NUF2441FCT1

NUF2441FC Integrated Passive Filter with ESD Protection This device is designed for cell phone applications requiring Headset and Speaker Phone, EMI Filtering and ESD Protection. This device offers an integrated solution in a small package reducing PCB space and cost. Features: http://onsemi.com CIRCUIT DESCRIPTION B2 C1 B1 A1 C1 L C2 L C2 B3 A3 • Provides EMI Filtering and ESD Protection • Single IC Offers Cost Savings by Replacing 2 Inductors, • • • • • 4 Capacitors, and 4 TVs Diodes Compliance with IEC61000−4−2, (Level 4) 30 kV (Contact), 30 kV (air) Flip−Chip Package Moisture Sensitivity Level 1 ESD Ratings: Machine Model = C ESD Ratings: Human Body Model = 3B This is a Pb−Free Device* A2 Benefits: A1 Flip−Chip CASE 499J 2441 A Y WW • Component Implementation TVs Devices Provide ESD Protection That is Better than a Discrete Implementation because the Small IC minimizes Parasitic Inductances Typical Applications: • Cell Phones • Communication Circuits MAXIMUM RATINGS (TA = 25°C) Rating ESD Discharge IEC61000−4−2 Contact Discharge Air Discharge Operating Temperature Range Storage Temperature Range Lead Solder Temperature (10 second duration) Symbol Vpp 30 30 TJ Tstg TL −40 to +125 −55 to +150 260 °C °C °C Value Unit kV = Specific Device Code = Assembly Location = Year = Work Week PIN CONFIGURATION A1 B1 A2 B2 A3 B3 (Bump View) Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. ORDERING INFORMATION Package NUF2441FCT1 NUF2441FCT1G Device Flip−Chip Flip−Chip (Pb−Free) Shipping† 3000/Tape & Reel 3000/Tape & Reel *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. † For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2005 1 May, 2005 − Rev. 4 Publication Order Number: NUF2441FC/D È • Flip−Chip Package Minimizes PCB Space • Integrated Circuit Increases System Reliability versus Discrete MARKING DIAGRAM 2441AYWW NUF2441FC ELECTRICAL CHARACTERISTICS (TA = 25°C) VBR @ 1 mA (Volts) Min 13.7 Max 17.7 Max IR @ VRWM = 12 V I/O Pin (mA) 0.1 Typical Capacitance C1 + C2 (pF) (Notes 1, 3, 4) 250 Typical Pass−Band Inductance L (nH) 2.9 Equivalent Series Resistance RS (W) (Note 2) Typ 0.28 Max 0.35 Device NUF2441FCT1G 1. 2. 3. 4. Device Marking 2441 VRWM (Volts) 12 Measured at 25°C, VR = 0, f = 1 MHz, Source A1, GND A2, Open A3. Measured at room temperature. Tolerance = ±20%. Measured under zero light conditions. 5 0 −5 −10 −20 (S41) dB 1.0E+07 1.0E+09 1.0E+08 FREQUENCY (Hz) 1.0E+10 −30 −40 −50 −35 −40 1.0E+06 −60 1.0E+06 1.0E+07 1.0E+08 1.0E+09 FREQUENCY (Hz) 1.0E+10 0 −10 (S21) dB −15 −20 −25 −30 Figure 1. Insertion Loss Characteristic Figure 2. Analog Crosstalk 300 250 CAPACITANCE (pF) 200 150 100 50 0 RESISTANCE (W) 0 2 4 6 8 10 12 14 0.35 0.34 0.33 0.32 0.31 0.30 0.29 0.28 0.27 0.26 0.25 0 10 20 30 40 50 60 70 80 90 TEMPERATURE (°C) REVERSE VOLTAGE (V) Figure 3. Typical Line Capacitance vs. Reverse Bias Voltage Figure 4. Typical Resistance vs. Temperature http://onsemi.com 2 NUF2441FC PACKAGE DIMENSIONS 6 PIN FLIP−CHIP CSP CASE 499J−01 ISSUE O 4X TERMINAL A1 LOCATOR 0.10 C A 0.05 C SIDE VIEW D1 e B 6X b A 1 2 3 0.05 C A B 0.03 C BOTTOM VIEW È È 0.10 C D A B E NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. MILLIMETERS DIM MIN MAX A −−− 0.700 A1 0.210 0.270 A2 0.380 0.430 D 1.720 BSC E 1.220 BSC b 0.290 0.340 e 0.500 BSC D1 1.000 BSC TOP VIEW A2 A1 C SEATING PLANE e http://onsemi.com 3 NUF2441FC Patent Pending. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 4 NUF2441FC/D