DATASHEET
IDT5V41066
4 OUTPUT PCIE GEN1/2 SYNTHESIZER
Recommended Applications
Features/Benefits
4 Output synthesizer for PCIe Gen1/2
• 20-pin TSSOP package; small board footprint
• Spread-spectrum capable; reduces EMI
• Outputs can be terminated to LVDS; can drive a wider
General Description
variety of devices
The IDT5V41066 is a PCIe Gen2 compliant
spread-spectrum-capable clock generator. The device has
4 differential HCSL outputs and can be used in
communication or embedded systems to subtantially
reduce electro-magnetic interference (EMI). The spread
amount and output frequency are selectable via select pins.
• Power down pin; greater system power management
• OE control pin; greater system power management
• Spread% and frequency pin selection; no software
required to configure device
• Industrial temperature range available; supports
demanding embedded applications
Output Features
• For PCIe Gen3 applications, see the 5V41236
• 4 - 0.7V current mode differential HCSL output pairs
Key Specifications
• Cycle-to-cycle jitter < 100 ps
• Output-to-output skew < 50 ps
• PCIe Gen2 phase jitter < 3.0ps RMS
Block Diagram
VDD
PD
OE
2
3
SEL[2:0]
Spread
Spectrum/
Output
clock
selection
Spread
Spectrum
Circuitry
CLKOUTA
X1
25 MHz
crystal or
clock
Clock
Oscillator
X2
CLKOUTA
CLKOUTB
PLL Clock
Synthesis
CLKOUTB
CLKOUTC
CLKOUTC
CLKOUTD
CLKOUTD
Optional tuning crystal
capacitors
2
Rr(IREF)
GND
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Pin Assignment
VDDXD
1
20
CLKA
S0
2
19
CLKA
S1
3
18
CLKB
S2
4
17
CLKB
X1
5
16
GNDODA
X2
6
15
VDDODA
PD
7
14
CLKC
OE
8
13
CLKC
GNDXD
9
12
CLKD
10
11
CLKD
IREF
20-pin (173 mil) TSSOP
Spread Spectrum Selection Table
S2 S1 S0 Spread% Spread Type
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
-0.5
Down
-1.0
Down
-1.5
Down
No Spread Not Applicable
-0.5
Down
-1.0
Down
-1.5
Down
No Spread Not Applicable
IDT® 4 OUTPUT PCIE GEN1/2 SYNTHESIZER
Output
Frequency
100
100
100
100
200
200
200
200
2
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Pin Descriptions
Pin
Pin
Name
Pin
Type
Pin Description
1
2
3
4
5
6
7
8
VDDXD
S0
S1
S2
X1
X2
PD
OE
Power
Input
Input
Input
Input
Output
Input
Input
Connect to +3.3 V digital supply.
Spread spectrum select pin #0. See table above. Internal pull-up resistor.
Spread spectrum select pin #1. See table above Internal pull-up resistor.
Spread spectrum select pin #2. See table above. Internal pull-up resistor.
Crystal connection. Connect to a fundamental mode crystal or clock input.
Crystal connection. Connect to a fundamental mode crystal or leave open.
Powers down all PLL’s and tri-states outputs when low. Internal pull-up resistor.
Provides output on, tri-states output (High = enable outputs; Low = disable outputs).
Internal pull-up resistor.
9
10
11
12
13
14
15
16
GND
IREF
CLKD
CLKD
CLKC
CLKC
VDDODA
GND
Power
Output
Output
Output
Output
Output
Power
Power
Connect to digital ground.
Precision resistor attached to this pin is connected to the internal current reference.
Selectable 100/200 MHz spread spectrum differential Complement output clock D.
Selectable 100/200 MHz spread spectrum differential True output clock D.
Selectable 100/200 MHz spread spectrum differential Complement output clock C.
Selectable 100/200 MHz spread spectrum differential True output clock C.
Connect to +3.3 V analog supply.
Connect to analog ground.
17
CLKB
Output Selectable 100/200 MHz spread spectrum differential Complement output clock B.
18
CLKB
Output Selectable 100/200 MHz spread spectrum differential True output clock B.
19
CLKA
Output Selectable 100/200 MHz spread spectrum differential Complement output clock A.
20
CLKA
Output Selectable 100/200 MHz spread spectrum differential True output clock A.
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Application Information
Decoupling Capacitors
Load Resistors RL
As with any high-performance mixed-signal IC, the
IDT5V41066 must be isolated from system power supply
noise to perform optimally.
Since the clock outputs are open source outputs, 50 ohm
external resistors to ground are to be connected at each
clock output.
Decoupling capacitors of 0.01µF must be connected
between each VDD and the PCB ground plane.
Output Termination
The PCI-Express differential clock outputs of the
IDT5V41066 are open source drivers and require an
external series resistor and a resistor to ground. These
resistor values and their allowable locations are shown in
detail in the PCI-Express Layout Guidelines section.
PCB Layout Recommendations
For optimum device performance and lowest output phase
noise, the following guidelines should be observed.
Each 0.01µF decoupling capacitor should be mounted on
the component side of the board as close to the VDD pin as
possible. No vias should be used between decoupling
capacitor and VDD pin. The PCB trace to VDD pin should
be kept as short as possible, as should the PCB trace to the
ground via. Distance of the ferrite bead and bulk decoupling
from the device is less critical.
The IDT5V41066 can also be configured for LVDS
compatible voltage levels. See the LVDS Compatible
Layout Guidelines section.
2) An optimum layout is one with all components on the
same side of the board, minimizing vias through other signal
layers (the ferrite bead and bulk decoupling capacitor can be
mounted on the back). Other signal traces should be routed
away from the IDT5V41066.
This includes signal traces just underneath the device, or on
layers adjacent to the ground plane layer used by the device.
External Components
A minimum number of external components are required for
proper operation. Decoupling capacitors of 0.01 μF should
be connected between VDD and GND pairs (1,9 and 15,16)
as close to the device as possible.
On chip capacitors- Crystal capacitors should be
connected from pins X1 to ground and X2 to ground to
optimize the initial accuracy. The value (in pf) of these
crystal caps equal (CL-12)*2 in this equation, CL=crystal
load capacitance in pf. For example, for a crystal with a 16
pF load cap, each external crystal cap would be 8 pF.
[(16-12)x2]=8.
Current Reference Source Rr (Iref)
If board target trace impedance (Z) is 50Ω, then Rr = 475Ω
(1%), providing IREF of 2.32 mA, output current (IOH) is
equal to 6*IREF.
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Output Structures
6*IREF
IREF
=2.3 mA
R R 475Ω
See Output Termination
Sections - Pages 3 ~ 5
General PCB Layout Recommendations
For optimum device performance and lowest output phase
noise, the following guidelines should be observed.
1. Each 0.01µF decoupling capacitor should be mounted on
the component side of the board as close to the VDD pin as
possible.
2. No vias should be used between decoupling capacitor
and VDD pin.
3. The PCB trace to VDD pin should be kept as short as
possible, as should the PCB trace to the ground via.
Distance of the ferrite bead and bulk decoupling from the
device is less critical.
4. An optimum layout is one with all components on the
same side of the board, minimizing vias through other signal
layers (any ferrite beads and bulk decoupling capacitors can
be mounted on the back). Other signal traces should be
routed away from the IDT5V41066.This includes signal
traces just underneath the device, or on layers adjacent to
the ground plane layer used by the device.
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Layout Guidelines
SRC Reference Clock
Common Recommendations for Differential Routing
L1 length, route as non-coupled 50ohm trace
L2 length, route as non-coupled 50ohm trace
L3 length, route as non-coupled 50ohm trace
Rs
Rt
D imension or Value
0.5 max
0.2 max
0.2 max
33
49.9
Unit
inch
inch
inch
ohm
ohm
Figure
1
1
1
1
1
Down Device Differential Routing
L4 length, route as coupled microstrip 100ohm differential trace
L4 length, route as coupled stripline 100ohm differential trace
2 min to 16 max
1.8 min to 14.4 max
inch
inch
1
1
Differential Routing to PCI Express Connector
L4 length, route as coupled microstrip 100ohm differential trace
L4 length, route as coupled stripline 100ohm differential trace
0.25 to 14 max
0.225 min to 12.6 max
inch
inch
2
2
Figure 1: Down Device Routing
L2
L1
Rs
L4
L4'
L2'
L1'
Rs
Rt
HCSL Output Buffer
Rt
L3'
PCI Express
Down Device
REF_CLK Input
L3
Figure 2: PCI Express Connector Routing
L2
L1
Rs
L4
L4'
L2'
L1'
Rs
Rt
HCSL Output Buffer
Rt
L3'
IDT® 4 OUTPUT PCIE GEN1/2 SYNTHESIZER
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PCI Express
Add-in Board
REF_CLK Input
L3
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Alternative Termination for LVDS and other Common Differential Signals (figure 3)
Vdiff
Vp-p
Vcm
R1
R2
R3
R4
Note
0.45v
0.22v
1.08
33
150
100
100
0.58
0.28
0.6
33
78.7
137
100
0.80
0.40
0.6
33
78.7
none
100
ICS874003i-02 input compatible
0.60
0.3
1.2
33
174
140
100
Standard LVDS
R1a = R1b = R1
R2a = R2b = R2
Figure 3
L2
L1
R3
R1a
R4
L4
L4'
L2'
L1'
R1b
R2a
HCSL Output Buffer
R2b
L3'
Down Device
REF_CLK Input
L3
Cable Connected AC Coupled Application (figure 4)
Component
Value
Note
R5a, R5b
8.2K 5%
R6a, R6b
1K 5%
Cc
0.1 µF
Vcm
0.350 volts
Figure 4
3.3 Volts
R5a
R5b
R6a
R6b
Cc
L4
L4'
Cc
IDT® 4 OUTPUT PCIE GEN1/2 SYNTHESIZER
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PCIe Device
REF_CLK Input
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Typical PCI-Express (HCSL) Waveform
700 mV
0
tOR
500 ps
500 ps
0.52 V
0.175 V
tOF
0.52 V
0.175 V
Typical LVDS Waveform
1325 mV
1000 mV
tOR
500 ps
500 ps
1250 mV
1150 mV
IDT® 4 OUTPUT PCIE GEN1/2 SYNTHESIZER
tOF
1250 mV
1150 mV
8
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Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the IDT5V41066. These ratings are stress
ratings only. Functional operation of the device at these or any other conditions above those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for
extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended
operating temperature range.
Item
Rating
Supply Voltage, VDD, VDDA
5.5 V
All Inputs and Outputs
-0.5 V to VDD+0.5 V
Ambient Operating Temperature (commercial)
0 to +70° C
Ambient Operating Temperature (industrial)
-40 to +85° C
Storage Temperature
-65 to +150° C
Junction Temperature
125° C
Soldering Temperature
260° C
ESD Protection (Input)
2000 V min. (HBM)
DC Electrical Characteristics
Unless stated otherwise, VDD = 3.3 V ±5%, Ambient Temperature -40 to +85° C
Parameter
Symbol
Supply Voltage
Input High Voltage1
Input Low Voltage
1
2
Min.
Typ.
Max.
V
Conditions
3.135
3.3
3.465
Units
VIH
2.2
VDD +0.3
V
VIL
VSS-0.3
0.8
V
Input Leakage Current
IIL
0 < Vin < VDD
5
μA
Operating Supply Current
@100 MHz
IDD
115
125
mA
IDDOE
RS=33Ω, RP=50Ω, CL=2 pF
OE =Low
42
48
mA
IDDPD
No load, PD =Low
350
500
μA
Input Capacitance
CIN
-5
Input pin capacitance
7
pF
Output pin capacitance
6
pF
CINX
5
pF
LPIN
5
nH
Output Capacitance
COUT
X1, X2 Capacitance
Pin Inductance
Output Impedance
Zo
Pull-up Resistance
RPUP
CLK outputs
3.0
OE, SEL, PD pins
kΩ
110
kΩ
1. Single edge is monotonic when transitioning through region.
2. Inputs with pull-ups/-downs are not included.
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AC Electrical Characteristics - CLKOUT (A:D)
Unless stated otherwise, VDD=3.3 V ±5%, Ambient Temperature -40 to +85° C
Parameter
Symbol
Conditions
Min.
Typ.
Input Frequency
25
Output Frequency
25
200
MHz
25
100
MHz
850
mV
VOH
HCSL
VOL
HCSL
-150
Absolute
250
Crossing Point
Crossing Point Voltage1,2,4
Jitter,
Cycle-to-Cycle1,3
All outputs
Modulation Frequency
Rise Time1,2
Fall
mV
Variation over all edges
Frequency Synthesis Error
Time1,2
Rise/Fall Time
MHz
LVDS termination
Voltage1,2
Voltage1,2
Units
HCSL termination
Output High Voltage1,2
Output Low
Max.
550
mV
140
mV
100
ps
0
32.9
ppm
Spread spectrum
30
33
kHz
tOR
From 0.175 V to 0.525 V
175
700
ps
tOF
From 0.525 V to 0.175 V
175
700
ps
125
ps
Variation1,2
Output to Output Skew
Duty Cycle1,3
45
50
ps
55
%
Output Enable
Time5
All outputs
50
100
ns
Output Disable
Time5
All outputs
50
100
ns
1.8
ms
30
ms
Stabilization Time
tSTABLE
From power-up VDD=3.3 V
Spread Spectrum Transition
Time
tSPREAD
Stabilization time after spread
spectrum changes
1 Test
7
setup is RS=33Ω, RP=50Ω with CL=2 pF, Rr = 475Ω (1%).
taken from a single-ended waveform.
2 Measurement
3
Measurement taken from a differential waveform.
4
Measured at the crossing point where instantaneous voltages of both CLKOUT and CLKOUT are equal.
5
CLKOUT pins are tri-stated when OE is asserted low. CLKOUT is driven differential when OE is high unless its
PD= low.
Electrical Characteristics - Differential Phase Jitter
Parameter
Jitter, Phase
Symbol
Conditions
Min
Typ
Max
Units
Notes
30
86
ps (p-p)
1,2,3
tjphasePLL
PCIe Gen1
tjphaseLO
PCIe Gen2, 10 kHz < f < 1.5 MHz
0.76
3
ps (RMS)
1,2,3
PCIe Gen2, 1.5 MHz < f < Nyquist (50 MHz)
2.0
3.1
ps (RMS)
1,2,3
tjphaseHIGH
Note 1. Guaranteed by design and characterization, not 100% tested in production.
Note 2. See http://www.pcisig.com for complete specs.
Note 3: Applies to 100MHz, spread off and 0.5% down spread only.
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Thermal Characteristics
Parameter
Symbol
Thermal Resistance Junction to
Ambient
Thermal Resistance Junction to Case
Conditions
Max. Units
Still air
93
° C/W
θ JA
1 m/s air flow
78
° C/W
θ JA
3 m/s air flow
65
° C/W
20
° C/W
θ JC
Marking Diagram (5V41066PGGI)
20
11
11
IDT5V410
66PGGI
#YYWW$
IDT5V410
66PGG
#YYWW$
1
Typ.
θ JA
Marking Diagram (5V41066PGG)
20
Min.
1
10
10
Notes:
1. Line 1 and 2: IDT part number.
2. Line 3: # – Die revision; YYWW – Date code; $ – Assembly location.
3. “G” after the two-letter package code designates RoHS compliant package.
4. “I” at the end of part number indicates industrial temperature range.
5. Bottom marking: country of origin if not USA.
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Package Outline and Package Dimensions (20-pin TSSOP, 173 mil Body)
Package dimensions are kept current with JEDEC Publication No. 95, MO-153
Millimeters
Inches*
20
Symbol
E1
A
A1
A2
b
c
D
E
E1
e
L
a
aaa
E
INDEX
AREA
1 2
D
Min
Max
1.20
0.05
0.15
0.80
1.05
0.19
0.30
0.09
0.20
6.40
6.60
6.40 BASIC
4.30
4.50
0.65 Basic
0.45
0.75
0°
8°
-0.10
Min
Max
0.047
0.002
0.006
0.032
0.041
0.007
0.012
0.0035 0.008
0.252
0.260
0.252 BASIC
0.169
0.177
0.0256 Basic
0.018
0.030
0°
8°
-0.004
A
A2
A1
c
-Ce
b
SEATING
PLANE
L
aaa C
Ordering Information
Part / Order Number
Marking
Shipping Packaging
Package
Temperature
5V41066PGG
see page 10
Tubes
20-pin TSSOP
0 to +70° C
5V41066PGG8
Tape and Reel
20-pin TSSOP
0 to +70° C
5V41066PGGI
Tubes
20-pin TSSOP
-40 to +85° C
5V41066PGGI8
Tape and Reel
20-pin TSSOP
-40 to +85° C
“G” after the two-letter package code are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes
no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No
other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications
such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not
recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT
does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.
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Revision History
Rev.
Originator
Date
Description of Change
A
RDW
01/20/10
New datasheet; Preliminary initial release.
B
RDW
04/27/10
Updated electrical tables per char; released to final.
C
RDW
07/19/10
1. Updated title and general decription
2. Updated cycle-to-cycle jitter spec from 125 to 100 ps.
D
RDW
11/21/11
1. Changed title to “4 Output PCIe GEN1/2 Synthesizer”
2. Added note to Features section: “For PCIe Gen3 applications, see 5V41236”
3. Updated Differential Phase Jitter table.
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