NUF4401MN

NUF4401MN 4 Line EMI Filter with ESD Protection NUF4401MN is a 4 line EMI filter array for wireless applications. It offers greater than −35 dB attenuation at frequencies from 900 MHz to 2.4 GHz. This device also offers ESD protection−clamping transients from static discharges and ESD protection is provided across all capacitors. Features http://onsemi.com 1 Cd Cd 8 • Provides EMI Filtering and ESD Protection • Integration of 20 Discretes • Compliance with IEC61000−4−2 (Level 4) • • • • 10 kV (Contact) 15 kV (Air) DFN8, 2x2 mm Package Moisture Sensitivity Level 1 ESD Ratings: Machine Model = C Human Body Model = 3B This is a Pb−Free Device* 2 Cd Cd 7 3 Cd Cd 6 4 Cd Cd 5 (Top View) Benefits • Reduces EMI/RFI Emmisions on a Data Line • Integrated Solution Offers Cost and Space Savings • Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass • • • • • • Filter Response Integrated Solution Improves System Reliability 1 MARKING DIAGRAM DFN8 CASE 506AQ PLASTIC RS MG G 1 Applications RS = Specific Device Code M = Month Code G = Pb−Free Package (Note: Microdot may be in either location) 1 2 3 4 EMI Filtering and ESD Protection on a Data Line Wireless Phones Handheld Products Notebook Computers LCD Displays GND 8 7 6 5 (Bottom View) ORDERING INFORMATION Device NUF4401MNT1G *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Package DFN8 (Pb−Free) Shipping† 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2005 1 August, 2005 − Rev. 0 Publication Order Number: NUF4401MN/D NUF4401MN MAXIMUM RATINGS Parameter ESD Discharge IEC61000−4−2 Steady−State Power per Resistor Steady−State Power per Package Operating Temperature Range Storage Temperature Range Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 s) Contact Discharge Symbol VPP PR PT TOP Tstg TL Value 100 100 400 −40 to 85 −55 to 150 260 Unit kV mW mW °C °C °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Parameter Maximum Reverse Working Voltage Breakdown Voltage Leakage Current Resistance Capacitance (Note 1, 3) Cut−Off Frequency (Note 2) IR = 1.0 mA VRWM = 3.3 V IR = 20 mA VR = 2.5 V, f = 1.0 MHz Above this frequency, appreciable attenuation occurs Test Conditions Symbol VRWM VBR IR RA Cd f3dB 170 12 200 15 125 6.0 7.0 Min Typ Max 5.0 8.0 100 230 18 Unit V V nA W pF MHz 1. Measured at 25°C. 2. 50 W source and 50 W load termination. 3. Total line capacitance is 2 times the diode capacitance (Cd). http://onsemi.com 2 NUF4401MN TYPICAL PERFORMANCE CURVES (TA = 25°C unless otherwise specified) 0 NORMALIZED CAPACITANCE −5 −10 −15 (S21) dB −20 −25 −30 −35 −40 −45 −50 1.0E+06 Channels 2, 3 1.0E+07 1.0E+08 FREQUENCY (Hz) 1.0E+09 1.0E+10 0 0 1.0 2.0 3.0 4.0 5.0 REVERSE BIASED VOLTAGE (V) Channels 1, 4 2.0 1.5 1.0 0.5 Figure 1. Insertion Loss Characteristics Figure 2. Typical Line Capacitance vs. Reverse Bias Voltage (Normalized to Capacitance @ 2.5 V) 208 206 204 RESISTANCE (W) 202 200 198 196 194 192 −40 −30 −20 −10 0 10 20 30 40 50 60 70 80 90 TEMPERATURE (°C) Figure 3. Typical Resistance vs. Temperature http://onsemi.com 3 NUF4401MN PACKAGE DIMENSIONS DFN8 CASE 506AQ−01 ISSUE A D A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. INTERNAL PAD SIZE: 1.5 X 0.9 MM. MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.10 1.30 2.00 BSC 0.50 0.70 0.50 BSC 0.20 −−− 0.25 0.45 PIN ONE REFERENCE E 2X 0.10 C 2X 0.10 C 0.10 C 8X 0.08 C SEATING PLANE A1 8X L K ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ D2 e/2 1 8 TOP VIEW A DIM A A1 A3 b D D2 E E2 e K L SIDE VIEW (A3) C e SOLDERING FOOTPRINT* 4 NOTE 5 0.575 0.0226 0.250 0.0098 1.150 0.0453 E2 0.300 0.0118 5 8X 1.350 0.0531 b 0.10 C A B 0.05 C NOTE 3 BOTTOM VIEW 0.500 0.0197 PITCH 0.700 0.0276 SCALE 15:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 4 NUF4401MN/D