50 BSC
0.30
0.40
−−−
0.15
MOUNTING FOOTPRINT
0.05 C
A1
SIDE VIEW
A2
e
6X
C
6X
SEATING
PLANE
L
1.24
3
1
DETAIL A
6X
0.53
6
0.30
PACKAGE
OUTLINE
4
BOTTOM VIEW
6X
0.50
PITCH
DIMENSIONS: MILLIMETERS
b
0.10 C A B
0.05 C
1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTE 3
www.onsemi.com
15
MC74VHC1G125, MC74VHC1GT125
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA−01
ISSUE D
EDGE OF PACKAGE
L1
ÉÉ
ÉÉ
PIN ONE
REFERENCE
2X
0.10 C
E
DETAIL A
Bottom View
(Optional)
TOP VIEW
2X
EXPOSED Cu
0.10 C
(A3)
0.10 C
A1
A
10X
0.08 C
ÉÉÉ
ÉÉÉ
A3
DETAIL B
Side View
(Optional)
5X
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
1.20 BSC
1.00 BSC
0.40 BSC
0.30
0.40
0.00
0.15
0.40
0.50
MOUNTING FOOTPRINT*
6X
6X
0.42
C
A1
DIM
A
A1
A3
b
D
E
e
L
L1
L2
MOLD CMPD
SEATING
PLANE
SIDE VIEW
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
D
0.22
L
3
L2
6
0.40
PITCH
4
e
6X
DIMENSIONS: MILLIMETERS
b
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.10 C A B
BOTTOM VIEW
1.07
0.05 C
NOTE 3
www.onsemi.com
16
MC74VHC1G125, MC74VHC1GT125
PACKAGE DIMENSIONS
UDFN6, 1x1, 0.35P
CASE 517BX
ISSUE O
PIN ONE
REFERENCE
2X
0.08 C
2X
ÉÉÉ
ÉÉÉ
0.08 C
0.05 C
L1
A B
D
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
L3
E
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTION
ÉÉ
ÉÉ
ÇÇ
TOP VIEW
EXPOSED Cu
DETAIL B
A3
A1
MOLD CMPD
DETAIL B
A
ALTERNATE
CONSTRUCTION
0.05 C
SIDE VIEW
C
SEATING
PLANE
3
1
6X
MILLIMETERS
MIN
MAX
0.50
0.65
0.00
0.05
0.13 REF
0.17
0.23
1.00 BSC
1.00 BSC
0.35
0.20
0.40
−−−
0.15
0.26
0.33
RECOMMENDED
SOLDERING FOOTPRINT*
e
DETAIL A
DIM
A
A1
A3
b
D
E
e
L
L1
L3
L
6X
6X
0.25
0.52
1.20
6
4
BOTTOM VIEW
6X
PACKAGE
OUTLINE
b
0.07
M
C A B
0.05
M
C
1
0.35
PITCH
NOTE 3
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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