PA4349.753ANLT

SMT Power Inductor High Current Molded Power Inductor - PA4349.XXXANLT Series Height: 13.0mm Max Footprint: 24.0mm x 22.3mm Max Current Rating: up to 62.0A Inductance Range: 1.5uH to 100uH Shielded construction and compact design High current, low DCR, and high efficiency Minimized acoustic noise and minimized leakage flux Electrical Specifications @ 25°C - Operating Temperature -55°C to +155°C DC Resistance Inductance 100KHz, 1V Rated Current MAX. TYP. Saturation Current Max. uH±20% 1.5 A 62.0 mΩ 1.15 mΩ 1.00 A 52.0 PA4349.202ANLT 2.0 60.0 1.20 1.02 50.0 PA4349.222ANLT PA4349.302ANLT PA4349.332ANLT PA4349.472ANLT PA4349.682ANLT PA4349.103ANLT PA4349.223ANLT PA4349.233ANLT PA4349.333ANLT PA4349.473ANLT PA4349.683ANLT PA4349.753ANLT PA4349.823ANLT PA4349.104ANLT 2.2 3.0 3.3 4.7 6.8 10.0 22.0 23.0 33.0 47.0 68.0 75.0 82.0 100 58.0 51.0 49.0 47.0 40.0 33.0 22.0 22.0 19.0 17.0 14.0 13.0 12.0 11.0 1.25 1.64 1.75 2.20 3.10 4.15 11.0 11.0 15.4 20.8 29.5 31.6 34.2 40.0 1.05 1.42 1.50 1.90 2.70 3.80 9.20 9.20 13.5 17.3 26.2 27.5 31.0 36.0 48.0 44.0 41.0 38.0 36.0 28.0 15.0 15.0 12.0 12.0 12.0 10.5 9.0 9.0 Part Number PA4349.152ANLT 1 power.pulseelectronics.com P821.E (09/19) http://www.power.pulseelectronics.com/contact SMT Power Inductor High Current Molded Power Inductor - PA4349.XXXANLT Series Notes: 1. Actual temperature of the component during system operation (ambient plus tempera- 3. The rated current is the DC current required to raise the component temperature by ture rise) must be within the standard operating range. approximately 40�C. Take note that the components’ performanc varies depending on the 2. The saturation current is the current at which the initial inductance drops approxisystem condition. It is suggested that the component be tested at the system level, to mately 30% at the stated ambient temperature. This current is determined by placing verify the temperature rise of the component during system operation. the component in the specified ambient environment and applying a short duration 4. The part temperature (ambient+temp rise) should not exceed 155�C under worst case pulse current (to eliminate self-heating effect) to the component. operating conditions. Circuit design, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. Mechanical PA4349.XXXANLT C A D L XXXANL D/C E H B G Final Layout SUGGESTED PAD LAYOUT Series A B C D E L G H PA4349.XXXANLT 23.5±0.5 22.0±0.3 12.6±0.4 5.0±0.4 19.0±0.3 24 12.5 19.6 All Dimensions in mm. TAPE & REEL INFO Chip cavity Blank portions K0 A W Blank portions P1 200mm or more 400mm or more G Direction of tape SURFACE MOUNTING TYPE, REEL/TAPE LIST REEL SIZE (mm) PA4349.XXXANLT 2 TAPE SIZE (mm) QTY A G P1 W K0 PCS/REEL Ø330 44.4+2/-0 32±0.1 44±0.3 13±0.1 80 power.pulseelectronics.com P821.E (09/19) http://www.power.pulseelectronics.com/contact SMT Power Inductor High Current Molded Power Inductor - PA4349.XXXANLT Series Typical Performance Curves 2.8 40 1.5 30 2.1 30 1 20 1.4 20 0.5 10 0.7 10 14 42 DC CURRENT(A) 56 PA4349.222ANLT 0 0 70 0 13 26 39 DC CURRENT(A) 52 PA4349.302ANLT 2.8 40 4 36 2.1 30 3 27 1.4 20 2 18 0.7 10 1 9 0 0 0 13 26 39 DC CURRENT(A) 52 PA4349.332ANLT INDUCTANCE (uH) 5 0 65 0 11 22 33 DC CURRENT(A) 45 44 PA4349.472ANLT 0 55 7 4 32 5.6 36 3 24 4.2 27 2 16 2.8 18 1 8 1.4 9 0 0 0 0 3 11 22 33 DC CURRENT(A) 44 power.pulseelectronics.com INDUCTANCE (uH) 40 5 55 P821.E (09/19) 0 10 20 30 DC CURRENT(A) TEMP. RISE(oC) 0 65 50 TEMP. RISE(oC) 3.5 INDUCTANCE (uH) 28 50 TEMP. RISE(oC) 0 INDUCTANCE (uH) 40 TEMP. RISE(oC) 2 TEMP. RISE(oC) INDUCTANCE (uH) 3.5 0 INDUCTANCE (uH) PA4349.202ANLT 50 45 40 TEMP. RISE(oC) PA4349.152ANLT 2.5 0 50 http://www.power.pulseelectronics.com/contact SMT Power Inductor High Current Molded Power Inductor - PA4349.XXXANLT Series 4 power.pulseelectronics.com P821.E (09/19) http://www.power.pulseelectronics.com/contact SMT Power Inductor High Current Molded Power Inductor - PA4349.XXXANLT Series                                                                                         For More Information Pulse Worldwide Headquarters 15255 Innovation Drive Ste 100 San Diego, CA 92128 U.S.A. Pulse Europe Pulse Electronics GmbH Am Rottland 12 58540 Meinerzhagen Germany Pulse China Headquarters Pulse Electronics (ShenZhen) CO., LTD D708, Shenzhen Academy of Aerospace Technology, The 10th Keji South Road, Nanshan District, Shenzhen, P.R. China 518057 Pulse North China Room 2704/2705 Super Ocean Finance Ctr. 2067 Yan An Road West Shanghai 200336 China Pulse South Asia 3 Fraser Street 0428 DUO Tower Singapore 189352 Pulse North Asia 1F, No.111 Xiyuan Road Zhongli District Taoyuan City 32057 Taiwan (R.O.C) Tel: 858 674 8100 Fax: 858 674 8262 Tel: 49 2354 777 100 Fax: 49 2354 777 168 Tel: 86 755 33966678 Fax: 86 755 33966700 Tel: 86 21 62787060 Fax: 86 2162786973 Tel: 65 6287 8998 Fax: 65 6280 0080 Tel: 886 3 4356768 Fax: 886 3 4356820 Performance warranty of products offered on this data sheet is limited to the parameters specified. Data is subject to change without notice. Other brand and product names mentioned herein may be trademarks or registered trademarks of their respective owners. © Copyright, 2019. Pulse Electronics, Inc. All rights reserved. 5 power.pulseelectronics.com P821.E (09/19) http://www.power.pulseelectronics.com/contact