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LCS700LG

LCS700LG

  • 厂商:

    POWERINT(帕沃英蒂格盛)

  • 封装:

    SIP16

  • 描述:

    Half Bridge Driver General Purpose Power MOSFET eSIP-16K

  • 数据手册
  • 价格&库存
LCS700LG 数据手册
HiperLCS Family Integrated LLC Controller, High-Voltage Power MOSFETs and Drivers Product Highlights B+ Features • LLC half-bridge power stage incorporating controller, high and • • • • • • • • • low-side gate drives, and high-voltage power MOSFETs • Eliminates up to 30 external components High maximum operating frequency of 1 MHz • Nominal steady-state operation up to 500 kHz • Dramatically reduces magnetics size and allows use of SMD ceramic output capacitors Precise duty symmetry balances output rectifier current, improving efficiency • 50% ±0.3% typical at 300 kHz Comprehensive fault handling and current limiting • Programmable brown-in/out thresholds and hysteresis • Undervoltage (UV) and overvoltage (OV) protection • Programmable over-current protection (OCP) • Short-circuit protection (SCP) • Over-temperature protection (OTP) Programmable dead-time for optimized design Programmable burst mode maintains regulation at no-load and improves light load efficiency Programmable soft-start time and delay before soft-start Accurate programmable minimum and maximum frequency limits Single package designed for high-power and high-frequency • Reduces assembly cost and reduces PCB layout loop areas • Simple single clip attachment to heat sink • Staggered pin arrangement for simple PC board routing and high-voltage creepage requirements Paired with HiperPFS PFC product gives complete, high efficiency, low part count PSU solutions Applications • • • • • D VCCH High-efficiency power supplies (80 PLUS Silver, Gold and Platinum) LCD TV power supplies LED street and area lighting Printer power supplies Audio amplifier CONTROL Standby Supply VCC +V HB HV DC Input OV/UV VREF RTN RFMAX DT/BF IS HiperLCS RBURST FB B- G S1/S2 LLC Feedback Circuit PI-6159-060211 Figure 1. Typical Application Circuit – LCD TV and PC Main Power Supply. Output Power Table Product Maximum Practical Power1 LCS700HG/LG 110 W LCS701HG/LG 170 W LCS702HG/LG 220 W LCS703HG/LG 275 W LCS705HG/LG 350 W LCS708HG/LG 440 W Table 1. Output Power Table. Notes: 1. Maximum practical power is the power the part can deliver when properly mounted to a heat sink and a maximum heat sink temperature of 90 °C. Description The HiperLCS™ is an integrated LLC power stage incorporating a multi-function controller, high-side and low-side gate drivers, plus two power MOSFETs in a half-bridge configuration. Figure 1 shows a simplified schematic of a HiperLCS based power stage where the LLC resonant inductor is integrated into the transformer. The variable frequency controller provides high-efficiency by switching the power MOSFETs at zero voltage (ZVS), eliminating switching losses.  www.power.com May 2017 This Product is Covered by Patents and/or Pending Patent Applications. LCS700-708 VCC VREF DRAIN (D) 3.4 V REGULATOR UVLO VCCH LLC_ON + OV/UV VSDH/ VSDL UVLO SOFT-START DELAY 131,072 LLC CLOCK CYCLES DEBOUNCE 3 LLC CLOCK CYCLES + VOVH/ VOVL OVERTEMPERATURE PROTECTION + IS HB LEVEL SHIFT VISF 7 CONSECUTIVE LLC CLOCK CYCLES + VISS LLC_CLK VREF FEEDBACK (FB) LLC CLOCK DT/BF + DT/BF RESISTOR SENSOR DEAD-TIME GENERATOR OUTPUT CONTROL LOGIC DEBOUNCE 3 LLC CLOCK CYCLES Bursting Thresholds Control GROUND (G) PI-5755-060111 SOURCE (S1/S2) Figure 2. Block Diagram. 2 Rev. G 05/17 www.power.com LCS700-708 Pin Functional Description VCC Pin IC power pin. In a typical application, VCC is connected to the 12 V system standby supply via a 5 W resistor. This resistor helps provide filtering and improves noise immunity. H Package (eSIP-16J) (Front View) CURRENT-SENSE (IS) Pin The CURRENT-SENSE pin is used for sensing transformer primary current, to detect overload and fault conditions, through a current sense resistor or a capacitive divider plus sense resistor circuit. It resembles a reverse diode to ground, and does not require a rectifier circuit for preventing negative pulses from reaching the pin, provided the reverse current is limited to 0.9 V. Both will invoke a 131,072 cycle restart cycle. VCC can also be pulled down to shut the device off, but when it is pulled up, the FEEDBACK pin is pulled up to the VREF pin to discharge the soft-start capacitor for only 1024 fMAX clock cycles. If this scheme is used, the designer must ensure that the time the VCC is pulled down, plus 1024 cycles, is sufficient to discharge the soft-start capacitor, or if not, that the resulting lower starting frequency is high enough so as not to cause excessive primary currents that may cause the over-current protection to trip. Current Sense The IS pin senses the primary current. It resembles a reverse diode to the GROUND pin. It is tolerant of negative voltages provided the negative current is limited to 220 Ω. Thus it can accept an AC waveform and does not need a rectifier or peak detector circuit. If the IS pin senses a nominal positive peak voltage of 0.5 V for 7 consecutive cycles, an auto-restart will be invoked. The IS pin also has a second, higher threshold at nominally 0.9 V, which will invoke an auto-restart with a single pulse. The minimum pulse width requirement for detection of both voltage thresholds is nominally 30 ns. i.e. the thresholds have to be exceeded for >30 ns for proper detection. Over-Temperature Shutdown The HiperLCS has latching OTP. VCCH must be cycled to resume operation once the unit drops down below the OTP threshold. VCCH Pin UVLO The VCCH pin is the supply pin for the high-side driver. It also has a UVLO function similar to the VCC pin, with a threshold lower than the VCC pin. This is to allow for a VCCH voltage that is slightly lower than VCC because the VCCH pin is fed by a bootstrap diode and series current-limiting resistor from the VCC supply. 5 www.power.com Rev. G 05/15 LCS700-708 Basic Layout Guidelines The HiperLCS is a high-frequency power device and requires careful attention to circuit board layout in order to achieve maximum performance. The bypass capacitors need to be positioned and laid out carefully to minimize trace lengths to the pins they serve. SMD components are recommended for minimum component and trace stray inductance. Table 2 describes the recommended bypass capacitor values for pins that require filtering/bypassing. The table lists the pins in the order of most to least sensitive. The bypass capacitor of the pin at the top of the list being the most sensitive, receives higher priority in bypass capacitor positioning to minimize trace lengths, than the bypass capacitor of the pin below it. Noise entering the two most sensitive pins on the list, namely the FEEDBACK and DT/BF pins, will cause duty cycle, and dead-time imbalance, respectively. Figure 5 and Figure 6 show two alternate schemes for routing ground traces for optimum performance. Figure 5 shows a layout footprint for the LCS with oval pads. These allow a trace to be passed between pins 3 and 5, directly connecting the ground systems for the bypass capacitors located on each side of the IC. Figure 6 shows an LCS layout footprint with round pads that do not allow traces to be routed between them due to insufficient space. In this case, a jumper (JP1, a 1206 size 0 W resistor) is used to connect the ground systems together and allow a connection for pin 3 to be routed under JP1 to the optocoupler. Transformer T1 is a source of both high di/dt signals and dv/dt noise. The first can couple magnetically to sensitive circuitry, while the second can inject noise via electrostatic coupling. Electrostatic noise coupling can be reduced by grounding the transformer core, but it is not economically feasible to reduce the stray magnetic field around the transformer without drastically reducing its efficiency. Sensitive traces and components (such as the optocoupler) should be located away from the transformer to avoid noise pickup. Pin Returned to Pin Recommended Value Notes FEEDBACK (FB) GROUND 4.7 nF (at 250 kHz) Increase value proportionally for lower nominal frequency (e.g. 10 nF at 100 kHz). Forms a pole with FEEDBACK pin input impedance which is part of feedback loop characteristic. Must not introduce excessive phase shift at expected gain crossover frequency. Noise entering FEEDBACK pin will cause duty cycle imbalance. DEAD-TIME/BURST FREQUENCY (DT/BF) GROUND 4.7 nF Time constant of this capacitor and the source impedance of the resistors connected to DT/BF pin must be 300 kHz start to lose significant efficiency due to increased eddy current losses in the copper, and due to the fact that a more significant percentage of time is spent on the primary slew time (ZVS transition time) which erodes the percentage of time that power is transferred to the secondary. Resonant Tank and Transformer Design Please refer to the Application Note AN-55 for guidance on using the PIXls HiperLCS spreadsheet which assists in the entire design process. Primary Inductance The optimal powertrain design for the HiperLCS uses a primary inductance that results in minimal loss of ZVS at any steady-state condition. Some loss of ZVS during non-steady-state conditions is acceptable. Reducing primary inductance produces higher magnetizing current which increases the range of ZVS operation, but the increased magnetizing current increases losses and reduces efficiency. The calculation of the primary inductance to be used for a first-pass design is based on device size, rated load, minimum input voltage, and desired operating frequency. It is provided in the PIXls spread- sheet. LPRI is the primary inductance of an integrated transformer (high leakage inductance), or in the case of the use of an external series inductance, the sum of this inductance and the transformer primary inductance. Leakage Inductance The parameter KRATIO is a function of leakage inductance: K RATIO = L PRI - 1 L RES The recommended KRATIO is from 2.5 - 7. This determines the acceptable range of leakage inductance. LRES is the leakage inductance in an integrated transformer; if a separate series inductor is used, it is the sum of this inductance and the leakage inductance of the transformer. A low KRATIO (high leakage inductance) may not be capable of regulation at the minimum input voltage, and may show increased transformer copper losses due to the leakage flux. A high KRATIO (low leakage inductance) will have high peak and RMS currents at low-line, and require a lower primary inductance to achieve ZVS operation over a suitably wide range, which increases the resonant circulating current, reducing efficiency. The core and bobbin designs available to the designer may limit the adjustability of leakage inductance. Fortunately, excellent performance can be achieved over a relatively wide range of leakage inductance values. The KRATIO directly affects the frequency range that the LLC needs to operate in order to maintain regulation over the input voltage range. Increasing KRATIO increases this frequency range, lowering fMIN. A low fMIN is only a potential problem for low frequency designs which typically run at higher nominal BAC. This may allow the core to reach saturation when operating at fMIN. Operating at fMIN occurs when the input voltage is at a minimal (input brown-out). For a design with a separate resonant inductor, running the inductance on the low side of the range (KRATIO = 7), minimizes the size and cost of the inductor. Adjusting Leakage Inductance Sectioned bobbins (separated primary and secondary) are commonly used for LLC converters. Increasing or decreasing both primary and secondary turns (while maintaining turns ratio) will change the leakage inductance proportionally to the square of primary turns. If the leakage inductance is too high, one possible solution is to use a 3-section bobbin, where the secondary is in the middle section, and the primary winding is split into 2 halves connected in series. Lastly, if the leakage inductance is too low an external inductor may be added. 11 www.power.com Rev. G 05/15 LCS700-708 Resonant Frequency The series resonant frequency is a function of LRES and CRES, the resonant capacitor. For any given value of LRES, the value of CRES can be adjusted for the desired series resonant frequency fRES. For best efficiency the resonant frequency is set close to the target operating frequency at nominal input voltage. Operating Frequency and Frequency Ratio The operating to resonant frequency ratio fRATIO is defined as: fRATIO = fSW fRES fRATIO = 1 signifies the converter is operating at the series resonant frequency. The main determinant of fRATIO is the transformer turns ratio. Increasing primary turns lowers fRATIO for a given input and output voltage. The recommended fRATIO at nominal input voltage is 0.92 – 0.97. Operating at resonance often yields the highest efficiency for the resonant powertrain if output rectifier selection is ignored. However, operating slightly below resonance (which puts the rectifiers in discontinuous conduction mode), allows the use of lower voltage diodes or synchronous MOSFETs, which have lower losses, increasing overall efficiency. This is because at high-line, when the converter needs to operate above resonance, the rectifiers operate less deeply in continuous mode, reducing the magnitude of their current commutation, reducing their stray inductance voltage spikes. (The stray inductance is comprised of the leakage inductance between secondary phases and the stray inductance in the connections to the rectifiers and output capacitors). Conversely, operating at a very low fRATIO (fSTOP. 12.0 250 1000 Figure 16. FEEDBACK Pin and DT/BF Pin Current vs. Frequency. 13.0 BT1 BT2 BT3 450 fSTART (kHz) 350 RFMAX (kΩ) 500 PI-6150-052011 450 PI-6457-051911 LCS700-708 500 FEEDBACK Pin The FEEDBACK pin is the voltage regulation FEEDBACK pin. It has a nominal Thevenin equivalent circuit of 0.65 V and 2.5 kΩ. In normal operation, it sinks current. During the off-period of auto-restart, and during the clocked delay before start-up, it pulls up internally to VREF in order to discharge the soft-start capacitor. The current entering the pin determines switching frequency. Higher current yields higher frequency and thus reduces LLC output voltage. In a typical application an optocoupler connected to the VREF pin pulls up on the FEEDBACK pin, via a resistor network. The optocoupler is configured to source increasing FEEDBACK pin current, as the output rises. The resistor network between the optocoupler, FEEDBACK pin, and VREF pin, determine the minimum and maximum FEEDBACK pin current (and thus the minimum and maximum operating frequency), that the optocoupler can command as it goes from cutoff to saturation. This network also contains the soft-start timing capacitor, CSTART (Figure 19). The minimum frequency as set by this network must be lower than the frequency required by the powertrain at minimum input voltage. In Figure 19 this is determined by the sum of RFMIN and RSTART. The FEEDBACK pin current is determined by these two resistors when the optocoupler is cut off. CSTART can be ignored during normal operation. 14 Rev. G 05/17 www.power.com Bursting Duty ≈ 50% 10 μs / div 3.4 V VREF CSTART RFMIN RSTART D1 FB CFB 4.7 nF U1B IPRI VHB PI-6463-060711 LCS700-708 850 ns / div ROPTO RLOAD GND ~850 kHz Figure 19. Feedback Network Shown with Additional Load Resistor. Figure 20. Bursting at fMAX Causes High Internal Dissipation Due to Loss of ZVS and Should be Avoided. 300 The FEEDBACK pin current at start-up is determined by the value of RSTART because the voltage on CSTART will be zero. For minimum start-up peak currents, this current should match or slightly exceed the DT/BF pin current so that start-up switching frequency begins at fMAX. The resulting value of RSTART will be approximately 10% lower than the value of the pull-up resistor on the DT/BF pin. The frequency will slide down as CSTART charges. If RSTART is smaller than that which provides start-up at fMAX, it will create an additional delay before start-up switching. Please see the PIXls HiperLCS spreadsheet. 100 Capacitor CSTART should be sized at the minimum possible value that exhibits a 7 consecutive-cycle peak current at start-up that is just below the peak current measured at brown-out and full load. A larger value will slow down start-up and will make it more likely that fSTOP is not reached. This can prevent exiting start-up mode when the HiperLCS is powered up at high-line and minimum load, and may subsequently cause the HiperLCS to burst at fMAX instead of between fSTART and fSTOP. RFB (kΩ) Do not confuse RSTART, which determines start-up frequency, and fSTART, which is the burst mode start (lower) threshold frequency. Resistor RLOAD provides a load on the optocoupler, and speeds up the large signal transient response during burst mode. The recommended value is ~4.7 kΩ. Diode D1 prevents RLOAD from loading RFMIN when the optocoupler is cut off. Diode D1 can be omitted and a combination of resistor values found to achieve the desired fMIN but the resulting tolerances will be poor. Resistor ROPTO will improve the ESD and surge immunity of the PSU. It also improves burst mode output ripple voltage. Its maximum value must be such that the FEEDBACK pin current is equal to the DT/BF pin current when the optocoupler is in saturation and the FEEDBACK pin is at 2.0 V (please see PIXls HiperLCS spreadsheet). This is to ensure that if the HiperLCS does not exit start-up mode, because the feedback loop did not allow the switching frequency to drop below fSTOP, then it can regulate at light load by bursting at fMAX. Note however bursting at fMAX can lead to high internal dissipation due to loss of ZVS and should be avoided. See Figure 20. Severe Loss of ZVS PI-6151-060911 PI-6118-051711 50 20 10 4 20 50 100 200 500 1000 Frequency (kHz) Figure 21. VREF to FB External Resistance vs. Frequency. In order to calculate RFMIN and RSTART, use the following equation which describes nominal resistance from FEEDBACK pin to VREF pin, vs. frequency: R FB = 3574 f ^0.6041 + 0.1193 # LOG^ f hh Where RFB is in kΩ and f is in kHz. To calculate the minimum RSTART, which produces start-up at fMAX, use the above equation with f = fMAX from the equation relating dead-time and fMAX. To set fMIN, use the above equation with f = fMIN × 0.93. Where 0.93 is to ensure that, despite the worst case frequency tolerance of -7%, the frequency can go below fMIN, guaranteeing regulation at VBROWNOUT. Using the resulting calculated value for RFB, calculate RFMIN: R FMIN = R FB - R START The sum of RFMIN and RSTART determines fMIN. 15 www.power.com Rev. G 05/15 LCS700-708 At start-up, this state remains for 1024 clock cycles at frequency fMAX. During the off-state of auto-restart, or if the OV/UV or IS pin is triggered while the VCC remains above its UVLO threshold, this state remains for 131,072 clock cycles. After 1024 or 131,072 cycles (as the case may be), the HiperLCS turns off the internal pull-up transistor, the soft-start capacitor begins to charge, the output MOSFETs switch at fMAX, current in the FEEDBACK pin diminishes, the frequency begins to drop, and the PSU output rises. For example, for fMAX = 800 kHz, the start-up delay after VCC power-up is 1.3 ms. If IS, or the OV/UV pin are tripped, auto-restart is invoked, with a restart delay of 164 ms. The FEEDBACK pin has a current limit equal to the current flowing into the DT/BF pin. This limits the maximum current that charges the soft-start capacitor at start-up. If RSTART is smaller than that which allows the FEEDBACK pin current to match the DT/BF pin current at start-up, an additional delay is introduced. CSTART will charge at the current limit, and switching will only commence when the FEEDBACK pin voltage drops below 2.0 V. Thus the designer can add an additional start-up delay if desired. As the soft-start capacitor continues to charge, the current through RSTART and thus the FEEDBACK pin decreases, reducing switching frequency. The output voltage climbs; and when the feedback loop closes, the optocoupler conducts and starts controlling the switching frequency thus the output voltage. Remote-Off Remote-off can be invoked by pulling down the OV/UV pin to ground, or by pulling up the IS pin to >0.9 V. Both will invoke a 131,072 cycle restart cycle. VCC can also be pulled down to shut the device off, but when it is pulled up, the FEEDBACK pin is pulled up to the VREF pin to discharge the soft-start capacitor for only 1024 fMAX clock cycles. If this scheme is used, the designer must ensure that the time the VCC is pulled down, plus 1024 cycles, is sufficient to discharge the soft-start capacitor, or if not, that the resulting lower starting frequency is high enough so as not to cause excessive primary currents that may cause the over-current protection to trip. IS Pin The IS pin has 2 thresholds: nominally 0.5 V and 0.9 V. The IS pin can tolerate small negative voltages and currents, and thus does not A 4 B 80 70 60 2 Primary Current 0 50 -2 40 -4 30 -6 Volts (V) Start-Up and Auto-Restart At start-up and during the off-state of the auto-restart cycle, the FEEDBACK pin is internally pulled up to the VREF pin. This keeps the output MOSFETs off and discharges the soft-start capacitor, in preparation for soft-start. PI-6471-052411 6 Amps (A) It should be noted that the 4.7 nF decoupling capacitor, CFB (see Figure 19), in conjunction with the 2.5 kΩ input resistance presented by the FEEDBACK pin, form a pole in the LLC transfer function. This can add significant phase lag to the feedback loop. A typical value for a 250 kHz design with a 3 kHz crossover frequency is 4.7 nF. To prevent loop instability, the value of the 4.7 nF capacitor should not be increased arbitrarily. At the other extreme, insufficient FEEDBACK pin bypass capacitance or poor layout may cause duty cycle asymmetry. 20 Output Voltage 10 -8 0 -10 0 0.5 1 1.5 2 2.5 3 3.5 Time (ms) 4 4.5 5 Figure 22. Typical Start-up Waveform. Observe Initial Current Spike ‘A’ to Ensure it is Below the 1-Cycle Current Limit. A Higher f MAX Reduces it. Size the Soft-Start Capacitor so that the Peak of ‘B’ is just Below the Peak Current at VBROWNOUT at Full Load. need a peak detector or rectifier circuit. The pin has a reverse-biased diode to ground equivalent circuit, and can tolerate a maximum negative current of 5 mA. The primary current is sampled by a primary, B- referenced current sense resistor, or by a capacitor current divider + current sense resistor combination circuit. In order to limit the negative current to 5 mA, a current limiting resistor between the sense resistor and the IS pin is necessary, with a minimum value of 220 Ω. Using the minimum value maximizes the IS pin bypass capacitor value and thus pin noise rejection, for a given RC pole frequency. The IS pin will invoke a restart if it sees 7 consecutive pulses >0.5 V. It will also invoke a restart if a single pulse exceeds 0.9 V. The minimum pulse detection time is nominally 30 ns – i.e. the pulses must be higher than the threshold voltage for >30 ns. The “capacitive divider” circuit in Figure 23 reduces power dissipation and improves efficiency over a simple current sense resistor circuit. The two capacitors, main resonant capacitor C11, and sense capacitor C12, form a current divider. The portion of the primary current routed through C12 is C12 C11 + C12 . Consequently, the voltage at the IS pin is equal to IP # C12 C11 + C12 # R11, where IP is the primary current flowing from the HB pin through the transformer primary. The current in the sense capacitor passes through sense resistor R11. Resistor R11 is the main means for tuning current limit. The signal on R11, an AC voltage, passes through low-pass filter R12 and C7, to the IS pin. Note that R11 is returned to the GROUND pin and not to SOURCE pin. 16 Rev. G 05/17 www.power.com LCS700-708 24.1 24.0 HB Voltage (V) Burst Mode Operation and Tuning Burst mode will produce a typical waveform such as in Figure 24. During the burst pulse train, the switching frequency rises from fSTART to fSTOP. PI-6469-062811 Output Ripple Voltage (V) The recommended series resistor value of 220 W and the bypass capacitor form a low-pass filter, and its time constant must not cause significant attenuation of the current sense signal at the nominal operating frequency. The effect of the attenuation is greatest for the first pulse in the start-up current waveform, and can also affect proper shutdown during short-circuit testing, which typically trips the 7-cycle current limit. Place a close-coupled probe across the IS pin bypass capacitor and compare the waveform to the primary current. 400 23.9 300 200 100 0 LLC Transformer 0 HB Pin 25 Time (μs) 50 Figure 25. Zoom in of First Few Switching Cycles of Burst Pulse Train of Figure 24. The First 2 Cycles Show That the High-Side Driver has not Turned on yet. The Switching Frequency of the First Few Cycles is fSTART, 335 kHz in This Case. The Ringing on the Output is from the Output Filter. C12 47 pF 1 kV C11 6.8 nF 1 kV IS Pin C7 GROUND 220 pF Pin R12 1 kΩ R11 24 Ω S Pin PI-6161-093010 I = C # dv dt Figure 23. Capacitive Divider Current Sense Circuit. Where I = load current. C is the total output capacitance. PI-6468-062811 24.1 Output Ripple Voltage (V) HB Voltage (V) 24.0 23.9 400 300 200 100 0 Burst Repetition Rate 0 50 Time (ms) If the initial output ripple spike at the beginning of the burst pulse train is ignored, the output ripple somewhat resembles a sawtooth. See the output ripple waveform in Figure 24. When the HiperLCS is switching, the output rises. When it stops switching, the output falls. The top of the sawtooth is where the burst pulse train ends, because the feedback loop has commanded a frequency = fSTOP. The bottom of the sawtooth is where the burst pulse train begins, because the feedback loop has commanded a frequency = fSTART. As such, the burst mode control resembles a hysteretic controller, where the top and bottom of the sawtooth are fixed by the feedback loop gain. The downward slope of the sawtooth is merely the output capacitors discharging into the load, with dv/dt: 100 The upward slope of the sawtooth is dependent on the difference between the current delivered by the powertrain, and the current drawn by the load. For a given design, the upward slope increases with input voltage. The burst repetition rate (frequency) then increases with load. When the load reaches a point where the powertrain can regulate at a frequency 30 N applied to the center of the package. 3. Junction to case thermal resistance is based on hottest junction, case temperature measured at center of package back surface. 4. Temperature difference between hottest junction and over temperature sensor. Conditions SOURCE = 0 V; TJ = -40 °C to 125 °C (D) VCC = 12 V, VCCH = 12 V (Unless Otherwise Specified) Min Typ Max Units Half-Bridge OFF-State Current Breakdown Voltage IDSS BVDSS Measured from D to HB or from HB to S TJ = 100 °C, VCC = 12 V, VCCH = 12 V, VD = 424 V LCS700 60 LCS701 60 LCS702 65 LCS703 80 LCS705 120 LCS708 200 VCC = 12 V, VCCH = 12 V, 250 mA, TJ = 25 °C Measured from D to HB or from HB to S 530 mA V 19 www.power.com Rev. G 05/15 LCS700-708 Parameter Symbol Conditions SOURCE = 0 V; TJ = -40 °C to 125 °C (D) VCC = 12 V, VCCH = 12 V (Unless Otherwise Specified) BVDSS(TC) Measured from D to HB or from HB to S Min Typ Max Units Half-Bridge (cont.) Breakdown Voltage Temperature Coefficient ON-State Resistance ON-State Resistance Half-Bridge Capacitance Diode Forward Voltage RDS(ON) RDS(ON) CHB VFWD Measured from D to HB or from HB to S VCC = 12 V, VCCH = 12 V, TJ = 25 °C Measured from D to HB or from HB to S VCC = 12 V, VCCH = 12 V, TJ = 100 °C V/°C LCS700, I = 0.8 A 1.53 1.82 LCS701, I = 1.2 A 1.00 1.24 LCS702, I = 1.6 A 0.74 0.92 LSC703, I = 2.0 A 0.60 0.73 LCS705, I = 3.0 A 0.40 0.49 LCS708, I = 4.8 A 0.26 0.31 LCS700, I = 0.8 A 2.15 2.63 LCS701, I = 1.2 A 1.42 1.78 LCS702, I = 1.6 A 1.05 1.33 LCS703, I = 2.0 A 0.85 1.06 LCS705, I = 3.0 A 0.58 0.71 LCS708, I = 4.8 A 0.36 0.45 LCS700 134 Effective half-bridge capacitance. VHB swinging from 0 V to 400 V or 400 V to 0 V, See Note A Measured from HB to D or from S to HB TJ = 125 °C 0.2 LCS701 201 LCS702 268 LCS703 335 LCS705 503 LCS708 804 LCS700, I = 0.8 A 1.15 LCS701, I = 1.2 A 1.15 LCS702, I = 1.6 A 1.15 LSC703, I = 2.0 A 1.15 LCS705, I = 3.0 A 1.15 LCS708, I = 4.8 A 1.15 W W pF V Power Supply VCC Supply Voltage Range VCC See Note C 11.4 12 15 V VCCH Supply Voltage Range VCCH See Note C 11.4 12 15 V ICC(OFF) Undervoltage lockout state: VCC = 7 V 120 170 mA ICC(INHIBIT) VCC = 12 V, OV/UV < VSD(L) 450 650 mA LCS700 2.8 5.2 LCS701 3.3 5.8 LCS702 3.8 6.5 LCS703 4.2 7.1 LCS705 5.4 8.8 LCS708 7.4 11.8 Start-Up Current Inhibit Current VCC Operating Current VCCH Operating Current ICC(ON) ICCH(ON) Typical at VCC = 12 V Maximum at VCC = 15 V Measured at 300 kHz, HB Open and VD = 15 V Typical at VCCH = 12 V Maximum at VCCH = 15 V Measured at 300 kHz, HB Open and VD = 15 V LCS700 2.4 4.6 LCS701 2.9 5.2 LCS702 3.3 5.8 LSC703 3.7 6.4 LCS705 4.8 7.9 LCS708 6.8 10.7 mA mA 20 Rev. G 05/17 www.power.com LCS700-708 Parameter Symbol Conditions SOURCE = 0 V; TJ = -40 °C to 125 °C (D) VCC = 12 V, VCCH = 12 V (Unless Otherwise Specified) Min Typ Max Units VCCH Supply Undervoltage Lockout VCC Start Threshold VUVLO(+) Device exits UVLO state when VCC exceeds UVLO+, TJ = 0 to 100 °C 10 10.5 11.4 V VCC Shutdown Threshold VUVLO(-) Device enters UVLO state when VCC falls below UVLO+, TJ = 0 to 100 °C 9.1 9.5 10.5 V VCC Start-Up/ Shutdown Hysteresis VUVLO(HYST) TJ = 0 to 100 °C 0.7 1.0 1.2 V VCCH Start Threshold VUVLO(H+) Driver exits UVLO state when VCCH exceeds UVLOH+ 8.2 8.5 8.9 V VCCH Shutdown Threshold VUVLO(H-) Driver enters UVLO state when VCCH falls below UVLOH- 7.2 7.5 7.9 V 0.8 1.0 1.2 V VCCH Start-Up/Shutdown Hysteresis VUVLO(H)HYST High-Voltage Supply Undervoltage/Overvoltage Enable OV/UV Overvoltage Shutdown Threshold VOV(H) Overvoltage assertion threshold 129 131 133 % of VSD(H) OV/UV Overvoltage Recovery Threshold VOV(L) Overvoltage de-assertion threshold 124 126 128 % of VSD(H) OV/UV Undervoltage Start Threshold VSD(H) Undervoltage de-assertion threshold 2.35 2.40 2.45 V OV/UV Undervoltage Shutdown Threshold VSD(L) Undervoltage assertion threshold 77 79 81 % of VSD(H) R IN(OVUV) OV/UV pin resistance to G TJ = 25 °C 4.0 5.0 6.0 MW OV/UV Pin Input Resistance OV/UV Pin Input Resistance Temperature Coefficient R IN(OVUVTC) -0.4 %/°C Reference Reference Voltage VREF Current Source Capability of VREF Pin IREF VREF Capacitance CREF IREF = 4 mA Required external coupling on VREF pin 3.20 3.40 3.50 V 4 mA 1 mF LLC Oscillator Frequency Range Accuracy of Minimum Frequency Limit Accuracy of Maximum Frequency Limit Duty Balance Dead-TimeB DT/BF Control Current Range FRANGE 25 1000 kHz FMIN(ACC) RFB = 37.9 kW to VREF , 180 kHz -5.0 5.0 FMIN(ACL) RFB = 154 kW to VREF , 48 kHz TJ = 25 °C -7.5 7.5 FMAX(ACC) IFB = IDT/BF, RFMAX = 12.5 kW, FMAX = 510 kHz, TJ = 0 to 100 °C -7.5 7.5 % DLLC Duty symmetry of the half-bridge waveform, CFB = 4.7 nF, CDT/BF = 4.7 nF, 250 kHz Use recommended layout 49 51 % tD RFMAX = 7 kW, RBURST = 39.6 kW IDT/BF 330 30 % ns 430 mA 21 www.power.com Rev. G 05/15 LCS700-708 Symbol Conditions SOURCE = 0 V; TJ = -40 °C to 125 °C (D) VCC = 12 V, VCCH = 12 V (Unless Otherwise Specified) ISTOP1 Threshold applies after exiting soft-start mode for burst setting BT1 52.0 ISTOP2 Threshold applies after exiting soft-start mode for burst setting BT2 46.0 ISTOP3 Threshold applies after exiting soft-start mode for burst setting BT3 39.0 IBURST(HYST) ISTART is IBURST(HYST) below ISTOP 5 6.8 8 VBT1 Required VDT/BF at start-up to enable burst setting BT1 93.5 95 96.3 VBT2 Required VDT/BF at start-up to enable burst setting BT2 88.5 90 91.3 VBT3 Required VDT/BF at start-up to enable burst setting BT3 83.5 85 86.3 RCDT/BF This time constant must be less than the specified maximum to ensure correct setting of burst mode. Feedback Current Maximum IFB Determines the maximum control frequency that can be set by IFB Feedback Control Current Range IFB IFB is limited by the current into DT/BF Feedback Virtual Voltage VFB FB input appears as R IN(FB) in series with VFB, 30 mA < IFB < IDT/BF 0.65 V Feedback Input Resistance R IN(FB) FB input appears as R IN(FB) in series with VFB, 30 mA < IFB < IDT/BF 2.5 kW Feedback Input Resistance During Soft-Start RFB(SS) FB input appears as RFB(SS) in series with VREF during the soft-start delay interval or when OV/UV < VSD or OV/UV > VOV 750 W Parameter Min Typ Max Units LLC Oscillator (cont.) IFB Threshold to Stop LLC Switching IFB Threshold Hysteresis DT/BF Voltage to Program Burst Setting Time Constant for the Combination of RFMAX, RBURST and the Decoupling Cap on DT/BF % of IDT/BF 100 100 15 % of IDT/BF % of VREF ms %IDT/BF 430 mA Over-Current Protection Fast Over-Current Fault Voltage Threshold4 VIS(F) Slow Over-Current Fault Voltage Threshold VIS(S) 7 LLC clock cycle debounce tIS Minimum time VIS exceeds VIS(F)/VIS(S) per cycle to trigger fault protection Over-Current Fault Pulse Width 0.855 0.905 0.955 V 0.455 0.505 0.555 V 30 ns 125 °C Over-Temperature Protection Over-Temperature Shutdown ThresholdA TOT NOTES: A. Guaranteed by design. B. Typical apparent dead-time at the HB pin under resonant ZVS conditions. C. VCC/VCCH operating range to achieve power capabilities specified in data sheet power table. D. Operation possibly limited by over-temperature shutdown. 22 Rev. G 05/17 www.power.com LCS700-708 Typical Performance Characteristics 12 Current (mA) 12 10 8 6 LCS700 LCS701 LCS702 LCS703 LCS705 LCS708 4 2 200 300 400 500 Frequency (kHz) 600 700 2 Power (mW) 600 500 400 300 LCS700 LCS701 LCS702 LCS703 LCS705 LCS708 200 100 300 400 500 Frequency (kHz) 600 700 200 300 400 500 Frequency (kHz) 600 700 800 LCS700 LCS701 LCS702 LCS703 LCS705 LCS708 1000 800 600 400 0 800 0 50 100 150 200 250 300 350 400 Half-Bridge Voltage (V) Figure 30. Half-Bridge Small Signal Capacitance vs. Half-Bridge Voltage. PI-6758-050812 1.80 RDS(ON) (Normalized To Room Temperature) 100 200 Figure 29. Control Power vs. Frequency. 1.60 1.40 1.20 1.00 1.50 1.00 0.50 0.00 -0.50 .80 .60 -40 0 1200 Capacitance (pF) 700 200 0 800 PI-6183-022912 800 100 LCS700 LCS701 LCS702 LCS703 LCS705 LCS708 Figure 28. VCCH Current vs. Frequency. 900 0 6 PI-6184-112910 100 8 PI-6759-050812 0 10 4 Figure 27. VCC Current vs. Frequency. 0 14 Shift In FMIN(ACC) From Room Temperature (%) Current (mA) 14 PI-6182-022912 16 0 16 PI-6181-022912 18 -1.00 -20 0 20 40 60 Temperature (°C) Figure 31. Normalized R DS(ON) vs. Temperature. 80 100 120 -1.50 -40 -20 0 20 40 60 80 100 120 Temperature (°C) Figure 32. Typical FMIN(ACC) Shift vs. Temperature. 23 www.power.com Rev. G 05/15 LCS700-708 4.00 528 Shift In FMIN(ACL) From Room Temperature (%) 530 526 524 522 520 518 2.00 1.00 0.00 -2.00 514 -20 0 20 40 60 80 100 -3.00 -40 120 -20 0 Figure 33. Normalized BVDSS vs. Temperature. 40 80 100 120 80 100 120 80 100 120 6.00 PI-6762-050812 1.50 5.50 1.00 RIN(OVUV) (MΩ) 5.00 -0.50 -0.00 -0.50 4.50 4.00 3.50 -1.00 3.00 -1.50 2.50 -20 0 20 40 60 80 100 2.00 -40 120 -20 0 20 40 3.45 50.5 3.44 3.43 50.4 50.3 Duty Balance (%) 3.42 3.41 3.40 3.39 3.38 50.2 50.1 50.0 49.9 49.8 3.37 49.7 3.36 49.6 0 20 40 60 Temperature (°C) Figure 37. Typical VREF vs. Temperature. 80 100 120 PI-6765-050812 Figure 36. Typical R IN(OVUV) vs. Temperature. PI-6764-051412 Figure 35. Typical FMAX(ACC) vs. Temperature. -20 60 Temperature (°C) Temperature (°C) 3.35 -40 60 Figure 34. Typical FMIN(ACL) vs. Temperature. 2.00 VREF (V) 20 Temperature (°C) PI-6763-051412 512 -40 Temperature (°C) Shift In FMAX(ACC) From Room Temperature (%) 3.00 -1.00 516 -2.00 -40 PI-6761-050812 532 PI-6760-050812 BVDSS (Normalized To 530 V at Room Temperature) Typical Performance Characteristics 49.5 -40 -20 0 20 40 60 Temperature (°C) Figure 38. Typical Duty Balance vs. Temperature. 24 Rev. G 05/17 www.power.com LCS700-708 Typical Performance Characteristics 465 PI-6767-050812 470 1.030 460 Normalized ICC(ON) ICC(INHIBIT) (μA) 1.050 PI-6766-050812 475 455 450 445 440 1.010 0.990 0.970 435 430 425 -40 -20 0 20 40 60 80 100 0.950 -40 120 -20 0 Figure 39. Typical ICC(INHIBIT) vs. Temperature. 60 80 100 120 1.02 100 120 PI-6769-050812 10.6 VCC UVLO Threshold (V) LCS700 LCS701 LCS702 LCS703 LCS705 LCS708 1.04 10.8 PI-6768-060712 Normalized ICCH(ON) (µA) 40 Figure 40. Normalized ICC(ON) vs. Temperature. 1.06 1 0.98 0.96 0.94 -40 20 Temperature (°C) Temperature (°C) 10.4 10.2 VCC-UVLO(+) VCC-UVLO(-) 10.0 9.8 9.6 9.4 -20 0 20 40 60 80 100 9.2 -40 120 -20 0 Figure 41. Typical ICCH(ON) vs. Temperature (Normalized to Room Temperature). 40 60 80 Figure 42. Typical VCC UVLO vs. Temperature. PI-6770-050812 8.8 8.6 VCCH UVLO Threshold (V) 20 Temperature (°C) Temperature (°C) 8.4 8.2 VCC-UVLO(+) VCC-UVLO(-) 8.0 7.8 7.6 7.4 7.2 -40 -20 0 20 40 60 80 100 120 Temperature (°C) Figure 43. Typical VCCH UVLO vs. Temperature. 25 www.power.com Rev. G 05/15 Rev. G 05/17 1 5 6 9 10 11 END VIEW 0.628 [15.95] Ref. 0.060 [1.52] Ref. FRONT VIEW 7 8 Pin 1 I.D. 0.653 [16.59] 0.647 [16.43] 0.038 [0.97] 3 4 0.019 [0.48] Ref. A 2 13 14 16 2 0.140 [3.56] 0.120 [3.05] Detail A SIDE VIEW 0.118 [3.00] 0.047 [1.19] 0.016 [0.41] Ref. 0.290 (7.37] Ref. 0.027 [0.70] 0.023 [0.58] 0.020 [0.50] Detail A (Scale = 9×) 0.016 [0.41] 13× 0.011 [0.28] 0.020 M 0.51 M C 3 0.021 [0.53] 0.019 [0.48] 0.048 [1.22] 0.046 [1.17] 10° Ref. All Around 0.056 [1.42] Ref. 0.325 [8.25] 0.320 [8.13] B 0.081 [2.06] 0.077 [1.96] C eSIP-16J (H Package) 3 Dimensions in inches, (mm). All dimensions are for reference. PCB FOOT PRINT 0.118 (3.00) 0.029 Dia Hole 0.062 Dia Pad BACK VIEW 4 0.024 [0.61] 13× 0.019 [0.48] 0.010 M 0.25 M C A B 0.207 [5.26] 0.187 [4.75] Notes: 1. Dimensioning and tolerancing per ASME Y14.5M-1994. 2. Dimensions noted are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between the top and bottom of the plastic body. Maximum mold protrusion is 0.007 [0.18] per side. 3. Dimensions noted are inclusive of plating thickness. 4. Does not include interlead flash or protrusions. 5. Controlling dimensions in inches [mm]. PI-6632-120211 0.076 (1.93) 0.038 (0.97) 0.012 (0.30] Ref. 0.076 [1.93] 0.519 [13.18] Ref. LCS700-708 26 www.power.com www.power.com 1 5 6 END VIEW 0.628 (15.95) Ref. 0.060 (1.52) Ref. 11 13 0.056 (1.42) Ref. 9 10 FRONT VIEW Typ. 9 Places 7 8 Pin 1 I.D. 0.038 (0.97) 3 4 0.019 (0.48) Ref. A 2 0.653 (16.59) 0.647 (16.43) 14 16 2 0.094 (2.40) Detail A 0.048 (1.22) 0.046 (1.17) 0.021 (0.53) 0.019 (0.48) 10° Ref. All Around R0.012 (0.30) Typ., Ref. 0.016 (0.41) 13× 0.011 (0.28) 0.020 M 0.51 M C 3 0.325 (8.25) 0.320 (8.13) B SIDE VIEW 0.027 (0.70) 0.023 (0.58) 0.020 (0.50) 0.128 (3.26) 0.122 (3.10) 0.144 (3.66) Ref. 0.047 (1.19) Ref. 0.050 (1.26) Ref. 0.290 (7.37) Ref. Detail A (N.T.S.) 0.081 (2.06) 0.077 (1.96) C eSIP-16K (L Package) 14 13 11 10 3 5 4 4 3 1 0.173 (4.39) 0.163 (4.14) 0.024 (0.61) 13× 0.019 (0.48) 0.010 M 0.25 M C A B 7 6 0.076 (1.93) 0.038 (0.97) BACK VIEW 9 8 Dimensions in inches, (mm). All dimensions are for reference. PCB FOOT PRINT 0.094 (2.40) 0.029 Dia Hole 0.062 Dia Pad 16 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M-1994. 2. Dimensions noted are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between the top and bottom of the plastic body. Maximum mold protrusion is 0.007 [0.18] per side. 3. Dimensions noted are inclusive of plating thickness. 4. Does not include interlead flash or protrusions. 5. Controlling dimensions in inches (mm). PI-6454-020212 Typ. 3 Pieces 0.076 (1.93) 0.079 (1.99) 0.069 (1.74) LCS700-708 Rev. G 05/15 27 LCS700-708 Part Ordering Information • Hiper Product Family • LCS Series Number • Package Identifier H Plastic eSIP-16J L Plastic eSIP-16K • Pin Finish LCS 700 H G G Halogen Free and RoHS Compliant 28 Rev. G 05/17 www.power.com LCS700-708 Revision Notes Date B Initial Release. C Added L bend parts. 06/20/11 02/12 C1 Removed backside metal H package option. 06/12 D Not implemented. E Overmold change, extended temperature change. E Updated BVDSS(TC) unit, Junction Temperature range and added Note 7. 08/30/12 06/12 E Corrected error in Figure 3. 12/02/14 F Updated with new Brand Style. 06/15 G Added LG package parts for LCS705 and LCS708. 05/17 29 www.power.com Rev. G 05/15 For the latest updates, visit our website: www.power.com Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. Patent Information The products and applications illustrated herein (including transformer construction and circuits external to the products) may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrations patents may be found at www.power.com. Power Integrations grants its customers a license under certain patent rights as set forth at http://www.power.com/ip.htm. Life Support Policy POWER INTEGRATIONS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS. As used herein: 1. A Life support device or system is one which, (i) is intended for surgical implant into the body, or (ii) supports or sustains life, and (iii) whose failure to perform, when properly used in accordance with instructions for use, can be reasonably expected to result in significant injury or death to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. The PI logo, TOPSwitch, TinySwitch, SENZero, SCALE, SCALE-iDriver, Qspeed, PeakSwitch, LYTSwitch, LinkZero, LinkSwitch, InnoSwitch, HiperTFS, HiperPFS, HiperLCS, DPA-Switch, CAPZero, Clampless, EcoSmart, E-Shield, Filterfuse, FluxLink, StakFET, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies. ©2017, Power Integrations, Inc. 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LCS700LG
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