AN26027A

DATA SHEET Part No. Package Code No. AN26027A ALGA005-W-0609ANA Publication date: August 2008 SDB00168AEB 1 AN26027A Contents Overview ………………………………………………….…………………………………………………………. 3 Features ………………………………………………….…………………………………………………………. 3 Applications ……….………………………………………………………………………………………………… 3 Package ……………………………………………………………………………………………………………. 3 Type …………………………………...……………………………………………………………………………. 3 Application Circuit Example (Block Diagram) Pin Descriptions …………………………….…………………………………… 4 …………………..………………………………………………………………………………. 5 Absolute Maximum Ratings ……………………..……………..…………………………………………………. 6 Operating Supply Voltage Range …………..……………………………………………………………………. 6 Electrical Characteristics ………………….………………….………………….………………………………. 7 Electrical Characteristics (Reference values for design) ………………….………………….………………. 8 Switching Logic Table ………………………………………………………….………………….………………. 9 Technical Data …………………………………….………………….……………………………………………. 10 • PD ⎯ Ta diagram …………........………….………………….…………………………………………………. 10 Usage Notes ……….…..…………………….………………….…………………………………………………. 11 SDB00168AEB 2 AN26027A AN26027A Single band LNA-IC for 600 MHz band applications Overview AN26027A is single band LNA-IC for 600 MHz band applications. It realizes high performance by using 0.18 μm SiGeC BiCMOS process (fT = 90 GHz, fmax = 140 GHz). High/Low gain-mode is changeable, controlled by integrated CMOS logic circuit. A WLCSP package (wafer level chip sized package) achieves miniaturization. Features Low voltage operation Low current consumption High gain (gain) Low noise figure (NF) Low distortion (IIP3 +10 MHz offset) Small and thin package (WLCSP) +2.85 V typ. 3 mA typ. 1 μA typ. 15.0 dB typ. 1.30 dB typ. –4.0 dBm typ. (High-gain mode) (Low-gain mode) (High-gain mode) (High-gain mode) (High-gain mode) fRX = 620 MHz fRX = 620 MHz fRX = 620 MHz Applications 600 MHz band single band LNA Package 5 pin wafer level chip size package (WLCSP) Size: 0.86 × 0.56 mm2 (0.3 mm pitch) Type Bi-CMOS IC SDB00168AEB 3 AN26027A Application Circuit Example (Block Diagram) (Top View) RF output 50 Ω VCC A3 B3 C2 A2 A1 B1 CNT (Gain cnt) C1 L1 50 Ω RF input Note) 1. This circuit and these circuit constants show an example and do not guarantee the design as a mass-production set. 2. This block diagram is for explaining functions. The part of the block diagram may be omitted, or it may be simplified. SDB00168AEB 4 AN26027A Pin Descriptions Pin No. A1 A2 A3 B1 B3 IN GND OUT CNT VCC Pin name Type Input Ground Output input Power Supply RF input GND RF output High-gain / Low-gain switch VCC Description SDB00168AEB 5 AN26027A Absolute Maximum Ratings A No. 1 2 3 4 5 Parameter Supply voltage Supply current Power dissipation Operating ambient temperature Storage temperature Symbol VCC ICC PD Topr Tstg Rating 3.6 18 36 –25 to +75 –40 to +125 Unit V mA mW °C °C Note *1 — *2 *3 *3 Note) *1: The range under absolute maximum ratings, power dissipation. *2: Power dissipation shows the value of only package at Ta = 70°C. When using this IC, refer to the • PD – Ta diagram in the Technical Data and use under the condition not exceeding the allowable value. *3: Expect for the storage temperature and operating ambient temperature, all ratings are for Ta = 25°C. Operating Supply Voltage Range Parameter Supply voltage range Symbol VCC Range 2.5 to 3.0 Unit V Note — Note) The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. SDB00168AEB 6 AN26027A Electrical Characteristics Note) Unless otherwise specified, Ta = 25°C±2°C VCC = 28.5 V Limits Min Typ Max No te B No. Parameter Symbol Conditions Unit DC electrical characteristics DC-1 Supply current HG DC-2 Supply current LG DC-3 DC-4 Switching voltage (High gain mode) Switching voltage (Low gain mode) ICCH ICCL VIH VIL IIH VCC current at High-gain mode No input signal VCC current at Low-gain mode No input signal VIH = VCC × 0.90 VIL = VCC × 0.14 Current at CNT pin VIH = VCC — — 2.57 — — 3.0 1.0 2.85 0.0 4.6 4.4 10 — 0.4 20 mA μA V V μA — — — — — DC-5 Switching current (High) Note) Unless otherwise specified, Ta = 25°C±2°C, fRXa = 620 MHz, PRX = –30 dBm, CW B No. Parameter Symbol Conditions Limits Min Typ Max Unit No te LNA AC electrical characteristics A-1 A-2 Power gain HG Power gain LG GHS GLS High-gain mode Low-gain mode PRX = –20 dBm High-gain mode f1 = fRXa + 10 MHz f2 = fRXa + 20 MHz Input 2 signals (f1, f2) 13.0 –7.5 15.0 –4.0 17.0 –1.0 dB dB — — A-3 IIP3 +10 MHz offset HG IIP3H1 –12 –4.0 — dBm — SDB00168AEB 7 AN26027A Electrical Characteristics (Reference values for design) Note) Unless otherwise specified, Ta = 25°C±2°C, fRX = 470 MHz, 620 MHz, 770 MHz, PRX = –30 dBm, CW. The characteristics listed below are reference values for design of the IC and are not guaranteed by inspection. If a problem does occur related to these characteristics, Matsushita will respond in good faith to user concerns. VCC = 2.85 V B No. Parameter Symbol Conditions Limits Min Typ Max Unit No te LNA AC electrical characteristics C-1 C-2 C-3 C-4 Power gain HG Power gain LG Noise Figure HG Noise Figure LG GH GL NFH NFL High-gain mode f = fRX Low-gain mode f = fRX, PRX = –20 dBm High-gain mode f = fRX Low-gain mode f = fRX High-gain mode f1 = fRX + 10 MHz f2 = fRX + 20 MHz Input 2 signals (f1, f2) High-gain mode f1 = fRXa – 10 MHz f2 = fRXa – 20 MHz Input 2 signals (f1, f2) High-gain mode f1 = fRX High-gain mode f1 = fRX High-gain mode f1 = fRX 11.5 –8.0 — — 15.0 –4.0 1.3 6.5 17.5 –1.0 2.3 8.5 dB dB dB dB — — * — C-5 IIP3 +10 MHz offset HG IIP3H1 –13 –4.0 — dBm — C-6 IIP3 –10 MHz offset HG IIP3H2 –13 –4.0 — dBm — C-7 C-8 C-9 Input P1dB HG Reverse Isolation HG Reverse Isolation LG IP1dBH ISOH ISOL –10 — — –6 –24 –3.5 — — — dBm dB dB — — — Note) Connector & substrate loss (0.1 dB) included. SDB00168AEB 8 AN26027A Switching Logic Table Note) See parameters B No. DC-3 to B No. DC-4 in the Electrical Characteristics for control voltage retention ranges. Pin No. B1 Description High-Gain / Low-Gain Switching (Gain Control) Pin voltage Low Low-Gain High High-Gain Remarks — SDB00168AEB 9 AN26027A Technical Data • PD ⎯ Ta diagram SDB00168AEB 10 AN26027A Usage Notes 1. This IC is intended to be used for general electronic equipment [cellular phones]. Consult our sales staff in advance for information on the following applications: Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. (1) Space appliance (such as artificial satellite, and rocket) (2) Traffic control equipment (such as for automobile, airplane, train, and ship) (3) Medical equipment for life support (4) Submarine transponder (5) Control equipment for power plant (6) Disaster prevention and security device (7) Weapon (8) Others: Applications of which reliability equivalent to (1) to (7) is required 2. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might smoke or ignite. 3. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In addition, refer to the Pin Description for the pin configuration. 4. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as a solderbridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during transportation. 5. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin – VCC short (power supply fault), output pin – GND short (ground fault), or output-to-output-pin short (load short). And, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and smoke emission will depend on the current capability of the power supply. 6. When using the LSI for new models, verify the safety including the long-term reliability for each product. 7. When the application system is designed by using this LSI, be sure to confirm notes in this book. Be sure to read the notes to descriptions and the usage notes in the book. 8. Due to unshielded structure of this IC, under exposure of light, function and characteristic of the product cannot be guaranteed. During normal operation or even under testing condition, please ensure that IC is not exposed to light. 9. Basically, chip surface is ground potential. Please design to ensure no contact between chip surface and metal shielding. SDB00168AEB 11 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.