SZ1SMB5917BT3G-VF01

DATA SHEET www.onsemi.com 3 Watt Plastic Surface Mount Zener Voltage Regulators PLASTIC SURFACE MOUNT ZENER VOLTAGE REGULATOR DIODES 3.3−200 V, 3 W DC POWER 1SMB59xxBT3G Series, SZ1SMB59xxT3G Series This complete new line of 3 W Zener diodes offers the following advantages. SMB CASE 403A PLASTIC Features • • • • • • • Zener Voltage Range − 3.3 V to 200 V ESD Rating of Class 3 (> 16 kV) per Human Body Model Flat Handling Surface for Accurate Placement Package Design for Top Side or Bottom Circuit Board Mounting AEC−Q101 Qualified and PPAP Capable − SZ1SMB59xxT3G SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements These are Pb−Free Devices* Cathode Anode MARKING DIAGRAM AYWW 9xxB G G Mechanical Characteristics: CASE: Void-free, transfer-molded plastic FINISH: All external surfaces are corrosion resistant and leads are readily solderable MAXIMUM LEAD TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds LEADS: Modified L−Bend providing more contact area to bond pads POLARITY: Cathode indicated by polarity band FLAMMABILITY RATING: UL 94 V−0 MAXIMUM RATINGS Rating Maximum Steady State Power Dissipation @ TL = 75°C Measured at Zero Lead Length Derate Above 75°C Thermal Resistance from Junction−to−Lead Maximum Steady State Power Dissipation @ TA = 25°C (Note ) Derate Above 25°C Thermal Resistance from Junction−to−Ambient Operating and Storage Temperature Range Symbol Value Unit A Y WW 9xxB G = Assembly Location = Year = Work Week = Device Code (Refer to page 3) = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Package Shipping† 1SMB59xxBT3G SMB (Pb−Free) 2,500 / Tape & Reel SMB (Pb−Free) 2,500 / Tape & Reel Device PD 3.0 W RqJL 40 25 mW/°C °C/W SZ1SMB59xxBT3G 550 4.4 226 mW mW/°C °C/W †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. −65 to +150 °C PD RqJA TJ, Tstg DEVICE MARKING INFORMATION Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−4 board, using recommended footprint. See specific marking information in the device marking column of the Electrical Characteristics table on page 3 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2016 August, 2021 − Rev. 10 1 Publication Order Number: 1SMB5913BT3/D 1SMB59xxBT3G Series, SZ1SMB59xxT3G Series ELECTRICAL CHARACTERISTICS (TL = 30°C unless otherwise noted, VF = 1.5 V Max. @ IF = 200 mA(dc) for all types) I Parameter Symbol VZ Reverse Zener Voltage @ IZT IZT Reverse Current ZZT Maximum Zener Impedance @ IZT IZK Reverse Current ZZK Maximum Zener Impedance @ IZK IR Reverse Leakage Current @ VR VR Reverse Voltage IF Forward Current VF Forward Voltage @ IF IZM Maximum DC Zener Current IF VZ VR IR VF IZT Zener Voltage Regulator www.onsemi.com 2 V 1SMB59xxBT3G Series, SZ1SMB59xxT3G Series ELECTRICAL CHARACTERISTICS (TL = 30°C unless otherwise noted, VF = 1.5 V Max. @ IF = 200 mA(dc) for all types) (Devices listed in bold, italic are onsemi Preferred devices.) Zener Voltage (Note 3) Device* (Note 2) VZ (Volts) Zener Impedance (Note 4) @ IZT ZZT @ IZT Leakage Current ZZK @ IZK IR @ VR IZM Device Marking Min Nom Max mA W W mA mA Volts mA(dc) 1SMB5913BT3G 1SMB5914BT3G 1SMB5915BT3G 1SMB5916BT3G 913B 914B 915B 916B 3.13 3.42 3.70 4.08 3.3 3.6 3.9 4.3 3.47 3.78 4.10 4.52 113.6 104.2 96.1 87.2 10 9 7.5 6 500 500 500 500 1 1 1 1 100 75 25 5 1 1 1 1 454 416 384 348 1SMB5917BT3G 1SMB5918BT3G 1SMB5919BT3G 1SMB5920BT3G 917B 918B 919B 920B 4.46 4.84 5.32 5.89 4.7 5.1 5.6 6.2 4.94 5.36 5.88 6.51 79.8 73.5 66.9 60.5 5 4 2 2 500 350 250 200 1 1 1 1 5 5 5 5 1.5 2 3 4 319 294 267 241 1SMB5921BT3G 1SMB5922BT3G 1SMB5923BT3G 1SMB5924BT3G 921B 922B 923B 924B 6.46 7.12 7.79 8.64 6.8 7.5 8.2 9.1 7.14 7.88 8.61 9.56 55.1 50 45.7 41.2 2.5 3 3.5 4 200 400 400 500 1 0.5 0.5 0.5 5 5 5 5 5.2 6 6.5 7 220 200 182 164 1SMB5925BT3G 1SMB5926BT3G 1SMB5927BT3G 1SMB5928BT3G 925B 926B 927B 928B 9.5 10.45 11.4 12.35 10 11 12 13 10.5 11.55 12.6 13.65 37.5 34.1 31.2 28.8 4.5 5.5 6.5 7 500 550 550 550 0.25 0.25 0.25 0.25 5 1 1 1 8 8.4 9.1 9.9 150 136 125 115 1SMB5929BT3G 1SMB5930BT3G 1SMB5931BT3G 1SMB5932BT3G 929B 930B 931B 932B 14.25 15.2 17.1 19 15 16 18 20 15.75 16.8 18.9 21 25 23.4 20.8 18.7 9 10 12 14 600 600 650 650 0.25 0.25 0.25 0.25 1 1 1 1 11.4 12.2 13.7 15.2 100 93 83 75 1SMB5933BT3G 1SMB5934BT3G 1SMB5935BT3G 1SMB5936BT3G 933B 934B 935B 936B 20.9 22.8 25.65 28.5 22 24 27 30 23.1 25.2 28.35 31.5 17 15.6 13.9 12.5 17.5 19 23 28 650 700 700 750 0.25 0.25 0.25 0.25 1 1 1 1 16.7 18.2 20.6 22.8 68 62 55 50 1SMB5937BT3G 1SMB5938BT3G 1SMB5939BT3G 1SMB5940BT3G 937B 938B 939B 940B 31.35 34.2 37.05 40.85 33 36 39 43 34.65 37.8 40.95 45.15 11.4 10.4 9.6 8.7 33 38 45 53 800 850 900 950 0.25 0.25 0.25 0.25 1 1 1 1 25.1 27.4 29.7 32.7 45 41 38 34 1SMB5941BT3G 1SMB5942BT3G 1SMB5943BT3G 1SMB5944BT3G 941B 942B 943B 944B 44.65 48.45 53.2 58.9 47 51 56 62 49.35 53.55 58.8 65.1 8 7.3 6.7 6 67 70 86 100 1000 1100 1300 1500 0.25 0.25 0.25 0.25 1 1 1 1 35.8 38.8 42.6 47.1 31 29 26 24 1SMB5945BT3G 1SMB5946BT3G 1SMB5947BT3G 1SMB5948BT3G 945B 946B 947B 948B 64.6 71.25 77.9 86.45 68 75 82 91 71.4 78.75 86.1 95.55 5.5 5 4.6 4.1 120 140 160 200 1700 2000 2500 3000 0.25 0.25 0.25 0.25 1 1 1 1 51.7 56 62.2 69.2 22 20 18 16 1SMB5949BT3G 1SMB5951BT3G 1SMB5952BT3G 949B 951B 952B 95 114 123.5 100 120 130 105 126 136.5 3.7 3.1 2.9 250 380 450 3100 4500 5000 0.25 0.25 0.25 1 1 1 76 91.2 98.8 15 12 11 1SMB5953BT3G 1SMB5954BT3G 1SMB5955BT3G 1SMB5956BT3G 953B 954B 955B 956B 142.5 152 171 190 150 160 180 200 157.5 168 189 210 2.5 2.3 2.1 1.9 600 700 900 1200 6000 6500 7000 8000 0.25 0.25 0.25 0.25 1 1 1 1 114 121.6 136.8 152 10 9 8 7 2. TOLERANCE AND TYPE NUMBER DESIGNATION The type numbers listed indicate a tolerance of ±5%. 3. ZENER VOLTAGE (VZ) MEASUREMENT Nominal Zener voltage is measured with the device junction in thermal equilibrium with ambient temperature at 25°C. 4. ZENER IMPEDANCE (ZZ) DERIVATION ZZT and ZZK are measured by dividing the ac voltage drop across the device by the ac current applied. The specified limits are for IZ(ac) = 0.1 IZ(dc) with the ac frequency = 60 Hz. *Include SZ-prefix devices where applicable. www.onsemi.com 3 1SMB59xxBT3G Series, SZ1SMB59xxT3G Series P D, MAXIMUM POWER DISSIPATION (WATTS) 6 PPK , PEAK SURGE POWER (WATTS) 1K 5 4 TL 3 2 1 TA 0 0 25 50 75 100 T, TEMPERATURE (°C) 125 RECTANGULAR NONREPETITIVE WAVEFORM TJ=25°C PRIOR TO INITIAL PULSE 500 300 200 100 50 30 20 10 0.1 150 0.2 0.3 0.5 10 8 VZ @ IZT 6 4 2 0 -2 -4 2 4 6 8 VZ, ZENER VOLTAGE (VOLTS) 10 12 VZ @ IZT 100 70 50 30 20 10 10 20 30 50 70 100 VZ, ZENER VOLTAGE (VOLTS) 200 Figure 4. Zener Voltage − 14 To 200 Volts 100 100 50 30 20 50 30 20 IZT, REVERSE CURRENT (mA) IZT, REVERSE CURRENT (mA) 100 200 Figure 3. Zener Voltage − To 12 Volts 10 5 3 2 1 0.5 0.3 0.2 0.1 2 3 5 10 20 30 50 PW, PULSE WIDTH (ms) Figure 2. Maximum Surge Power θVZ , TEMPERATURE COEFFICIENT (mV/ °C) θVZ , TEMPERATURE COEFFICIENT (mV/ °C) Figure 1. Steady State Power Derating 1 10 5 3 2 1 0.5 0.3 0.2 0.1 0 1 2 3 4 5 6 7 VZ, ZENER VOLTAGE (VOLTS) 8 9 0 10 10 20 30 40 50 60 70 VZ, ZENER VOLTAGE (VOLTS) 80 Figure 6. VZ = 12 thru 82 Volts Figure 5. VZ = 3.3 thru 10 Volts www.onsemi.com 4 90 100 1SMB59xxBT3G Series, SZ1SMB59xxT3G Series 200 1k IZ(dc) = 1mA Z Z , DYNAMIC IMPEDANCE (OHMS) Z Z , DYNAMIC IMPEDANCE (OHMS) 30 20 10mA 10 7 5 3 2 20mA 5 7 10 TJ = 25°C iZ(rms) = 0.1 IZ(dc) 500 100 70 50 iZ(rms) = 0.1 IZ(dc) 20 30 50 VZ, ZENER VOLTAGE (VOLTS) 70 200 VZ =150V 100 91V 50 62V 20 10 5 22V 2 12V 1 0.5 100 1 2 Figure 7. Effect of Zener Voltage 5 10 20 50 100 IZ, ZENER TEST CURRENT (mA) 200 6.8V 500 Figure 8. Effect of Zener Current Rating and Typical Characteristic Curves (TA = 25°C) 1000 10 MEASURED @ VZ/2 100 NONREPETITIVE, EXPONENTIAL PULSE WAVEFORM, TJ = 25°C Ppk , PEAK POWER (kW) C, CAPACITANCE (pF) MEASURED @ ZERO BIAS 1 0.1 TJ = 25°C 10 0.01 10 BREAKDOWN VOLTAGE (VOLTS) 100 0.01 Figure 9. Capacitance Curve 10 Figure 10. Typical Pulse Rating Curve 120 120 TA = 25°C PW (ID) IS DEFINED AS THE POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF Ipp. 100 PEAK VALUE Ippm 80 60 0.9 IPEAK HALF VALUE - Ipp/2 40 10/1000 ms WAVEFORM AS DEFINED BY R.E.A. 20 8/20 ms WAVEFORM AS DEFINED BY ANSI C62.1 AND IEC 801-5. 100 CURRENT (%) ≤ 10 ms Ippm, PEAK PULSE Ippm, PEAK PULSE CURRENT (%) 0.1 1 TP, PULSE WIDTH (ms) 80 60 0.5 IPEAK 40 20 td T = 8 ms 0.1 IPEAK 0 0 1 2 3 t, TIME (ms) 4 0 5 0 0.02 T 20 ms Figure 11. Pulse Waveform www.onsemi.com 5 0.04 0.06 t, TIME (ms) 0.08 Figure 12. Pulse Waveform 0.1 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SMB CASE 403A−03 ISSUE J SCALE 1:1 DATE 19 JUL 2012 SCALE 1:1 Polarity Band Non−Polarity Band HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1. E b DIM A A1 b c D E HE L L1 D POLARITY INDICATOR OPTIONAL AS NEEDED A L L1 c MIN 1.95 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MILLIMETERS NOM MAX 2.30 2.47 0.10 0.20 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF MIN 0.077 0.002 0.077 0.006 0.130 0.160 0.205 0.030 INCHES NOM 0.091 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF MAX 0.097 0.008 0.087 0.012 0.156 0.181 0.220 0.063 GENERIC MARKING DIAGRAM* A1 SOLDERING FOOTPRINT* 2.261 0.089 AYWW XXXXXG G AYWW XXXXXG G Polarity Band Non−Polarity Band XXXXX = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) 2.743 0.108 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 2.159 0.085 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98ASB42669B SMB Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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