MN102H76G

MN102H76G Type ROM (× 8-bit) RAM (× 8-bit) Package Minimum Instruction Execution Time Interrupts MN102H76G 128 K 4K QFP084-P-1818E *Lead-free 83 ns (at 3.135 V to 3.465 V, 12 MHz) External (7 lines) Internal (28 lines) : Timer × 11, A/D × 1, Undefined command × 1, RESET × 1, OSD × 2, Serial × 2, I2C × 1, Caption × 2, Remote control × 1, Address coincidence × 4, HSYNC× 1, VSYNC× 1 8-bit timer × 1 0 Watchdog timer: 17-bit × 1 I2C × 1 : for multimaster mode, bus line (output) has 2 systems Sync serial / UART × 1 • Built-in sync separator × 1 Timer Counter Serial Interface Caption I/O Pins A/D Inputs PWM Special Ports CRTC Notes I/O 35 • Common use 10-bit × 8-ch. (with S/H) 8-bit × 6-ch. Remote control reception 3-layer display (graphics, characters, splits) Remote control input discriminant circuit built-in, build-in NTSC video signal processing circuit, built-in 3-line comb filter M AE00018BEM MN102H76G Pin Assignment P07, ADIN7, VDAF P06, ADIN8, HDAF P05, ADIN5 P04, ADIN4 P03, ADIN3 P02, ADIN2 P01, ADIN1 P00, ADIN0 /TESTMD 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 P15, RMIN, /IRQ7 *P16, SDA0 *P17, SCL0 P20, WDOUT P21, STOP, VOUT0 P27, SBT0 P30, SBD0 P31, SBO0 *P32, SDA1 *P33, SCL1 P34, PWM0 P35, PWM1 P36, PWM2 DVDD DVSS P22, SYSCLK *P23, TM5IO *P26, TM8IO P43, /RST P44, /IRQ0 P45, /IRQ1 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 43 SCOMP DVDD DVDD AVDD SIREF BOUT DVSS AVSS OSC2 OSC1 VCOI PDO 42 41 40 39 38 37 36 35 34 GOUT ROUT VIREF VCOMP VMOUT AVDD FBPIN AVSS EW VOUT AVDD FSCOUT FSCIN FPCO AVSS FVCOI HOUT HDOWN EHTIN BEAMIN ABLIN MN102H76G 33 32 31 30 29 28 27 26 25 24 23 22 10 11 12 13 14 16 17 18 19 20 P37, PWM3 P40, PWM4 P41, PWM5 VREFM MCOMPIN MSCIN MVIN CLH MUIN P14, TM4IO AVDD AVSS VREFH VREFL CREFH CLL P46, /IRQ2 P47, /IRQ3 P50, /IRQ4 P51, IRQ5 QFP084-P-1818E *Lead-free *5 V dielectric Nch open drain output pin Support Tool In-circuit Emulator PX-ICE102H76-QFP084-P-1818E MAE00018BEM CREFL 21 15 1 2 3 4 5 6 7 8 9 Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technical information described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. • Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. 2003 SEP