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70V9269S9PRF8

70V9269S9PRF8

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    LQFP-128

  • 描述:

    IC SRAM 256KBIT PARALLEL 128TQFP

  • 数据手册
  • 价格&库存
70V9269S9PRF8 数据手册
HIGH-SPEED 3.3V 32/16K x 16 SYNCHRONOUS DUAL-PORT STATIC RAM Features: ◆ ◆ ◆ ◆ ◆ ◆ True Dual-Ported memory cells which allow simultaneous access of the same memory location High-speed clock to data access – Commercial: 7.5/9ns (max.) – Industrial: 7.5ns (max.) Low-power operation – IDT70V9279/69L Active: 429mW (typ.) Standby: 1.32mW (typ.) Flow-through or Pipelined output mode on either port via the FT/PIPE pin Counter enable and reset features Dual chip enables allow for depth expansion without additional logic ◆ ◆ ◆ ◆ ◆ ◆ 70V9279/69S/L Full synchronous operation on both ports – 4ns setup to clock and 1ns hold on all control, data, and address inputs – Data input, address, and control registers – Fast 6.5ns clock to data out in the Pipelined output mode – Self-timed write allows fast cycle time – 10ns cycle time, 100MHz operation in Pipelined output mode Separate upper-byte and lower-byte controls for multiplexed bus and bus matching compatibility LVTTL- compatible, single 3.3V (±0.3V) power supply Industrial temperature range (–40°C to +85°C) is available for selected speeds Available in a 128-pin Thin Quad Flatpack (TQFP) package Green parts available, see ordering information Functional Block Diagram R/WL R/WR UBL UBR CE0L CE0R 1 0 0/1 1 0 CE1L 0/1 CE1R LBL OEL LBR OER FT/PIPEL 0/1 1b 0bb a 1a 0a 0a 1a a 0b 1b b 0/1 FT/PIPER , I/O8L-I/O15L I/O8R-I/O15R I/O Control I/O Control I/O0L-I/O7L I/O0R-I/O7R A14R(1) A14L(1) A0L CLKL ADSL CNTEN L Counter/ Address Reg. MEMORY ARRAY CNTRSTL Counter/ Address Reg. A0R CLKR ADSR CNTENR CNTRSTR 3743 drw 01 NOTE: 1. A14X is a NC for IDT70V9269. AUGUST 2019 1 ©2019 Integrated Device Technology, Inc. DSC 3743/13 70V9279/69S/L High-Speed 32/16K x 16 Dual-Port Synchronous Static RAM Description: Industrial and Commercial Temperature Ranges The IDT70V9279/69 is a high-speed 32/16K x 16 bit synchronous Dual-Port RAM. The memory array utilizes Dual-Port memory cells to allow simultaneous access of any address from both ports. Registers on control, data, and address inputs provide minimal setup and hold times. The timing latitude provided by this approach allows systems to be designed with very short cycle times. With an input data register, the IDT70V9279/69 has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. Fabricated using CMOS high-performance technology, these devices typically operate on only 429mW of power. 70V9279/69 PKG128(5) 128-Pin TQFP Top View(6) 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 A14L(1) N/C N/C N/C LBL UBL CE0L CE1L CNTRSTL VDD VSS R/WL OEL FT/PIPEL VSS I/O15L I/O14L I/O13L I/O12L VDD VSS I/O11L 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 A10L A11L A12L A13L N/C N/C N/C N/C A9R A8R A7R A6R A5R A4R A3R A2R A1R A0R N/C CNTENR CLKR ADSR VSS VDD ADSL CLKL CNTENL N/C A0L A1L A2L A3L A4L A5L A6L A7L A8L A9L N/C N/C N/C N/C 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 A10R A11R A12R A13R A14R(1) N/C N/C N/C LBR UBR CE0R CE1R CNTRSTR VDD VSS R/WR OER FT/PIPER Vss I/O15R I/O14R I/O13R I/O12R VDD VDD I/O11R Pin Configuration(2,3,4) NOTES: 1. A14X is a NC for IDT70V9269. 2. All VDD pins must be connected to power supply. 3. All VSS pins must be connected to ground. 4. Package body is approximately 14mm x 20mm x 1.4mm. 5. This package code is used to reference the package diagram. 6. This text does not indicate orientation of the actual part-marking. 6.42 2 I/O10R I/O9R VSS N/C I/O8R N/C N/C I/O7R VDD I/O6R I/O5R I/O4R VSS I/O3R VDD I/O2R I/O1R I/O0R VSS VDD I/O0L I/O1L VSS I/O2L I/O3L VSS I/O4L I/O5L I/O6L I/O7L VDD N/C N/C I/O8L N/C VDD I/O9L I/O10L 3743 drw 02 70V9279/69S/L High-Speed 32/16K x 16 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Pin Names Left Port Right Port Names CE0L, CE1L CE0R, CE1R Chip Enables (3) R/WL R/WR Read/Write Enable OEL OER Output Enable A0L - A14L(1) A0R - A14R(1) Address I/O0L - I/O15L I/O0R - I/O15R Data Input/Output CLKL CLKR Clock UBL UBR Upper Byte Select(2) LBL LBR Lower Byte Select(2) ADSL ADSR Address Strobe Enable CNTENL CNTENR Counter Enable CNTRSTL CNTRSTR Counter Reset FT/PIPEL FT/PIPER Flow-Through / Pipeline VDD Power (3.3V) VSS Ground (0V) NOTES: 1. Address A14X is a NC for IDT70V9269. 2. LB and UB are single buffered regardless of state of FT/PIPE. 3. CE0 and CE1 are single buffered when FT/PIPE = VIL, CE0 and CE1 are double buffered when FT/PIPE = VIH, i.e. the signals take two cycles to deselect. 3743 tbl 01 Truth Table I—Read/Write and Enable Control(1,2,3) UB(4) LB(4) R/W Upper Byte I/O8-15 Lower Byte I/O0-7 X X X X High-Z High-Z Deselected–Power Down X L X X X High-Z High-Z Deselected–Power Down ↑ L H H H X High-Z High-Z Both Bytes Deselected ↑ L H L H L DIN High-Z Write to Upper Byte Only X ↑ L H H L L High-Z DATAIN Write to Lower Byte Only X ↑ L H L L L DATA IN DATAIN Write to Both Bytes L ↑ L H L H H DATAOUT High-Z Read Upper Byte Only L ↑ L H H L H High-Z DATAOUT Read Lower Byte Only L ↑ L H L L H DATAOUT DATAOUT Read Both Bytes H ↑ L H L L X High-Z High-Z Outputs Disabled OE CLK CE0(5) X ↑ H X ↑ X X (5) CE1 MODE 3743 tbl 02 NOTES: 1. "H" = VIH, "L" = VIL, "X" = Don't Care. 2. ADS, CNTEN, CNTRST = X. 3. OE is an asynchronous input signal. 4 LB and UB are single buffered regardless of state of FT/PIPE. 5. CEo and CE1 are single buffered when FT/PIPE = VIL. CEo and CE1 are double buffered when FT/PIPE = VIH, i.e. the signals take two cycles to deselect. 6.42 3 70V9279/69S/L High-Speed 32/16K x 16 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Truth Table II—Address Counter Control(1,2,3) External Address Previous Internal Address Internal Address Used CLK An X An ↑ ADS CNTEN CNTRST I/O(3) X H DI/O (n) L(4) (5) MODE External Address Used X An An + 1 ↑ H L H DI/O(n+1) Counter Enabled—Internal Address generation X An + 1 An + 1 ↑ H H H DI/O(n+1) External Address Blocked—Counter disabled (An + 1 reused) X X A0 ↑ X X L(4) DI/O(0) Counter Reset to Address 0 3743 tbl 03 NOTES: 1. "H" = VIH, "L" = VIL, "X" = Don't Care. 2. CE0, LB, UB, and OE = VIL; CE1 and R/W = VIH. 3. Outputs configured in Flow-Through Output mode; if outputs are in Pipelined mode the data out will be delayed by one cycle. 4. ADS and CNTRST are independent of all other signals including CE0, CE1, UB and LB. 5. The address counter advances if CNTEN = VIL on the rising edge of CLK, regardless of all other signals including CE0, CE1, UB and LB. Recommended Operating Temperature and Supply Voltage(1,2) Grade Commercial Industrial Symbol Ambient Temperature GND VDD 0OC to +70OC 0V 3.3V + 0.3V -40OC to +85OC 0V 3.3V + 0.3V 3743 tbl 04 NOTES: 1. Industrial temperature: for specific speeds, packages and powers contact your sales office. 2. This is the parameter TA. This is the "instant on" case temperature. Rating Commercial & Industrial Unit Terminal Voltage with Respect to GND -0.5 to +4.6 V TBIAS(3) Temperature Under Bias -55 to +125 o TSTG StorageTemperature -65 to +150 o C TJN Junction Temperature +150 o C IOUT DC Output Current VTERM(2) Min. Typ. Max. Unit 3.0 3.3 3.6 V 0 0 0 V VDD Supply Voltage VSS Ground VIH Input High Voltage 2.2 ____ VDD+0.3V(2) V VIL Input Low Voltage -0.3(1) ____ 0.8 V 3743 tbl 05 NOTES: 1. VIL > -1.5V for pulse width less than 10 ns. 2. VTERM must not exceed VDD + 0.3V. (TA = +25°C, f = 1.0MHZ) Symbol CIN COUT C Parameter Input Capacitance (2) 50 Parameter Capacitance(1) Absolute Maximum Ratings(1) Symbol Recommended DC Operating Conditions Output Capacitance Conditions Max. Unit VIN = 0V 9 pF VOUT = 0V 10 pF 3743 tbl 07 NOTES: 1. These parameters are determined by device characterization, but are not production tested. 2. COUT also references CI/O. mA 3743 tbl 06 NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. VTERM must not exceed VDD + 0.3V for more than 25% of the cycle time or 10ns maximum, and is limited to < 20mA for the period of VTERM > VDD + 0.3V. 3. Ambient Temperature Under DC Bias. No AC Conditions. Chip Deselected. 6.42 4 70V9279/69S/L High-Speed 32/16K x 16 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range (VDD = 3.3V ± 0.3V) 70V9279/69S Symbol Parameter Test Conditions (1) 70V9279/69L Min. Max. Min. Max. Unit |ILI| Input Leakage Current VDD = 3.6V, VIN = 0V to VDD ___ 10 ___ 5 µA |ILO| Output Leakage Current CE0 = VIH or CE1 = VIL, VOUT = 0V to VDD ___ 10 ___ 5 µA VOL Output Low Voltage IOL = +4mA ___ 0.4 ___ 0.4 V VOH Output High Voltage IOH = -4mA 2.4 ___ 2.4 ___ V 3743 tbl 08 NOTE: 1. At VDD < 2.0V input leakages are undefined. DC Electrical Characteristics Over the Operating Temperature Supply Voltage Range(3,6) (VDD = 3.3V ± 0.3V) 70V9279/69X6 Com'l Only Symbol IDD ISB1 ISB2 ISB3 ISB4 Parameter Test Condition Dynamic Operating Current (Both Ports Active) CEL and CER= VIL, Outputs Disabled, f = fMAX(1) Standby Current (Both Ports - TTL Level Inputs) CEL = CER = VIH f = fMAX(1) Version 70V9279/69X7 Com'l & Ind 70V9279/69X9 Com'l Only Typ.(4) Max. Typ.(4) Max. Typ.(4) Max. Unit mA COM'L S L 220 220 395 350 200 200 335 290 180 180 260 225 IND S L ____ ____ 370 335 ____ ____ 200 200 ____ ____ ____ ____ COM'L S L 70 70 145 130 60 60 115 100 50 50 75 65 IND S L ____ ____ 130 115 ____ ____ 60 60 ____ ____ ____ ____ Standby Current (One Port - TTL Level Inputs) COM'L CE"A" = VIL and CE"B" = VIH(5) Active Port Outputs Disabled, IND f=fMAX(1) S L 150 150 280 250 130 130 240 210 110 110 170 150 S L ____ ____ 265 240 ____ ____ 130 130 ____ ____ ____ ____ Full Standby Current (Both Ports - CMOS Level Inputs) Both Ports CEL and CER > VDD - 0.2V, VIN > VDD - 0.2V or VIN < 0.2V, f = 0(2) COM'L S L 1.0 0.4 5 3 1.0 0.4 5 3 1.0 0.4 5 3 IND S L ____ ____ 20 15 ____ ____ 1.0 0.4 ____ ____ ____ ____ Full Standby Current (One Port - CMOS Level Inputs) CE"A" < 0.2V and CE"B" > VDD - 0.2V(5) VIN > VDD - 0.2V or VIN < 0.2V, Active Port, Outputs Disabled, f = fMAX(1) COM'L S L 140 140 270 240 120 120 230 200 100 100 160 140 IND S L ____ ____ 255 230 ____ ____ 120 120 ____ ____ ____ ____ mA mA mA mA 3743 tbl 09a NOTES: 1. At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency clock cycle of 1/tCYC, using "AC TEST CONDITIONS" at input levels of VSS to 3V. 2. f = 0 means no address, clock, or control lines change. Applies only to input at CMOS level standby. 3. Port "A" may be either left or right port. Port "B" is the opposite from port "A". 4. VDD = 3.3V, TA = 25°C for Typ, and are not production tested. IDD DC(f=0) = 90mA (Typ). 5. CEX = VIL means CE0X = VIL and CE1X = VIH CEX = VIH means CE0X = VIH or CE1X = VIL CEX < 0.2V means CE0X < 0.2V and CE1X > VDD - 0.2V CEX > VDD - 0.2V means CE0X > VDD - 0.2V or CE1X < 0.2V 'X' represents "L" for left port or "R" for right port. 6. 'X' in part numbers indicate power rating (S or L). 6.42 5 70V9279/69S/L High-Speed 32/16K x 16 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges DC Electrical Characteristics Over the Operating Temperature Supply Voltage Range(3,6) (VDD = 3.3V ± 0.3V)(Cont'd) 70V9279/69X12 Com'l Only Symbol IDD ISB1 ISB2 ISB3 ISB4 Parameter Test Condition Dynamic Operating Current (Both Ports Active) CEL and CER= VIL, Outputs Disabled, f = fMAX(1) Standby Current (Both Ports - TTL Level Inputs) CEL = CER = VIH f = fMAX(1) Version 70V9279/69X15 Com'l Only Typ.(4) Max. Typ.(4) Max. Unit mA COM'L S L 150 150 240 205 130 130 220 185 IND S L ____ ____ ____ ____ ____ ____ ____ ____ COM'L S L 40 40 65 50 30 30 55 35 IND S L ____ ____ ____ ____ ____ ____ ____ ____ Standby Current (One Port - TTL Level Inputs) COM'L CE"A" = VIL and CE"B" = VIH(5) Active Port Outputs Disabled, IND f=fMAX(1) S L 100 100 160 140 90 90 150 130 S L ____ ____ ____ ____ ____ ____ ____ ____ Full Standby Current (Both Ports - CMOS Level Inputs) Both Ports CEL and CER > VDD - 0.2V, VIN > VDD - 0.2V or VIN < 0.2V, f = 0(2) COM'L S L 1.0 0.4 5 3 1.0 0.4 5 3 IND S L ____ ____ ____ ____ ____ ____ ____ ____ Full Standby Current (One Port - CMOS Level Inputs) CE"A" < 0.2V and CE"B" > VDD - 0.2V(5) VIN > VDD - 0.2V or VIN < 0.2V, Active Port, Outputs Disabled, f = fMAX(1) COM'L S L 90 90 150 130 80 80 140 120 IND S L ____ ____ ____ ____ ____ ____ ____ ____ mA mA mA mA 3743 tbl 09b NOTES: 1. At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency clock cycle of 1/tCYC, using "AC TEST CONDITIONS" at input levels of VSS to 3V. 2. f = 0 means no address, clock, or control lines change. Applies only to input at CMOS level standby. 3. Port "A" may be either left or right port. Port "B" is the opposite from port "A". 4. VDD = 3.3V, TA = 25°C for Typ, and are not production tested. IDD DC(f=0) = 90mA (Typ). 5. CEX = VIL means CE0X = VIL and CE1X = VIH CEX = VIH means CE0X = VIH or CE1X = VIL CEX < 0.2V means CE0X < 0.2V and CE1X > VDD - 0.2V CEX > VDD - 0.2V means CE0X > VDD - 0.2V or CE1X < 0.2V 'X' represents "L" for left port or "R" for right port. 6. 'X' in part numbers indicate power rating (S or L). 6.42 6 70V9279/69S/L High-Speed 32/16K x 16 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges AC Test Conditions Input Pulse Levels GND to 3.0V Input Rise/Fall Times 3ns Input Timing Reference Levels 1.5V Output Reference Levels 1.5V Output Load Figures 1, 2, and 3 7343 tbl 10 3.3V 3.3V 590Ω 590Ω DATAOUT DATAOUT 30pF 435Ω 435Ω 3743 drw 03 3743 drw 04 Figure 2. Output Test Load (For tCKLZ, tCKHZ, tOLZ, and tOHZ). *Including scope and jig. Figure 1. AC Output Test load. 8 7 10pF is the I/O capacitance of this device, and 30pF is the AC Test Load Capacitance 6 5 tCD1, tCD2 (Typical, ns) 4 3 2 1 0 -1 5pF* 20 40 60 80 100 120 140 160 180 200 Capacitance (pF) 3743 drw 05 Figure 3. Typical Output Derating (Lumped Capacitive Load). 6.42 7 70V9279/69S/L High-Speed 32/16K x 16 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges AC Electrical Characteristics Over the Operating Temperature Range (Read and Write Cycle Timing)(3,4) (VDD = 3.3V ± 0.3V, TA = 0°C to +70°C) Symbol tCYC1 Parameter Clock Cycle Time (Flow-Through) (2) (2) 70V9279/69X6 Com'l Only 70V9279/69X7 Com'l & Ind 70V9279/69X9 Com'l Only Min. Max. Min. Max. Min. Max. Unit 19 ____ 22 ____ 25 ____ ns ns tCYC2 Clock Cycle Time (Pipelined) 10 ____ 12 ____ 15 ____ tCH1 Clock High Time (Flow-Through)(2) 6.5 ____ 7.5 ____ 12 ____ ns tCL1 (2) tCH2 Clock Low Time (Flow-Through) 6.5 ____ 7.5 ____ 12 ____ ns (2) 4 ____ 5 ____ 6 ____ ns (2) 4 ____ 5 ____ 6 ____ ns Clock High Time (Pipelined) tCL2 Clock Low Time (Pipelined) tR Clock Rise Time ____ 3 ____ 3 ____ 3 ns tF Clock Fall Time ____ 3 ____ 3 ____ 3 ns tSA Address Setup Time 3.5 ____ 4 ____ 4 ____ ns tHA Address Hold Time 0 ____ 0 ____ 1 ____ ns tSC Chip Enable Setup Time 3.5 ____ 4 ____ 4 ____ ns tHC Chip Enable Hold Time 0 ____ 0 ____ 1 ____ ns tSW R/W Setup Time 3.5 ____ 4 ____ 4 ____ ns tHW R/W Hold Time 0 ____ 0 ____ 1 ____ ns tSD Input Data Setup Time 3.5 ____ 4 ____ 4 ____ ns tHD Input Data Hold Time 0 ____ 0 ____ 1 ____ ns ADS Setup Time 3.5 ____ 4 ____ 4 ____ ns ADS Hold Time 0 ____ 0 ____ 1 ____ ns ____ 4 ____ 4 ____ ns tSAD tHAD tSCN CNTEN Setup Time 3.5 tHCN CNTEN Hold Time 0 ____ 0 ____ 1 ____ ns tSRST CNTRST Setup Time 3.5 ____ 4 ____ 4 ____ ns tHRST CNTRST Hold Time tOE Output Enable to Data Valid tOLZ (1) Output Enable to Output Low-Z (1) 0 ____ 0 ____ 1 ____ ns ____ 6.5 ____ 7.5 ____ 9 ns 2 ____ 2 ____ 2 ____ ns tOHZ Output Enable to Output High-Z 1 7 1 7 1 7 ns tCD1 Clock to Data Valid (Flow-Through)(2) ____ 15 ____ 18 ____ 20 ns tCD2 Clock to Data Valid (Pipelined)(2) ____ 6.5 ____ 7.5 ____ 9 ns tDC Data Output Hold After Clock High 2 ____ 2 ____ 2 ____ ns tCKHZ tCKLZ (1) 2 9 2 9 2 9 ns (1) 2 ____ 2 ____ 2 ____ ns ns Clock High to Output High-Z Clock High to Output Low-Z Port-to-Port Delay tCWDD Write Port Clock High to Read Data Delay ____ 24 ____ 28 ____ 35 tCCS Clock-to-Clock Setup Time ____ 9 ____ 10 ____ 15 ns 3743 tbl 11a NOTES: 1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). This parameter is guaranteed by device characterization, but is not production tested. 2. The Pipelined output parameters (tCYC2, tCD2) apply to either or both left and right ports when FT/PIPE = VIH. Flow-through parameters (tCYC1, tCD1) apply when FT/PIPE = VIL for that port. 3. All input signals are synchronous with respect to the clock except for the asynchronous Output Enable (OE) and FT/PIPE. FT/PIPE should be treated as a DC signal, i.e. steady state during operation. 4. 'X' in part number indicates power rating (S or L). 6.42 8 70V9279/69S/L High-Speed 32/16K x 16 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges AC Electrical Characteristics Over the Operating Temperature Range (Read and Write Cycle Timing)(3,4) (VDD = 3.3V ± 0.3V, TA = 0°C to +70°C)(Cont'd) Symbol tCYC1 tCYC2 tCH1 Parameter Clock Cycle Time (Flow-Through) Clock Cycle Time (Pipelined) (2) (2) Clock High Time (Flow-Through) (2) (2) 70V9279/69X12 Com'l Only 70V9279/69X15 Com'l Only Min. Max. Min. Max. Unit 30 ____ 35 ____ ns 20 ____ 25 ____ ns 12 ____ 12 ____ ns 12 ____ ns 10 ____ ns tCL1 Clock Low Time (Flow-Through) 12 ____ tCH2 Clock High Time (Pipelined)(2) 8 ____ (2) tCL2 Clock Low Time (Pipelined) 8 ____ 10 ____ ns Clock Rise Time ____ 3 ____ tR 3 ns tF Clock Fall Time ____ 3 ____ 3 ns tSA Address Setup Time 4 ____ 4 ____ ns tHA Address Hold Time 1 ____ 1 ____ ns tSC Chip Enable Setup Time 4 ____ 4 ____ ns tHC Chip Enable Hold Time 1 ____ 1 ____ ns tSW R/W Setup Time 4 ____ 4 ____ ns tHW R/W Hold Time 1 ____ 1 ____ ns tSD Input Data Setup Time 4 ____ 4 ____ ns tHD Input Data Hold Time 1 ____ 1 ____ ns ADS Setup Time 4 ____ 4 ____ ns ADS Hold Time 1 ____ 1 ____ ns ns tSAD tHAD tSCN CNTEN Setup Time 4 ____ 4 ____ tHCN CNTEN Hold Time 1 ____ 1 ____ ns tSRST CNTRST Setup Time 4 ____ 4 ____ ns tHRST CNTRST Hold Time tOE Output Enable to Data Valid tOLZ (1) Output Enable to Output Low-Z (1) 1 ____ 1 ____ ns ____ 12 ____ 15 ns 2 ____ 2 ____ ns tOHZ Output Enable to Output High-Z 1 7 1 7 ns tCD1 Clock to Data Valid (Flow-Through)(2) ____ 25 ____ 30 ns tCD2 Clock to Data Valid (Pipelined)(2) ____ 12 ____ 15 ns tDC Data Output Hold After Clock High 2 ____ 2 ____ ns 2 9 2 9 ns 2 ____ 2 ____ ns ns tCKHZ tCKLZ (1) Clock High to Output High-Z (1) Clock High to Output Low-Z Port-to-Port Delay tCWDD Write Port Clock High to Read Data Delay ____ 40 ____ 50 tCCS Clock-to-Clock Setup Time ____ 15 ____ 20 ns 3743 tbl 11b NOTES: 1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). This parameter is guaranteed by device characterization, but is not production tested. 2. The Pipelined output parameters (tCYC2, tCD2) apply to either or both left and right ports when FT/PIPE = VIH. Flow-through parameters (tCYC1, tCD1) apply when FT/PIPE = VIL for that port. 3. All input signals are synchronous with respect to the clock except for the asynchronous Output Enable (OE) and FT/PIPE. FT/PIPE should be treated as a DC signal, i.e. steady state during operation. 4. 'X' in part number indicates power rating (S or L). 6.42 9 70V9279/69S/L High-Speed 32/16K x 16 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of Read Cycle for Flow-through Output (FT/PIPE"X" = VIL)(3,7) tCYC1 tCH1 tCL1 CLK CE0 tSC tHC tSB tHB tSC tHC tSB tHB CE1 UB, LB R/W tSW tHW tSA (5) ADDRESS tHA An An + 1 tCD1 tCKLZ An + 3 tCKHZ (1) Qn DATAOUT OE An + 2 tDC Qn + 1 Qn + 2 (1) (1) tOHZ tOLZ tDC (1) (2) tOE 3743 drw 06 Timing Waveform of Read Cycle for Pipelined Output (FT/PIPE"X" = VIH)(3,7) tCYC2 tCH2 tCL2 CLK CE0 tSC tSC tHC tHC (4) CE1 tSB tSB tHB tHB (6) UB, LB R/W (5) ADDRESS tSW tHW tSA tHA An An + 1 (1 Latency) An + 2 tDC tCD2 DATAOUT Qn (1) tCKLZ OE An + 3 Qn + 2(6) Qn + 1 tOHZ(1) tOLZ(1) (2) tOE NOTES: 3743 drw 07 1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). 2. OE is asynchronously controlled; all other inputs are synchronous to the rising clock edge. 3. ADS = VIL, CNTEN and CNTRST = VIH. 4. The output is disabled (High-Impedance state) by CE 0 = V IH or CE 1 = V IL following the next rising edge of the clock. Refer to Truth Table 1. 5. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 6. If UB or LB was HIGH, then the Upper Byte and/or Lower Byte of DATAOUT for Qn + 2 would be disabled (High-Impedance state). 7. "X" denotes Left or Right port. The diagram is with respect to that port. 6.42 10 70V9279/69S/L High-Speed 32/16K x 16 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of a Bank Select Pipelined Read(1,2) tCH2 tCYC2 tCL2 CLK tSA tHA A0 ADDRESS(B1) tSC tHC CE0(B1) tSC tHC Q0 DATAOUT(B1) tCD2 Q3 Q1 tDC tDC tSA tCKHZ(3) tCD2 tCD2 tCKLZ (3) tCKHZ(3) tHA A0 ADDRESS(B2) A6 A5 A4 A3 A2 A1 A6 A5 A4 A3 A2 A1 tSC tHC CE0(B2) tSC tHC tCD2 DATAOUT(B2) tCKLZ(3) tCKHZ (3) tCD2 Q2 Q4 tCKLZ (3) 3743 drw 08 Timing Waveform of a Bank Select Flow-Through Read(6) tCH1 tCYC1 tCL1 CLK tSA A0 ADDRESS(B1) CE0(B1) tHA tSC tHC tSC tCD1 tHC tCD1 tCKHZ D0 DATAOUT(B1) tSC tCD1 D3 tCKLZ tDC A1 (1) D5 tCKHZ (1) tCKLZ (1) A6 A5 A4 A3 A2 tSC CE0(B2) tCD1 tHA A0 ADDRESS(B2) (1) D1 tDC tSA A6 A5 A4 A3 A2 A1 tHC tHC tCD1 DATAOUT(B2) tCKLZ (1) tCKHZ (1) tCD1 D2 tCKLZ (1) tCKHZ (1) D4 3743 drw 08a NOTES: 1. B1 Represents Bank #1; B2 Represents Bank #2. Each Bank consists of one IDT70V9279/69 for this waveform, and are setup for depth expansion in this example. ADDRESS(B1) = ADDRESS(B2) in this situation. 2. UB, LB, OE, and ADS = VIL; CE1(B1), CE1(B2), R/W, CNTEN, and CNTRST = VIH. 3. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). 4. CE0, UB, LB, and ADS = VIL; CE1, CNTEN, and CNTRST = VIH. 5. OE = VIL for the Right Port, which is being read from. OE = VIH for the Left Port, which is being written to. 6. If tCCS < maximum specified, then data from right port READ is not valid until the maximum specified for tCWDD. If tCCS > maximum specified, then data from right port READ is not valid until tCCS + tCD1. tCWDD does not apply in this case. 6.42 11 70V9279/69S/L High-Speed 32/16K x 16 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Timing Waveform with Port-to-Port Flow-Through Read(1,2,3,5) CLK "A" tSW tHW tSA tHA R/W "A" ADDRESS "A" NO MATCH MATCH tSD DATAIN "A" tHD VALID tCCS (4) CLK "B" tCD1 R/W "B" ADDRESS "B" tSW tHW tSA tHA NO MATCH MATCH tCWDD (4) tCD1 DATAOUT "B" VALID VALID tDC tDC 3743 drw 09 NOTES: 1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). 2. CE0, UB, LB, and ADS = VIL; CE1, CNTEN, and CNTRST = VIH. 3. OE = VIL for the Right Port, which is being read from. OE = VIH for the Left Port, which is being written to. 4. If tCCS < maximum specified, then data from right port READ is not valid until the maximum specified for tCWDD. If tCCS > maximum specified, then data from right port READ is not valid until tCCS + tCD1. tCWDD does not apply in this case. 5. All timing is the same for both left and right ports. Port "A" may be either left or right port. Port "B" is the opposite of Port "A". Timing Waveform of Left Port Write to Pipelined Right Port Read(1,2,4) CLK"A" tSW tHW tSA tHA R/W"A " ADDRESS"A" tSD DATAIN"A" NO MATCH MATCH tHD VALID tCO(3) CLK"B" tCD2 R/W"B" ADDRESS"B" tSW tHW tSA tHA NO MATCH MATCH DATAOUT"B" VALID tDC , 3743 drw 10 NOTES: 1. CE0, BEn, and ADS = VIL; CE1, CNTEN, and REPEAT = VIH. 2. OE = VIL for Port "B", which is being read from. OE = VIH for Port "A", which is being written to. 3. If tCO < minimum specified, then data from Port "B" read is not valid until following Port "B" clock cycle (ie, time from write to valid read on opposite port will be tCO + 2 tCYC2 + tCD2). If tCO > minimum, then data from Port "B" read is available on first Port "B" clock cycle (ie, time from write to valid read on opposite port will be tCO + tCYC2 + tCD2). 4. All timing is the same for Left and Right ports. Port "A" may be either Left or Right port. Port "B" is the opposite of Port "A" 6.42 12 70V9279/69S/L High-Speed 32/16K x 16 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of Pipelined Read-to-Write-to-Read (OE = VIL)(3) tCYC2 tCH2 tCL2 CLK CE0 tSC tHC CE1 tSB tHB UB, LB tSW tHW R/W (4) ADDRESS tSW tHW An tSA tHA An +1 An + 2 An + 4 An + 3 An + 2 tSD tHD DATAIN Dn + 2 tCD2 (2) (1) (1) tCD2 tCKLZ tCKHZ Qn + 3 Qn DATAOUT (5) READ NOP WRITE READ , 3743 drw 11 Timing Waveform of Pipelined Read-to-Write-to-Read (OE Controlled)(3) tCH2 tCYC2 tCL2 CLK CE0 tSC tHC CE1 tSB tHB UB, LB tSW tHW R/W (4) ADDRESS tSW tHW An tSA tHA An +1 An + 2 An + 3 An + 4 An + 5 tSD tHD DATAIN Dn + 3 Dn + 2 tCD2 (2) tCKLZ(1) tCD2 Qn DATAOUT Qn + 4 tOHZ(1) OE READ WRITE READ 3743 drw 12 NOTES: 1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). 2. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals. 3. CE0, UB, LB, and ADS = VIL; CE1, CNTEN, and CNTRST = VIH. 4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 5. "NOP" is "No Operation." Data in memory at the selected address may be corrupted and should be rewritten to guarantee data integrity. 6.42 13 , 70V9279/69S/L High-Speed 32/16K x 16 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of Flow-Through Read-to-Write-to-Read (OE = VIL)(3) tCH1 tCYC1 tCL1 CLK CE0 tSC tHC CE1 tSB tHB UB, LB tSW tHW R/W tSW tHW (4) An tSA tHA ADDRESS An +1 An + 2 An + 4 An + 3 An + 2 tSD tHD DATAIN Dn + 2 tCD1 (2) tCD1 Qn DATAOUT tCD1 tCD1 Qn + 1 tDC tCKHZ READ NOP (1) Qn + 3 tDC (1) tCKLZ (5) READ WRITE , 3743 drw 13 Timing Waveform of Flow-Through Read-to-Write-to-Read (OE Controlled)(3) tCYC1 tCH1 tCL1 CLK CE0 tSC tHC CE1 tSB tHB UB, LB tSW tHW tSW tHW R/W (4) An tSA tHA ADDRESS An +1 DATAIN (2) DATAOUT An + 2 tSD tHD An + 3 Dn + 2 Dn + 3 tDC tCD1 Qn An + 4 tOE tCD1 (1) tCKLZ tOHZ(1) An + 5 tCD1 Qn + 4 tDC OE READ WRITE READ , 3743 drw 14 NOTES: 1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). 2. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals. 3. CE0, UB, LB, and ADS = VIL; CE1, CNTEN, and CNTRST = VIH. 4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 5. "NOP" is "No Operation." Data in memory at the selected address may be corrupted and should be rewritten to guarantee data integrity. 6.42 14 70V9279/69S/L High-Speed 32/16K x 16 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of Pipelined Read with Address Counter Advance(1) tCYC2 tCH2 tCL2 CLK tSA ADDRESS tHA An tSAD tHAD ADS tSAD tHAD CNTEN tSCN tHCN tCD2 DATAOUT Qx - 1(2) , Qn + 2(2) Qn + 1 Qn Qx Qn + 3 tDC READ EXTERNAL ADDRESS READ WITH COUNTER COUNTER HOLD READ WITH COUNTER 3743 drw 15 Timing Waveform of Flow-Through Read with Address Counter Advance(1) tCYC1 tCH1 tCL1 CLK tSA ADDRESS tHA An tSAD tHAD ADS tSAD tHAD tSCN tHCN CNTEN tCD1 DATAOUT Qx(2) Qn Qn + 1 Qn + 2 Qn + 3(2) , Qn + 4 tDC READ EXTERNAL ADDRESS READ WITH COUNTER COUNTER HOLD READ WITH COUNTER 3743 drw 16 NOTES: 1. CE0, OE, UB, and LB = VIL; CE1, R/W, and CNTRST = VIH. 2. If there is no address change via ADS = VIL (loading a new address) or CNTEN = VIL (advancing the address), i.e. ADS = VIH and CNTEN = VIH, then the data output remains constant for subsequent clocks. 6.42 15 70V9279/69S/L High-Speed 32/16K x 16 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of Write with Address Counter Advance (Flow-Through or Pipelined Outputs)(1) tCH2 tCYC2 tCL2 CLK tSA tHA An ADDRESS INTERNAL(3) ADDRESS An(7) An + 2 An + 1 An + 4 An + 3 tSAD tHAD ADS CNTEN(7) tSD tHD Dn + 1 Dn DATAIN WRITE EXTERNAL ADDRESS Dn + 1 Dn + 4 Dn + 3 Dn + 2 WRITE WRITE WITH COUNTER COUNTER HOLD WRITE WITH COUNTER 3743 drw 17 , Timing Waveform of Counter Reset (Pipelined Outputs)(2) tCYC2 tCH2 tCL2 CLK tSA tHA (4) An ADDRESS INTERNAL(3) ADDRESS Ax(6) 0 1 An + 2 An + 1 An An + 1 tSW tHW R/W ADS tSA tHAD D CNTEN tSCN tHCN tSRST tHRST CNTRST tSD tHD D0 DATAIN (5) Q1 Q0 DATAOUT COUNTER RESET (6) WRITE ADDRESS 0 READ ADDRESS 0 READ ADDRESS 1 READ ADDRESS n READ ADDRESS n+1 Qn , 3743 drw 18 NOTES: 1. CE0, UB, LB, and R/W = VIL; CE1 and CNTRST = VIH. 2. CE0, UB, LB = VIL; CE1 = VIH. 3. The "Internal Address" is equal to the "External Address" when ADS = VIL and equals the counter output when ADS = VIH. 4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 5. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals. 6. No dead cycle exists during counter reset. A READ or WRITE cycle may be coincidental with the counter reset cycle. ADDR0 will be accessed. Extra cycles are shown here simply for clarification. 7. CNTEN = VIL advances Internal Address from ‘An’ to ‘An +1’. The transition shown indicates the time required for the counter to advance. The ‘An +1’Address is written to during this cycle. 6.42 16 70V9279/69S/L High-Speed 32/16K x 16 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Functional Description Depth and Width Expansion The IDT70V9279/69 provides a true synchronous Dual-Port Static RAM interface. Registered inputs provide minimal set-up and hold times on address, data, and all critical control inputs. All internal registers are clocked on the rising edge of the clock signal, however, the self-timed internal write pulse is independent of the LOW to HIGH transition of the clock signal. An asynchronous output enable is provided to ease asynchronous bus interfacing. Counter enable inputs are also provided to staff the operation of the address counters for fast interleaved memory applications. A HIGH on CE0 or a LOW on CE1 for one clock cycle will power down the internal circuitry to reduce static power consumption. Multiple chip enables allow easier banking of multiple IDT70V9279/69's for depth expansion configurations. When the Pipelined output mode is enabled, two cycles are required with CE0 LOW and CE1 HIGH to reactivate the outputs. The IDT70V9279/69 features dual chip enables (refer to Truth Table I) in order to facilitate rapid and simple depth expansion with no requirements for external logic. Figure 4 illustrates how to control the various chip enables in order to expand two devices in depth. The IDT70V9279/69 can also be used in applications requiring expanded width, as indicated in Figure 4. Since the banks are allocated at the discretion of the user, the external controller can be set up to drive the input signals for the various devices as required to allow for 32-bit or wider applications. A15/A14(1) IDT70V9279/69 IDT70V9279/69 CE0 CE1 VDD Control Inputs IDT70V9279/69 CE0 CE1 VDD Control Inputs IDT70V9279/69 CE1 CE0 CE1 CE0 Control Inputs Control Inputs 3743 drw 19 Figure 4. Depth and Width Expansion with IDT70V9279/69 NOTE: 1. A15 is for IDT70V9279. A14 is for IDT70V9269. 6.42 17 , CNTRST CLK ADS CNTEN R/W LB, UB OE 70V9279/69S/L High-Speed 32/16K x 16 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Ordering Information XXXXX A 99 A Device Type Power Speed Package A A A Process/ Temperature Range Blank 8 Tray Tape and Reel Blank I(1) Commercial (0°C to +70°C) Industrial (-40°C to +85°C) G Green PRF 128-pin TQFP (PKG128) 7 9 Commercial & Industrial Commercial Only L Low Power 70V9279 70V9269 512K (32K x 16-Bit) Synchronous Dual-Port RAM 256K (16K x 16-Bit) Synchronous Dual-Port RAM Speed in nanoseconds 3743 drw 20 NOTES: 1. Contact your local sales office for industrial temp. range for other speeds, packages and powers. LEAD FINISH (SnPb) parts are Obsolete. Product Discontinuation Notice - PDN# SP-17-02 Note that information regarding recently obsoleted parts are included in this datasheet for customer convenience. Ordering Information for Flow-through Devices Old Flow-through Part New Combined Part 70V927S/L25 70V9279L7 70V927S/L30 70V9279L9 3743 tbl 12 IDT Clock Solution for IDT70V9279/69 Dual-Port Dual-Port I/O Specitications IDT Dual-Port Part Number Voltage 70V9279/69 3.3 Clock Specifications I/O Input Capacitance Input Duty Cycle Requirement Maximum Frequency Jitter Tolerance LVTTL 9pF 40% 100 150ps IDT PLL Clock Device IDT Non-PLL Clock Device 2305 2308 2309 49FCT3805 49FCT3805D/E 74FCT3807 74FCT3807D/E 3743 tbl 13 Orderable Part Information Speed (ns) 7 Pkg. Code Pkg. Type Temp. Grade Speed (ns) 70V9279L7PRFG PKG128 TQFP C 9 70V9279L7PRFG8 PKG128 TQFP C Orderable Part ID 70V9279L7PRFGI PKG128 TQFP I 70V9279L7PRFGI8 PKG128 TQFP I 6.42 18 Pkg. Code Pkg. Type Temp. Grade 70V9269L9PRFG PKG128 TQFP C 70V9269L9PRFG8 PKG128 TQFP C Orderable Part ID 70V9279/69S/L High-Speed 32/16K x 16 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges Datasheet Document History 01/12/99: 06/15/99: 09/29/99: 11/10/99: 03/31/00: 01/017/01: Page 14 Page 4 Page 7 Page 4 Page 5 02/25/04: Page 2 Page 3 Page 4 Page 5 Page 7 Page 18 05/04/04: 10/11/04: 01/19/06: 10/23/08: 06/25/18: 08/06/19: Page 1 & 19 Page 1 & 18 Page 5 Page 8 Page 4 Page 5 Page 8 Page 12 Page 18 Page 1 Page 18 Page18 Page 1 & 18 Page 2 Page 18 Initiated datasheet document history Converted to new format Cosmetic and typographical corrections Added additional notes to pin configurations Added Depth & Width Expansion section Deleted note 6 for Table II Corrected typo in heading Replaced IDT logo Combined Pipelined 70V9279/69 family and Flow-through 70V927 family offerings into one data sheet Changed ±200mV in waveform notes to 0mV Added corresponding part chart with ordering information Changed information in Truth Table II Increased storage temperature parameters Clarified TA parameter DC Electrical parameters–changed wording from "open" to "disabled" Removed Preliminary status Consolidated multiple devices into one datasheet Changed naming conventions from VCC to VDD and from GND to Vss Added date revision for pin configuration Added footnotes for UB, LB, CE0 and CE1 buffer conditions when FT or PIPE Added junction temperature to Absolute Maximum Ratings Table Added Ambient Temperature footnote Added I-temp numbers for 9ns speed to DC Electrical Characteristics Table Added 6ns speed DC power numbers to the DC Electrical Characteristics Table Added I-temp for 9ns speed to AC Electrical CharacteristicsTable Added 6ns speed AC timing numbers to the AC Electrical Characteristics Table Added 6ns speed grade and 9ns I-temp to ordering information Added IDT Clock Solution Table Updated IDT logo, replaced IDTTM logo with IDT® logo Added 7ns speed grade to ordering information Added 7ns speed DC power numbers to the DC Electrical Characteristics Table Added 7ns speed AC timing numbers to the AC Electrical Characteristics Table Updated Capacitance table Added 7ns I-temp and removed 9ns I-temp DC power numbers from the DC Electrical Characteristics table Added 7ns I-temp and removed 9ns I-temp from the AC Electrical Characteristics table Added Timing Waveform of Left Port Write to Pipelined Right Port Read Added 7ns I-temp and removed 9ns I-temp from ordering information Added green availability to features Added green indicator to ordering information Removed "IDT" from orderable part number Added Tape & Reel to Ordering Information Product Discontinuation Notice - PDN# SP-17-02 Last time buy expires June 15, 2018 Deleted obsolete Commercial speed grades 6/12/15ns Updated package code PK-128 to PKG128 Added Orderable Part Information table CORPORATE HEADQUARTERS 6024 Silver Creek Valley Road San Jose, CA 95138 for SALES: 800-345-7015 or 408-284-8200 fax: 408-284-2775 www.idt.com The IDT logo is a registered trademark of Integrated Device Technology, Inc. 6.42 19 for Tech Support: 408-284-2794 DualPortHelp@idt.com IMPORTANT NOTICE AND DISCLAIMER RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. 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