NLX2G04CMUTCG

NLX2G04 Dual Inverter The NLX2G04 MiniGatet is an advanced high−speed CMOS dual inverter in ultra−small footprint. The NLX2G04 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. www.onsemi.com Features High Speed: tPD = 1.8 ns (Typ) @ VCC = 5.0 V Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C Power Down Protection Provided on inputs Balanced Propagation Delays Overvoltage Tolerant (OVT) Input and Output Pins Ultra−Small Packages These are Pb−Free Devices 5 2 3 IN A2 4 UDFN6 1.0 x 1.0 CASE 517BX M UDFN6 1.2 x 1.0 CASE 517AA L GND 6 M E 1 1 ULLGA6 1.2 x 1.0 CASE 613AE M 2 IN A1 MARKING DIAGRAMS Q • • • • • • • M 1 OUT Y1 VCC 1 UDFN6 1.45 x 1.0 CASE 517AQ OUT Y2 1 Q M Figure 1. Pinout (Top View) IN A1 1 IN A2 1 OUT Y1 = Device Marking = Date Code ORDERING INFORMATION See detailed ordering and shipping information on page 5 of this data sheet. OUT Y2 Figure 2. Logic Symbol PIN ASSIGNMENT 1 IN A1 2 GND 3 IN A2 4 OUT Y2 5 VCC 6 OUT Y1 FUNCTION TABLE A Y L H H L © Semiconductor Components Industries, LLC, 2016 June, 2016 − Rev. 4 1 Publication Order Number: NLX2G04/D NLX2G04 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage −0.5 to +7.0 V VIN DC Input Voltage −0.5 to +7.0 V DC Output Voltage −0.5 to +7.0 V VIN < GND −50 mA VOUT < GND −50 mA VOUT Parameter IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias 150 °C MSL FR ILATCHUP Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in ±500 Latchup Performance Above VCC and Below GND at 125°C (Note 2) mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 1.65 5.5 V VCC Positive DC Supply Voltage VIN Digital Input Voltage 0 5.5 V Output Voltage 0 5.5 V −55 +125 °C 0 0 0 20 10 5 ns/V VOUT TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 2 NLX2G04 DC ELECTRICAL CHARACTERISTICS VCC (V) Min Typ TA = +855C Max Min Max TA = −555C to +1255C Min Max Symbol Parameter VIH Low−Level Input Voltage 1.65−1.95 0.75 x VCC 0.75 x VCC 0.75 x VCC 2.3 to 5.5 0.70 x VCC 0.70 x VCC 0.70 x VCC Low−Level Input Voltage 1.65−1.95 0.25 x VCC 0.25 x VCC 0.25 x VCC 2.3 − 5.5 0.30 x VCC 0.30 x VCC 0.30 x VCC VIL VOH VOL High− Level Output Voltage Low−Level Output Voltage Conditions TA = 255C VIN = VIH or VIL IOH = −100 mA VIN = VIH or VIL IOH = −4 mA IOH = −8 mA IOH = −12 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA VIN = VIH or VIL IOL = 100 mA 1.65 − 5.5 VCC− 0.1 VCC VCC− 0.1 VCC− 0.1 1.65 2.3 2.7 3.0 3.0 4.5 1.29 1.9 2.2 2.4 2.3 3.8 1.52 2.1 2.4 2.7 2.5 4.0 1.29 1.9 2.2 2.4 2.3 3.8 1.29 1.9 2.2 2.4 2.3 3.8 1.65 − 5.5 Unit V V V 0.1 0.1 0.1 0.24 0.3 0.4 0.4 0.55 0.55 0.24 0.3 0.4 0.4 0.55 0.55 0.24 0.3 0.4 0.4 0.55 0.55 V VIN = VIH or VIL IOH = −4 mA IOH = −8 mA IOH = −12 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA 1.65 2.3 2.7 3.0 3.0 4.5 Input Leakage Current 0 v VIN v 5.5 V 0 to 5.5 ±0.1 ±1.0 ±1.0 mA IOFF Power−Off Output Leakage Current VIN or VOUT = 5.5 V 0 1.0 10 10 mA ICC Quiescent Supply Current 0 v VIN v VCC 5.5 1.0 10 10 mA IIN 0.08 0.2 0.22 0.28 0.38 0.42 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 3 NLX2G04 AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 nS) Symbol tPLH, tPHL Parameter Propagation Delay, Input A to Output Y VCC (V) Test Condition 1.65 TA = −555C to +1255C TA = 255C Min Typ Max Min Max Unit RL = 1 MW, CL = 15 pF 1.8 2.3 9.2 1.8 11 ns 1.8 RL = 1 MW, CL = 15 pF 1.8 4.4 7.6 1.2 8.4 2.3−2.7 RL = 1 MW, CL = 15 pF 1.2 3.0 5.1 1.2 5.6 3.0−3.6 RL = 1 MW, CL = 15 pF 0.8 2.2 3.4 0.8 3.8 RL = 500 W, CL = 50 pF 1.2 2.9 4.5 1.2 5.0 RL = 1 MW, CL = 15 pF 0.5 1.8 2.8 0.5 3.1 RL = 500 W, CL = 50 pF 0.8 2.3 3.6 0.8 4.0 4.5−5.5 CIN Input Capacitance 5.5 VIN = 0 V or VCC 2.5 pF CPD Power Dissipation Capacitance (Note 3) 3.3 5.5 10 MHz VIN = 0 V or VCC 9 11 pF 3. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no−load dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC. www.onsemi.com 4 NLX2G04 VCC A or B 50% GND tPLH Y tPHL 50% VCC Figure 3. Switching Waveforms VCC PULSE GENERATOR DUT RT CL RL RT = ZOUT of pulse generator (typically 50 W) Figure 4. Test Circuit ORDERING INFORMATION Package Shipping† NLX2G04BMX1TCG ULLGA6, 1.2 x 1.0, 0.4P (Pb−Free) 3000 / Tape & Reel NLX2G04MUTCG UDFN6, 1.2 x 1.0, 0.4P (Pb−Free) 3000 / Tape & Reel NLX2G04AMUTCG UDFN6, 1.45 x 1.0, 0.5P (Pb−Free) 3000 / Tape & Reel NLX2G04CMUTCG UDFN6, 1.0 x 1.0, 0.35P (Pb−Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). www.onsemi.com 5 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN6, 1.45x1.0, 0.5P CASE 517AQ ISSUE O 1 SCALE 4:1 A B D DATE 15 MAY 2008 L L NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. L1 PIN ONE REFERENCE 0.10 C ÉÉÉ ÉÉÉ DETAIL A E OPTIONAL CONSTRUCTIONS ÉÉ ÉÉ EXPOSED Cu TOP VIEW 0.10 C DETAIL B MOLD CMPD DETAIL B 0.05 C 6X DIM A A1 A2 b D E e L L1 OPTIONAL CONSTRUCTIONS A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.07 REF 0.20 0.30 1.45 BSC 1.00 BSC 0.50 BSC 0.30 0.40 −−− 0.15 MOUNTING FOOTPRINT 0.05 C A1 SIDE VIEW A2 e 6X C SEATING PLANE 6X 0.30 PACKAGE OUTLINE L 1.24 3 1 DETAIL A 6X 0.53 6 4 6X BOTTOM VIEW b 0.10 C A B 0.05 C NOTE 3 1 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. GENERIC MARKING DIAGRAM* XM X M = Specific Device Code = Date Code *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. DOCUMENT NUMBER: DESCRIPTION: 98AON30313E UDFN6, 1.45x1.0, 0.5P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN6, 1x1, 0.35P CASE 517BX ISSUE O SCALE 4:1 PIN ONE REFERENCE 2X 0.10 C 2X 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D ÉÉ ÉÉ ÉÉ DATE 18 MAY 2011 E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 0.05 C SIDE VIEW A1 C SEATING PLANE RECOMMENDED SOLDERING FOOTPRINT* 5X e 5X 0.48 L 6X 0.22 3 1 L1 1.18 6 4 6X BOTTOM VIEW b 0.10 M C A B 0.05 M C NOTE 3 0.53 1 PKG OUTLINE 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. GENERIC MARKING DIAGRAM* XM 1 X = Specific Device Code M = Date Code *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. DOCUMENT NUMBER: DESCRIPTION: 98AON56787E UDFN6, 1x1, 0.35P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS ULLGA6, 1.2x1.0, 0.4P CASE 613AE−01 ISSUE A 1 SCALE 8:1 PIN ONE REFERENCE 0.10 C ÉÉ ÉÉ ÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D DATE 06 FEB 2008 E DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 6X 0.05 C SEATING PLANE SIDE VIEW C A1 MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.35 0.45 MOUNTING FOOTPRINT SOLDERMASK DEFINED* 5X 0.49 e 5X L 6X 0.26 NOTE 4 3 1 1.24 L1 6 4 0.53 6X b 0.10 C A B BOTTOM VIEW DOCUMENT NUMBER: DESCRIPTION: 0.05 C NOTE 3 98AON24012D ULLGA6, 1.2X1.0, 0.4P 1 PKG OUTLINE 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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