EK423641-01

Product Specification PE423641 UltraCMOS® SP4T RF Switch 50–3000 MHz Product Description The PE423641 is a HaRP™ technology-enhanced reflective SP4T RF switch. It has received AEC-Q100 Grade 2 certification and meets the quality and performance standards that makes it suitable for use in harsh automotive environments. It is designed to cover a wide range of wireless applications from 50 MHz through 3 GHz such as cellular antenna band switching, automotive infotainment and traffic safety applications. No blocking capacitors are required if DC voltage is not present on the RF ports. The PE423641 is manufactured on Peregrine’s UltraCMOS® process, a patented variation of silicon-oninsulator (SOI) technology on a sapphire substrate, offering excellent RF performance. Peregrine’s HaRP™ technology enhancements deliver high linearity and excellent harmonics performance. It is an innovative feature of the UltraCMOS process, offering the performance of GaAS with the economy and integration of conventional CMOS. Features  AEC-Q100 Grade 2 certified  Supports operating temperature up to +105°C  HaRPTM technology enhancements provide excellent linearity  Low harmonics of 2fo = –83 dBc and 3fo = –77 dBc @ +35 dBm  IMD3 of –111 dBm @ WCDMA band 1  IIP3 of 68 dBm  Low insertion loss  0.50 dB @ 1000 MHz  0.65 dB @ 2200 MHz  High isolation  32 dB @ 1000 MHz  25 dB @ 2200 MHz  High ESD performance  2 kV HBM on all pins Figure 1. Functional Diagram  100V MM on all pins  1 kV CDM on all pins  Integrated decoder for 2-pin control ESD  Accepts 1.8V and 2.75V levels Figure 2. Package Type 16-lead 3 x 3 mm QFN 71-0094 Document No. DOC-12414-2 │ www.psemi.com ©2013-2014 Peregrine Semiconductor Corp. All rights reserved. Page 1 of 11 PE423641 Product Specification Table 1. Electrical Specifications @ +25°C, VDD = 2.75V (ZS = ZL = 50Ω ) Parameter Path Condition Min Operational frequency 50 Insertion loss (symmetric ports) RFC–RFX Isolation RFC–RFX Return loss (active ports) 3000 MHz 50–1000 MHz 0.50 0.60 dB 1000–2200 MHz 0.65 0.75 dB 2200–2700 MHz 0.80 0.95 dB 2700–3000 MHz 0.95 1.15 dB 50–1000 MHz 30 32 dB 1000–2200 MHz 23 25 dB 21 23 dB 20 22 dB 50–1000 MHz 24 dB 1000–2200 MHz 19 dB 2200–2700 MHz 16 dB 2700–3000 MHz 14 dB 50–1000 MHz 23 dB 1000–2200 MHz 16 dB 2200–2700 MHz 14 dB 2700–3000 MHz 13 dB +35 dBm output power, 850/900 MHz –83 –80 dBc +33 dBm output power, 1800/1900 MHz –85 –78 dBc +35 dBm output power, 850/900 MHz –77 –73.5 dBc +33 dBm output power, 1800/1900 MHz –78 –72.5 dBc RF Measured at 2.14 GHz at ANT port, input +20 dBm CW signal at 1.95 GHz and –15 dBm CW signal at 1.76 GHz –111 dBm RFC–RFX 50–3000 MHz 115 dBm RFC–RFX 50–3000 MHz 68 dBm RFC–RFX 50–3000 MHz 37 dBm 50% CTRL to 90% or 10% RF 1 RFX 3rd harmonic RFX IMD3 Input IP2 Input IP3 Switching time Unit 2700–3000 MHz RFC–RFX 2nd harmonic Max 2200–2700 MHz RFC–RFX Return loss (common ports) Input 0.1 dB compression point Typ 1 2 μs Note 1: Input 0.1 dB compression point is a linearity figure of merit. Refer to Table 3 for the operating RF input power (50Ω). ©2013-2014 Peregrine Semiconductor Corp. All rights reserved. Page 2 of 11 Document No. DOC-12414-2 │ UltraCMOS® RFIC Solutions PE423641 Product Specification Table 1A. Electrical Specifications @ –40 to +105°C, VDD = 2.75V (ZS = ZL = 50Ω ) Parameter Path Condition Min Operational frequency 50 Insertion loss (symmetric ports) RFC–RFX Isolation RFC–RFX Return loss (active ports) Unit 3000 MHz 50–1000 MHz 0.50 0.75 dB 1000–2200 MHz 0.65 0.90 dB 2200–2700 MHz 0.80 1.10 dB 2700–3000 MHz 0.95 1.30 dB 50–1000 MHz 30 32 dB 1000–2200 MHz 23 25 dB 21 23 dB 2700–3000 MHz 20 22 dB 50–1000 MHz 24 dB 1000–2200 MHz 19 dB 2200–2700 MHz 16 dB 2700–3000 MHz 14 dB 50–1000 MHz 23 dB 1000–2200 MHz 16 dB 2200–2700 MHz 14 dB 2700–3000 MHz 13 dB +35 dBm output power, 850/900 MHz –83 –76 dBc +33 dBm output power, 1800/1900 MHz –85 –74 dBc +35 dBm output power, 850/900 MHz –77 –69.5 dBc +33 dBm output power, 1800/1900 MHz –78 –68.5 dBc RF Measured at 2.14 GHz at ANT port, input +20 dBm CW signal at 1.95 GHz and –15 dBm CW signal at 1.76 GHz –111 dBm RFC–RFX 50–3000 MHz 115 dBm RFC–RFX 50–3000 MHz 68 dBm RFC–RFX 50–3000 MHz 37 dBm 50% CTRL to 90% or 10% RF 1 RFC–RFX 2nd harmonic Max 2200–2700 MHz RFC–RFX Return loss (common ports) RFX 3rd harmonic RFX IMD3 Input IP2 Input IP3 Input 0.1 dB compression point Typ 1 Switching time 2 μs Note 1: Input 0.1 dB compression point is a linearity figure of merit. Refer to Table 3 for the operating RF input power (50Ω). Document No. DOC-12414-2 │ www.psemi.com ©2013-2014 Peregrine Semiconductor Corp. All rights reserved. Page 3 of 11 PE423641 Product Specification Figure 3. Pin Configuration (Top View) Table 3. Operating Ranges Parameter Symbol Min Typ Max Unit Supply voltage VDD 2.65 2.75 3.3 V Supply current (VDD = 2.75V, +25°C only) IDD 13 50 µA Digital input high (V1, V2) VIH 1.4 VDD V Digital input low (V1, V2) VIL 0 0.4 V +35 dBm +105 °C RF input power, CW 1 Operating temperature range PMAX,CW –40 TOP +25 Note 1: 100% duty cycle, all bands, 50Ω Table 4. Absolute Maximum Ratings Parameter/Condition Supply voltage Table 2. Pin Descriptions Pin # Pin Name 1, 5, 7, 9, 10, 12, 14, 16 2 3 N/C VDD Digital input voltage (V1, V2) Description No connect Supply voltage V2 ESD voltage HBM , all pins 2 ESD voltage MM , all pins 3 Max Unit VDD –0.3 3.7 V VI –0.3 3.7 V +37 dBm -65 +150 °C VESD ,HBM 2000 V VESD,MM 100 V VESD,CDM 1000 V PMAX,ABS TST ESD voltage CDM , all pins Digital control logic input 1 Notes: 1. Human Body Model (MIL-STD-883 Method 3015) 2. Machine Model (JEDEC JESD22-A115) 3. Charged Device Model (JEDEC JESD22-C101) V1 6 RF41 RF port 8 RF31 RF port 11 RFC RF common 13 RF11 RF port 15 1 RF2 RF port Pad GND Exposed pad: Ground for proper operation Note 1: RF pins 6, 8, 13, and 15 must be at 0 VDC. The RF pins do not require DC blocking capacitors for proper operation if the 0 VDC requirement is met. ©2013-2014 Peregrine Semiconductor Corp. All rights reserved. Page 4 of 11 1 Min Digital control logic input 2 4 1 RF input power, max Storage temperature range Symbol Exceeding absolute maximum ratings may cause permanent damage. Operation should be restricted to the limits in the Operating Ranges table. Operation between operating range maximum and absolute maximum for extended periods may reduce reliability. Document No. DOC-12414-2 │ UltraCMOS® RFIC Solutions PE423641 Product Specification Electrostatic Discharge (ESD) Precautions When handling this UltraCMOS device, observe the same precautions that you would use with other ESD-sensitive devices. Although this device contains circuitry to protect it from damage due to ESD, precautions should be taken to avoid exceeding the specified rating. Latch-Up Avoidance Unlike conventional CMOS devices, UltraCMOS devices are immune to latch-up. Moisture Sensitivity Level The Moisture Sensitivity Level rating for the PE423641 in the 16-lead 3x3 mm QFN package is MSL1. Document No. DOC-12414-2 │ www.psemi.com Table 5. Truth Table Path V2 V1 RFC–RF1 0 0 RFC–RF2 1 0 RFC–RF3 0 1 RFC–RF4 1 1 Switching Frequency The PE423641 has a maximum 25 kHz switching frequency. Switching frequency describes the time duration between switching events. Switching time is the time duration between the point the control signal reaches 50% of the final value and the point the output signal reaches within 10% or 90% of its target value. Switching time is provided in Table 1 and Table 1A. ©2013-2014 Peregrine Semiconductor Corp. All rights reserved. Page 5 of 11 PE423641 Product Specification Typical Performance Data @ +25°C and VDD = 2.75V, unless otherwise specified Figure 4. Insertion Loss vs Temp (RFC–RFX) Figure 5. Insertion Loss vs VDD (RFC–RFX) Figure 6. Return Loss vs Temp (Active Port) Figure 7. Return Loss vs VDD (Active Port) Figure 8. Return Loss vs Temp (Common Port) Figure 9. Return Loss vs VDD (Common Port) ©2013-2014 Peregrine Semiconductor Corp. All rights reserved. Page 6 of 11 Document No. DOC-12414-2 │ UltraCMOS® RFIC Solutions PE423641 Product Specification Typical Performance Data @ +25°C and VDD = 2.75V, unless otherwise specified Figure 10. Isolation vs Temp (RFC–RFX) Document No. DOC-12414-2 │ www.psemi.com Figure 11. Isolation vs VDD (RFC–RFX) ©2013-2014 Peregrine Semiconductor Corp. All rights reserved. Page 7 of 11 PE423641 Product Specification Evaluation Kit Figure 12. Evaluation Board Layouts The SP4T switch evaluation board was designed to ease customer evaluation of Peregrine’s PE423641. The RF common port is connected through a 50Ω transmission line via the top SMA connector, J1. RF1, RF2, RF3 and RF4 are connected through 50Ω transmission lines via SMA connectors J3, J5, J2 and J4, respectively. A through 50Ω transmission is available via SMA connectors J6 and J7. This transmission line can be used to estimate the loss of the PCB over the environmental conditions being evaluated. The board is constructed of a four metal layer FR4 material with a total thickness of 62 mils. The middle layers provide ground for the transmission lines. The transmission lines were designed using a coplanar waveguide with ground plane model using a trace width of 32 mils, trace gaps of 25 mils, and metal thickness of 2.1 mils. PRT-50900 ©2013-2014 Peregrine Semiconductor Corp. All rights reserved. Page 8 of 11 Document No. DOC-12414-2 │ UltraCMOS® RFIC Solutions PE423641 Product Specification Figure 13. Evaluation Board Schematic 13 RF1 J5 50 Ohm RF3 RF3 8 14 N/C U1 N/C 7 15 RF2 PE423641 RF4 6 RF4 4 V1 3 V2 2 VDD 1 N/C R2 J8 14 12 10 8 6 4 2 14 12 10 8 6 4 2 J4 50 Ohm N/C 5 16 N/C RF2 J2 50 Ohm N/C 9 50 Ohm RF1 N/C 10 J3 RFC 11 50 Ohm ANT N/C 12 J1 J6 J7 50 Ohm 1M 13 11 9 7 5 3 1 R1 13 11 9 7 VDD 5 3 V2 1 V1 HEADER14 ThroughLine 1M DOC-12427 C4 C3 C2 C1 DNI DNI DNI DNI Caution: Contains parts and assemblies susceptible to damage by electrostatic discharge (ESD). Document No. DOC-12414-2 │ www.psemi.com ©2013-2014 Peregrine Semiconductor Corp. All rights reserved. Page 9 of 11 PE423641 Product Specification Figure 14. Package Drawing 16-lead 3x3 mm QFN 0.10 C 3.00 A (2X) 0.28 (X16) 1.70±0.05 B 9 0.50 (X12) 12 0.575 (X16) 13 8 1.70±0.05 3.00 4 0.10 C 1.75 3.40 16 5 0.23±0.05 (X16) 0.50 1 (2X) 1.50 0.375±0.05 (X16) 1.75 Pin #1 Corner 3.40 TOP VIEW BOTTOM VIEW RECOMMENDED LAND PATTERN DOC-01881 0.10 C 0.10 0.05 0.75±0.05 0.05 C C A B C ALL FEATURES SEATING PLANE 0.203 0.05 C SIDE VIEW Figure 15. Top Marking Specification 423641 YYWW ZZZZZZ = Pin 1 designator YYWW = Date code, last two digits of the year and work week ZZZZZZ = Last six characters of the assembly lot code DOC-51207 ©2013-2014 Peregrine Semiconductor Corp. All rights reserved. Page 10 of 11 Document No. DOC-12414-2 │ UltraCMOS® RFIC Solutions PE423641 Product Specification Figure 16. Tape and Reel Specifications Tape Feed Direction Pin 1 Top of Device Device Orientation in Tape Table 6. Ordering Information Order Code Description Package Shipping Method PE423641MLAA-Z PE423641 SP4T RF switch Green 16-lead 3 x 3 mm QFN 3000 units / T&R EK423641-01 PE423641 Evaluation kit Evaluation kit 1 / Box Sales Contact and Information For sales and contact information please visit www.psemi.com. Advance Information: The product is in a formative or design stage. The datasheet contains design target specifications for product development. Specifications and features may change in any manner without notice. Preliminary Specification: The datasheet contains preliminary data. Additional data may be added at a later date. Peregrine reserves the right to change specifications at any time without notice in order to supply the best possible product. Product Specification: The datasheet contains final data. In the event Peregrine decides to change the specifications, Peregrine will notify customers of the intended changes by issuing a CNF (Customer Notification Form). The information in this datasheet is believed to be reliable. However, Peregrine assumes no liability for the use of this information. Use shall be entirely at the user’s own risk. Document No. DOC-12414-2 │ www.psemi.com No patent rights or licenses to any circuits described in this datasheet are implied or granted to any third party. Peregrine’s products are not designed or intended for use in devices or systems intended for surgical implant, or in other applications intended to support or sustain life, or in any application in which the failure of the Peregrine product could create a situation in which personal injury or death might occur. Peregrine assumes no liability for damages, including consequential or incidental damages, arising out of the use of its products in such applications. The Peregrine name, logo, UltraCMOS and UTSi are registered trademarks and HaRP, MultiSwitch and DuNE are trademarks of Peregrine Semiconductor Corp. Peregrine products are protected under one or more of the following U.S. Patents: http://patents.psemi.com. ©2013-2014 Peregrine Semiconductor Corp. All rights reserved. Page 11 of 11