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82P2284BBG8

82P2284BBG8

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    BGA208

  • 描述:

    IC TRANSCEIVER HALF 208PBGA

  • 数据手册
  • 价格&库存
82P2284BBG8 数据手册
Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 TLK10034 Quad-Channel XAUI/10GBASE-KR Transceiver 1 Device Overview 1.1 Features 1 • Quad-Channel Multi-Rate Transceiver • Supports 10GBASE-KR, XAUI, and 1GBASE-KX Ethernet Standards • Supports All CPRI and OBSAI Data Rates Up to 10 Gbps • Supports Multi-Rate SERDES Operation with Up to 10.3125 Gbps Data Rate on the High Speed Side and Up to 5 Gbps on the Low Speed Side • Differential CML I/Os on Both High Speed and Low Speed Sides • Interface to Backplanes, Passive and Active Copper Cables, or SFP+ Optical Modules • Selectable Reference Clock per Channel with Multiple Output Clock Options • Loopback Capability on Both High Speed and Low Speed Sides • Supports Data Retime Operation • Supports PRBS, CRPAT, CJPAT, High-/Low/Mixed-Frequency Patterns, and KR PseudoRandom Pattern Generation and Verification, Square-Wave Generation • Two Power Supplies: 1.0-V, and 1.5 or 1.8-V 1.2 • • • • • • • • • • • • Applications 10GBASE-KR Compliant Backplane Links 10 Gigabit Ethernet Switch, Router, and Network Interface Cards 1.3 • • Nominal No Power Supply Sequencing Requirements Transmit De-emphasis and Receive Adaptive Equalization to Allow Extended Backplane/Cable Reach on Both High Speed and Low Speed Sides Programmable Transmit Output Swing on Both High Speed and Low Speed Sides Loss of Signal (LOS) Detection Supports 10G-KR Link Training, Forward Error Correction, Auto-Negotiation Jumbo Packet Support JTAG; IEEE 1149.1/1149.6 Test Interface Industry Standard MDIO Clause 45 and 22 Control Interfaces 65nm Advanced CMOS Technology Industrial Ambient Operating Temperature (–40°C to 85°C) Power Consumption: 825 mW per Channel (Nominal) Device Package: 19-mm x 19-mm, 324-Pin PBGA, 1-mm Ball-Pitch • • • 10 Gigabit Ethernet Blade Servers Proprietary Cable/Backplane Links High-Speed Point- to-Point Transmission Systems Description The TLK10034 is a quad-channel multi-rate transceiver intended for use in high-speed bi-directional pointto-point data transmission systems. This device supports three primary modes. It can be used as a XAUI to 10GBASE-KR transceiver, as a general-purpose 8b/10b multi-rate 4:1, 2:1, or 1:1 serializer/deserializer, or can be used in 1G-KX mode. While operating in the 10GBASE-KR mode, the TLK10034 performs serialization of the 8B/10B encoded XAUI data stream presented on its low speed (LS) side data inputs. The serialized 8B/10B encoded data is presented on the high speed (HS) side outputs in 64B/66B encoding format. Likewise, the TLK10034 performs deserialization of 64B/66B encoded data streams presented on its high speed side data inputs. The deserialized 64B/66B data is presented in 8B/10B format on the low speed side outputs. Link Training is supported in this mode as well as Forward Error Correction (FEC) for extended length applications. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com While operating in the General Purpose SERDES mode, the TLK10034 performs 2:1 and 4:1 serialization of the 8B/10B encoded data streams presented on its low speed (LS) side data inputs. The serialized 8B/10B encoded data is presented on the high speed (HS) side outputs. Likewise, the TLK10034 performs 1:2 and 1:4 deserialization of 8B/10B encoded data streams presented on its high speed side data inputs. The deserialized 8B/10B encoded data is presented on the low speed side outputs. Depending on the serialization/deserialization ratio, the low speed side data rate can range from 0.5Gbps to 5Gbps and the high speed side data rate can range from 1Gbps to 10Gbps. 1:1 retime mode is also supported but limited to 1Gbps to 5Gbps rates. The TLK10034 also supports 1G-KX (1.25Gbps) mode with PCS (CTC) capabilities. This mode can be enabled via software provisioning or via auto negotiation. If software provisioFCBGAning is used, data rates up to 3.125 Gbps are supported. Both low speed and high speed side data inputs and outputs are of differential current mode logic (CML) type with integrated termination resistors. The TLK10034 provides flexible clocking schemes to support various operations. They include the support for clocking with an externally-jitter-cleaned clock recovered from the high speed side. The device is also capable of performing clock tolerance compensation (CTC) in 10GBASE-KR and 1G-KX modes, allowing for asynchronous clocking. The TLK10034 provides low speed side and high speed side loopback modes for self-test and system diagnostic purposes. The TLK10034 has built-in pattern generators and verifiers to help in system tests. The device supports generation and verification of various PRBS, High, Low, Mixed, CRPAT long/short, CJPAT, and KR pseudo-random test patterns and square wave generation. The types of patterns supported on the low speed and high speed side are dependent on the operational mode chosen. The TLK10034 has an integrated loss of signal (LOS) detection function on both high speed and low speed sides. LOS is asserted in conditions where the input differential voltage swing is less than the LOS assert threshold. In the 10GBASE-KR mode, the lane alignment for each channel is achieved through the standard XAUI lane alignment scheme. In the General Purpose SERDES mode the low speed side lane alignment for each channel is achieved through a proprietary lane alignment scheme. The upstream link partner device needs to implement the lane alignment scheme for the correct link operation. Normal link operation resumes only after lane alignment is achieved. The four TLK10034 channels are fully independent. They can be operated with different reference clocks, at different data rates, and with different serialization/deserialization ratios. The low speed side of the TLK10034 is ideal for interfacing with an FPGA or ASIC capable of handling lower-rate serial data streams. The high speed side is ideal for interfacing with remote systems through optical fibers, electrical cables, or backplane interfaces. The TLK10034 supports operation with SFP and SFP+ optical modules, as well as 10GBASE-KR compatible backplane systems. Device Information (1) PART NUMBER TLK10034 (1) 2 PACKAGE BODY SIZE (NOM) FCBGA (324) 19.00 mm × 19.00 mm For all available packages, see the orderable addendum at the end of the datasheet. Device Overview Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com 1.4 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Functional Block Diagram Figure 1-1. A Simplified One Channel Block Diagram of the TLK10034 Data Paths Device Overview Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 3 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com Table of Contents 1 2 3 4 Device Overview ......................................... 1 1.1 Features .............................................. 1 1.2 Applications ........................................... 1 1.3 Description ............................................ 1 1.4 Functional Block Diagram ............................ 3 5 Revision History ......................................... 4 Pin Configuration and Functions ..................... 5 3.1 Pin Diagrams ......................................... 5 3.2 Pin Attributes ......................................... 7 Specifications ........................................... 13 4.1 Absolute Maximum Ratings ......................... 13 4.2 ESD Ratings 4.3 Recommended Operating Conditions ............... 13 4.4 Thermal Information ................................. 14 4.5 LVCMOS Electrical Characteristics (VDDO) ........ 14 4.6 High Speed Side Serial Transmitter Characteristics 15 4.7 High Speed Side Serial Receiver Characteristics 4.8 Low Speed Side Serial Transmitter Characteristics 4.9 4.10 Low Speed Side Serial Receiver Characteristics ... 17 Reference Clock Characteristics (REFCLK0P/N, REFCLK1P/N) ....................................... 17 Differential Output Clock Characteristics 4.11 ........................................ .. 13 .............................. 17 ........................ 18 4.13 JTAG Timing Requirements ........................ 18 4.14 Typical Characteristics .............................. 20 Detailed Description ................................... 21 5.1 Overview ............................................ 21 5.2 Functional Block Diagrams.......................... 21 5.3 Feature Description ................................. 22 5.4 Device Functional Modes ........................... 53 5.5 Memory .............................................. 56 5.6 Register Map ........................................ 67 Application and Implementation ................... 156 6.1 Application Information ............................ 156 6.2 Typical Application ................................. 156 6.3 Power Supply Recommendations ................. 163 Device and Documentation Support .............. 164 7.1 Community Resources............................. 164 7.2 Trademarks ........................................ 164 7.3 Electrostatic Discharge Caution ................... 164 7.4 Glossary............................................ 164 (CLKOUTA/B/C/DP/N) 4.12 6 7 16 16 8 MDIO Timing Requirements Mechanical, Packaging, and Orderable Information ............................................. 164 2 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Original (August 2012) to Revision A • 4 Page Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ................................................................................................................................. 1 Revision History Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 3 Pin Configuration and Functions 3.1 Pin Diagrams A 19-mm x 19-mm, 324-pin PBGA package with a ball pitch of 1 mm is used. The device pin-out is as shown in Figure 3-1, Figure 3-2 and is described in detail in Table 3-1 and Table 3-2. 1 2 3 4 5 6 7 8 9 A VSS INA0N INA0P VSS HSRXAN HSRXAP VSS HSTXAP HSTXAN INA1N INA1P VSS VSS VSS VDDRA_HS VSS AMUXA_HS VSS VSS VSS OUTA0P VSS HSTX0_CLKOUTN HSTX0_CLKOUTP VSS TESTEN LS0_CLKOUTP INA2P VSS OUTA0N OUTA1P GPI0 LOSA HSRXA_CLKOUTN HSRXA_CLKOUTP VSS INA2N AMUXA_LS VSS OUTA1N PRBSEN PDTRXA_N REFCLK_SEL VDDT0_HS VSS VSS VSS OUTA2P VSS MDIO LS_OK_IN_A VSS RESET_N VDDA0_HS INA3P VSS OUTA2N VDDRA_LS MDC PRBS_PASS VDDO0 VSS VSS INA3N VDDA0_LS VDDA0_LS OUTA3P VSS VSS DVDD VDDD DVDD VSS OUTB0N VSS OUTA3N VDDT0_LS LS_OK_OUT_A VSS VDDD DVDD VSS OUTB0P OUTB1N VDDRB_LS VDDT0_LS VSS DVDD VDDD VSS INB0P VDDA0_LS OUTB1P VSS VSS VSS DVDD VDDD DVDD INB0N VSS VDDA0_LS OUTB2N PRTAD4 VSS VDDO3 VSS VDDD VSS VSS VSS OUTB2P VSS LS_OK_OUT_B VPP VSS VDDA1_HS INB1P AMUXB_LS OUTB3N VSS PDTRXB_N LS_OK_IN_B LOSB VDDT1_HS VSS INB1N VSS OUTB3P VSS VSS VSS HSRXB_CLKOUTP HSRXB_CLKOUTN VSS VSS INB2P VSS REFCLK0N REFCLK0P VSS VSS VSS HSTX1_CLKOUTN INB3P INB2N VSS VSS VSS VDDRB_HS VSS AMUXB_HS VSS INB3N VSS VSS HSTXBN HSTXBP VSS HSRXBP HSRXBN VSS B C D E F G H J K L M N P R T U V Figure 3-1. The Pin-Out of the TLK10034 in a 19-mm x 19-mm 324-pin PBGA Package (1 of 2) Pin Configuration and Functions Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 5 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 10 11 www.ti.com 12 13 14 15 16 17 18 A VSS HSRXCN HSRXCP VSS HSTXCP HSTXCN VSS VSS INC0N AMUXC_HS VSS VDDRC_HS VSS VSS VSS VSS INC1N INC0P LS0_CLKOUTN VSS VSS VSS REFCLK1N REFCLK1P VSS INC1P VSS VSS HSRXC_CLKOUTN HSRXC_CLKOUTP PDTRXC_N LOSC VSS OUTC0P VSS INC2N VDDA0_HS VSS TDI TCK TMS VSS OUTC0N AMUXC_LS INC2P VSS VDDA0_HS LS_OK_IN_C LS_OK_OUT_C PRTAD1 OUTC1P VSS VSS VSS VDDD VSS VDDO1 VSS TDO OUTC1N VDDA1_LS VSS INC3N DVDD VDDD DVDD TRST_N VSS VSS OUTC2P VDDA1_LS INC3P VSS VDDD DVDD VSS VDDT1_LS VDDRC_LS OUTC2N OUTC3P VSS DVDD VDDD VSS LS_OK_IN_D VDDT1_LS OUTD0N VSS OUTC3N VSS DVDD VDDD DVDD VSS VSS OUTD0P VDDA1_LS VDDA1_LS IND0N VSS VSS VDDO2 VSS GPI2 VDDRD_LS OUTD1N VSS IND0P VSS VDDA1_HS PRTAD0 LS_OK_OUT_D PRTAD3 VSS OUTD1P VSS VSS VDDA1_HS MODE_SEL PRTAD2 PDTRXD_N GPI1 OUTD2N VSS AMUXD_LS IND1N VSS HSRXD_CLKOUTP HSRXD_CLKOUTN LOSD VSS OUTD2P OUTD3N VSS IND1P HSTX1_CLKOUTP VSS ST LS1_CLKOUTP LS1_CLKOUTN VSS OUTD3P VSS VSS AMUXD_HS VSS VDDRD_HS VSS VSS VSS VSS IND2P IND2N HSTXDN HSTXDP VSS HSRXDP HSRXDN VSS IND3P IND3N VSS B C D E F G H J K L M N P R T U V Figure 3-2. The Pin-Out of the TLK10034 in a 19-mm x 19-mm 324-pin PBGA Package (2 of 2) 6 Pin Configuration and Functions Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com 3.2 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Pin Attributes The details of the terminal functions of the TLK10034 are provided in Table 3-1 and Table 3-2. Table 3-1. Pin Functions - Signal Pins PIN BGA DIRECTION TYPE SUPPLY DESCRIPTION HSTXAP HSTXAN A8 A9 Output CML VDDA_HS High Speed Transmit Channel A Output. HSTXAP and HSTXAN comprise the high speed side transmit direction Channel A differential serial output signal. During device reset (RESET_N asserted low) these pins are driven differential zero. These CML outputs must be AC coupled. HSRXAP HSRXAN A6 A5 Input CML VDDA_HS High Speed Receive Channel A Input. HSRXAP and HSRXAN comprise the high speed side receive direction Channel A differential serial input signal. These CML input signals must be AC coupled. INA[3:0]P/N G1/H1 D1/E1 B2/B1 A3/A2 Input CML VDDA_LS Low Speed Channel A Inputs. INAP and INAN comprise the low speed side transmit direction Channel A differential input signals. These signals must be AC coupled. OUTA[3:0]P/N H4/J4 F3/G3 D4/E4 C3/D3 Output CML VDDA_LS Low Speed Channel A Outputs. OUTAP and OUTAN comprise the low speed side receive direction Channel A differential output signals. During device reset (RESET_N asserted low) these pins are driven differential zero. These signals must be AC coupled. SIGNAL CHANNEL A LOSA D6 Output LVCMOS 1.5V/1.8V VDDO0 40Ω Driver Channel A Receive Loss Of Signal (LOS) Indicator. LOSA=0: Signal detected. LOSA=1: Loss of signal. Loss of signal detection is based on the input signal level. When HSRXAP/N has a differential input signal swing of ≤65 mVpp, LOSA will be asserted (if enabled). If the input signal is greater than 175 mVp-p, LOS will be deasserted. Outside of these ranges, the LOS indication is undefined. Other functions can be observed on LOSA real-time, configured via MDIO During device reset (RESET_N asserted low) this pin is driven low. During pin based power down (PDTRXA_N asserted low), this pin is floating. During register based power down (30.1.15 asserted high), this pin is floating. It is highly recommended that LOSA be brought to an easily accessible point on the application board (header) in the event that debug is required. F6 Input LVCMOS 1.5V/1.8V VDDO0 Channel A Receive Lane Alignment Status Indicator. Lane alignment status signal received from a Lane Alignment Slave on the link partner device. Valid in 10G General Purpose Serdes Mode. LS_OK_IN_A=0: Channel A link partner receive lanes not aligned. LS_OK_IN_A=1: Channel A link partner receive lanes aligned LS_OK_OUT_A J6 Output LVCMOS 1.5V/1.8V VDDO0 40Ω Driver Channel A Transmit Lane Alignment Status Indicator. Lane alignment status signal sent to a Lane Alignment Master on the link partner device. Valid in 10G General Purpose Serdes Mode. LS_OK_OUT_A=0: Channel A link partner transmit lanes not aligned. LS_OK_OUT_A=1: Channel A link partner transmit lanes aligned. PDTRXA_N E6 Input LVCMOS 1.5V/1.8V VDDO0 Transceiver Power Down. When this pin is held low (asserted), Channel A is placed in power down mode. When deasserted, Channel A operates normally. After deassertion, a software data path reset should be issued through the MDIO interface. HSTXBP HSTXBN V5 V4 Output CML VDDA_HS High Speed Transmit Channel B Output. HSTXBP and HSTXBN comprise the high speed side transmit direction Channel B differential serial output signal. During device reset (RESET_N asserted low) these pins are driven differential zero. These CML outputs must be AC coupled. HSRXBP HSRXBN V7 V8 Input CML VDDA_HS High Speed Receive Channel B Input. HSRXBP and HSRXBN comprise the high speed side receive direction Channel B differential serial input signal. These CML input signals must be AC coupled. INB[3:0]P/N U1/V1 T2/U2 P1/R1 L1/M1 Input CML VDDA_LS Low Speed Channel B Inputs. INBP and INBN comprise the low speed side transmit direction Channel B differential input signals. These signals must be AC coupled. OUTB[3:0]P/N R3/P3 N4/M4 L3/K3 K2/J2 Output CML VDDA_LS LS_OK_IN_A CHANNEL B Low Speed Channel B Outputs. OUTBP and OUTBN comprise the low speed side receive direction Channel B differential output signals. During device reset (RESET_N asserted low) these pins are driven differential zero. These signals must be AC coupled. Pin Configuration and Functions Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 7 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com Table 3-1. Pin Functions - Signal Pins (continued) PIN SIGNAL LOSB DIRECTION TYPE SUPPLY BGA P7 Output LVCMOS 1.5V/1.8V VDDO3 40Ω Driver DESCRIPTION Channel B Receive Loss Of Signal (LOS) Indicator. LOSB=0: Signal detected. LOSB=1: Loss of signal. Loss of signal detection is based on the input signal level. When HSRXBP/N has a differential input signal swing of ≤65 mVpp, LOSB will be asserted (if enabled). If the input signal is greater than 175 mVp-p, LOS will be deasserted. Outside of these ranges, the LOS indication is undefined. Other functions can be observed on LOSB real-time, configured via MDIO During device reset (RESET_N asserted low) this pin is driven low. During pin based power down (PDTRXB_N asserted low), this pin is floating. During register based power down (30.1.15 asserted high), this pin is floating. It is highly recommended that LOSB be brought to easily accessible point on the application board (header), in the event that debug is required. P6 Input LVCMOS 1.5V/1.8V VDDO3 Channel B Receive Lane Alignment Status Indicator. Lane alignment status signal received from a Lane Alignment Slave on the link partner device. Valid in 10G General Purpose Serdes Mode. LS_OK_IN_B=0: Channel B Receive lanes not aligned. LS_OK_IN_B=1: Channel B Receive lanes aligned LS_OK_OUT_B N6 Output LVCMOS 1.5V/1.8V VDDO3 40Ω Driver Channel B Transmit Lane Alignment Status Indicator. Lane alignment status signal sent to a Lane Alignment Master on the link partner device. Valid in 10G General Purpose Serdes Mode. LS_OK_OUT_B=0: Channel B Transmit lanes not aligned. LS_OK_OUT_B=1: Channel B Transmit lanes aligned. PDTRXB_N P5 Input LVCMOS 1.5V/1.8V VDDO1 Transceiver Power Down. When this pin is held low (asserted), Channel B is placed in power down mode. When deasserted, Channel B operates normally. After deassertion, a software data path reset should be issued through the MDIO interface. HSTXCP HSTXCN A14 A15 Output CML VDDA_HS High Speed Transmit Channel C Output. HSTXCP and HSTXCN comprise the high speed side transmit direction Channel C differential serial output signal. During device reset (RESET_N asserted low) these pins are driven differential zero. These CML outputs must be AC coupled. HSRXCP HSRXCN A12 A11 Input CML VDDA_HS High Speed Receive Channel C Input. HSRXCP and HSRXCN comprise the high speed side receive direction Channel C differential serial input signal. These CML input signals must be AC coupled. INC[3:0]P/N H18/G18 E18/D18 C17/B17 B18/A18 Input CML VDDA_LS Low Speed Channel C Inputs. INCP and INCN comprise the low speed side transmit direction Channel C differential input signals. These signals must be AC coupled. OUTC[3:0]P/N J17/K17 H16/J16 F15/G15 D16/E16 Output CML VDDA_LS Low Speed Channel C Outputs. OUTCP and OUTCN comprise the low speed side receive direction Channel C differential output signals. During device reset (RESET_N asserted low) these pins are driven differential zero. These signals must be AC coupled. LS_OK_IN_B CHANNEL C LOSC D14 Output LVCMOS 1.5V/1.8V VDDO1 40Ω Driver Channel C Receive Loss Of Signal (LOS) Indicator. LOSC=0: Signal detected. LOSC=1: Loss of signal. Loss of signal detection is based on the input signal level. When HSRXCP/N has a differential input signal swing of ≤65 mVpp, LOSC will be asserted (if enabled). If the input signal is greater than 175 mVp-p, LOS will be deasserted. Outside of these ranges, the LOS indication is undefined. Other functions can be observed on LOSC real-time, configured via MDIO During device reset (RESET_N asserted low) this pin is driven low. During pin based power down (PDTRXC_N asserted low), this pin is floating. During register based power down (30.1.15 asserted high), this pin is floating. It is highly recommended that LOSC be brought to easily accessible point on the application board (header), in the event that debug is required. LS_OK_IN_C LS_OK_OUT_C 8 F12 Input LVCMOS 1.5V/1.8V VDDO1 Channel C Receive Lane Alignment Status Indicator. Lane alignment status signal received from a Lane Alignment Slave on the link partner device. Valid in 10G General Purpose Serdes Mode. LS_OK_IN_C=0: Channel C Receive lanes not aligned. LS_OK_IN_C=1: Channel C Receive lanes aligned F13 Output LVCMOS 1.5V/1.8V VDDO1 40Ω Driver Channel C Transmit Lane Alignment Status Indicator. Lane alignment status signal sent to a Lane Alignment Master on the link partner device. Valid in 10G General Purpose Serdes Mode. LS_OK_OUT_C=0: Channel C Transmit lanes not aligned. LS_OK_OUT_C=1: Channel C Transmit lanes aligned. Pin Configuration and Functions Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Table 3-1. Pin Functions - Signal Pins (continued) PIN SIGNAL BGA DIRECTION TYPE SUPPLY DESCRIPTION D13 Input LVCMOS 1.5V/1.8V VDDO1 Transceiver Power Down. When this pin is held low (asserted), Channel C is placed in power down mode. When deasserted, Channel C operates normally. After deassertion, a software data path reset should be issued through the MDIO interface. HSTXDP HSTXDN V11 V10 Output CML VDDA_HS High Speed Transmit Channel D Output. HSTXDP and HSTXDN comprise the high speed side transmit direction Channel D differential serial output signal. During device reset (RESET_N asserted low) these pins are driven differential zero. These CML outputs must be AC coupled. HSRXDP HSRXDN V13 V14 Input CML VDDA_HS High Speed Receive Channel D Input. HSRXDP and HSRXDN comprise the high speed side receive direction Channel D differential serial input signal. These CML input signals must be AC coupled. IND[3:0]P/N V16/V17 U17/U18 R18/P18 M18/L18 Input CML VDDA_LS Low Speed Channel D Inputs. INDP and INDN comprise the low speed side transmit direction Channel D differential input signals. These signals must be AC coupled. OUTD[3:0]P/N T16/R16 R15/P15 N16/M16 L15/K15 Output CML VDDA_LS Low Speed Channel D Outputs. OUTDP and OUTDN comprise the low speed side receive direction Channel D differential output signals. During device reset (RESET_N asserted low) these pins are driven differential zero. These signals must be AC coupled. PDTRXC_N CHANNEL D LOSD R13 Output LVCMOS 1.5V/1.8V VDDO2 40Ω Driver Channel D Receive Loss Of Signal (LOS) Indicator. LOSD=0: Signal detected. LOSD=1: Loss of signal. Loss of signal detection is based on the input signal level. When HSRXDP/N has a differential input signal swing of ≤65 mVpp, LOSD will be asserted (if enabled). If the input signal is greater than 175 mVp-p, LOS will be deasserted. Outside of these ranges, the LOS indication is undefined. Other functions can be observed on LOSD real-time, configured via MDIO. During device reset (RESET_N asserted low) this pin is driven low. During pin based power down (PDTRXD_N asserted low), this pin is floating. During register based power down (30.1.15 asserted high), this pin is floating. It is highly recommended that LOSD be brought to easily accessible point on the application board (header), in the event that debug is required. Channel D Receive Lane Alignment Status Indicator. Lane alignment status signal received from a Lane Alignment Slave on the link partner device. LS_OK_IN_D=0: Channel D Receive lanes not aligned. LS_OK_IN_D=1: Channel D Receive lanes aligned LS_OK_IN_D K13 Input LVCMOS 1.5V/1.8V VDDO2 LS_OK_OUT_D N13 Output LVCMOS 1.5V/1.8V VDDO2 40Ω Driver Channel D Transmit Lane Alignment Status Indicator. Lane alignment status signal sent to a Lane Alignment Master on the link partner device. LS_OK_OUT_D=0: Channel D Transmit lanes not aligned. LS_OK_OUT_D=1: Channel D Transmit lanes aligned. PDTRXD_N P13 Input LVCMOS 1.5V/1.8V VDDO2 Transceiver Power Down. When this pin is held low (asserted), Channel D is placed in power down mode. When deasserted, Channel D operates normally. After deassertion, a software data path reset should be issued through the MDIO interface. REFERENCE CLOCKS, OUTPUT CLOCKS, AND CONTROL AND MONITORING SIGNALS REFCLK0P/N T5 T4 Input LVDS/ LVPECL DVDD Reference Clock Input Zero. This differential input is a clock signal used as a reference to channels A, B, C, or D. The reference clock selection is done through MDIO or the REFCLK_SEL pin. This input signal must be AC coupled. If unused, REFCLK0P/N should be pulled down to GND through a shared 100 Ω resistor. REFCLK1P/N C15 C14 Input LVDS/ LVPECL DVDD Reference Clock Input One. This differential input is a clock signal used as a reference to channels A, B, C, or D. The reference clock selection is done through MDIO or the REFCLK_SEL pin. This input signal must be AC coupled. If unused, REFCLK1P/N should be pulled down to GND through a shared 100 Ω resistor. HSRXA_CLKOUTP/N HSRXB_CLKOUTP/N HSRXC_CLKOUTP/N HSRXD_CLKOUTP/N D8/D7 R7/R8 D12/D11 R11/R12 Output CML DVDD High Speed Side Recovered Byte Output Clock. By default, these outputs are disabled. When enabled they output the high speed side Channel A/B/C/D recovered byte clocks (high speed line rate divided by 16 or 20). Optionally they can be configured to output the VCO clock divided by 2. (Note: For full rates, VCO/2 pre divided clocks will be equivalent to the line rate divided by 8, for sub-rates, VCO/2 pre divided clocks will be equivalent to the line rate divided by 4) Additional MDIO-selectable divide ratios of 1, 2, 4, 5, 8, 10, 16, 20, and 25 are available. See Figure 5-35 for more information. These CML outputs must be AC coupled. During device reset (RESET_N asserted low), pin-based power down (PDTRXA_N, PDTRXB_N, PDTRXC_N, and PDTRXD_N asserted low), or register-based power down (30.1.15 asserted high per channel), these pins are floating. Pin Configuration and Functions Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 9 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com Table 3-1. Pin Functions - Signal Pins (continued) PIN SIGNAL HSTX0_CLKOUTP/N HSTX1_CLKOUTP/N DIRECTION TYPE SUPPLY BGA High Speed Side Transmit Output Clock. By default, these outputs are disabled. When enabled, they can be configured to output the high speed side transmit clock of any of the four channels. Additional MDIO-selectable divide ratios of 1, 2, 4, 5, 8, 10, 16, 20, and 25 are available. See Figure 5-35 for more information. Output CML DVDD C6/C5 T10/T9 DESCRIPTION These CML outputs must be AC coupled. During device reset (RESET_N asserted low), pin-based power down (PDTRXA_N, PDTRXB_N, PDTRXC_N, and PDTRXD_N asserted low), or register-based power down (30.1.15 asserted high on all channels), these pins are floating. LS0_CLKOUTP/N LS1_CLKOUTP/N Low Speed Side Output Clock. By default, these outputs are disabled. When enabled, they can be configured to output the low speed side transmit byte clock or recovered byte clock (low speed line rate divided by 10) of any of the four channels. Additional MDIOselectable divide ratios of 1, 2, 4, 5, 8, 10, 16, 20, and 25 are available. See Figure 5-35 for more information. Output CML DVDD C9/C10 T13/T14 These CML outputs must be AC coupled. During device reset (RESET_N asserted low), pin-based power down (PDTRXA_N, PDTRXB_N, PDTRXC_N, and PDTRXD_N asserted low), or register-based power down (30.1.15 asserted high on all channels), these pins are floating. REFCLK_SEL PRBSEN E7 Input LVCMOS 1.5V/1.8V VDDO0 E5 Input LVCMOS 1.5V/1.8V VDDO0 Reference Clock Select. This input, when low, selects REFCLK0P/N as the reference clock to all the SERDES channels. When high, REFCLK1P/N is selected as the reference clock to all the SERDES channels. If software control is desired (register bit 30.1.1), this input signal should be tied low. With software control, the reference clock for each channel can be independently selected. See Figure 5-34 for more information. Default reference clock for all the channels is REFCLK0P/N. Enable PRBS: When this pin is asserted high, the internal PRBS generator and verifier circuits are enabled on both transmit and receive data paths on high speed and low speed sides of all the channels. The PRBS 231-1 pattern is selected by default, and can be changed through MDIO. For more details, see the test mode descriptions for the various operating modes. PRBS_PASS G6 Output LVCMOS 1.5V/1.8V VDDO0 40Ω Driver Receive PRBS Error Free (Pass) Indicator. When PRBS test is enabled (PRBSEN=1): PRBS_PASS=1 indicates that PRBS pattern reception is error free. PRBS_PASS=0 indicates that a PRBS error is detected. The channel, high speed or low speed side, and lane (for low speed side) that this signal refers to is chosen through MDIO. During device reset (RESET_N asserted low) this pin is driven high. During pin based power down (PDTRXA_N, PDTRXB_N, PDTRXC_N, and PDTRXD_N asserted low), this pin is floating. During register based power down, this pin is floating. It is highly recommended that PRBS_PASS be brought to easily accessible point on the application board (header), in the event that debug is required. ST MODE_SEL T12 Input LVCMOS 1.5V/1.8V VDDO2 P11 Input LVCMOS 1.5V/1.8V VDDO2 MDIO Select. Used to select Clause 22 (=1) or Clause 45 (=0) operation. Note that selecting clause 22 will impact mode availability. See MODE_SEL. A hard or soft reset must be applied after a change of state occurs on this input signal. Device Operating Mode Select. Used together with ST pin to select device operating mode. See Table 5-13 for details. MDIO Port Address. Used to select the MDIO port address. PRTAD[4:2] selects the MDIO port address. Selecting a unique PRTAD[4:2] per TLK10034 device allows 8 TLK10034 devices per MDIO bus. Each channel can be accessed by setting the appropriate port address field within the serial interface protocol transaction. PRTAD[4:0] M5 N14 P12 F14 N12 Input LVCMOS 1.5V/1.8V VDDO[3:1] The TLK10034 will respond if the 3 MSB’s of the port address field on MDIO protocol (PA[4:2]) matches PRTAD[4:2]. If PA[1:0] = 2’b00, TLK10034 Channel A will respond. If PA[1:0] = 2’b01, TLK10034 Channel B will respond. If PA[1:0] = 2’b10, TLK10034 Channel C will respond. If PA[1:0] = 2’b11, TLK10034 Channel D will respond. PRTAD1 is not needed for device addressing, but shares functionality with the stopwatch latency timer function. PRTAD0 is not used functionally, but is present for device testability and compatibility with other devices in the family of products. PRTAD0 should be grounded on the application board. RESET_N F8 Input LVCMOS 1.5V/1.8V VDDO0 Low True Device Reset. RESET_N must be held asserted (low logic level) for at least 10us after device power stabilization. MDC G5 Input LVCMOS with Hysteresis 1.5V/1.8V VDDO0 MDIO Clock Input. Clock input for the MDIO interface. Note that an external pullup is generally not required on MDC except if driven by an opendrain/open-collector clock source. 10 Pin Configuration and Functions Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Table 3-1. Pin Functions - Signal Pins (continued) PIN SIGNAL BGA DIRECTION TYPE SUPPLY DESCRIPTION MDIO Data I/O. MDIO interface data input/output signal for the MDIO interface. This signal must be externally pulled up to VDDO using a 2kΩ resistor. During device reset (RESET_N asserted low) this pin is floating. During software initiated power down the management interface remains active for control register writes and reads. Certain status bits will not be deterministic as their generating clock source may be disabled as a result of asserting either power down input signal. During pin based power down (PDTRXA_N, PDTRXB_N, PDTRXC_N, and PDTRXD_N asserted low), this pin is floating. During register based power down (30.1.15 asserted high all channels), this pin is driven normally. F5 Input/ Output LVCMOS 1.5V/1.8V VDDO0 25Ω Driver E12 Input LVCMOS 1.5V/1.8V VDDO1 (Internal Pullup) JTAG Input Data. TDI is used to serially shift test data and test instructions into the device during the operation of the test port. In system applications where JTAG is not implemented, this input signal may be left floating. During pin based power down (PDTRXA_N, PDTRXB_N, PDTRXC_N, and PDTRXD_N asserted low), this pin is not pulled up. During register based power down (30.1.15 asserted high all channels), this pin is pulled up normally. G14 Output LVCMOS 1.5V/1.8V VDDO1 50Ω Driver JTAG Output Data. TDO is used to serially shift test data and test instructions out of the device during operation of the test port. When the JTAG port is not in use, TDO is in a high impedance state. During device reset (RESET_N asserted low) this pin is floating. During pin based power down (PDTRXA_N, PDTRXB_N, PDTRXC_N, and PDTRXD_N asserted low), this pin is floating. During register based power down (30.1.15 asserted high all channels), this pin is floating. TMS E14 Input LVCMOS 1.5V/1.8V VDDO1 (Internal Pullup) JTAG Mode Select. TMS is used to control the state of the internal test-port controller. In system applications where JTAG is not implemented, this input signal can be left unconnected. During pin based power down (PDTRXA_N, PDTRXB_N, PDTRXC_N, and PDTRXD_N asserted low), this pin is not pulled up. During register based power down (30.1.15 asserted high all channels), this pin is pulled up normally. TCK E13 Input LVCMOS with Hysteresis 1.5V/1.8V VDDO1 JTAG Clock. TCK is used to clock state information and test data into and out of the device during boundary scan operation. In system applications where JTAG is not implemented, this input signal should be grounded. MDIO TDI TDO TRST_N H13 Input LVCMOS 1.5V/1.8V VDDO1 (Internal Pulldown) JTAG Test Reset. TRST_N is used to reset the JTAG logic into system operational mode. This input can be left unconnected in the application and is pulled down internally, disabling the JTAG circuitry. If JTAG is implemented on the application board, this signal should be deasserted (high) during JTAG system testing, and otherwise asserted (low) during normal operation mode. During pin based power down (PDTRXA_N, PDTRXB_N, PDTRXC_N, and PDTRXD_N asserted low), this pin is not pulled down. During register based power down (30.1.15 asserted high all channels), this pin is pulled down normally. TESTEN C8 Input LVCMOS 1.5V/1.8V VDDO0 Test Enable. This signal is used during the device manufacturing process. It should be grounded through a resistor in the device application board. The application board should allow the flexibility of easily reworking this signal to a high level if device debug is necessary (by including an uninstalled resistor to VDDO). GPI[2:0] M14 P14 D5 Input LVCMOS .5V/1.8V VDDO0,2 General Purpose Input. This signal is used during the device manufacturing process. It should be grounded through a resistor on the device application board. The application board should also allow the flexibility of easily reworking this signal to a high level if device debug is necessary (by including an uninstalled resistor to VDDO). AMUXA_LS/HS E2 B8 Analog I/O Analog Testability I/O. This signal is used during the device manufacturing process. It should be left unconnected in the device application. AMUXB_LS/HS P2 U8 Analog I/O Analog Testability I/O. This signal is used during the device manufacturing process. It should be left unconnected in the device application. AMUXC_LS/HS E17 B10 Analog I/O Analog Testability I/O. This signal is used during the device manufacturing process. It should be left unconnected in the device application. AMUXD_LS/HS P17 U10 Analog I/O Analog Testability I/O. This signal is used during the device manufacturing process. It should be left unconnected in the device application. Table 3-2. Pin Description - Power Pins TERMINAL SIGNAL VDDA[1:0]_LS/HS BGA H2, H3, L2, M3, F9, E10, F11, G16, H17, L16, L17, N9, P10, N11 TYPE Power DESCRIPTION SERDES Analog Power. VDDA_LS and VDDA_HS provide supply voltage for the analog circuits on the low-speed and high-speed sides respectively. 1.0V nominal. Can be tied together on the application board. Pin Configuration and Functions Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 11 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com Table 3-2. Pin Description - Power Pins (continued) TERMINAL SIGNAL BGA TYPE DESCRIPTION VDDT[1:0]_LS/HS J5, K5, E8, J14, K14, P8 Power SERDES Analog Power. VDDT_LS and VDDT_HS provide termination and supply voltage for the analog circuits on the low-speed and high-speed sides respectively. 1.0V nominal. Can be tied together on the application board. VDDD H8, J8, K8, L8, M9, G10, H11, J11, K11, L11 Power SERDES Digital Power. VDDD provides supply voltage for the digital circuits internal to the SERDES. 1.0V nominal. DVDD H7, K7, L7, H9, J9, L9, H10, K10, L10, H12, J12, L12 Power Digital Core Power. DVDD provides supply voltage to the digital core. 1.0V nominal. VDDRA_LS/HS G4 B6 Power SERDES Analog Regulator Power. VDDRA_LS and VDDRA_HS provide supply voltage for the internal PLL regulator for Channel A low speed and high speed sides respectively. 1.5V or 1.8V nominal. VDDRB_LS/HS K4 U6 Power SERDES Analog Regulator Power VDDRB_LS and VDDRB_HS provide supply voltage for the internal PLL regulator for Channel B low speed and high speed sides respectively. 1.5V or 1.8V nominal. VDDRC_LS/HS J15 B12 Power SERDES Analog Regulator Power. VDDRC_LS and VDDRC_HS provide supply voltage for the internal PLL regulator for Channel C low speed and high speed sides respectively. 1.5V or 1.8V nominal. VDDRD_LS/HS M15 U12 Power SERDES Analog Regulator Power VDDRD_LS and VDDRD_HS provide supply voltage for the internal PLL regulator for Channel D low speed and high speed sides respectively. 1.5V or 1.8V nominal. VDDO[3:0] M7 M12 G12 G7 Power LVCMOS I/O Power. VDDO0[3:0] and VDDO1 provide supply voltage for the LVCMOS inputs and outputs. 1.5V or 1.8V nominal. Can be tied together on the application board. VPP N7 Power Factory Program Voltage. Used during device manufacturing. The application must connect this power supply directly to DVDD. VSS A1, A4, A7, A10, A13, A16, A17, B3, B4, B5, B7, B9, B11, B13, B14, B15, B16, C1, C2, C4, C7, C11, C12, C13, C16, C18, D2, D9, D10, D15, D17, E3, E9, E11, E15, F1, F2, F4, F7, F10, F16, F17, F18, G2, G8, G9, G11, G13, G17, H5, H6, H14, H15, J1, J3, J7, J10, J13, J18, K1, K6, K9, K12, K16, K18, L4, L5, L6, L13, L14, M2, M6, M8, M10, M11, M13, M17, N1, N2, N3, N5, N8, N10, N15, N17, N18, P4, P9, P16, R2, R4, R5, R6, R9, R10, R14, R17, T1, T3, T6, T7, T8, T11, T15, T17, T18, U3, U4, U5, U7, U9, U11, U13, U14, U15, U16, V2, V3, V6, V9, V12, V15, V18 Ground Ground. Common analog and digital ground. 12 Pin Configuration and Functions Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 4 Specifications 4.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT DVDD, VDDA, LS/HS, VPP, VDDD –0.3 1.4 V VDDRA/B/C/D_LS/HS, VDDO[3:0] –0.3 2.2 V –0.3 Supply + 0.3 V Characterized free-air operating temerature –40 85 °C Storage temperature Tstg –65 85 °C Supply voltage Input Voltage, VI (1) LVCMOS/CML/Analog Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 4.2 ESD Ratings VALUE Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 V(ESD) (1) (2) 4.3 Electrostatic discharge (1) UNIT ±1500 Charged-device model (CDM), per JEDEC specification JESD22C101 (2) V ±500 JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) NOM MAX UNIT 0.95 1.00 1.05 V 1.5-V Nominal 1.425 1.5 1.575 1.8-V Nominal 1.71 1.8 1.89 1.5-V Nominal 1.425 1.5 1.575 1.8-V Nominal 1.71 1.8 1.89 VDDD, VDDA_LS/HS, DVDD, VDDT_LS/HS, VPP SERDES PLL regulator voltage VDDRA_LS/HS, VDDRB_LS/HS, VDDRC_LS/HS, VDDRD_LS/HS LVCMOS I/O supply voltage VDDO[3:0] VDDD IDD MIN Digital / analog supply voltages Supply current 10.3 Gbps VDDA_LS/HS 1020 DVDD + VPP 1117 VDDT_LS/HS 1249 VDDRA/B/C/D_LS 168 VDDRA/B/C/D_HS 118 (1) mA 10 Nominal Power dissipation V 913 VDDO[3:0] PD V All supplies worst case, 10GBASE-KR 3.3 3.7 (1) W Total worst-case power is not a sum of the individual power supply worst cases, as the individual worst-case powers are taken from multiple modes. These modes are mutually exclusive and therefore used only for power supply requirements. Specifications Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 13 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com Recommended Operating Conditions (continued) over operating free-air temperature range (unless otherwise noted) MIN NOM 125 VDDA 60 DVDD + VPP ISD Shutdown current UNIT 130 VDDT 95 PD* Asserted VDDRA_HS/LS + VDDRB_HS/LS + VDDRC_HS/LS + VDDRD_HS/LS mA 5 VDDO 4.4 MAX VDDD 10 Thermal Information TLK10034 THERMAL METRIC (1) AAJ (FCBGA) UNIT 324 PINS RθJA Junction-to-ambient thermal resistance 21.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 0.2 °C/W RθJB Junction-to-board thermal resistance 7.9 °C/W ψJT Junction-to-top characterization parameter 0.1 °C/W ψJB Junction-to-board characterization parameter 7.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4.5 LVCMOS Electrical Characteristics (VDDO) PARAMETER VOH TEST CONDITIONS MIN IOH = 2 mA, Driver Enabled (1.8V) VDDO – 0.45 IOH = 2 mA, Driver Enabled (1.5V) 0.75 × VDDO High-level output voltage IOL = –2 mA, Driver Enabled (1.8V) 0 TYP MAX UNIT VDDO V 0.45 VOL Low-level output voltage VIH High-level input voltage 0.65 × VDDO VDDO + 0.3 V VIL Low-level input voltage –0.3 0.35 × VDDO V IIH, IIL Receiver only Low/High Input Current ±170 µA Driver only Driver Disabled Driver/Receiver With Pullup/Pulldown Driver disabled With Pull Up/Down Enabled IOZ CIN 14 0.25 × VDDO IOL = –2 mA, Driver Enabled (1.5V) Input capacitance ±25 ±195 3 Specifications V µA pF Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com 4.6 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 High Speed Side Serial Transmitter Characteristics PARAMETER VOD(p-p) TX Output differential peak-to-peak voltage swing, transmitter enabled MIN TYP MAX SWING (3.15:22) = 0000 TEST CONDITIONS 50 130 220 SWING (3.15:22) = 0001 110 220 320 SWING (3.15:22) = 0010 180 300 430 SWING (3.15:22) = 0011 250 390 540 SWING (3.15:22) = 0100 320 480 650 SWING (3.15:22) = 0101 390 570 770 SWING (3.15:22) = 0110 460 660 880 SWING (3.15:22) = 0111 530 750 1000 SWING (3.15:22) = 1000 590 830 1100 SWING (3.15:22) = 1001 660 930 1220 SWING (3.15:22) = 1010 740 1020 1320 SWING (3.15:22) = 1011 820 1110 1430 SWING (3.15:22) = 1100 890 1180 1520 SWING (3.15:22) = 1101 970 1270 1610 SWING (3.15:22) = 1110 1060 1340 1680 SWING (3.15:22) = 1111 1090 1400 1740 Transmitter disabled TX Output pre/post cursor emphasis voltage See register bits TWPOST1, TWPOST2, and TWPRE for deemphasis settings. See Figure 4-2 VCMT TX Output common mode voltage 100-Ω differential termination. DCcoupled. tskew Intra-pair output skew Serial Rate = 9.8304 Gbps Tr, Tf Differential output signal rise, fall time (20% to 80%), Differential Load = 100Ω Serial output total jitter (CPRI LV/LV-II/LV-III, OBSAI and 10GBASE-KR Rates) Serial Rate ≤ 3.072Gbps 0.35 JT1 Serial Rate > 3.072Gbps 0.28 Serial output deterministic jitter (CPRI LV/LV-II, OBSAI and 10GBASE-KR Rates) Serial Rate ≤ 3.072Gbps 0.17 JD1 Serial Rate > 3.072Gbps 0.15 JR1 Serial output random jitter (CPRI LV/LV-II/LV-III, OBSAI and 10GBASE-KR Rates) Serial Rate > 3.072Gbps 0.15 JT2 Serial output total jitter (CPRI E.6/12.HV) JD2 Serial output deterministic jitter (CPRI E.6/12.HV) SDD22 Differential output return loss T(LATENCY) (1) (2) Common-mode output return loss Transmit path latency mVpp 30 Vpre/post SCC22 UNIT –17.5/ –37.5% +17.5/ +37.5% VDDT .25*VOD(p-p) mV 0.045 24 UI ps UIpp UIpp UIpp 0.279 Serial Rate = 0.6144 and 1.2288Gbps UIpp 0.14 50 MHz < f < 2.5 GHz 9 dB (1) dB 50 MHz < f < 2.5 GHz 6 dB 2.5 GHz < f < 7.5 GHz (2) dB 2.5 GHz < f < 7.5 GHz See See 10GBASE-KR mode see Figure 5-10 1GBASE-KX mode see Figure 5-11 General Purpose mode see Figure 5-18 Differential input return loss, SDD22 = 9 – 12 log10(f / 2500MHz)) dB Common-mode output return loss, SDD22 = 6 – 12 log10(f / 2500MHz)) dB Specifications Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 15 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 4.7 www.ti.com High Speed Side Serial Receiver Characteristics PARAMETER TEST CONDITIONS VID RX Input differential voltage, |RXP – RXN| VID(pp) RX Input differential peak-to-peak voltage swing, 2×|RXP – RXN| CI RX Input capacitance SDD11 Differential input return loss tskew Intra-pair input skew t(LATENCY) (1) MAX 600 Half/Quarter/Eighth Rate, AC Coupled 50 800 Full Rate, AC Coupled 100 1200 Half/Quarter/Eighth Rate, AC Coupled 100 1600 Applied sinusoidal jitter 0.115 Applie drandom jitter 0.130 Applied duty cycle distortion 0.035 Broadband noise amplitude (RMS) mV mVpp pF UIpp 5.2 50 MHz < f < 2.5 GHz 9 2.5 GHz < f < 7.5 GHz Receive path latency UNIT See dB (1) 10GBASE-KR mode see Figure 5-10 1GBASE-KX mode see Figure 5-11 General Purpose mode see Figure 5-18 0.23 UI UNIT Differential input return loss, SDD11 = 9 – 12 log10(f / 2.5GHz)) dB 4.8 Low Speed Side Serial Transmitter Characteristics PARAMETER VOD(pp) DE TEST CONDITIONS Transmitter output differential peak-to-peak voltage swing Transmitter output de-emphasis voltage swing reduction MIN TYP MAX SWING = 000 110 190 280 SWING = 001 280 380 490 SWING = 010 420 560 700 SWING = 011 560 710 870 SWING = 100 690 850 1020 SWING = 101 760 950 1150 SWING = 110 800 1010 1230 SWING = 111 830 1050 1270 DE = 0000 0 DE = 0001 0.42 DE = 0010 0.87 DE = 0011 1.34 DE = 0100 1.83 DE = 0101 2.36 DE = 0110 2.92 DE = 0111 3.52 DE = 1000 4.16 DE = 1001 4.86 DE = 1010 5.61 DE = 1011 6.44 DE = 1100 7.35 DE = 1101 8.38 DE = 1110 9.54 DE = 1111 10.87 100-Ω differential termination. DCcoupled. VCMT Transmitter output common mode voltage tskew Intra-pair output skew tR, tF Differential output signal rise, fall time (20% to 80%) Differential Load = 100Ω 16 TYP 50 2 10GBASE-KR Jitter tolerance, test channel with mTC =1 (see Figure 4-5 for attenuation curve), PRBS31 test pattern at 10.3125 Gbps JTOL MIN Full Rate, AC Coupled dB VDDT.5*VDD(p-p) mV 0.045 Specifications 30 mVpp UI ps Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Low Speed Side Serial Transmitter Characteristics (continued) MAX UNIT JT Serial output total jitter PARAMETER 0.35 UI JD Serial output deterministic jitter 0.17 UI tskew Lane-to-lane output skew 50 ps 4.9 TEST CONDITIONS MIN TYP Low Speed Side Serial Receiver Characteristics PARAMETER TEST CONDITIONS VID Receiver input differential voltage, |INP – INN| VID(pp) Receiver input differential peak-to-peak voltage swing 2×|INP – INN| CI Receiver input capacitance MIN TYP MAX Full Rate, AC Coupled 50 600 Half/Quarter Rate, AC Coupled 50 800 Full Rate, AC Coupled 100 1200 Half/Quarter Rate, AC Coupled 100 1600 2 JTOL Jitter tolerance, total jitter at serial input (DJ + RJ) (BER 10-15) JDR Serial input deterministic jitter (BER 10-15) tskew Intra-pair input skew tlane-skew Lane-to-lane input skew Zero crossing, Half/Quarter Rate 0.66 Zero crossing, Full Rate 0.65 Zero crossing, Half/Quarter Rate 0.50 Zero crossing, Full Rate 0.35 UNIT mV mVdfpp pF UIp-p UIp-p 0.23 UI 30 UI 4.10 Reference Clock Characteristics (REFCLK0P/N, REFCLK1P/N) PARAMETER F Frequency FHSoffset Accuracy DC Duty cycle VID Differential input voltage CIN Input capacitance RIN Differential input impedance TRISE Rise/fall time JR TEST CONDITIONS MIN TYP MAX UNIT MHz 122.88 425 Relative to Nominal HS Serial Data Rate –100 100 Relative to Incoming HS Serial Data Rate –200 200 High Time 45% 50% 250 55% 2000 1 80 10% to 90% 100 50 ppm mVpp pF 120 Ω 350 ps 10 kHz to 1 MHz 3 psRMS Above 1 MHz 1 psRMS MAX UNIT 2000 mVpp 350 ps 500 MHz Random jitter 4.11 Differential Output Clock Characteristics (CLKOUTA/B/C/DP/N) PARAMETER VOD TEST CONDITIONS Differential output voltage Peak to peak TRISE Output rise time 10% to 90%, 2pF lumped capacitive load, AC-Coupled RTERM Output termination CLKOUT×P/N to DVDD F Output frequency MIN TYP 1000 Ω 50 0 Specifications Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 17 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com 4.12 MDIO Timing Requirements over recommended operating conditions (unless otherwise noted) MIN tperiod MDC period tsetup MDIO setup to ↑ MDC thold MDIO hold to ↑ MDC Tvalid MDIO valid from MDC ↑ See Figure 4-3 NOM MAX UNIT 100 ns 10 ns 10 ns 0 40 ns 4.13 JTAG Timing Requirements over recommended operating conditions (unless otherwise noted) MIN TPERIOD TCK period TSETUP TDI/TMS/TRST_N setup to ↑ TCK THOLD TDI/TMS/TRST_N hold from ↑ TCK TVALID TDO delay from TCK Falling NOM MAX UNIT 66.67 3 See Figure 4-4 5 0 0.5 * VDE * VOD(pp) VCMT ns 10 ns 0.5 * VOD(pp) 0.25 * VDE * VOD (pp) tr , t f bit time 0.25 * VOD (pp) Figure 4-1. Transmit Output Waveform Parameter Definitions +V 0/0 +V pst +Vpre +Vss 0 -Vss -Vpre -V pst -V 0/0 UI h -1 = TWPRE (0% h 1 = TWPOST1 (0 % -17 .5% for typical application) setting -37.5 % for typical application) setting h 0 = 1 - |h 1| - |h -1 | V0 /0 = Output Amplitude with TWPRE = 0% , TWPOST = 0 %. Vss = Steady State Output Voltage = V0/0 * | h1 + h 0 + h- 1| Vpre = PreCursor Output Voltage = V0 /0 * | -h 1 – h 0 + h -1| Vpst = PostCursor Output Voltage = V0/0 * | - h1 + h 0 + h- 1| Figure 4-2. Pre and Post Cursor Swing Definitions 18 Specifications Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 MDC tPERIOD tSETUP tHOLD MDIO Figure 4-3. MDIO Read and Write Timing TCK tPERIOD tSETUP tHOLD TDI/TMS/ TRST_N tVALID TDO Figure 4-4. JTAG Timing Specifications Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 19 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com 4.14 Typical Characteristics 40 Fitted Attenuation (dB) 35 30 25 20 15 10 5 0 1000 2000 3000 4000 Frequency (MHz) 5000 6000 G001 Figure 4-5. 10GBASE-KR Fitted Channel Attenuation Limit 20 Figure 4-6. Eye Diagram of the TLK100034 at 10.3125 Gbps Under Nominal Conditions Specifications Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 5 Detailed Description 5.1 Overview Various interfaces of the TLK10034 device are shown in Figure 5-1 for Channel A. The implementation of all four channels is identical. The block diagrams for the transmit and receive data paths are shown in Figure 5-2. This low-power transceiver consists of two serializer/deserializer (SERDES) blocks, one on the low speed side and the other on the high speed side. The core logic block that lies between the two SERDES blocks carries out all the logic functions including channel synchronization, lane alignment, 8B/10B and 64B/66B encoding/decoding, as well as test pattern generation and verification. The TLK10034 provides a management data input/output (MDIO) interface as well as a JTAG interface for device configuration, control, and monitoring. Detailed description of the TLK10034 pin functions is provided in Table 3-1. 5.2 Functional Block Diagrams INA 0P /N INA 1P /N INA 2P /N High Speed Outputs Low Speed Inputs DATA PATH (Channel A) INA 3P /N OU TA0 P/N OU TA1 P/N OU TA2 P/N HSTXAP/N Low Speed Outputs High Speed Inputs HSRXAP/N OU TA3 P/N LS 0_CLK OUT P/N LS 1_ CLK OUT P/N HSRXA_CLKOUTP/N REF C LK0 P/N HST X0_ CLK OUTP/N CLOCKS HST X1_ CLK OUTP/N REF C LK1 P/N REFCLK _SEL PRTAD[ 4:0] LO SA MDIO MDC MDIO LS_OK_IN_A CONTROL, STATUS, TEST LS_OK_OUT_A ST MODE_SEL PDTRX_N TDO RESET_N TMS TESTEN JTAG PRBSEN TRST_N TCK PRBS_PASS TDI GPI[2:0] Figure 5-1. TLK10034 Interfaces Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 21 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com TX FIFO 1G- KX PCS RX 8b/10b Dec TX PCS 1G KX PCS TX RX PCS TPGEN XAUI RX- 1 LS SERDES XAUI RX- 4 66/16 Gearbox CHA_LN1_IP CHA_LN1_IN Scrambler XAUI RX- 3 64b/66b Encoder XAUI RX TX CTC XAUI RX- 2 LS SERDES Data Width 32:64 CHA_LN0_IP CHA_LN0_IN 10KR Training TPGEN 10G KR PCS TX 10KR Autonegotiation TX HS SERDES CHA_LN2_IP LS SERDES LS RX- 1 CHA_LN3_IN LS SERDES Comma Lane Alignment CHA_LN3_IP LS RX- 2 LS RX x4 LS RX- 3 TX FIFO 1 Lane TX FIFO ( 2, 4 Lanes) CHA_LN2_IN CHA_OP CHA_ON 10G General Purpose TX LS RX- 4 TPGEN LS TX- 1 LS TX- 3 CHA_LN1_OP 10G General Purpose RX LS SERDES CHA_LN0_ON 20-bit Ch Sync LS TX x4 CHA_LN0_OP RX FIFO (1 Lane) 20-bit 8b/10b Decoder RX FIFO (2, 4 Lanes) LS TX- 2 TP Verifier LS TX- 4 LS SERDES HS SERDES CHA_LN1_ON XAUI TX- 1 CHA_LN3_ON XAUI TX- 4 TX PCS RX PCS TP Verifier 10KR Autonegotiation RX 1G KX PCS RX TP Verifier 10 bit Ch Sync 8b/10b Enc CHA_IP CHA_IN 10G KR PCS RX 10-bit 8b/10b Decoder RX CTC 1G- KX PCS TX 16/66 Gearbox XAUI TX- 3 Ch_Sync_66 LS SERDES XAUI TX- 2 XAUI TX DeScrambler CHA_LN3_OP RX CTC LS SERDES 64b/66b Decoder CHA_LN2_OP CHA_LN2_ON 10KR Training Figure 5-2. Simplified, One-Channel Block Diagram of TLK10034 Data Paths 5.3 Feature Description 5.3.1 10GBASE-KR Mode 5.3.1.1 10GBASE-KR Transmit Data Path Overview In 10GBASE-KR Mode, the TLK10034 takes in XAUI data on the four low speed input lanes. The serial data in each lane is deserialized into 10-bit parallel data, then byte aligned (channel synchronized) based on comma detection. The four XAUI lanes are then aligned with one another, and the aligned data is input to four 8B/10B decoders. The decoded data is then input to the transmit clock tolerance compensation (CTC) block which compensates for any frequency offsets between the incoming XAUI data and the local reference clock. The CTC block then delivers the data to a 64B/66B encoder and a scrambler. The resulting scrambled 10GBASE-KR data is then input to a transmit gearbox which in turn delivers it to the high speed side SERDES for serialization and output through the HSTX*P/N pins. 5.3.1.2 10GBASE-KR Receive Data Path Overview In the receive direction, the TLK10034 will take in 64B/66B-encoded serial 10GBASE-KR data on the HSRX*P/N pins. This data is deserialized by a high speed SERDES, then input to a receive gearbox. After the gearbox, the data is aligned to 66-bit frames, descrambled, 64B/66B decoded, and then input to the receive CTC block. After CTC, the data is encoded by four 8B/10B encoders, and the resulting four 10-bit parallel words are serialized by the low speed SERDES blocks. The four serial XAUI output lanes are transmitted out the OUT*P/N pins. 22 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com 5.3.1.3 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Channel Synchronization Block When parallel data is clocked into a parallel-to-serial converter, the byte boundary that was associated with the parallel data is lost in the serialization of the data. When the serial data is received and converted to parallel format again, a method is needed to be able to recognize the byte boundary again. Generally, this is accomplished through the use of a synchronization pattern. This is a unique pattern of 1’s and 0’s that either cannot occur as part of valid data or is a pattern that repeats at defined intervals. 8B/10B encoding contains a character called the comma (b’0011111’ or b’1100000’) which is used by the comma detect circuit to align the received serial data back to its original byte boundary. The TLK10034 channel synchronization block detects the comma pattern found in the K28.5 character, generating a synchronization signal aligning the data to their 10-bit boundaries for decoding. It is important to note that the comma can be either a (b’0011111’) or the inverse (b’1100000’) depending on the running disparity. The TLK10034 decoder will detect both patterns. The TLK10034 performs channel synchronization per lane as shown in the flowchart of Figure 5-3. Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 23 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com Reset | LOS(Loss of Signal ) Loss Of Sync (Enable Alignment ) Sync Status Not Ok No Comma Comma Comma Detect 1 (Disable Alignment ) !Comma & !Invalid Decode Invalid Decode Comma Comma Detect 2 !Comma & !Invalid Decode Invalid Decode Comma Comma Detect 3 !Comma & !Invalid Decode Invalid Decode Note: If MDIO field HS_CH_SYNC_HYSTERESIS[1:0] is equal to 2'b00, machine operates as drawn. If HS_CH_SYNC_HYSTERESIS[1:0] is equal to2'b01/2'b10/ 2'b11, then a transition from all Sync Acquired states occurs immediately upon detection of1, 2, or 3 adjacent invalid code words or disparity errors respectively. Comma A Sync Acquired 1 (Sync Status Ok ) B Invalid Decode Sync Acquired 2 (good cgs = 0) C Invalid Decode Invalid Decode Sync Acquired 3 (good cgs = 0) Invalid Decode !Invalid Decode Invalid Decode Sync Acquired 4 (good cgs = 0) Invalid Decode !Invalid Decode !Invalid Decode Invalid Decode Sync Acquired 2A good cgs++ A !invalid Decode & good_cgs=3 Sync Acquired 3A good cgs++ !invalid Decode & B good_cgs=3 Sync Acquired 4A good cgs++ C !invalid Decode & good_cgs=3 !Invalid Decode & good_cgs !=3 !Invalid Decode & good_cgs !=3 !Invalid Decode & good_cgs !=3 Figure 5-3. Channel Synchronization Flowchart 5.3.1.4 8B/10B Encoder Embedded-clock serial interfaces require a method of encoding to ensure sufficient transition density for the receiving CDR to acquire and maintain lock. The encoding scheme also maintains the signal DC balance by keeping the number of ones and zeros balanced which allows for AC coupled data transmission. The TLK10034 uses the 8B/10B encoding algorithm that is used by 10Gbps and 1Gbps Ethernet and Fibre Channel standards. This provides good transition density for clock recovery and improves error checking. 24 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 The 8B/10B encoder converts each 8-bit wide data to a 10-bit wide encoded data character to improve its transition density. This transmission code includes /D/ Characters, used for transmitting data, and /K/ Characters, used for transmitting protocol information. Each /K/ or /D/ character code word can also have both a positive and a negative disparity version. The disparity of a code word is selected by the encoder to balance the running disparity of the serialized data stream. 5.3.1.5 8B/10B Decoder Once the Channel Synchronization block has identified the byte boundaries from the received serial data stream, the 8B/10B decoder converts 10-bit 8B/10B-encoded characters into their respective 8-bit formats. When a code word error or running disparity error is detected in the decoded data, the appropriate LOS pin is asserted (depending on the LOS overlay selection). 5.3.1.6 64B/66B Encoder/Scrambler To facilitate the transmission of data received from the media access control (MAC) layer, the TLK10034 encodes data received from the MAC using the 64B/66B encoding algorithm defined in the IEEE802.3ae Clause 49.2.4 standard. The TLK10034 takes two consecutive transfers from the XAUI interface and encodes them into a 66-bit code word. The information from the two XAUI transfers includes 64 bits of data and 8 bits of control information after 8B/10B decoding. If the 64B/66B encoder detects an invalid packet format from the XAUI interface, it replaces erroneous information with appropriately-encoded error information. The resulting 66-bit code word is then sent on to the transmit gearbox. The encoding process implemented in the TLK10034 includes two steps: 1. an encoding step, which converts the 72 bits of data (8 data bytes plus 8 control-code indicators) received from the transmit CTC FIFO into a 66-bit code word 2. a scrambling step, which scrambles 64 bits of encoded data using the scrambler polynomial x57+x39+1. The 66 bits created by the encoder consists of 64 bits of data and a 2-bit synchronization field consisting of either 01 or 10. Only the 64 bits of data are scrambled, leaving the two synchronization bits unmodified. The two synchronization bits allow the receive gearbox to obtain frame alignment and, in addition, ensure an edge transition of at least once in 66 bits of data. The encoding process allows a limited amount of control information to be sent in-line with the data. 5.3.1.7 64B/66B Decoder/Descrambler The data received from the serial 10GBASE-KR is 64B/66B-encoded data. The TLK10034 decodes the data received using the 64B/66B decoding algorithm defined in the IEEE 802.3-2008 Clause 49.2.4 standard. The TLK10034 creates consecutive 72-bit data words from the encoded 66-bit code words for transfer over the XAUI interface to the MAC. The information for the two XAUI transfers includes 64 bits of data and 8 bits of control information before 8B/10B encoding. Not all 64B/66B block payloads are valid. Invalid block payloads are handled by the 64B/66B decoder block and appropriate error handling is provided, as defined in the IEEE 802.3-2008 standard. The decoding algorithm includes two steps: a descrambling step which descrambles 64 bits of the 66-bit code word with the scrambling polynomial x57+x39+1, and a decoding step which converts the 66 bits of data received into 64 bits of data and 8 bits of control information. These words are sent to the receive CTC FIFO. 5.3.1.8 Transmit Gearbox The function of the transmit gearbox is to convert the 66-bit encoded, scrambled data stream into a 16-bitwide data stream to be sent out to the serializer and ultimately to the physical medium attachment (PMA) device. The gearbox is needed because while the effective bit rate of the 66-bit data stream is equal to the effective bit rate of the 16-bit data, the clock rates of the two buses are of different frequencies. Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 25 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 5.3.1.9 www.ti.com Receive Gearbox While the transmit gearbox only performs the task of converting 66-bit data to be transported on to the 16bit serializer, the receive gearbox has more to do than just the reverse of this function. The receive gearbox must also determine where within the incoming data stream the boundaries of the 66-bit code words are. The receive gearbox has the responsibility of initially synchronizing the header field of the code words and continuously monitoring the ongoing synchronization. After obtaining synchronization to the incoming data stream, the gearbox assembles 66-bit code words and presents these to the 64B/66B decoder. Note that in FEC mode, the Receive Gearbox blindly converts 16-bit data to 66-bit data and depends on the RX FEC logic to frame align the data. 5.3.1.10 XAUI Lane Alignment / Code Gen (XAUI PCS) The XAUI interface standard is defined to allow for 21 UI of skew between lanes. This block is implemented to handle up to 30 UI (XAUI UI) of skew between lanes using /A/ characters. The state machine follows the standard 802.3-2008 defined state machine. 5.3.1.11 XAUI Inter-Packet Gap (IPG) Handling The XAUI interface transports information that consists of packets and inter-packet gap (IPG) characters. The IEEE 802.3ae standard defines that the IPG, when transferred over the XAUI interface, consists of alignment characters (/A/), control characters (/K/) and replacement characters (/R/). TLK10034 converts all AKR characters to IDLE characters, performs insertions or deletions on the IDLE characters, and transmits only encoded IDLE characters out to the 10GBASE-KR interface. The receive channel expects encoded IDLE characters to enter the 10GBASE-KR interface, and performs insertions and deletions on IDLE characters and then converts IDLE characters back to AKR characters. Any AKR characters received on the high speed interface are by default converted to IDLE characters for reconversion to AKR columns. Both the transmit and receive FIFOs rely upon a valid IDLE stream to perform clock tolerance compensation (CTC). 5.3.1.12 Clock Tolerance Compensation (CTC) The XAUI interface is defined to allow for separate clock domains on each side of the link. Though the reference clocks for two devices on a XAUI link have the same specified frequencies, there are slight differences that, if not compensated for, will lead to over or under run of the FIFO’s on the receive/transmit data path. The TLK10034 provides compensation for these differences in clock frequencies via the insertion or the removal of idle (/I/) characters on all lanes, as shown in Figure 5-4 and Figure 5-5. 26 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Packet IPG LANE 0 I I S D D D D ... D D D D I I I I S D LANE 1 I I D D D D D ... D D D T I I I I D D LANE 2 I I D D D D D ... D D D I I I I I D D LANE 3 I I D D D D D ... D D D I I I I I D D LANE 0 I I S D D D D ... D D D D I I I I I S LANE 1 I I D D D D D ... D D D T I I I I I D LANE 2 I I D D D D D ... D D D I I I I I I D LANE 3 I I D D D D D ... D D D I I I I I I D Input Output S = Start of Packet, D = Data, T = End of Packet, I = I28.3, I = I28.5, I = I28.0, I = Idle Added Column Figure 5-4. Clock Tolerance Compensation: Add The /R/ code is disparity neutral, allowing its removal or insertion without affecting the current running disparity of each channel’s serial stream. Packet IPG LANE 0 I I S D D D D ... D D D D I I I I S D LANE 1 I I D D D D D ... D D D T I I I I D D LANE 2 I I D D D D D ... D D D I I I I I D D LANE 3 I I D D D D D ... D D D I I I I I D D Input Dropped Column LANE 0 I I S D D D D ... D D D D I I I S D D LANE 1 I I D D D D D ... D D D T I I I D D D LANE 2 I I D D D D D ... D D D I I I I D D D LANE 3 I I D D D D D ... D D D I I I I D D D Output S = Start of Packet, D = Data, T = End of Packet, I = I 28.3, I = I 28.5, I = I 28.0, I = Idle Figure 5-5. Clock Tolerance Compensation: Drop The TLK10034 allows for provisioning of both the CTC FIFO depth and the low/high watermark thresholds that trigger idle insertion/deletion beyond the standard requirements. This allows for optimization between maximum clock tolerance and packet length. For more information on the TLK10034 CTC provisioning, see Appendix A. 5.3.1.13 10GBASE-KR Auto-Negotiation When TLK10034 is selected to operate in 10GKR/1G-KX mode (MODE_SEL pin held low), Clause 73 Auto-Negotiation will commence after power up or hardware or software reset. The data path chosen from the result of Auto-Negotiation will be the highest speed of 10G-KR or 1G-KX as advertised in the MDIO ability fields (set to 10G-KR by default). If 10G-KR is chosen, link training will commence immediately following the completion of Auto-Negotiation. Legacy devices that operate in 1G-KX mode and do not support Clause 73 Auto Negotiation will be recognized through the Clause 73 parallel detect mechanism. Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 27 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com 5.3.1.14 10GBASE-KR Link Training Link training for 10G-KR mode is performed after auto-negotiation, and follows the procedure described in IEEE 802.3-2008. The high speed TX SERDES side will update pre-emphasis tap coefficients as requested through the Coefficient update field. Received training patterns are monitored for bit errors (MDIO configurable), and requests are made to update partner channel TX coefficients until optimal settings are achieved. The RX link training algorithm consists of sending a series of requests to move the link partner’s transmitter tap coefficients to the center point of an error free region. Once link training has completed, the 10G-KR data path is enabled. If link is lost, the entire process repeats with auto-negotiation, link training, and 10G-KR mode. 5.3.1.15 Forward Error Correction Optionally enabled, Forward Error Correction (FEC) follows the IEEE 802.3-2008 standard, and is able to correct a burst errors up to 11 bits. In the TX data path, the FEC logic resides between the scrambler and gearbox. In the RX datapath, FEC resides between the gearbox and descrambler. Frame alignment is handled inside the RX FEC block during FEC operation, and the RX gearbox sync header alignment is bypassed. Because latency is increased in both the TX and RX data paths with FEC enabled, it is disabled by default and must be enabled through MDIO programming. Note that FEC by nature will add latency due to frame storage. 5.3.1.16 10GBASE-KR Line Rate, PLL Settings, and Reference Clock Selection The TLK10034 includes internal low-jitter high quality oscillators that are used as frequency multipliers for the low speed and high speed SERDES and other internal circuits of the device. Specific MDIO registers are available for SERDES rate and PLL multiplier selection to match line rates and reference clock (REFCLK0/1) frequencies for various applications. The external differential reference clock has a large operating frequency range allowing support for many different applications. The reference clock frequency must be within ±200 PPM of the incoming serial data rate (±100 PPM of nominal data rate), and have less than the specified jitter characteristics (see Section 4.10). When the TLK10034 device is set to operate in the 10GBASE-KR mode with a low speed side line rate of 3.125Gbps and a high speed side line rate of 10.3125Gbps, the reference clock choices are as shown in Table 5-1. Table 5-1. Specific Line Rate and Reference Clock Selection for the 10GBASE-KR Mode LOW SPEED SIDE HIGH SPEED SIDE Line Rate (Mbps) SERDES PLL Multiplier Rate REFCLKP/N (MHz) Line Rate (Mbps) SERDES PLL Multiplier Rate REFCLKP/N (MHz) 3125 10 Full 156.25 10312.5 16.5 Full 156.25 3125 5 Full 312.5 10312.5 8.25 Full 312.5 5.3.1.17 10GBASE-KR Loopback Modes In 10G-KR mode, the TLK10034 supports looping back of data on both the XAUI (local) side and 10G-KR (remote) side. In either case, the loopback point can be chosed to be either prior to serialization (shallow) or after serialization (deep). The various loopback modes can be activated and configured via MDIO register settings. The datapath for deep remote loopback is shown in Figure 5-6. The data is accepted on the high speed side receive SERDES pins (HSRX*P/N), traverses the entire receive data path is returned through the entire transmit data path and sent out through the high speed side transmit SERDES pins (HSTX*P/N). The low speed side outputs on OUT*P/N pins are still available for monitoring and should be correctly terminated. The low speed side inputs on IN*P/N should be electrically idle (floating). 28 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 IN*3P/N OUT*0P/N OU T*1P/N OUT*2P/N OU T*3P/N RX CTC 8B/10 B Encode r Low Speed Side SERDES Pattern Generator Pattern Verifier IN*2P/N HSTX*P/N High Speed Side SERDES Ge arbox IN*1P/N HS PRBS Generator Gearbox IN *0P/N Descrambler 64B/66B Decoder Cha nnel S ync X AUI Lane Align 8B/1 0B Decoder LS PRBS Verifier 6 4B/66B Encoder Scrambler SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 TX CTC www.ti.com HSRX *P/N LS PRBS Generator HS PRBS Verifier Figure 5-6. Deep Remote Loopback for the 10GBASE-KR Mode Note that in deep remote loopback mode, the the LS serial transmitter is internally connected directly to the LS serial receiver. This short, low-loss interconnect will have different properties than a typical PCB interconnect, so different transmit and receive link settings should be used to optimize BER. The datapath for shallow remote loopback is shown in Figure 5-7. In this mode, the device functions as a high speed serial retimer. The data is accepted on the high speed side receive SERDES pins (HSRX*P/N), traverses the receive data path through the RX CTC block, is looped back before the 8B/10B encoders, and is returned through the transmit data path to be sent out through the high speed side transmit SERDES pins (HSTX*P/N). 8B/10 B Encode r OUT*0P/N OUT*1P/N OUT*2P/N OUT*3P/N Pattern Generator Pattern Verifier Low Speed Side SERDES HSTX*P/N High Speed Side SERDES Ge arbox IN*3P/N HS PRBS Generator Gearbox IN*2P/N 6 4B/66B Encoder Scrambler IN*1P/N Descrambler 64B/66B Decoder IN *0P/N RX CTC Cha nnel S ync X AUI Lane Align 8B/1 0B Decoder LS PRBS Verifier TX CTC The low speed side transmit path SERDES can be optionally enabled or disabled, but the PLL needs to be enabled to provide the required clock. The low speed side outputs on OUTA*P/N pins are available for monitoring and must be correctly terminated. LS PRBS Generator HSRX *P/N HS PRBS Verifier Figure 5-7. Shallow Remote Loopback (Serial Retime) for the 10GBASE-KR Mode Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 29 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com OUT*0P/N OUT*1P/N OUT*2P/N OUT*3P/N RX CTC 8B/10 B Encode r Low Speed Side SERDES Pattern Generator Pattern Verifier IN*3P/N HSTX*P/N High Speed Side SERDES Ge arbox IN*2P/N HS PRBS Generator Gearbox IN*1P/N 6 4B/66B Encoder Scrambler IN *0P/N Descrambler 64B/66B Decoder Cha nnel S ync X AUI Lane Align 8B/1 0B Decoder LS PRBS Verifier TX CTC The datapath for deep local loopback is shown in Figure 5-8. The data is accepted on the low speed side SERDES pins (IN*P/N), traverses the entire transmit data path, is returned through the entire receive data path and sent out through the low speed side receive SERDES pins (OUT*P/N). The high speed side outputs on HSTX*P/N pins are available for monitoring. The high speed side inputs on HSRX*P/N should be electrically idle (floating). HSRX *P/N LS PRBS Generator HS PRBS Verifier Figure 5-8. Deep Local Loopback for the 10GBASE-KR Mode Note that in deep local loopback mode, the HS serial transmitter is internally connected directly to the HS serial receiver. This short, low-loss interconnect will have different properties than a typical PCB interconnect, so different transmit and receive link settings should be used to optimize BER. 8B/10 B Encode r OUT*0P/N OUT*1P/N OUT*2P/N OUT*3P/N Pattern Generator Pattern Verifier Low Speed Side SERDES HSTX*P/N High Speed Side SERDES Ge arbox IN*3P/N HS PRBS Generator Gearbox IN*2P/N 6 4B/66B Encoder Scrambler IN*1P/N Descrambler 64B/66B Decoder IN*0P/N RX CTC Cha nnel S ync X AUI Lane Align 8B/1 0B Decoder LS PRBS Verifier TX CTC The datapath for shallow local loopback is shown in Figure 5-9. The data is accepted on the low speed side SERDES pins (IN*P/N), traverses the transmit data path up to the HS SERDES, is looped back before through the receive data path, and sent out through the low speed side receive SERDES pins (OUT*P/N). The high speed side outputs on HSRX*P/N pins are available for monitoring. LS PRBS Generator HSRX *P/N HS PRBS Verifier Figure 5-9. Shallow Local Loopback for the 10GBASE-KR Mode 30 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 5.3.1.18 10GBASE-KR Test Pattern Support The TLK10034 has the capability to generate and verify various test patterns for self-test and system diagnostic measurements. The following test patterns are supported: • High Speed (HS) Side: PRBS 27 – 1, PRBS 223 – 1, PRBS 231 – 1, Square Wave with Provisionable Length, and KR Pseudo-Random Pattern • Low Speed (LS) Side: PRBS 27 – 1, PRBS 223 – 1, PRBS 231 – 1, High Frequency, Low Frequency, Mixed Frequency, CRPAT, CJPAT. The TLK10034 provides two pins: PRBSEN and PRBS_PASS, for additional control and monitoring of PRBS pattern generation and verification. When the PRBSEN is asserted high, the internal PRBS generator and verifier circuits are enabled on both transmit and receive data paths on high speed and low speed sides of all channels. PRBS 231-1 is selected by default, and can be changed through MDIO. When PRBS test is enabled (PRBSEN=1): • PRBS_PASS = 1 indicates that PRBS pattern reception is error free. • PRBS_PASS = 0 indicates that a PRBS error is detected. The channel, the side (high speed or low speed), and the lane (for low speed side) that this signal refers to is chosen through MDIO. For further details, refer to the application note TLK10034 Test Pattern Procedures. 5.3.1.19 10GBASE-KR Latency The latency through the TLK10034 in 10GBASE-KR mode is as shown in Figure 5-10. Note that the latency ranges shown indicate static rather than dynamic latency variance, i.e., the range of possible latencies when the serial link is initially established. During normal operation, the latency through the device is fixed. Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 31 TLK10034 OUT*3P/N LS PRBS Generator TX Gearbox TX PMA HS PRBS Generator HSTX*P/N 26 TX FEC TX Scrambler 64b/66b Encoder Data Width 32_64 16 35x66* 67x66 RX PMA 33–66 82 82–147 (82 in FEC mode) 16 66 RX Gearbox SH Lock OUT*2P/N RX CTC OUT*1P/N 132 RX FEC 8b/10b Encoder AKR Processor OUT*0P/N 132 RX Descrambler 165 1–7x33: depth 8 (ctc off) 3–9x33: depth 12 3–13x33: depth 16 4–20x33: depth 24 4–28x33: depth 32 132 66 } 33 Datapath Mux Retime LowSpeed Side SERDES 64b/66b Decoder IN*3P/N TX CTC IN*2P/N Data Width 64_32 56–59 1–7x33: depth 8 (ctc off) 3–9x33: depth 12 3–13x33: depth 16 4–20x33: depth 24 4–28x33: depth 32 132 132 66 8b/10b Decoder AKR Checker IN*1P/N 297-363 XAUI Lane Algin AKR Processor IN*0P/N 69–99 Loopback / Retime 33 www.ti.com } LS PRBS Verifier Channel Sync SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 *35x65 if no uncorrectable error indication to PCS 67x66 if uncorrectable error is indicated to PCS HighSpeed Side SERDES HSRX*P/N 80–83 HS PRBS Verifier TX, FEC bypassed, CTC depth 12: 1140–1473 UI (111 ns–143 ns) NOTE: TX Latency numbers represent no external skew between lanes. External lane skew will increase overall latency. RX, FEC bypassed, CTC depth 12: 772–107 UI (76 ns–104 ns) Figure 5-10. 10GBASE-KR Mode Latency Per Block 5.3.2 1GBASE-KX Mode 5.3.2.1 Sync 1 GX Block This block is used to align the deserialized signals to the proper 10-bit word boundaries. The Sync 1 GX block generates a synchronization flag indicating incoming data is synchronized to the correct bit boundary. This module implements the synchronization state machine found in Figure 36-9 of the IEEE 802.3-2008 Standard. A synchronization status signal, latched low, is available to indicate synchronization errors. 5.3.2.2 8b/10b Encoder and Decoder Blocks As in the 10GBASE-KR operating mode, these blocks are used to convert between 10-bit (encoded) data and 8-bit data words. They can be optionally bypassed. A code invalid signal, latched low, is available to indicate 8b/10b encode and decode errors. 5.3.2.3 RX PCS This block implements the PCS receive function for Gigabit Ethernet mode as defined in Clause 36. It operates on decoded characters. This block can also be bypassed. 32 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com 5.3.2.4 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 TX CTC The transmit clock tolerance compensation (CTC) block acts as a FIFO with add and delete capabilities, adding and deleting 2 cycles each time to support ±200ppm during IFG (no errors) between the read and write clocks. This block implements a 12 deep asynchronous FIFO with a usable space 8 deep. It has two separate pointer tracking systems. One determines when to delete or insert and another determines when to reset. Inserts and deletes are only allowed during non-errored inter-frame gaps and occurs 2 cycles at a time. It has an auto reset feature once collision occurs. If a collision occurs, the indication is latched high until read by MDIO. 5.3.2.5 TX PCS The TX PCS block implements the PCS Transmit ordered_set and transmit code_group FSMs as specified in Clause 36. This block can be bypassed. 5.3.2.6 Test Pattern Generator In 1G-KX mode, this block can be used to generate test patterns allowing the 1G-KX channel to be tested for compliance while in a system environment or for diagnostic purposes. Test patterns generated are high/low/mixed frequency and CRPAT long or short. 5.3.2.7 Test Pattern Verifier The 1G-KX test pattern verifier performs the verification and error reporting for the CRPAT Long and Short test patterns specified in Annex 36A of the IEEE 802.3-2002 standard. Errors are reported to MDIO registers. 5.3.2.8 1GBASE-KX Line Rate, PLL Settings, and Reference Clock Selection When the TLK10034 is configured to operate in the 1GBASE-KX mode, the available line rates, reference clock frequencies, and corresponding PLL multipliers are summarized in Table 5-2. Table 5-2. Specific Line Rate and Reference Clock Selection for the 1GBASE-KX Mode LOW SPEED SIDE SERDES PLL Multiplier Rate REFCLKP/N (MHz) Line Rate (Mbps (1) ) SERDES PLL Multiplier Rate REFCLKP/N (MHz) 3125 (2) 10 Full 156.25 3125 (2) 16.5 Full 156.25 (2) 3125 (1) (2) HIGH SPEED SIDE Line Rate (Mbps) (2) 5 Full 312.5 8.25 Full 312.5 1250 10 Half 125 (2) 3125 1250 20 Quarter 125 (2) 1250 8 Half 156.25 1250 16 Quarter 156.25 1250 8 Quarter 312.5 1250 8 Quarter 312.5 High Speed Side SERDES runs at 2x effective data rate. Manual mode only, as auto negotiate does not support 125Mhz REFCLK or line rate of 3125Mbps. To disable automatic setting of PLL and rate modes, write 1'b1 to bit 13 of register 0x1E.001D. 5.3.2.9 1GBASE-KX Mode Latency The latency through the TLK10034 in 1G-KX mode is as shown in Figure 5-11. Note that the latency ranges shown indicate static rather than dynamic latency variance, i.e., the range of possible latencies when the serial link is initially established. During normal operation, the latency through the device is fixed. Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 33 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com Figure 5-11. 1G-KX Mode Latency 5.3.3 General Purpose (10G) SerDes Mode 5.3.3.1 General Purpose SERDES Transmit Data Path The TLK10034 General Purpose SERDES low speed to high speed (transmit) data path with the device configured to operate in the normal transceiver (mission) mode is shown in the upper half of Figure 5-33. In this mode, 8B/10B encoded serial data (IN*P/N) in 2 or 4 lanes is received by the low speed side SERDES and deserialized into 10-bit parallel data for each lane. The data in each individual lane is then byte aligned (channel synchronized) and then 8B/10B decoded into 8-bit parallel data for each lane. The lane data is then lane aligned by the Lane Alignment Slave. 32-bits of lane aligned parallel data is subsequently fed into a transmit FIFO which delivers it to an 8B/10B encoder, 16 data bits at a time. The resulting 20-bit 8B/10B encoded parallel data is sent to the high speed side SERDES for serialization and output through the HSTX*P/N pins. 34 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com 5.3.3.2 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 General Purpose SERDES Receive Data Path With the device configured to operate in the normal transceiver (mission) mode, the high speed to low speed (receive) data path is shown in the lower half of Figure 5-33. 8B/10B encoded serial data (HSRX*P/N) is received by the high speed side SERDES and deserialized into 20-bit parallel data. The data is then byte aligned, 8B/10B decoded into 16-bit parallel data, and then delivered to a receive FIFO. The receive FIFO in turn delivers 32-bit parallel data to the Lane Alignment Master which splits the data into the same number of lanes as configured on the transmit data path. The lane data is then 8B/10B encoded and the resulting 10-bit parallel data for each lane is fed into the low speed side SERDES for serialization and output through the OUT*P/N pins. This process is exactly the same for all the channels (A, B, C, and D). 5.3.3.3 Channel Synchronization As in the 10GBASE-KR mode, the channel synchronization block is used in the 10G General Purpose SERDES mode to align received serial data to a defined byte boundary. The channel synchronization block detects the comma pattern found in the K28.5 character, and follows the synchronization flowchart shown in Figure 5-3. 5.3.3.4 8B/10B Encoder and Decoder As in the 10GBASE-KR and 1GBASE-KX modes, the 8B/10B encoder and decoder blocks are used to convert between 10-bit (encoded) and 8-bit (unencoded) data words. 5.3.3.5 Lane Alignment Scheme for 8b/10b General Purpose Serdes Mode (Non XAUI Fata, - No /A/) Lower rate multi-lane serial signals per channel must be byte aligned and lane aligned such that high speed multiplexing (proper reconstruction of higher rate signal) is possible. For that reason, the TLK10034 implements a special lane alignment scheme on the low speed (LS) side for 8b/10b data that does not contain XAUI alignment characters. During lane alignment, a proprietary pattern (or a custom comma compliant data stream) is sent by the LS transmitter to the LS receiver on each active lane. This pattern allows the LS receiver to both delineate byte boundaries within a lower speed lane and align bytes across the lanes (2 or 4) such that the original higher rate data ordering is restored. Lane alignment completes successfully when the LS receiver asserts a “Link Status OK” signal monitored by the LS transmitter on the link partner device such as an FPGA. The TLK10034 sends out the “Link Status OK” signals through the LS_OK_OUT_A/B/C/D output pins, and monitors the “Link Status OK” signals from the link partner device through the LS_OK_IN_A/B/C/D input pins. If the link partner device does not need the TLK10034 LAM to send proprietary lane alignment pattern, LS_OK_IN_A/B/C/D can be tied high on the application board or set through MDIO register bits. The lane alignment scheme is activated under any of the following conditions: • Device/System power up (after configuration/provisioning) • Loss of channel synchronization assertion on any enabled LS lane • Loss of signal assertion on any enabled LS lane • LS SERDES PLL Lock indication deassertion • After software determined LS 8B/10B decoder error rate threshold exceeded • After device reset is deasserted • Any time the LS receiver deasserts “Link Status OK”. • Presence of reoccurring higher level / protocol framing errors All the above conditions are selectable through MDIO register provisioning. The block diagram of the lane alignment scheme is shown in Figure 5-12. Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 35 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Protocol Device www.ti.com (Channel A Only ) TLK10034 (Channel A Only ) LS _OK_ OUT _A LAM Lane Alignment Master 8B à 10B 8B à 10B SYNC 10Bà8B SYNC 10Bà8B SYNC 10Bà8B SYNC 10Bà8B INA[3:0]P/N 8B à 10B 8B à 10B Lane Align LAS Lane Alignment Slave Low Speed Side SERDES Channel A (4R/4T) Low Speed Side SERDES Channel A (4RX/4TX) 8B ß 10B SYNC 8B ß 10B SYNC 8B ß 10B SYNC 10B ß 8B 8B ß 10B SYNC 10B ß 8B LAS Lane Alignment Slave OUTA[3:0]P/N Lane Align 10B ß 8B 10B ß 8B LAM Lane Alignment Master LS _OK _IN_A Figure 5-12. Block Diagram of the Lane Alignment Scheme 5.3.3.6 • • 5.3.3.7 Lane Alignment Components Lane Alignment Master (LAM) – Responsible for generating proprietary LS lane alignment initialization pattern – Resides in the TLK10034 receive path (one instance per channel) • Responsible for bringing up LS receive link for the data sent from the TLK10034 to a link partner device • Monitors the LS_OK_IN pins for Link Status OK signals sent from the Lane Alignment Slave (LAS) of the link partner device – Resides in the link partner device (one instance per channel) • Responsible for bringing up LS transmit link for the data sent from the link partner device to the TLK10034 • Monitors the Link Status OK signals sent from the LS_OK_OUT pins of the Lane Alignment Slave (LAS) of the TLK10034 Lane Alignment Slave (LAS) – Responsible for monitoring the LS lane alignment initialization pattern – Performs channel synchronization per lane (2 or 4 lanes) through byte rotation – Performs lane alignment and realignment of bytes across lanes – Resides in the TLK10034 transmit path (one instance per channel) • Generates the Link Status OK signal for the LAM on the link partner device – Resides in the link partner device (one instance per channel) • Generates the Link Status OK signal for the LAM on the TLK10034 device. Lane Alignment Operation (General Purpose Serdes Mode) During lane alignment, the LAM sends a repeating pattern of 49 characters (control + data) simultaneously across all enabled LS lanes. These simultaneous streams are then encoded by 8B/10B encoders in parallel. The proprietary lane alignment pattern consists of the following characters: /K28.5/ (CTL=1, Data=0xBC) Repeat the following sequence of 12 characters four times: /D30.5/ (CTL=0, Data=0xBE) /D23.6/ (CTL=0, Data=0xD7) 36 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 /D3.1/ (CTL=0, Data=0x23) /D7.2/ (CTL=0, Data=0x47) /D11.3/ (CTL=0, Data=0x6B) /D15.4/ (CTL=0, Data=0x8F) /D19.5/ (CTL=0, Data=0xB3) /D20.0/ (CTL=0, Data=0x14) /D30.2/ (CTL=0, Data=0x5E) /D27.7/ (CTL=0, Data=0xFB) /D21.1/ (CTL=0, Data=0x35) /D25.2/ (CTL=0, Data=0x59) The above 49-character sequence is repeated until LS_OK_IN is asserted. Once LS_OK_IN is asserted, the LAM resumes transmitting traffic received from the high speed side SERDES immediately. The TLK10034 performs lane alignment across the lanes similar in fashion to the IEEE 802.3-2008 (XAUI) specification. XAUI only operates across 4 lanes while LAS operates with 2 or 4 lanes. The lane alignment state machine is shown in Figure 5-13. The TLK10034 uses the comma (K28.5) character for lane to lane alignment by default, but can be provisioned to use XAUI's /A/ character as well. Lane alignment checking is not performed by the LAS after lane alignment is achieved. After LAM detects that the LS_OK_IN signal is asserted, normal system traffic is carried instead of the proprietary lane alignment pattern. Channel synchronization is performed during lane alignment and normal system operation. Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 37 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com Hard or Soft Reset Loss of Lane Alignment (enable deskew) Deassert LS_OK /C/ & CH_SYNC? no Align Detect 3 yes any deskew_err !deskew_err & /C/ no Align Detect 1 (disable deskew) yes any deskew_err !deskew_err & /C/ Lane Aligned (Assert LS_OK) no yes yes Align Detect 2 any deskew_err !deskew_err & /C/ no Any Lane Realign Conditions? no /C/ = Character matched In All Enabled Lanes deskew_err = Character matched in any lane, but not in all lanes at same time yes CH_SYNC = Channel Sync Asserted All Lanes Figure 5-13. Lane Alignment State Machine 38 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com 5.3.3.8 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Line Rate, SERDES PLL Settings, and Reference Clock Selection for the General Purpose SERDES Mode When the TLK10034 is set to operate in the General Purpose SERDES mode, the following tables show a summary of line rates and reference clock frequencies used for CPRI/OBSAI for 1:1, 2:1 and 4:1 operation modes. Table 5-3. Specific Line Rate Selection for the 1:1 General Purpose Operation Mode LOW SPEED SIDE Line Rate (Mbps) HIGH SPEED SIDE SERDES PLL Multiplier Rate REFCLKP/N (MHz) SERDES PLL Multiplier Rate REFCLKP/N (MHz) Line Rate (Mbps) 4915.2 20 Full 122.88 4915.2 20 Half 122.88 3840 12.5 Full 153.6 3840 12.5 Half 153.6 3125 10 Full 156.25 3125 10 Half 156.25 3125 5 Full 312.5 3125 5 Half 312.5 3072 10 Full 153.6 3072 10 Half 153.6 2457.6 8/10 Full 153.6/122.88 2457.6 16/20 Quarter 153.6/122.88 1920 12.5 Half 153.6 1920 12.5 Quarter 153.6 1536 10 Half 153.6 1536 10 Quarter 153.6 1228.8 8/10 Half 153.6/122.88 1228.8 16/20 Eighth 153.6/122.88 Table 5-4. Specific Line Rate and Reference Clock Selection for the 2:1 General Purpose Operation Mode LOW SPEED SIDE HIGH SPEED SIDE SERDES PLL Multiplier Rate REFCLKP/N (MHz) 9830.4 20 Full 122.88 7680 12.5 Full 153.6 153.6 6144 10 Full 153.6 Full 153.6/122.88 4915.2 16/20 Half 153.6/122.88 12.5 Half 153.6 3840 12.5 Half 153.6 10 Half 153.6 3072 10 Half 153.6 8/10 Half 153.6/122.88 2457.6 16/20 Quarter 153.6/122.88 768 10 Quarter 153.6 1536 10 Quarter 153.6 614.4 8/10 Quarter 153.6/122.88 1228.8 16/20 Eighth 153.6/122.88 Line Rate (Mbps) SERDES PLL Multiplier Rate REFCLKP/N (MHz) Line Rate (Mbps) 4915.2 20 Full 122.88 3840 12.5 Full 153.6 3072 10 Full 2457.6 8/10 1920 1536 1228.8 Table 5-5. Specific Line Rate and Reference Clock Selection for the 4:1 General Purpose Operation Mode LOW SPEED SIDE HIGH SPEED SIDE Rate REFCLKP/N (MHz) Line Rate (Mbps) SERDES PLL Multiplier 8/10 Full 153.6/122.88 9830.4 16/20 Full 153.6/122.88 10 Half 153.6 6144 10 Full 153.6 8/10 Half 153.6/122.88 4915.2 16/20 Half 153.6/122.88 10 Quarter 153.6 3072 10 Half 153.6 8/10 Quarter 153.6/122.88 2457.6 16/20 Quarter 153.6/122.88 Line Rate (Mbps) SERDES PLL Multiplier 2457.6 1536 1228.8 768 614.4 Rate REFCLKP/N (MHz) Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 39 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com Table 5-3, Table 5-4, and Table 5-5 indicate two possible reference clock frequencies for CPRI/OBSAI applications: 153.6MHz and 122.88MHz, which can be used based on the application preference. The SERDES PLL Multiplier (MPY) has been given for each reference clock frequency respectively. For each channel, the low speed side and the high speed side SERDES use the same reference clock frequency. Note that Channel A, B, C and D are independent and their application rates and references clocks are separate. For other line rates not shown in Table 5-3, Table 5-4, or Table 5-5, valid reference clock frequencies can be selected with the help of the information provided in Table 5-6 and Table 5-7 for the low speed and high speed side SERDES. The reference clock frequency has to be the same for the two SERDES and must be within the specified valid ranges for different PLL multipliers. Table 5-6. Line Rate and Reference Clock Frequency Ranges for the Low Speed Side SERDES (General Purpose Mode) FULL RATE (Gbps) HALF RATE (Gbps) MIN MAX MIN MAX MIN MAX MIN 4 250 425 2 3.4 1 1.7 0.5 0.85 5 200 425 2 4.25 1 2.125 0.5 1.0625 6 166.667 416.667 2 5 1 2.5 0.5 1.25 SERDES PLL MULTIPLIER (MPY) REFERENCE CLOCK (MHz) QUARTER RATE (Gbps) MAX 8 125 312.5 2 5 1 2.5 0.5 1.25 10 122.88 250 2.4576 5 1.2288 2.5 0.6144 1.25 12 122.88 208.333 2.94912 5 1.47456 2.5 0.73728 1.25 12.5 122.88 200 3.072 5 1.536 2.5 0.768 1.25 15 122.88 166.667 3.6864 5 1.8432 2.5 0.9216 1.25 20 122.88 125 4.9152 5 2.4576 2.5 1.2288 1.25 RateScale: Full Rate = 0.5, Half Rate = 1, Quarter Rate = 2 Table 5-7. Line Rate and Reference Clock Frequency Ranges for the High Speed Side SERDES (General Purpose Mode) SERDES PLL MULTIPLIER (MPY) REFERENCE CLOCK (MHz) FULL RATE (Gbps) HALF RATE (Gbps) QUARTER RATE (Gbps) MIN MAX MIN MAX MIN MAX MIN MAX 4 375 425 6 6.8 3 3.4 1.5 1.7 5 300 425 6 8.5 3 4.25 1.5 6 250 416.667 6 10 3 5 1.5 8 187.5 312.5 6 10 3 5 10 150 250 6 10 3 12 125 208.333 6 10 12.5 153.6 200 7.68 15 122.88 166.667 16 122.88 20 122.88 EIGHTH RATE (Gbps) MIN MAX 2.125 1.0 1.0625 2.5 1.0 1.25 1.5 2.5 1.0 1.25 5 1.5 2.5 1.0 1.25 3 5 1.5 2.5 1.0 1.25 10 3.84 5 1.92 2.5 1.0 1.25 7.3728 10 3.6864 5 1.8432 2.5 1.0 1.25 156.25 7.86432 10 3.932 5 1.966 2.5 1.0 1.25 125 9.8304 10 4.9152 5 2.4576 2.5 1.2288 1.25 RateScale: Full Rate = 0.25, Half Rate = 0.5, Quarter Rate = 1, Eighth Rate = 2 For example, in the 2:1 operation mode, if the low speed side line rate is 1.987Gbps, the high-speed side line rate will be 3.974Gbps. The following steps can be taken to make a reference clock frequency selection: 1. Determine the appropriate SERDES rate modes that support the required line rates. Table 5-6 shows that the 1.987Gbps line rate on the low speed side is only supported in the half rate mode (RateScale = 1). Table 5-7 shows that the 3.974Gbps line rate on the high speed side is only supported in the half rate mode (RateScale = 1). 2. For each SERDES side, and for all available PLL multipliers (MPY), compute the corresponding reference clock frequencies using the formula: Reference Clock Frequency = (LineRate x RateScale)/MPY 40 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 The computed reference clock frequencies are shown in Table 5-8 along with the valid minimum and maximum frequency values. 3. Mark all the common frequencies that appear on both SERDES sides. Note and discard all those that fall outside the allowed range. In this example, the common frequencies are highlighted in Table 5-8. The highest and lowest computed reference clock frequencies must be discarded because they exceed the recommended range. 4. Select any of the remaining marked common reference clock frequencies. Higher reference clock frequencies are generally preferred. In this example, any of the following reference clock frequencies can be selected: 397.4MHz, 331.167MHz, 248.375MHz, 198.7MHz, 165.583MHz, 158.96MHz, and 132.467MHz Table 5-8. Reference Clock Frequency Selection Example LOW SPEED SIDE SERDES HIGH SPEED SIDE SERDES REFERENCE CLOCK FREQUENCY (MHz) REFERENCE CLOCK FREQUENCY (MHz) SERDES PLL MULTIPLIER COMPUTED MIN MAX SERDES PLL MULTIPLIER COMPUTED MIN MAX 4 496.750 250 425 4 496.750 375 425 5 397.400 200 425 5 397.400 300 425 6 331.167 166.667 416.667 6 331.167 250 416.667 8 248.375 125 312.5 8 248.375 187.5 312.5 10 198.700 122.88 250 10 198.700 150 250 12 165.583 122.88 208.333 12 165.583 125 208.333 12.5 158.960 122.88 200 12.5 158.960 153.6 200 15 132.467 122.88 166.667 15 132.467 122.88 166.667 20 99.350 122.88 125 20 99.350 122.88 125 5.3.3.9 General Purpose (10G) Loopback Modes In General Purpose (10G) mode, the TLK10034 supports looping back of data on both the LS (local) side and HS (remote) side. The loopback point can be chosen to be either prior to serialization (shallow) or after serialization (deep). The various loopback modes can be activated and configured through the MDIO interface. The datapath for deep remote loopback mode is shown in Figure 5-14. The data is accepted on the high speed side receive SERDES pins (HSRX*P/N), traverses the entire receive data path, is returned through the entire transmit data path and sent out through the high speed side transmit SERDES pins (HSTX*P/N). The low speed side outputs on OUT*P/N pins are still available for monitoring and should be correctly terminated. The low speed side inputs on IN*P/N should be electrically idle (floating). Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 41 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com 8B/1 0B Encoder Lane Align Master Low Speed Side SERDES OU T*0P/N OUT*1P/N OUT*2P/N OUT*3P/N LS PRBS Generator 8B/1 0B Encoder TX FIFO RX FIFO HSTX *P /N High Speed Side SERDES 8B/1 0B Decoder Cha nnel S ync IN*3P/N Pattern Verifier IN*2P/N HS PRBS Generator Pattern Generator IN*0 P/N IN*1P/N 8B/10B Dec oder La ne Align Slave Channel Sync LS PRBS Verifier HSRX*P/N HS PRBS Verifier Figure 5-14. Deep Remote Loopback for the General Purpose SERDES Mode Note that in deep remote loopback mode, the the LS serial transmitter is internally connected directly to the LS serial receiver. This short, low-loss interconnect will have different properties than a typical PCB interconnect, so different transmit and receive link settings should be used to optimize BER. The datapath for shallow remote loopback mode is shown in Figure 5-15. In this mode, the device functions as a high speed serial retimer. The data is accepted on the high speed side receive SERDES pins (HSRX*P/N), traverses the receive data path up to the LS SERDES, and is looped back through the transmit data path to be sent out through the high speed side transmit SERDES pins (HSTX*P/N). In shallow remote loopback mode, the low speed side transmit path SERDES can be optionally enabled or disabled, but the PLL needs to be enabled to provide the required clock. The low speed side outputs on OUTA*P/N pins are available for monitoring and must be correctly terminated. The internal LAS’s link status is automatically routed to the LAM so that lane alignment can take place. OUT*0P/N OUT*1P/N OUT*2P/N OUT*3P/N LS PRBS Generator 8B/1 0B Encoder TX FIFO RX FIFO HSTX *P /N High Speed Side SERDES 8B/1 0B Decoder Cha nnel S ync Low Speed Side SERDES Pattern Verifier IN*3P/N HS PRBS Generator Pattern Generator IN*1P/N IN*2P/N 8B/10B Dec oder La ne Align Slave IN*0 P/N 8B/1 0B Encoder Lane Align Master Channel Sync LS PRBS Verifier HSRX*P/N HS PRBS Verifier Figure 5-15. Shallow Remote Loopback for the General Purpose SERDES Mode The datapath for deep local loopback mode is shown in Figure 5-16. Data is accepted on the low speed side SERDES pins (IN*P/N), traverses the entire transmit data path, is returned through the entire receive data path to be sent out through the low speed side receive SERDES pins (OUT*P/N). Note that lane alignment still must occur before passing traffic. The high speed side outputs on the HSTX*P/N pins are available for monitoring. The high speed side inputs on HSRX*P/N should be electrically idle (floating). 42 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 OUT*0P/N OUT*1P/N OUT*2P/N OUT*3P/N LS PRBS Generator 8B/1 0B Encoder TX FIFO RX FIFO HSTX *P /N High Speed Side SERDES 8B/1 0B Decoder Cha nnel S ync Low Speed Side SERDES Pattern Verifier IN*3P/N HS PRBS Generator Pattern Generator IN*2P/N 8B/10B Dec oder La ne Align Slave IN*0 P/N IN*1P/N 8B/1 0B Encoder Lane Align Master Channel Sync LS PRBS Verifier HSRX*P/N HS PRBS Verifier Figure 5-16. Deep Local Loopback for the General Purpose SERDES Mode Note that in deep local loopback mode, the the HS serial transmitter is internally connected directly to the HS serial receiver. This short, low-loss interconnect will have different properties than a typical PCB interconnect, so different transmit and receive link settings should be used to optimize BER. In shallow local loopback mode, the data is accepted on the low speed side SERDES pins (IN*P/N), traverses the transmit data path up to the HS SERDES, is looped back before through the receive data path, and sent out through the low speed side receive SERDES pins (OUT*P/N). The high speed side outputs on HSRX*P/N pins are available for monitoring. 5.3.3.10 General Purpose (10G) Latency Measurement Function The TLK10034 includes a latency measurement function to support CPRI and OBSAI type applications. There are two start and two stop locations for the latency counter as shown in Figure 5-17 for Channel A. The start and stop locations are selectable through MDIO register bits. The elapsed time from a comma detected at an assigned counter start location of a particular channel to a comma detected at an assigned counter stop location of the same channel is measured and reported through the MDIO interface. The function may operate independently on each channel. The following three control characters (containing commas) are monitored: 1. K28.1 (control = 1, data = 0x3C) 2. K28.5 (control = 1, data = 0xBC) 3. K28.7 (control = 1, data = 0xFC). The first comma found at the assigned counter start location will start up the latency counter. The first comma detected at the assigned counter stop location will stop the latency counter. The 20-bit latency counter result of this measurement is readable through the MDIO interface. The accuracy of the measurement is a function of the serial bit rate at which the channel being measured is operating. The register will return a value of 0xFFFFF if the duration between transmit and receive comma detection exceeds the depth of the counter. Only one measurement value is stored internally until the 20-bit results counter is read. The counter will return zero in cases where a transmit comma was never detected (indicating the results counter never began counting). It is also possible to start and stop the counter using the PRTAD1 pin. This allows the stopwatch circuit to be triggered from an external device such as the low speed side link partner. For a detailed description of the latency measurement procedure, please refer to the application note TLK10034 Latency Measurement Function. Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 43 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 10 10 LS PRBS Generator OUTA3P/N 10 10 Stop Counter 20 10 10 Receive Data Path Covered Start Counter 10 10 32 16 RX FIFO HS PRBS Generator HSTXAP /N High Speed Side SERDES Transmit Data Path Covered Latency Counter 8B/10 B Encode r Lane Align Ma ster 10 16 Pattern 16 Generator Stop Counter OUTA0P/N OUTA2P/N 10 Start Counter Low Speed Side SERDES OUTA1P/N 10 TX FIFO 16 8 B/10B Encoder INA2P/N INA3P/N 10 32 8B/10B Dec oder Channel Sync 10 Channel A 8B/10B Dec oder La ne Align Slave 10 10 Comma Detec tion for Latency Measurement INA1P/N LS PRBS Verifier Channe l Sync 10 INA0P/N www.ti.com 20 HS PRBS Verifier HSRXAP /N Pattern Verifier Figure 5-17. Location of TX and RX Comma Character Detection (Only Channel A Shown) In high speed side SERDES full rate mode, the latency measurement function runs off of an internal clock which is equal to the frequency of the transmit serial bit rate divided by 8. In half rate mode, the latency measurement function runs off of an internal clock which is equal to the serial bit rate divided by 4. In quarter rate mode, the latency measurement function runs off of an internal clock which is equal to the serial bit rate divided by 2. In eighth rate mode, the latency measurement function runs off of a clock which is equal to the serial bit rate. The latency measurement does not include the low speed side transmit SERDES contribution as well as part of the channel synchronization block. The latency introduced by those two is up to (18 + 10) x N high speed side unit intervals (UIs), where N = 2, 4 is the multiplex factor. The latency measurement also doesn’t account for the low speed side receive SERDES contribution which is estimated to be up to 20 x N high speed side UIs. The latency measurement accuracy in all cases is equal to plus or minus one latency measurement clock period. The measurement clock can be divided down if a longer duration measurement is required, in which case the accuracy of the measurement is accordingly reduced. The high speed latency measurement clock is divided by either 1, 2, 4, or 8 via register settings. The measurement clock used is always selected by the channel under test. The high speed latency measurement clock may only be used when operating at one of the serial rates specified in the CPRI/OBSAI specifications. It is also possible to run the latency measurement function off of the recovered byte clock for the channel under test (giving a latency measurement clock frequency equal to the serial bit rate divided by 20). The accuracy for the standard based CPRI/OBSAI application rates is shown in Table 5-9, and assumes the latency measurement clock is not divided down per user selection (division is required to measure a duration greater than 682us). For each division of 2 in the measurement clock, the accuracy is also reduced by a factor of two. 44 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Table 5-9. CPRI/OBSAI Latency Measurement Function Accuracy (Undivided Measurement Clock) RATE LATENCY CLOCK FREQUENCY (GHz) ACCURACY (± ns) 1.2288 Eighth 1.2288 0.8138 1.536 Quarter 0.768 1.302 2.4576 Quarter 1.2288 0.8138 3.072 Half 0.768 1.302 3.84 Half 0.96 1.0417 4.9152 Half 1.2288 0.8138 6.144 Full 0.768 1.302 7.68 Full 0.96 1.0417 9.8304 Full 1.2288 0.8138 LINE RATE (Gbps) 5.3.3.11 General Purpose (10G) Mode Latency The latency through the TLK10034 in general purpose (10G) mode is as shown in Figure 5-18. Note that the latency ranges shown indicate static rather than dynamic latency variance, i.e., the range of possible latencies when the serial link is initially established. During normal operation, the latency through the device is fixed. Figure 5-18. General Purpose Mode Latency Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 45 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com Table 5-10. RX FIFO Latency in 4LN Mode RX FIFO TYPE FIFO_DEPTH_SEL MIN LATENCY (UI) MAX LATENCY (UI) REGULAR FIFO (No CTC) 4 100 220 RATE MATCH FIFO (No CTC) 8 40 280 12 120 360 16 120 520 24 160 800 32 160 1120 RATE MATCH FIFO (With CTC) Table 5-11. RX FIFO Latency in 2LN Mode RX FIFO TYPE FIFO_DEPTH_SEL MIN LATENCY (UI) MAX LATENCY (UI) REGULAR FIFO (No CTC) 4 40 100 RATE MATCH FIFO (No CTC) 8 20 140 12 60 180 16 60 260 24 80 400 32 80 560 RATE MATCH FIFO(With CTC 5.3.3.12 TLK10034 Clocks: REFCLK, CLKOUT 5.3.3.12.1 General Information The TLK10034 device requires a low-jitter reference clock to work. The reference clock can be provided on the REFCLK0P/N or REFCLK1P/N pins. Both reference clock input pins have internal 100-Ω differential terminations, so they do not need any external terminations. Both reference clock inputs must be AC-coupled with preferably 0.1-uF capacitors. The two channels (A and B) can have same or different reference clocks. Refer to the TLK10034 datasheet for more information on reference clock selection and jitter requirements. The TLK10034 serial receiver recovers clock and data from the incoming serial data. The recovered byte clock is made available on the CLKOUTAP/N and/or CLKOUTBP/N pins. The CLKOUTxP/N CML output pins must be AC-coupled with 0.1-uF AC-coupling capacitors. 5.3.3.13 TLK10034 Control Pins and Interfaces The TLK10034 device features a number of control pins and interfaces, some of which are described below. 5.3.3.14 MDIO Interface The TLK10034 supports the Management Data Input/Output (MDIO) Interface as defined in Clause 22 of the IEEE 802.3 Ethernet specification. The MDIO allows register-based management and control of the serial links. The MDIO Management Interface consists of a bi-directional data path (MDIO) and a clock reference (MDC). The port address is determined by the PRTAD[4:0] control pins. The MDIO pin requires a pullup to VDDO[1:0]. No pullup is needed on the MDC pin if driven with a pushpull MDIO master, but a pullup to VDDO[1:0] is needed if driven with an open-drain MDIO master. 5.3.3.15 JTAG Interface The JTAG interface is mostly used for device test. The JTAG interface operates through the TDI, TDO, TMS, TCK, and TRST_N pins. If not used, all the pins can be left unconnected except TDI and TCK which have to be grounded. 46 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 5.3.3.16 Unused Pins As a general guideline, any unused LVCMOS input pin needs to be grounded and any unused LVCMOS output pin can be left unconnected. Unused CML differential output pins can be left unconnected. Unused CML differential input pins should be tied to ground through a shared 100-Ω resistor. 5.3.4 Provisionable XAUI Clock Tolerance Compensation The XAUI interface is defined to allow for separate clock domains on each side of the link. Though the reference clocks for two devices on a XAUI/KR link have the same specified frequencies, there are slight differences that, if not compensated for, will lead to over or under run of the FIFOs on the receive/transmit data paths. The XAUI CTC block performs the clock domain transition and rate compensation by utilizing a FIFO that is 32 deep and 40-bits wide. The usable FIFO size in the RX and TX directions is dependent upon the RX_FIFO_DEPTH and TX_FIFO_DEPTH MDIO fields, respectively. The word format is illustrated in Figure 5-19. data_ln0_in[8:0] lane 0 ctrl[0] data_ln1_in[8:0] lane 1 ctrl[1] data_ln2_in[8:0] lane 2 data_ln3_in[8:0] ctrl[2] 0 lane 3 ctrl[3] 39 Figure 5-19. XAUI CTC FIFO Word Format The XAUI CTC performs one of the following operations to compensate the clock rate difference: 1. Delete Idle column from the data stream 2. Delete Sequence column from the data stream (enabled via MDIO) 3. Insert Idle column to the data stream. The following rules apply for insertion/removal: • Idle insertion/deletion occurs in groups of 4 idle characters (i.e., in columns) • Idle characters are added following Idle or Sequence ordered_set • Idle characters are not added while data is being received • When deleting Idle characters, minimum IPG of 5 characters is maintained. /T/ characters are counted towards IPG. • The first Idle column after /T/ is never deleted • Sequence ordered_sets are deleted only when two consecutive Sequence columns are received. In this case, only one of the two Sequence columns will be deleted. Insertion: When the FIFO fill level is at or below LOW watermark (insertion is triggered), the XAUI CTC needs to insert an IDLE column. It does so by skipping a read from the FIFO and inserting IDLE column to the data stream. It continues the insertion until the FIFO fill level is above the mid point. This occurs on the read side of the FIFO. Removal: When the FIFO fill level is at or above HIGH watermark (deletion is triggered), the XAUI CTC needs to remove an IDLE column. It does so by skipping a write to the FIFO and discarding the IDLE column or Sequence ordered_set. It continues the deletion until the FIFO fill level is below the mid point. This occurs on the write side of the FIFO. On the write side of the XAUI CTC FIFO a 40-bit write is performed at every cycle of the 312.5 MHz clock except during removal when it discards the IDLE or sequence ordered_set. On the read side of the XAUI CTC FIFO a 40-bit read is performed at every cycle of the 312.5 MHz clock except during insertion when it generates IDLE columns to the output while not reading the FIFO at all. Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 47 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com In IEEE 802.3ae the XAUI clock rate tolerance is given as 3.125 GHz ± 100 ppm, the XGMII clock rate tolerance is given as 156.25 MHz ± 0.02% (which is equivalent to 200ppm), and the Jumbo packet size is 9600 bytes which is equivalent to 2400 cycles of 312.5 MHz clock. The average inter-frame gap is 12 bytes (3 columns), which implies that there is one opportunity to insert/delete a column in between every packet on average. This gives one column deletion/insertion in every 2400 columns which results in a 400 ppm tolerance capability. If the IPG increases, then more clock rate variance or larger packet size can be supported. Note that the maximum frequency tolerance is limited by the frequency accuracy requirement of the reference clock. The number of words in the FIFO (fifo_depth[2:0]) and the HIGH/LOW watermark levels (wmk_sel[1:0]) are set through MDIO register 1.32769, and determine the allowable difference between the write clock and the read clock as well as the maximum packet size that can be processed without FIFO collision. At these watermarks the drop and insert start respectively and must happen before it hits overflow/underflow condition. Although the FIFO is supposed to never overflow/underflow given the average IPG, if it ever happens the overflow/underflow indications signal the error to the MDIO interface and the FIFO is reset. Note that the overflow/underflow status indications are latched high and cleared when read. Table 5-12Thshows XAUI CTC FIFO configuration and capabilities: wmk_sel[1:0] LOW Watermark HIGH Watermark Max Latency (Cycles) Nom Latency (Cycles) Min Latency (Cycles) Max pkt size (400ppm) Max pkt size (200ppm) Max pkt size (100ppm) Max pkt size (50ppm) 32 11 15 18 28 16 4 100KB 200KB 400KB 800KB 011 010 24 16 001 12 000 8 IPG to support the max pkt size FIFO Depth 1xx Min #of removable columns in fifo_depth[2:0] Table 5-12. XAUI CTC FIFO Configurations 10 10 13 20 28 16 4 80KB 160KB 320KB 640KB 8 01 10 23 28 16 4 50KB 100KB 200KB 400KB 5 00 6 27 28 16 4 10KB 20KB 40KB 80KB 1 11 11 14 20 12 4 60KB 120KB 240KB 480KB 6 10 9 16 20 12 4 40KB 80KB 160KB 320KB 4 0x 6 19 20 12 4 10KB 20KB 40KB 80KB 1 1x 7 10 13 8 3 30KB 60KB 120KB 240KB 3 0x 5 12 13 8 3 10KB 20KB 40KB 80KB 1 xx 5 8 9 6 3 10KB 20KB 40KB 80KB 1 7 4 1 Plain FIFO, No CTC default No limit on pkt size (needs 0 ppm to work) NOTE To support the max packet sizes as shown in Table 5-12, it is assumed that there are enough IDLE columns in IPG for deletion. Below is one example: Configure the FIFO to be 32-deep (fifo_depth[2:0] = 3’b1xx) and set the LOW/HIGH Watermarks to 10/23 (wmk_sel[1:0] = 2’b01). If the write clock is faster than the read clock by 200ppm, to support the max packet size of 100KB, a minimum of 5 removable columns in IPG is required (either IDLE columns or Sequence ordered_sets). If there are only 4 removable columns in IPG, the max packet size supported is dropped to 80KB. If there are only 3 removable columns in IPG, the max packet size supported is dropped to 60KB, and so on. As a rule of thumb, one removable column in IPG corresponds to 10KB at 400ppm, 20KB at 200ppm, 40KB at 100ppm, and 80KB at 50ppm 48 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Figure 5-20 through Figure 5-30 illustrate XAUI CTC FIFO configuration and capabilities. The green region (the middle of the FIFO fill level) indicates that the FIFO is operating stably without insertion or deletion. The more green bars in the figure, the more clock wander it can tolerate. The more yellow bars in the figure, the bigger packet size it can support. 32 words (fifo_depth=3'b1xx, wmk_sel=2'b00) 40 bits Underflow Drop Overflow Insert HIGH Watermark LOW Watermark Figure 5-20. Organization of the XAUI CTC FIFO (32-Deep, Low Watermark) 32 words (fifo_depth=3'b1xx, wmk_sel=2'b01) 40 bits Underflow Insert Drop Overflow HIGH Watermark LOW Watermark Figure 5-21. Organization of the XAUI CTC FIFO (32-Deep, Mid Watermark) Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 49 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com 32 words (fifo_depth=3'b1xx, wmk_sel=2'b10) 40 bits Underflow Insert Drop Overflow HIGH Watermark LOW Watermark Figure 5-22. Organization of the XAUI CTC FIFO (32-Deep, Mid-High Watermark) 32 words (fifo_depth=3'b1xx, wmk_sel=2'b11) 40 bits Underflow Insert Drop Overflow HIGH Watermark LOW Watermark Figure 5-23. Organization of the XAUI CTC FIFO (32-Deep, High Watermark) 50 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 24 words (fifo_depth=3'b011, wmk_sel=2'b0x) 40 bits Underflow Insert Drop LOW Watermark Overflow HIGH Watermark Figure 5-24. Organization of the XAUI CTC FIFO (24-Deep, Low Watermark) 24 words (fifo_depth=3'b011, wmk_sel=2'b10) 40 bits Underflow Insert Drop LOW Watermark Overflow HIGH Watermark Figure 5-25. Organization of the XAUI CTC FIFO (24-Deep, Mid Watermark) 24 words (fifo_depth=3'b011, wmk_sel=2'b11) 40 bits Underflow Insert Drop LOW Watermark Overflow HIGH Watermark Figure 5-26. Organization of the XAUI CTC FIFO (24-Deep, High Watermark) Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 51 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com 16 words (fifo_depth=3'b010 wmk_sel=2'b0x) 40 bits Underflow Insert Overflow Drop HIGH Watermark LOW Watermark Figure 5-27. Organization of the XAUI CTC FIFO (16-Deep, Low Watermark) 16 words (fifo_depth=3'b010 wmk_sel=2'b1x) 40 bits Underflow Insert LOW Watermark Overflow Drop HIGH Watermark Figure 5-28. Organization of the XAUI CTC FIFO (16-Deep, High Watermark) 52 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 12 words (ctc_depth=3'b001) 40 bits Underflow Insert Overflow Drop HIGH Watermark LOW Watermark Figure 5-29. Organization of the XAUI CTC FIFO (12-Deep) 8 words (ctc_depth=3'b000), no CTC 40 bits Underflow Overflow Figure 5-30. Organization of the XAUI CTC FIFO (8-Deep) 5.4 5.4.1 Device Functional Modes Operating Modes The TLK10034 is a versatile high-speed transceiver device that is designed to perform various physical layer functions in three operating modes: 10GBASE-KR Mode, 1G-KX Mode, and General Purpose (10G) SERDES Mode. The three modes are described in three separate sections. The device operating mode is determined by the MODE_SEL and ST pin settings, as well as bit MDIO bit 30.1.10. Table 5-13. TLK10034 Operating Mode Selection ST = 0 (Clause 45) ST = 1 (Clause 22) 10G {MODE_SEL pin, SW bit (30.1.10)} 1x 10G 01 10G 10G 00 10G-KR/1G-KX (Determined by Auto Neg) 1G-KX (No Auto Neg) Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 53 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 5.4.2 www.ti.com 10GBASE-KR Mode *3P OUT OUT*3N Training Serializer HSTX*N Scrambler Auto-Neg Gearbox 64b/66b Encoder TX CTC TX FEC 8b/10b decoder 8b/10b decoder 8b/10b decoder HSTX*P Deserializer Auto-Neg Gearbox 64b/66b Decoder 8b/10b encoder RX FEC Training 8b/10b decoder Descrambler serializer OUT*2N RX CTC serializer OUT*2P 8b/10b encoder OUT*1P OUT*1N XAUI_CODE_GEN serializer OUT*0N 8b/10b encoder serializer OUT*0P 8b/10b encoder IN*3P IN*3N ch_sync deserializer IN*2N XAUI Lane Alignmentent IN*2P ch_sync deserializer IN*1N ch_sync IN*1P ch_sync IN*0N deserializer IN*0P deserializer A simplified block diagram of the transmit and receive data paths in 10GBASE-KR mode is shown in Figure 5-31. This section gives a high-level overview of how data moves through these paths, then gives a more detailed description of each block’s functionality. HSRX*P HSRX*N Figure 5-31. A Simplified One Channel KR Data Path Block Diagram 5.4.3 1GBASE-KX Mode A simplified block diagram of the 1GBASE-KX data path is shown in Figure 5-32. 54 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 Serializer Encoder 10-bit 8b/10b TX_TPGEN TXPCS TX_CTC RXPCS 8b/10bdecoder IN*0N Sync_1gx IN*0P SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 deserializer www.ti.com HSTX*P HSTX*N Deserializer Sync_1gx 10-bit 8b/10b Decder RX_TPVER RX PCS RX CT TX PCS OUT*0N 8b/10b encoder OUT*0P serializ TX_TPVER HSRX*P HSRX*N RX_TPGEN Figure 5-32. A Simplified One Channel Block Diagram of the 1GKX Data Path 5.4.4 General Purpose (10G) SerDes Mode A block diagram showing the transmit and receive data paths of the TLK10034 operating in General Purpose (10G) SerDes mode is shown in Figure 5-33. Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 55 TLK10034 OUT*3P OUT*3N Serializer & PRBS gen 20-bit8b/10b Encoder TPGEN TX FIFO 1 lane TX FIFO 2 or 4-lane Comma Lane Alignment 8b/10b decoder 8b/10b decoder Deserializer & PRBS ver 20-bit ch_sync RX FIFO (1 lane) 8b/10b decoder 8b/10b decoder ch_sync ch_sync serializer & PRBS gen OUT*2N 20-bit 8b/10b Decoder OUT*2P HSTX*P HSTX*N HSRX*P HSRX*N TPVER OUT*1N RX FIFO (2 or 4-lane) OUT*1P Lane Alignment Gen OUT*0N 8b/10b ecoder OUT*0P 8b/10b ecoder IN*3N 8b/10b ecoder IN*3P www.ti.com 8b/10b ecoder IN*2N ch_sync IN*2P ch_sync IN*1N serializer serializer serializer & PRBS gen & PRBS gen & PRBS gen IN*1P deserializer deserializer & PRBS ver & PRBS ver IN*0N deserializer & PRBS ver IN*0P deserializer & PRBS ver SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Figure 5-33. Block Diagram Showing General Purpose SerDes Mode 5.5 5.5.1 Memory Clocking Architecture (All Modes) A simplified clocking architecture for the TLK10034 is captured in Figure 5-34. Each channel has an option of operating with a differential reference clock provided either on pins REFCLK0P/N or REFCLK1P/N. The choice is made either through MDIO or through REFCLK_SEL pins. The reference clock frequencies for each channel can be chosen independently. For each channel, the low speed side SERDES, high speed side SERDES and the associated part of the digital core operate from the same reference clock. 56 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 MDIO REG REFCLK0P/N High Speed SERDES MDIO REG High Speed SERDES MDIO REG High Speed SERDES MDIO REG Channel B HS Channel C HS High Speed SERDES MDIO REG Clock Multiplier MDIO REG Channel A HS Clock Multiplier MDIO REG Clock Multiplier MDIO REG Clock Multiplier Clock Multiplier Clock Multiplier Clock Multiplier Clock Multiplier Channel D LS Low Speed SERDES Channel C LS Low Speed SERDES Channel B LS Low Speed SERDES Channel A LS SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Low Speed SERDES www.ti.com Channel D HS REFCLK1P/N Figure 5-34. Reference Clock Architecture The architecture of the output clocks is shown in Figure 5-35. The clock and data recovery (CDR) function of the high speed side receiver recovers the clock from the incoming serial data. The high speed side SERDES receiver makes available two versions of clocks for further processing: • HS_RXBCLK_A/B/C/D: recovered byte clock synchronous with incoming serial data and with a frequency matching the incoming line rate divided by 16 (in the 10GBASE-KR mode), 10 (in the 1G-KX mode), or 20 (in the General Purpose SERDES mode). • VCO_CLOCK_A/B/C/D_DIV2: VCO frequency divided by 2. (VCO frequency = REFCLK x PLL Multiplier). (Note: For full rates, VCO/2 pre divided clocks will be equivalent to the line rate divided by 8, for sub-rates, VCO/2 pre divided clocks will be equivalent to the line rate divided by 4) The above-mentioned clocks can be output through the differential pins HSRXA/B/C/D_CLKOUTP/N with optional frequency division ratios of 1, 2, 4, 5, 8, 10, 16, 20, or 25. The high speed transmit side clock can also be made available on the HSTX0/1_CLKOUTP/N pins with optional frequency division ratios of 1, 2, 4, 5, 8, 10, 16, 20, or 25. From the low speed side SERDES, the recovered byte clock from the receive CDR as well as the transmit byte clock (both equal to the low speed side line rate divided by 10) can be made available on the LS0/1_CLKOUTP/N pins with optional frequency division ratios of 1, 2, 4, 5, 8, 10, 16, 20, or 25. The clock output options may be software controlled through the MDIO interface. The maximum CLKOUT frequency is 500 MHz. Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 57 TLK10034 HSRXA_CLKOUT_P HSRXA_CLKOUT_N HSTX0_CLKOUT_P HSTX0_CLKOUT_N LS0_CLKOUT_P LS0_CLKOUT_N 1/2/4/5/8/10/16/ 20/25 clock divider(MDIO selectable) TX LS Byte Clock www.ti.com HSRXB_CLKOUT_P HSRXB_CLKOUT_N SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 All Clockout buffers can be independently powered down via MDIO Clock Divider Clock Divider 0.5~5Gbps 4Ch BIDI Serdes Clock Divider CH A LS 1~10Gbps 1Ch BIDI Serdes TX HS Byte Clock Clock Divider 1~10Gbps 1Ch BIDI Serdes CH B HS 1~10Gbps 1Ch BIDI Serdes CH C HS 1~10Gbps 1Ch BIDI Serdes CH D HS Clock Divider Clock Divider Clock Divider CH D LS 0.5~5Gbps 4Ch BIDI Serdes CH C LS 0.5~5Gbps 4Ch BIDI Serdes Dual channel selectable LS TX or RX byte clock outs RX Byte or VCO/ 8 Clock Clock Divider CH B LS 0.5~5Gbps 4Ch BIDI Serdes RX LS Byte Clock CH A HS 1/2/4/5/8/10/16/ 20/25 clock divider on HS RX clocks(MDIO selectable) HSRXD_CLKOUT_N HSRXD_CLKOUT_P HSRXC_CLKOUT_N HSRXC_CLKOUT_P Dual channel selectable HS TX byte clock outs HSTX1_CLKOUT_N HSTX1_CLKOUT_P LS1_CLKOUT_P LS1_CLKOUT_N Per channel HS recovered clock outs Figure 5-35. Output Clock Architecture To minimize power consumption, the unused output clock ports can be selectively powered down or disabled. Details on the settings required for various output clock power down modes can be found in Table 5-14, Table 5-15, Table 5-16, Table 5-17, and Table 5-18. Note that when powered down, the clock outputs are held at differential high level. When flat lined, the clock outputs can be either differential high or differential low. Table 5-14. HSRX*_CLKOUTP/N Power Down Settings (1) 30.1.15 1.0.11 (2) 30.32801.2 30.1.14 30.32801.3 30.1.3 0 x X x x x x Power down 1 1 x x x x x Power down PDTRX*_N (1) (2) 58 HSRXA_CLKOUTP/N HSRX*_CLKOUTP/N settings are per channel basis This bit is valid only in 10GKR/1GKX modes. Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Table 5-14. HSRX*_CLKOUTP/N Power Down Settings(1) (continued) PDTRX*_N 30.1.15 1.0.11 (2) 30.32801.2 30.1.14 30.32801.3 30.1.3 1 0 1 x x x x Power down 1 0 0 1 x x x Power down if PLL lock is lost or LOS detected on HS side else active 1 0 0 0 1 x x Power down 1 0 0 0 1 x x Power down 1 0 0 0 0 1 x Flat lined if PLL lock is lost or LOS detected on HS side else active 1 0 0 0 0 0 1 Flat lined 1 0 0 0 0 0 0 Active HSRXA_CLKOUTP/N Note: When active, HSRX*_CLKOUT frequency depends on HSRX_CLKOUT_SEL (30.1.2) and HSRX_CLKOUT_DIV(30.1.7:4) Table 5-15. LS0_CLKOUTP/N Power Down Settings Ch A 30.1.15 & Ch B 30.1.15 & Ch C 30.1.15 & Ch D 30.1.15 Ch A 1.0.11 (1) & Ch B 1.0.11 (1) & Ch C 1.0.11 (1) & Ch D 1.0.11 (1) 30.27.0 30.25.3 0 x x x x Power down 1 1 x x x Power down 1 0 1 x x Power down 1 0 0 1 x Power down 1 0 0 0 1 Flat lined 1 0 0 0 0 Active PDTRXA_N | PDTRXB_N | PDTRXC_N | PDTRXD_N LS0_CLKOUTP/N Note: When active, LS0_CLKOUT frequency depends on LS0_CLKOUT_SEL (30.25.2:0) and LS0_CLKOUT_DIV(30.25.7:4) (1) This bit is valid only in 10GKR/1GKX modes. Table 5-16. LS1_CLKOUTP/N Power Down Settings PDTRXA_N | PDTRXB_N | PDTRXC_N | PDTRXD_N Ch A 30.1.15 & Ch B 30.1.15 & Ch C 30.1.15 & Ch D 30.1.15 Ch A 1.0.11 (1) & Ch B 1.0.11 (1) & Ch C 1.0.11 (1) & Ch D 1.0.11 (1) 30.27.1 30.25.11 0 x x x x Power down 1 1 x x x Power down 1 0 1 x x Power down 1 0 0 1 x Power down 1 0 0 0 1 Flat lined 1 0 0 0 0 Active LS0_CLKOUTP/N Note: When active, LS1_CLKOUT frequency depends on LS1_CLKOUT_SEL (30.25.10:8) and LS1_CLKOUT_DIV(30.25.15:12) (1) This bit is valid only in 10GKR/1GKX modes. Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 59 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com Table 5-17. HSTX0_CLKOUTP/N Power Down Settings Ch A 30.1.15 & Ch B 30.1.15 & Ch C 30.1.15 & Ch D 30.1.15 Ch A 1.0.11 (1) & Ch B 1.0.11 & (1) Ch C 1.0.11 (1) & Ch D 1.0.11 (1) 30.26.2 30.26.3 0 x x x x Power down 1 1 x x x Power down 1 0 1 x x Power down 1 0 0 1 x Power down 1 0 0 0 1 Flat lined 1 0 0 0 0 Active PDTRXA_N | PDTRXB_N | PDTRXC_N | PDTRXD_N HSTX0_CLKOUTP/N Note: When active, HSTX0_CLKOUT frequency depends on HSTX0_CLKOUT_SEL (30.26.1:0) and HSTX0_CLKOUT_DIV(30.26.7:4) (1) This bit is valid only in 10GKR/1GKX modes. Table 5-18. HSTX1_CLKOUTP/N Power Down Settings Ch A 30.1.15 & Ch B 30.1.15 & Ch C 30.1.15 & Ch D 30.1.15 Ch A 1.0.11 (1) & Ch B 1.0.11 (1) & Ch C 1.0.11 (1) & Ch D 1.0.11 (1) 30.26.10 30.26.11 0 x x x x Power down 1 1 x x x Power down 1 0 1 x x Power down 1 0 0 1 x Power down 1 0 0 0 1 Flat lined 1 0 0 0 0 Active PDTRXA_N | PDTRXB_N | PDTRXC_N | PDTRXD_N HSTX1_CLKOUTP/N Note: When active, HSTX1_CLKOUT frequency depends on HSTX1_CLKOUT_SEL (30.26.9:8) and HSTX0_CLKOUT_DIV(30.26.15:12) (1) This bit is valid only in 10GKR/1GKX modes. 5.5.2 Power Down Mode The TLK10034 can be put in power down either through MDIO control bits 30.1.15 and 1.0.11 or via hardware control pins: • PDTRXA_N: Active low, powers down channel A. • PDTRXB_N: Active low, powers down channel B. • PDTRXC_N: Active low, powers down channel C. • PDTRXD_N: Active low, powers down channel D. The MDIO management serial interface remains operational when in register based power down mode, but status bits may not be valid since the clocks are disabled. Refer to the detailed per pin description for the behavior of each device I/O signal during pin based and register based power down. 60 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com 5.5.2.1 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 High Speed CML Output The high speed data output driver is implemented using Current Mode Logic (CML) with integrated pull up resistors, requiring no external components. The transmit outputs must be AC coupled. HSTXAP HSRXAP 50 ohm transmission line 50 0.8*VDDT 50 GND 50 ohm transmission line HSTXAN TRANSMITTER HSRXAN MEDIA RECEIVER NOTE: Channel A HS Side is Shown Figure 5-36. Example of High Speed I/O AC Coupled Mode Current Mode Logic (CML) drivers often require external components. The disadvantage of the external component is a limited edge rate due to package and line parasitic. The CML driver on TLK10034 has onchip 50Ω termination resistors terminated to VDDT, providing optimum performance for increased speed requirements. The transmitter output driver is highly configurable allowing output amplitude and deemphasis to be tuned to a channel's individual requirements. Software programmability allows for very flexible output amplitude control. Only AC coupled output mode is supported. When transmitting data across long lengths of PCB trace or cable, the high frequency content of the signal is attenuated due to the skin effect of the media. This causes a “smearing” of the data eye when viewed on an oscilloscope. The net result is reduced timing margins for the receiver and clock recovery circuits. In order to provide equalization for the high frequency loss, 3-tap finite impulse response (FIR) transmit deemphasis is implemented. A highly configurable output driver maximizes flexibility in the end system by allowing de-emphasis and output amplitude to be tuned to a channel’s individual requirements. Output swing control is via MDIO. See Figure 4-2 for output waveform flexibility. The level of de-emphasis is programmable via the MDIO interface through control registers through pre-cursor and post-cursor settings. Users can control the strength of the de-emphasis to optimize for a specific system requirement. 5.5.2.2 High Speed Receiver The high speed receiver is differential CML with internal termination resistors. The receiver requires AC coupling. The termination impedances of the receivers are configured as 100 Ω with the center tap weakly tied to 0.7×VDDT with a capacitor to create an AC ground (see Figure 5-36). TLK10034 serial receivers incorporate adaptive equalizers. This circuit compensates for channel insertion loss by amplifying the high frequency components of the signal, reducing inter-symbol interference. Equalization can be enabled or disabled per register settings. Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 61 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 5.5.2.3 www.ti.com Loss of Signal Output Generation (LOS) Loss of input signal detection is based on the voltage level of each serial input signal IN*P/N, HSRX*P/N. When LOS indication is enabled and a channel’s differential serial receive input level is < 65 mVpp, that channel’s respective LOS indicator will be asserted (high true). If the input signal is > 175 mVpp, the LOS indicator will be deasserted (low false). Outside of these ranges, the LOS indication is undefined. The LOS indications are also directly readable through the MDIO interface in respective registers. The following additional critical status conditions can be combined with the loss of signal condition enabling additional real-time status signal visibility on the LOS* outputs per channel: 1. Loss of Channel Synchronization Status – Logically OR’d with LOS condition(s) when enabled. Loss of channel synchronization can be optionally logically OR’d (disabled by default) with the internally generated LOS condition (per channel). 2. Loss of PLL Lock Status on LS and HS sides – Logically OR’d with LOS condition(s) when enabled. The internal PLL loss of lock status bit is optionally OR’d (disabled by default) with the other internally generated loss of signal conditions (per channel). 3. Receive 8B/10B Decode Error (Invalid Code Word or Running Disparity Error) – Logically OR’d with LOS condition(s) when enabled. The occurrence of an 8B/10B decode error (invalid code word or disparity error) is optionally OR’d (disabled by default) with the other internally generated loss of signal conditions (per channel). 4. AGCLOCK (Active Gain Control Currently Locked) – Inverted and Logically OR’d with LOS condition(s) when enabled. HS RX SERDES adaptive gain control unlocked indication is optionally OR’d (disabled by default) with the other internally generated loss of signal conditions (per channel). 5. AZDONE (Auto Zero Calibration Done) - Inverted and Logically OR’d with LOS conditions(s) when enabled. HS RX SERDES auto-zero not done indication is optionally OR’d (disabled by default) with the other internally generated loss of signal conditions (per channel). Refer to Figure 5-37, which shows the detailed implementation of the LOSA signal along with the associated MDIO control registers for the General Purpose SERDES mode. More details about LOS settings including configurations related to the 10GBASE-KR mode can be found in the Programmers Reference section. 62 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Loss of Signal(HS Ch A) ENABLE LOS INA0 ENABLE LOS INA1 ENABLE Loss of Signal(LS Ch A) LOS INA2 ENABLE LOS INA3 ENABLE PLL Locked (HS Ch A) ENABLE PLL Locked (LS Ch A) ENABLE 8B/10B Invalid Code (HS Ch A) ENABLE LOS 8B/10B Invalid Code INA0 ENABLE 8B/10B Invalid Code INA1 ENABLE 8B/10B Invalid Code INA2 ENABLE 8B/10B Invalid Code (LS Ch A) 8B/10B Invalid Code INA3 ENABLE Loss of Ch Sync (HS Ch A) ENABLE Loss of Sync INA0 ENABLE Loss of Sync INA1 ENABLE Loss of Ch Sync (LS Ch A) Loss of Sync INA2 ENABLE Loss of Sync INA3 ENABLE AGCLOCK(HS Ch A) ENABLE AZDONE (HS Ch. A) ENABLE Note: LOSA is asserted (driven high) during a failing condition, and deasserted (driven low) otherwis . Any combinations of status signals may be enabled onto LOSA/B/C/D based on MDIO register bits indicated above. LOSB/C/D circuits are similar. Figure 5-37. LOSA – Logic Circuit Implementation 5.5.3 MDIO Management Interface The TLK10034 supports the Management Data Input/Output (MDIO) Interface as defined in Clauses 22 and 45 of the IEEE 802.3ae Ethernet specification. The MDIO allows register-based management and control of the serial links. Whether Clause 22 or Clause 45 is used will depend on the ST pin settings. If ST is low, Clause 45 is used. If ST is high, Clause 22 is used. Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 63 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com The MDIO Management Interface consists of a bi-directional data path (MDIO) and a clock reference (MDC). The device identification and port address are determined by control pins (see Table 3-1). Also, whether the device responds as a Clause 22 or Clause 45 device is also determined by control pin ST (see Table 3-1). In Clause 45 (ST = 0) and Clause 22 (ST = 1), the top 3 control pins PRTAD[4:2] determine the device port address. In this mode, TLK10034 will respond if the PHY address field on the MDIO protocol (PA[4:2]) matches PRTAD[4:2] pin value. In both these modes the 4 individual channels in TLK10034 are classified as 4 different ports. So for any PRTAD[4:2] value there will be 4 ports per TLK10034. 2 MSB’s of PHY address field (PA[1:0]) will determine which channel/port within TLK10034 to respond. If If If If PA[1:0] PA[1:0] PA[1:0] PA[1:0] = = = = 2’b00, TLK10034 2’b01, TLK10034 2’b10, TLK10034 2’b11, TLK10034 Channel A will respond. Channel B will respond. Channel C will respond. Channel D will respond. In Clause 22 (ST = 1) mode, only 32 (5’b00000 to 5’b11111) register addresses can be accessed through standard protocol. Due to this limitation, an indirect addressing method (More description in Clause 22 Indirect Addressing section) is implemented to provide access to all device specific control/status registers that cannot be accessed through the standard Clause 22 register address space. Write transactions which address an invalid register or device or a read only register will be ignored. Read transactions which address an invalid register or device will return a 0. 5.5.4 MDIO Protocol Timing Timing for a Clause 45 address transaction is shown in Figure 5-38. The Clause 45 timing required to write to the internal registers is shown in Figure 5-39. The Clause 45 timing required to read from the internal registers is shown in Figure 5-40. The Clause 45 timing required to read from the internal registers and then increment the active address for the next transaction is shown in Figure 5-41. The Clause 22 timing required to read from the internal registers is shown in Figure 5-42. The Clause 22 timing required to write to the internal registers is shown in Figure 5-43. MDC 0 MDIO 0 0 32 "1's" Preamble 0 Addr Code Start PA[4:0] PHY Addr DA[4:0] Dev Addr 1 0 Turn Around A15 A0 Reg Addr 1 Idle Figure 5-38. CL45 - Management Interface Extended Space Address Timing MDC 0 MDIO 0 0 32 "1's" Preamble 1 Write Code Start PA[4:0] PHY Addr DA[4:0] Dev Addr 1 0 Turn Around D15 D0 Data 1 Idle Figure 5-39. CL45 - Management Interface Extended Space Write Timing MDC 0 MDIO 0 32 "1's" Preamble Start 1 0 PA[4:0] Read Inc Code PHY Addr DA[4:0] Dev Addr 1 0 Turn Around D15 D0 Data 1 Idle Figure 5-40. CL45 - Management Interface Extended Space Read Timing 64 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 MDC 0 MDIO 0 32 "1's" Preamble Start 1 0 PA[4:0] Read Inc Code PHY Addr DA[4:0] 1 Dev Addr 0 Turn Around D15 D0 1 Idle Data Figure 5-41. CL45 - Management Interface Extended Space Read And Increment Timing MDC MDIO 1 0 1 32 "1's" Read Code Start Preamble 0 PA[4:0] PHY Addr RA4 RA0 1 REG Addr 0 Turn Around D15 D0 1 Data Idle Figure 5-42. CL22 - Management Interface Read Timing MDC MDIO 0 1 0 32 "1's" Write Code Start Preamble 1 PA[4:0] PHY Addr RA4 RA0 1 REG Addr 0 Turn Around D15 D0 1 Data Idle Figure 5-43. CL22 - Management Interface Write Timing The IEEE 802.3 Clause 22/45 specification defines many of the registers, and additional registers have been implemented for expanded functionality. 5.5.5 Clause 22 Indirect Addressing Due to Clause 22 register space limitations, an indirect addressing method is implemented so that the extended register space can be accessed through Clause 22. All the device specific control and status registers that cannot be accessed through Clause 22 direct addressing can be accessed through this indirect addressing method. To access this register space, an address control register (Reg 30, 5’h1E) should be written with the register address followed by a read/write transaction to address content register (Reg 31, 5’h1F) to access the contents of the address specified in address control register. Following timing diagrams illustrate an example write transaction to Register 16’h9000 using indirect addressing in Clause 22. MDC MDIO 0 1 0 32 "1's" Preamble 1 Write Code Start PA[4:0] 5'h1E PHY Addr REG Addr 1 0 Turn Around 16'h9000 1 Data Idle Figure 5-44. CL22 – Indirect Address Method – Address Write MDC MDIO 0 1 32 "1's" Preamble Start 0 1 Write Code PA[4:0] PHY Addr 5'h1F REG Addr 1 0 DATA Turn Around Data 1 Idle Figure 5-45. CL22 - Indirect Address Method – Data Write Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 65 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com Following timing diagrams illustrate an example read transaction to read contents of Register 16’h9000 using indirect addressing in Clause 22. MDC MDIO 0 1 0 32 "1's" Write Code Start Preamble 1 PA[4:0] 5'h1E PHY Addr REG Addr 1 0 Turn Around 16'h9000 Data 1 Idle Figure 5-46. CL22 - Indirect Address Method – Address Write MDC MDIO 1 0 1 32 "1's" Preamble 0 Read Code Start PA[4:0] PHY Addr 5'h1F REG Addr 1 0 Turn Around D15 D0 Data 1 Idle Figure 5-47. CL22 - Indirect Address Method – Data Read 5.5.6 Programmers Reference The top 3 control pins PRTAD[4:2] determine the device port address. In this mode, TLK10034 will respond if the PHY address field on the MDIO protocol (PA[4:2]) matches PRTAD[4:2] pin value. In both Clause 45 and Clause 22 modes, the 4 individual channels in TLK10034 are classified as 4 different ports. So for any PRTAD[4:2] value there will be 4 ports per TLK10034. 2 LSB’s of PHY address field (PA[1:0]) will determine which channel/port within TLK10034 to respond. • Channel A can be accessed by setting 2 LSB bits of PHY address to 2’b00. • Channel B can be accessed by setting 2 LSB bits of PHY address to 2’b01. • Channel C can be accessed by setting 2 LSB bits of PHY address to 2’b10. • Channel D can be accessed by setting 2 LSB bits of PHY address to 2’b11. Table 5-19 illustrates device modes with respect to ST and MODE_SEL pins. 10G mode referenced in below table and in the rest of programmer’s reference is equivalent to General purpose SERDES mode. Table 5-19. Mode Selection ST = 0 (Clause 45) ST = 1 (Clause 22) {MODE_SEL pin, SW bit (30.1.10)} 1x 10G 10G 01 10G 10G 00 10G-KR/1G-KX (Determined by Auto Neg) 1G-KX (No Auto Neg) Following programmer’s reference is divided into 3 sections. 10G-KR PROGRAMMERS REFERENCE is applicable in 10GKR mode only, 1G-KX PROGRAMMERS REFERENCE is applicable in 1G-KX mode only and 10G PROGRAMMERS REFERENCE applicable is in 10G mode only. Control register bits (RW) specified as NA in each section are not applicable in that specific mode and should not be changed from their default value. Read values of status register bits (RO/LH/LL/COR) that are specified as NA in each section are not valid and not applicable in that specific mode and should be left at their default or recommended values. 66 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com 5.5.7 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Register Bit Definitions RW: Read-Write User can write 0 or 1 to this register bit. Reading this register bit returns the same value that has been written. RW/SC: Read-Write Self-Clearing User can write 0 or 1 to this register bit. Writing a 1 to this register creates a high pulse. Reading this register bit always returns 0. RO: Read-Only This register can only be read. Writing to this register bit has no effect. Reading from this register bit returns its current value. RO/LH: Read-Only Latched High This register can only be read. Writing to this register bit has no effect. Reading a 1 from this register bit indicates that either the condition is occurring or it has occurred since the last time it was read. Reading a 0 from this register bit indicates that the condition is not occurring presently, and it has not occurred since the last time the register was read. A latched high register, when read high, should be read again to distinguish if a condition occurred previously or is still occurring. If it occurred previously, the second read will read low. If it is still occurring, the second read will read high. Reading this register bit automatically resets its value to 0. RO/LL: Read-Only Latched Low This register can only be read. Writing to this register bit has no effect. Reading a 0 from this register bit indicates that either the condition is occurring or it has occurred since the last time it was read. Reading a 1 from this register bit indicates that the condition is not occurring presently, and it has not occurred since the last time the register was read. A latched low register, when read low, should be read again to distinguish if a condition occurred previously or is still occurring. If it occurred previously, the second read will read high. If it is still occurring, the second read will read low. Reading this register bit automatically sets its value to 1. COR: Clear-On-Read counter This register can only be read. Writing to this register bit has no effect. Reading from this register bit returns its current value, then resets its value to 0. Counter value freezes at Max. 5.6 Register Map 5.6.1 10G-KR Programmers Reference 5.6.1.1 Vendor Specific Device Registers These registers can be accessed by setting device address field to 0x1E (DA[4:0] = 5’b11110). Table 5-20. GLOBAL_CONTROL_1 (1) Device Address: 0x1E Register Address:0x0000 Default: 0x0020 Bit Name Description 15 GLOBAL_RESET Global reset. 0 = Normal operation (Default 1’b0) 1 = Resets TX and RX data path including MDIO registers. Equivalent to asserting RESET_N. 11 (1) (2) GLOBAL_WRITE Access RW SC (2) Global write enable. 0 = Control settings are specific to channel addressed (Default 1’b0) 1 = Control settings in channel specific registers are applied to all 4 channels regardless of channel addressed RW This global register is channel independent. After reset bit is set to one, it automatically sets itself back to zero on the next MDC clock cycle. Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 67 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com Table 5-20. GLOBAL_CONTROL_1(1) (continued) Device Address: 0x1E Register Address:0x0000 Default: 0x0020 68 Bit Name Description 5:0 PRBS_PASS_OVERLAY[5:0] PRBS_PASS pin status selection. Applicable only when PRBS test pattern verification is enabled on HS side or LS side. PRBS_PASS pin reflects PRBS verification status on selected Channel HS/LS side 1xx000 = PRBS_PASS reflects combined status of Channel A/B/C/D HS serdes PRBS verification. If PRBS verification fails on any channel HS serdes, PRBS_PASS will be asserted low. (Default 6’b100000) 000000 = Status from Channel A HS Serdes side 000001 = NA 00001x = Reserved 000100 = Status from Channel A LS Serdes side Lane 0000101 = Status from Channel A LS Serdes side Lane 1000110 = Status from Channel A LS Serdes side Lane 2000111 = Status from Channel A LS Serdes side Lane 3001000 = Status from Channel B HS Serdes side 001001 = NA 00101x = Reserved 001100 = Status from Channel B LS Serdes side Lane 0001101 = Status from Channel B LS Serdes side Lane 1001110 = Status from Channel B LS Serdes side Lane 2001111 = Status from Channel B LS Serdes side Lane 3010000 = Status from Channel C HS Serdes side 010001 = NA 01001x = Reserved 010100 = Status from Channel C LS Serdes side Lane 0010101 = Status from Channel C LS Serdes side Lane 1010110 = Status from Channel C LS Serdes side Lane 2 010111 = Status from Channel C LS Serdes side Lane 3011000 = Status from Channel D HS Serdes side 011001 = NA 01101x = Reserved 011100 = Status from Channel D LS Serdes side Lane 0011101 = Status from Channel D LS Serdes side Lane 1011110 =Status from Channel D LS Serdes side Lane 2011111 = Status from Channel D LS Serdes side Lane 3 Detailed Description Access RW Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Table 5-21. CHANNEL_CONTROL_1 Device Address: 0x1E Register Address:0x0001 Default: 0x0B88 Bit Name Description 15 POWERDOWN Setting this bit high powers down entire data path with exception that MDIO interface stays active. 0 = Normal operation (Default 1’b0) 1 = Power Down mode is enabled. 14 HSRX_CLKOUT_POWERDOW 0 = Normal operation (Default 1’b0) N 1 = Enable HSRXx_CLKOUTP/N Power Down. RW 13 10G_RX_MODE_SEL NA. This bit must be left at its default value (1’b0) for proper 10GKR operation. RW 12 10G_TX_MODE_SEL NA. This bit must be left at its default value (1’b0) for proper 10GKR operation. RW 11 SW_PCS_SEL Valid only when MODE_SEL pin is 0, AN_ENABLE (7.0.12) is 0 and SW_DEV_MODE_SEL (30.1.10) is 0. 1 = Set device to 10G-KR mode(Default 1’b1) 0 = NA This bit must be left at its default value (1’b1) for proper 10GKR operation. RW 10 SW_DEV_MODE_SEL Valid only when MODE_SEL pin is 0 1 = NA 0 = Device mode is set using Auto negotiation. (Default 1’b0) This bit must be left at its default value (1’b0) for proper 10GKR operation. RW 9 10G_RX_DEMUX_SEL NA. This bit must be left at its default value (1’b1) for proper 10GKR operation. RW 8 10G_TX_MUX_SEL NA. This bit must be left at its default value (1’b1) for proper 10GKR operation. RW HSRX_CLKOUT_DIV[3:0] Output clock divide setting. This value is used to divide selected clock (Selected using HSRX_CLKOUT_SEL) before giving it out onto respective channel HSRXx_CLKOUTP/N. 0000 = Divide by 1 0001 = RESERVED 0010 = RESERVED 0011 = RESERVED 0100 = Divide by 2 0101 = RESERVED 0110 = RESERVED 0111 = RESERVED 1000 = Divide by 4 (Default 4’b1000) 1001 = Divide by 8 1010 = Divide by 16 1011 = RESERVED 1100 = Divide by 5 1101 = Divide by 10 1110 = Divide by 20 1111 = Divide by 25 RW 3 HSRX_CLKOUT_ EN Output clock enable. 0 = Holds HSRXx_CLKOUTP/N output to a fixed value. 1 = Allows HSRXx_CLKOUTP/N output to toggle normally (Default 1’b1) RW 2 HSRX_CLKOUT_SEL Output clock select. Selected Recovered clock sent out on HSRXx_CLKOUTP/N pins 0 = Selects respective Channel HSRX recovered byte clock as output clock (Default 1’b0) 1 = Selects respective Channel HSRX VCO divide by 2 clock as output clock RW 1 REFCLK_SW_SEL Channel HS Reference clock selection. Applicable only when REFCLK_SEL pin is LOW. 0 = Selects REFCLK_0_P/N as clock reference to Channel x HS side serdes macro(Default 1’b0) 1 = Selects REFCLK_1_P/N as clock reference to Channel x HS side serdes macro RW 0 LS_REFCLK_SEL Channel LS Reference clock selection. 0 = LS side serdes macro reference clock is same as HS side serdes reference clock (E.g. If REFCLK_0_P/N is selected as HS side serdes macro reference clock, REFCLK_0_P/N is selected as LS side serdes macro reference clock and vice versa) (Default 1’b0) 1 = Alternate reference clock is selected as clock reference to Channel x LS side serdes macro (E.g. If REFCLK_0_P/N is selected as HS side serdes macro reference clock, REFCLK_1_P/N is selected as LS side serdes macro reference clock and vice versa) RW 7:4 Access Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 RW 69 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com Table 5-22. HS_SERDES_CONTROL_1 Device Address: 0x1E Register Address:0x0002 Default: 0x811D Bit Name Description RESERVED For TI use only (Default 9’b100000) RW HS_LOOP_BANDWIDT H[1:0] HS Serdes PLL Loop Bandwidth settings 00 = Rserved 01 = Narrow bandwidth (Default 2'b01) 11 = Highest bandwidth. Recommended for 10GBASE-KR. RW 7 RESERVED For TI use only (Default 1’b1) 6 HS_VRANGE HS Serdes PLL VCO range selection. 0 = VCO runs at higher end of frequency range (Default 1’b0) 1 = VCO runs at lower end of frequency range This bit needs to be set HIGH if VCO frequency (REFCLK *HS_PLL_MULT) is below 2.5 Ghz. RW 5 RESERVED For TI use only (Default 1’b0) RW 4 HS_ENPLL HS Serdes PLL enable control. HS Serdes PLL is automatically disabled when PD_TRXx_N is asserted LOW or when register bit 30.1.15 is set HIGH. 0 = Disables PLL in HS serdes 1 = Enables PLL in HS serdes (Default 1’b1) RW HS_PLL_MULT[3:0] HS Serdes PLL multiplier setting (Default 4’b1101). This setting is automatically controlled and value set through these register bits is ignored unless REFCLK_FREQ_SEL_1 or related OVERRIDE bit is set. Refer 10GKR supported rates for valid PLL Multiplier values. Refer Table 5-23. RW 15:10 9:8 3:0 Access Table 5-23. HS PLL Multiplier Control 30.2.3:0 30.2.3:0 Value PLL Multiplier factor Value 0000 Reserved 1000 PLL Multiplier factor 12x 0001 Reserved 1001 12.5x 0010 4x 1010 15x 0011 5x 1011 16x 0100 6x 1100 16.5x 0101 8x 1101 20x 0110 8.25x 1110 25x 0111 10x 1111 Reserved Table 5-24. HS_SERDES_CONTROL_2 Device Address: 0x1E Register Address:0x0003 Default:0x8848 Bit Name Description HS_SWING[3:0] Transmitter Output swing control for HS Serdes. (Default 4’b1000) Refer Table 5-25. RW 11 HS_ENTX HS Serdes transmitter enable control. HS Serdes transmitter is automatically disabled when PD_TRXx_N is asserted LOW or when register bit 30.1.15 is set HIGH. 0 = Disables HS serdes transmitter 1 = Enables HS serdes transmitter (Default 1’b1) RW 10 HS_EQHLD HSRX Equalizer hold control. This setting is automatically controlled through link training and value set through this register bit is ignored unless related OVERRIDE bit is set. 0 = Normal operation (Default 1’b0) 1 = Holds equalizer and long tail correction in its current state RW 15:12 70 Access Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Table 5-24. HS_SERDES_CONTROL_2 (continued) Device Address: 0x1E Register Address:0x0003 Default:0x8848 Bit Name Description 9:8 HS_RATE_TX [1:0] HS Serdes TX rate settings. This setting is automatically controlled and value set through these register bits is ignored unless REFCLK_FREQ_SEL_1 or related OVERRIDE bit is set. 00 = Full rate (Default 2’b00) 01 = Half rate 10 = Quarter rate 11 = Eighth rate RW 7:4 RESERVED For TI use only (Default 4’b0100) RW HS_ENRX HS Serdes receiver enable control. This setting is automatically controlled and value set through this register bit is ignored unless related OVERRIDE bit is set. HS Serdes receiver is automatically disabled when PD_TRXx_N is asserted LOW or when register bit 30.1.15 is set HIGH. 0 = Disables HS serdes receiver 1 = Enables HS serdes receiver (Default 1’b1) RW HS_RATE_RX [2:0] HS Serdes RX rate settings. This setting is automatically controlled and value set through these register bits is ignored unless REFCLK_FREQ_SEL_1 or related OVERRIDE bit is set. 000 = Full rate (Default 3’b000) 101 = Half rate 110 = Quarter rate 111 = Eighth rate 001 = Reserved 01x = Reserved 100 = Reserved RW 3 2:0 Access Table 5-25. HSTX AC Mode Output Swing Control VALUE 30.3[15:12] AC MODE TYPICAL AMPLITUDE (mVdfpp) 0000 130 0001 220 0010 300 0011 390 0100 480 0101 570 0110 660 0111 750 1000 830 1001 930 1010 1020 1011 1110 1100 1180 1101 1270 1110 1340 1111 1400 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 71 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com Table 5-26. HS_SERDES_CONTROL_3 Device Address: 0x1E Register Address:0x0004 Default:0x1400 Bit Name Description Access 15 HS_ENTRACK HSRX ADC Track mode. This setting is automatically controlled through link training and value set through this register bit is ignored unless related OVERRIDE bit is set. 0 = Normal operation (Default 1’b0) 1 = Forces ADC into track mode RW 14:12 HS_EQPRE[2:0] Serdes Rx precursor equalizer selection 000 = 1/9 cursor amplitude 001 = 3/9 cursor amplitude (Default 3’b001) 010 = 5/9 cursor amplitude 011 = 7/9 cursor amplitude 100 = 9/9 cursor amplitude 101 =11/9 cursor amplitude 110 = 13/9 cursor amplitude 111 = Disable RW 11:10 HS_CDRFMULT[:10 Clock data recovery algorithm frequency multiplication selection ] 00 = First order. Frequency offset tracking disabled 01 = Second order. 1x mode 10 = Second order. 2x mode (Default 2’b10) 11 = Reserved RW 9:8 HS_CDRTHR[1:0] Clock data recovery algorithm threshold selection 00 = Four vote threshold (Default 2’b00) 01 = Eight vote threshold 10 = Sixteen vote threshold 11 = Thirty two vote threshold RW 7 RESERVED For TI use only (Default 1’b0) RW 6 HS_PEAK_DISABL E HS Serdes PEAK_DISABLE control 0 = Normal operation (Default 1’b0) 1 = Disables high frequency peaking. Suitable for 32 24 26 12/8 11 High High High NA 10 Mid-high Mid High 01 Mid Low Low 00 Low Low Low RX_CTC_WMK_SEL[1:0] RW 9 RX_Q_CNT_IPG 0 = Normal operation. (Default 1’b0) 1 = Sequence columns are counted as IPG. RW 8 RX_CTC_Q_DROP_EN 0 = Normal operation. (Default 1’b0) 1 = Enable Q column drop in RX CTC. RW 7 XMIT_IDLE 1 = Transmit idle pattern onto LS side 0 = Normal operation (Default 1’b0) RW 6:4 TX_FIFO_DEPTH[2:0] Tx CTC FIFO depth selection 1xx = 32 deep (Default 3’b100)011 = 24 deep 010 = 16 deep001 = 12 deep 000 = 8 deep (No CTC function) RW Water mark selection for receive CTC Works in conjunction with TX_FIFO_DEPTH_SEL setting (Default 2’b11) 3:2 Depth-> 32 24 26 12/8 11 High High High NA 10 Mid-high Mid High 01 Mid Low Low 00 Low Low Low TX_CTC_WMK_SEL[1:0] RW 1 TX_Q_CNT_IPG 0 = Normal operation. (Default 1’b0) 1 = Sequence columns are counted as IPG. RW 0 TX_CTC_Q_DROP_EN 0 = Normal operation. (Default 1’b0) 1 = Enable Q column drop in TX CTC. RW Table 5-100. KR_VS_TP_GEN_CONTROL Device Address: 0x01 Register Address:0x8002 Default: 0x0000 Bit Name Description 5:4 RX_TPG_HLM_TEST_SEL[1:0] XAUI based test pattern selection on LS side. See Test procedures for more information. 00 = High Frequency test pattern(Default 2’b00) 01 = Low Frequency test pattern 10 = Mixed Frequency test pattern 11 = Normal operation 3 RX_TPG_CRPAT_TEST_EN XAUI based test pattern selection on LS side. See Test procedures for more information. 0 = Normal operation. (Default 1’b0) 1 = Enables CRPAT test pattern generation 2 RX_TPG_CJPAT_TEST_EN XAUI based test pattern selection on LS side. See Test procedures for more information. 0 = Normal operation. (Default 1’b0) 1 = Enables CJPAT test pattern generation 1 RESERVED For TI use only (Default 1’b0) RX_TPG_HLM_TEST_EN XAUI based test pattern selection on LS side. See Test procedures for more information. 0 = Normal operation. (Default 1’b0) 1 = Enables H/L/M test pattern generation 0 94 Detailed Description Access RW Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Table 5-101. KR_VS_TP_VER_CONTROL Device Address: 0x01 Register Address:0x8003 Default: 0x0000 Bit Name Description 13:12 TX_TPV_HLM_TEST_SEL[1:0] XAUI based test pattern selection on LS side. See Test procedures for more information. 00 = High Frequency test pattern(Default 2’b00) 01 = Low Frequency test pattern 10 = Mixed Frequency test pattern 11 = Normal operation Access RW 11 TX_TPV_CRPAT_TEST_EN XAUI based test pattern selection on LS side. See Test procedures for more information. 0 = Normal operation. (Default 1’b0) 1 = Enables CRPAT test pattern verification RW 10 TX_TPV_CJPAT_TEST_EN XAUI based test pattern selection on LS side. See Test procedures for more information. 0 = Normal operation. (Default 1’b0) 1 = Enables CJPAT test pattern verification RW 9 RESERVED For TI use only(Default 1’b0) RW 8 TX_TPV_HLM_TEST_EN XAUI based test pattern selection on LS side. See Test procedures for more information. 0 = Normal operation. (Default 1’b0) 1 = Enables HL/M test pattern verification RW 5:0 RESERVED For TI use only(Default 6’b000000) RW Table 5-102. KR_VS_CTC_ERR_CODE_LN0 Device Address: 0x01 Register Address: 0x8005 Default: 0xCE00 Bit 15:7 Name Description Access KR_CTC_ERR_CODE_LN0 XGMII code to be transmitted in case of error condition. This applies to both TX and RX data paths. The msb is the control bit; remaining 8 bits constitute the error code. The default value for lane 0 corresponds to 8’h9C with the control bit being 1’b1. The default values for lanes 0~3 correspond to ||LF|| RW Table 5-103. KR_VS_CTC_ERR_CODE_LN1 Device Address: 0x01 Register Address: 0x8006 Default: 0x0000 Bit 15:7 Name Description KR_CTC_ERR_CODE_LN1 XGMII code to be transmitted in case of error condition. This applies to both TX and RX data paths. The msb is the control bit; remaining 8 bits constitute the error code. The default value for lane 1 corresponds to 8’h00 with the control bit being 1’b0. The default values for lanes 0~3 correspond to ||LF|| Access RW Table 5-104. KR_VS_CTC_ERR_CODE_LN2 Device Address: 0x01 Register Address: 0x8007 Default: 0x0000 Acces s Bit Name Description 15:7 KR_CTC_ERR_CODE_LN2 XGMII code to be transmitted in case of error condition. This applies to both TX and RX data paths. The msb is the control bit; remaining 8 bits constitute the error code. The default value for lane 2 corresponds to 8’h00 with the control bit being 1’b0. The default values for lanes 0~3 correspond to ||LF|| Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 RW 95 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com Table 5-105. KR_VS_CTC_ERR_CODE_LN3 Device Address: 0x01 Register Address: 0x8008 Default: 0x0080 Bit 15:7 Acces s Name Description KR_CTC_ERR_CODE_LN3 XGMII code to be transmitted in case of error condition. This applies to both TX and RX data paths. The msb is the control bit; remaining 8 bits constitute the error code. The default value for lane 3 corresponds to 8’h01 with the control bit being 1’b0. The default values for lanes 0~3 correspond to ||LF|| RW Table 5-106. KR_VS_LN0_EOP_ERROR_COUNTER Device Address: 0x01 Register Address: 0x8010 Default: 0xFFFD Bit Name Description Access 15:0 KR_LN0_EOP_ERR_COUNT Lane 0 End of packet Error counter. End of packet error is detected when Terminate character is in lane 0 and one or both of the following holds: ●Terminate character is not followed by /K/ characters in lanes 1, 2 and 3 COR ●The column following the terminate column is neither ||K|| nor ||A||. Counter value cleared to 16’h0000 when read. Table 5-107. KR_VS_LN1_EOP_ERROR_COUNTER Device Address: 0x01 Register Address: 0x8011 Default: 0xFFFD Bit Name Description Access 15:0 KR_LN1_EOP_ERR_COUN T Lane 1 End of packet Error counter. End of packet error is detected when Terminate character is in lane 1 and one or both of the following holds: ● Terminate character is not followed by /K/ characters in lanes 2 and 3 COR ● The column following the terminate column is neither ||K|| nor ||A||. Counter value cleared to 16’h0000 when read. Table 5-108. KR_VS_LN2_EOP_ERROR_COUNTER Device Address: 0x01 Register Address: 0x8012 Default: 0xFFFD Bit Name Description 15:0 KR_LN2_EOP_ERR_COU NT Lane 2 End of packet Error counter. End of packet error is detected when Terminate character is in lane 2 and one or both of the following holds: Access ● Terminate character is not followed by /K/ characters in lane 3 COR ● The column following the terminate column is neither ||K|| nor ||A||. Counter value cleared to 16’h0000 when read. Table 5-109. KR_VS_LN3_EOP_ERROR_COUNTER Device Address: 0x01 Register Address: 0x8013 Default: 0xFFFD Bit Name Description 15:0 KR_LN3_EOP_ERR_COUNT Lane 3 End of packet Error counter. End of packet error is detected when Terminate character is in lane 3 and the column following the terminate column is neither ||K|| nor ||A||. Counter value cleared to 16’h0000 when read. Access COR Table 5-110. KR_VS_TX_CTC_DROP_COUNT Device Address: 0x01 Register Address: 0x8014 Default: 0xFFFD Bit Name Description 15:0 TX_CTC_DROP_COUNT Counter for number of idle drops in the transmit CTC. 96 Detailed Description Access COR Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Table 5-111. KR_VS_TX_CTC_INSERT_COUNT Device Address: 0x01 Register Address: 0x8015 Default: 0xFFFD Bit Name Description 15:0 TX_CTC_INS_COUNT Counter for number of idle inserts in the transmit CTC. Access COR Table 5-112. KR_VS_RX_CTC_DROP_COUNT Device Address: 0x01 Register Address: 0x8016 Default: 0xFFFD Bit Name Description Access 15:0 RX_CTC_DROP_COUNT Counter for number of idle drops in the receive CTC. COR Table 5-113. KR_VS_RX_CTC_INSERT_COUNT Device Address: 0x01 Register Address: 0x8017 Default: 0xFFFD Bit Name Description 15:0 RX_CTC_INS_COUNT Counter for number of idle inserts in the receive CTC. Access COR Table 5-114. KR_VS_STATUS_1 Device Address: 0x01 Register Address: 0x8018 Default: 0x0000 Bit Name Description Access 15 TX_TPV_TP_SYNC 0 = Test pattern sync is not achieved on on Tx side 1 = Test pattern sync is achieved on on Tx side 11 RESERVED For TI use only 5 INVALID_S_COL_ERR 1 = Indicates invalid start (S) column error detected 4 INVALID_T_COL_ERR 1 = Indicates invalid terminate (T) column error detected 3 INVALID_XGMII_LN3 1 = Indicates invalid XGMII character detected in Lane 3 2 INVALID_XGMII_LN2 1 = Indicates invalid XGMII character detected in Lane 2 1 INVALID_XGMII_LN1 1 = Indicates invalid XGMII character detected in Lane 1 0 INVALID_XGMII_LN0 1 = Indicates invalid XGMII character detected in Lane 0 RO RO/LH Table 5-115. KR_VS_TX_CRCJ_ERR_COUNT_1 Device Address: 0x01 Register Address: 0x8019 Default: 0xFFFF Bit Name Description 15:0 TX_TPV_CR_CJ_ERR_COUNT[31:16] Error Counter for CR/CJ test pattern verification on Tx side. MSBs [31:16] Access COR Table 5-116. KR_VS_TX_CRCJ_ERR_COUNT_2 Device Address: 0x01 Register Address: 0x801A Default: 0xFFFD Bit Name Description 15:0 TX_TPV_CR_CJ_ERR_COUNT[15:0] Error Counter for CR/CJ test pattern verification on Tx side LSBs [15:0] Access COR Table 5-117. KR_VS_TX_LN0_HLM_ERR_COUNT Device Address: 0x01 Register Address: 0x801B Default: 0xFFFD Bit Name Description 15:0 TX_TPV_LN0_ERR_COUNT[15:0] Error Counter for H/L/M test pattern verification on Lane 0 of Tx side Access Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 COR 97 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com Table 5-118. KR_VS_TX_LN1_HLM_ERR_COUNT Device Address: 0x01 Register Address: 0x801C Default: 0xFFFD Bit Name Description 1.32796.15:0 TX_TPV_LN1_ERR_COUNT[15:0] Error Counter for H/L/M test pattern verification on Lane 1 of Tx side Access COR Table 5-119. KR_VS_TX_LN2_HLM_ERR_COUNT Device Address: 0x01 Register Address: 0x801D Default: 0xFFFD Bit Name Description Access 15:0 TX_TPV_LN2_ERR_COUNT[15:0] Error Counter for H/L/M test pattern verification on Lane 2 of Tx side COR Table 5-120. KR_VS_TX_LN3_HLM_ERR_COUNT Device Address: 0x01 Register Address: 0x801E Default: 0xFFFD Bit Name Description 15:0 TX_TPV_LN3_ERR_COUNT[15:0] Error Counter for H/L/M test pattern verification on Lane 3 of Tx side Access COR Table 5-121. TI_RESERVED_CONTROL Device Address: 0x01 Register Address: 0x9000 Default: 0x0241 Bit Name Description Access 9:0 RESERVED For TI use only (Default 10’b1001000001) RW Table 5-122. TI_RESERVED_CONTROL Device Address: 0x01 Register Address: 0x9001 Default: 0x0000 Bit Name Description Access 12 RESERVED For TI use only (Default 1’b0) RW/SC 10:0 RESERVED For TI use only (Default 11’b00000000000) RW Table 5-123. TI_RESERVED_CONTROL Device Address: 0x01 Register Address: 0x9002 Default: 0x1335 Bit Name Description 12:0 RESERVED For TI use only (Default 13’h1335) Access RW Table 5-124. TI_RESERVED_CONTROL Device Address: 0x01 Register Address: 0x9003 Default: 0x5E29 Bit Name Description 152:0 RESERVED For TI use only (Default 16’h5E29) Access RW Table 5-125. TI_RESERVED_CONTROL Device Address: 0x01 Register Address: 0x9004 Default: 0x007F Bit Name Description 12:0 RESERVED For TI use only (Default 7’h7F) Access RW Table 5-126. TI_RESERVED_CONTROL Device Address: 0x01 Register Address: 0x9005 Default: 0x0200 Bit Name Description 15:0 RESERVED For TI use only (Default 16’h0200) 98 Detailed Description Access RW Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Table 5-127. TI_RESERVED_CONTROL Device Address: 0x01 Register Address: 0x9006 Default: 0x0000 Bit Name Description 15:0 RESERVED For TI use only (Default 16’h0000) Access RW Table 5-128. TI_RESERVED_STATUS Device Address: 0x01 Register Address: 0x9010 Default: 0x0000 Bit Name Description Access 0 RESERVED For TI use only RO/LH Table 5-129. TI_RESERVED_STATUS Device Address: 0x01 Register Address: 0x9011 Default: 0xFFFD Bit Name Description 15:0 RESERVED For TI use only Access COR Table 5-130. TI_RESERVED_STATUS Device Address: 0x01 Register Address: 0x9012 Default: 0x0000 Bit Name Description 15:0 RESERVED For TI use only 5.6.1.3 Access RO PCS Registers The registers below can be accessed only in Clause 45 mode and with device address field set to 0x03 (DEVADD [4:0] = 5’b00011). Valid only when device is in 10GBASE-KR mode. Table 5-131. PCS_CONTROL Device Address: 0x03 Register Address: 0x0000 Default: 0x0000 Bit Name Description Access 15 PCS_RESET 1 = Resets datapath and MDIO registers of all channels. Equivalent to asserting RESET_N. 0 = Normal operation (Default 1’b0) RW/SC 14 PCS_LOOPBACK 1 = Enables PCS loopback 0 = Normal operation (Default 1’b0) Requires Auto Negotiation and Link Training to be disabled. RW 11 PCS_LP_MODE 1 = Enable power down mode 0 = Normal operation (Default 1’b0) RW Table 5-132. PCS_STATUS_1 Device Address: 0x03 Register Address: 0x0001 Default: 0x0002 Bit Name Description 7 PCS_FAULT 1 = Fault condition detected on either PCS TX or PCS RX 0 = No fault condition detected This bit is cleared after Register 3.8 is read and no fault condition occurs after 3.8 is read. Access 2 PCS_RX_LINK 1 = PCS receive link is up 0 = PCS receive link is down 1 PCS_LP_ABILITY Always reads 1. 1 = Supports low power mode 0 = Does not support low power mode RO/LL RO Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 RO 99 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com Table 5-133. PCS_STATUS_2 Device Address: 0x03 Register Address: 0x0001 Default: 0x0002 Bit Name Description 15:14 DEV_PRESENT Always reads 2’b10. 0x = No device responding at this address 10 = Device responding at this address 11 = No device responding at this address Access 11 PCS_TX_FAULT 1 = Fault condition detected on transmit path 0 = No fault condition detected on transmit path RO/LH 10 PCS_RX_FAULT 1 = Fault condition detected on receive path 0 = No fault condition detected on receive path RO/LH 0 PCS_10GBASER_CAPABLE Always reads 1. 1 = PCS is able to support 10GBASE-R PCS type 0 = PCS not able to support 10GBASE-R PCS type RO RO Table 5-134. KR_PCS_STATUS_1 Device Address: 0x03 Register Address: 0x0020 Default: 0x0004 Bit Name Description 12 PCS_RX_LINK_STATUS 1 = 10GBASE-R PCS receive link up 0 = 10GBASE-R PCS receive link down Access RO 2 PCS_PRBS31_ABILITY Always reads 1. 1 = PCS is able to support PRBS31 pattern testing 0 = PCS is not able to support PRBS31 testing RO 1 PCS_HI_BER 1 = High BER condition detected 0 = High BER condition not detected RO 0 PCS_BLOCK_LOCK 1 = PCS locked to receive blocks 0 = PCS not locked to receive blocks RO Table 5-135. KR_PCS_STATUS_2 Device Address: 0x03 Register Address: 0x0021 Default: 0x0000 Bit Name Description 15 PCS_BLOCK_LOCK_LL 1 = PCS locked to receive blocks 0 = PCS not locked to receive blocks Access RO/LL 14 PCS_HI_BER_LH 1 = High BER condition detected 0 = High BER condition not detected RO/LH 13:8 PCS_BER_COUNT[5:0] Value indicating number of times BER state machine enters BER_BAD_SH state COR 7:0 PCS_ERR_BLOCK_COUNT[7:0] Value indicating number of times RX decode state machine enters RX_E state. Same value is also reflected in 30.16 and reading either register clears the counter value. COR Table 5-136. PCS_TP_SEED_A0 Device Address: 0x03 Register Address: 0x0022 Default: 0x0000 Bit Name Description 15:0 PCS_TP_SEED_A[15:0] Test pattern seed A bits 15-0 Access RW Table 5-137. PCS_TP_SEED_A1 Device Address: 0x03 Register Address: 0x0023 Default: 0x0000 Bit Name Description 3.35.15:0 PCS_TP_SEED_A[31:16] Test pattern seed A bits 31-16 100 Detailed Description Access RW Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Table 5-138. PCS_TP_SEED_A2 Device Address: 0x03 Register Address: 0x0024 Default: 0x0000 Bit Name Description 15:0 PCS_TP_SEED_A[47:32] Test pattern seed A bits 47-32 Access RW Table 5-139. PCS_TP_SEED_A3 Device Address: 0x03 Register Address: 0x0025 Default: 0x0000 Bit Name Description 9:0 PCS_TP_SEED_A[57:48] Test pattern seed A bits 57-48 Access RW Table 5-140. PCS_TP_SEED_B0 Device Address: 0x03 Register Address: 0x0026 Default: 0x0000 Bit Name Description 15:0 PCS_TP_SEED_B[15:0] Test pattern seed B bits 15-0 Access RW Table 5-141. PCS_TP_SEED_B1 Device Address: 0x03 Register Address: 0x0027 Default: 0x0000 Bit Name Description 15:0 PCS_TP_SEED_B[31:16] Test pattern seed B bits 31-16 Access RW Table 5-142. PCS_TP_SEED_B2 Device Address: 0x03 Register Address: 0x0028 Default: 0x0000 Bit Name Description 15:0 PCS_TP_SEED_B[47:32] Test pattern seed B bits 47-32 Access RW Table 5-143. PCS_TP_SEED_B3 Device Address: 0x03 Register Address: 0x0029 Default: 0x0000 Bit Name Description 9:0 PCS_TP_SEED_B[57:48] Test pattern seed B bits 57-48 Access RW Table 5-144. PCS_TP_CONTROL Device Address: 0x03 Register Address: 0x002A Default: 0x0000 Bit Name Description 5 PCS_PRBS31_RX_TP_EN 1 = Enable PRBS31 test pattern verification on receive path 0 = Normal operation (Default 1’b0) Access RW 4 PCS_PRBS31_TX_TP_EN 1 = Enable PRBS31 test pattern generation on transmit path 0 = Normal operation (Default 1’b0) RW 3 PCS_TX_TP_EN 1 = Enable transmit test pattern generation 0 = Normal operation (Default 1’b0) RW 2 PCS_RX_TP_EN 1 = Enable receive test pattern verification 0 = Normal operation (Default 1’b0) RW 1 PCS_TP_SEL 1 = Square wave test pattern 0 = Pseudo random test pattern (Default 1’b0) RW 0 PCS_DP_SEL 1 = 0’S data pattern 0 = LF data pattern (Default 1’b0) RW Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 101 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com Table 5-145. PCS_TP_ERR_COUNT Device Address: 0x03 Register Address: 0x002B Default: 0x0000 Bit Name 15:0 PCS_TP_ERR_COUNT[15:0] Test pattern error counter. This counter reflects number of errors occurred during the test pattern mode selected through PCS_TP_CONTROL. In PRBS31 test pattern verification mode, counter value indicates the number of received bytes that have 1 or more bit errors. Description Access COR Table 5-146. PCS_VS_CONTROL Device Address: 0x03 Register Address: 0x8000 Default: 0x00B0 Bit Name Description 7:4 PCS_SQWAVE_N Sets number of repeating 0’s followed by repeating 1’s during square wave test pattern generation mode (Default 4’1011) Access RW 3 RESERVED For TI use only (Default 1’b0) RW 2 PCS_RX_DEC_CTRL_CHAR PCS RX Decode control character selection. Determines what control characters are passed 0 = A/K/R control characters are changed to Idles. Reserved characters passed through (Default 1’b0) 1 = A/K/R control characters are passed through as is RW RW 1 PCS_DESCR_DISABLE De-scrambler control in 10GKR RX PCS 1 = Disable descrambler 0 = Enable descrambler (Default 1’b0) RW 0 PCS_SCR_DISABLE Scrambler control in 10GKR TX PCS 1 = Disable scrambler 0 = Enable scrambler (Default 1’b0) RW Table 5-147. PCS_VS_STATUS Device Address: 0x03 Register Address: 0x8010 Default: 0x00FD Bit Name Description Access 13 UNCORR_ERR_STATUS 1 = Uncorrectable block error found RO/LH 12 CORR_ERR_STATUS 1 = Correctable block error found RO/LH 8 PCS_TP_ERR PCS test pattern verification status PCS_SCR_DISABLE 1 = Error occurred during pseudo random test pattern verification Number of errors can be checked by reading PCS_TP_ERR_COUNT (3.43) register RO/LH 7:0 RESERVED For TI use only. 5.6.1.4 COR Auto-Negotiation Registers The registers below can be accessed only in Clause 45 mode and with device address field set to 0x07 (DA[4:0] = 5’b00111) Table 5-148. AN_CONTROL Device Address: 0x07 Register Address: 0x0000 Default: 0x3000 Bit Name Description Access 15 AN_RESET 1 = Resets Auto Negotiation 0 = Normal operation (Default 1’b0) RW/SC 13 RESERVED For TI use only (Default 1’b1) RW 12 AN_ENABLE 1 = Enable Auto Negotiation (Default 1’b1) 0 = Disable Auto Negotiation RW 9 AN_RESTART 1 = Restart Auto Negotiation 0 = Normal operation (Default 1’b0) If set, a read of this register is required to clear AN_RESTART bit. (1) 102 RW/SC (1) If set, a read of register 7.0 is required to clear AN_RESTART bit. Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Table 5-149. AN_STATUS Device Address: 0x07 Register Address: 0x0001 Default: 0x0088 Bit Name Description Access 9 AN_PAR_DET_FAULT 1 = Fault has been detected via parallel detection function 0 = Fault has not been detected via parallel detection function RO/LH 7 AN_EXP_NP_STATUS 1 = Extended next page is used 0 = Extended next page is not allowed 6 AN_PAGE_RCVD 1 = A page has been received 0 = A page has not been received 5 AN_COMPLETE 1 = Auto Negotiation process is completed 0 = Auto Negotiation process not completed RO 4 REMOTE_FAULT Always reads 0. Fault condition status can be read at 7.1.9 and 7.1.2. RO 3 AN_ABILITY Always reads 1. 1 = Device is able to perform Auto Negotiation 0 = Device not able to perform Auto Negotiation RO 2 LINK_STATUS 1 = Link is up 0 = Link is down 0 AN_LP_ABILITY 1 = LP is able to perform Auto Negotiation 0 = LP not able to perform Auto Negotiation RO RO/LH RO/LL RO Table 5-150. AN_DEV_PACKAGE Device Address: 0x07 Register Address: 0x0005 Default: 0x0080 Bit Name Description 7 AN_PRESENT Always reads 1 1 = Auto Negotiation present in the package 0 = Auto Negotiation not present in the package Access RO Table 5-151. AN_ADVERTISEMENT_1 Device Address: 0x07 Register Address: 0x0010 Default: 0x1001 Bit Name Description Access 15 AN_NEXT_PAGE NP bit (D15) in base link codeword 1 = Next page available 0 = Next page not available (Default 1’b0) 14 AN_ACKNOWLEDGE Acknowledge bit (D14) in base link codeword. Always reads 0. RO 13 AN_REMOTE_FAULT RF bit (D13) in base link codeword 1 = Sets RF bit to 1 0 = Normal operation (Default 1’b0) RW 12:10 AN_CAPABILITY[2:0] Value to be set in D12:D10 bits of the base link codeword. Consists of abilities like PAUSE, ASM_DIR (Default 3’b100) RW 9:5 AN_ECHO_NONCE[4:0] Value to be set in D9:D5 bits of the base link codeword. Consists of Echo nonce value. Transmitted in base page only until local device and link Partner have exchanged unique Nonce values, at which time transmitted Echoed Nonce will change to Link Partner's Nonce value. Read value always reflects the value written, not the actual Echoed Nonce. (Default 5’b00000) RW 4:0 AN_SELECTOR[4:0] Value to be set in D4:D0 bits of the base link codeword. Consists of selector field value (Default 5’b00001) RW RW Table 5-152. AN_ADVERTISEMENT_2 Device Address: 0x07 Register Address: 0x0011 Default: 0x0080 Bit Name Description 15:8 AN_ABILITY[10:3] Value to be set in D31:D24 bits of the base link codeword. Consists of technology ability field bits [10:3] (Default 9’b000000000) Access RW 7 AN_ABILITY[2] Value to be set in D23 bits of the base link codeword. Consists of technology ability field bits [2]. When set, indicates device supports 10GBASE-KR (Default 1’b1) RW Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 103 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com Table 5-152. AN_ADVERTISEMENT_2 (continued) Device Address: 0x07 Register Address: 0x0011 Default: 0x0080 Bit Name Description Access 6 AN_ABILITY[1] Value to be set in D22 bits of the base link codeword. Consists of technology ability field bits [1]. Always set to 0 (Default 1’b0) RW 5 AN_ABILITY[0] Value to be set in D21 bits of the base link codeword. Consists of technology ability field bit [0]. When set, indicates device supports 1000BASE-KX (Default 1’b0) RW 4:0 AN_TRANS_NONCE_ FIELD[4:0] Not used. Transmitted Nonce field is generated by hardware random number generator. Read value always reflects value written, not the actual Transmitted Nonce (Default 5’b00000) RW Table 5-153. AN_ADVERTISEMENT_3 Device Address: 0x07 Register Address: 0x0012 Default: 0x4000 Bit Name Description 15 AN_FEC_REQUESTED Value to be set in D47 bits of the base link codeword. When set, indicates a request to enable FEC on the link (Default 1’b0) Access 14 AN_FEC_ABILITY Value to be set in D46 bits of the base link codeword. When set, indicates 10GBASE-KR has FEC ability (Default 1’b1) 13:0 AN_ABILITY[24:11] Value to be set in D45:D32 bits of the base link codeword. Consists of technology ability field bits [24:11] (Default 14’b00000000000000) RW Table 5-154. AN_LP_ADVERTISEMENT_1 (1) Device Address: 0x07 Register Address: 0x0013 Default: 0x0001 Bit Name Description 15 AN_LP_NEXT_PAGE NP bit (D15) in link partner base page 1 = Next page available in link partner 0 = Next page not available in link partner RO 14 AN_LP_ACKNOWLEDGE Acknowledge bit (D14) in link partner base page. RO 13 AN_LP_REMOTE_FAULT RF bit (D13) in link partner base page 1 = Remote fault detected in link partner 0 = Remote fault not detected in link partner RO 12:10 AN_ LP_CAPABILITY D12:D10 bits of the link partner base page. Consists of abilities like PAUSE, ASM_DIR RO 9:5 AN_ LP_ECHO_NONCE D9:D5 bits of the link partner base page. Consists of Echo nonce value RO 4:0 AN_LP_SELECTOR[4:0] D4:D0 bits of the link partner base page. Consists of selector field value Always reads 5’b00001 RO (1) Access To get accurate AN_LP_ADVERTISEMENT read value, Register 7.19 should be read first before reading 7.20 and 7.21 Table 5-155. AN_LP_ADVERTISEMENT_2 Device Address: 0x07 Register Address: 0x0014 Default: 0x0000 Bit Name Description 15:8 AN_ LP_ABILITY[10:3] D31:D24 bits of the link partner base page. Consists of technology ability field bits [10:3] 7 AN_LP_ABILITY[2] D23 bits of the link partner base page. Consists of technology ability field bits [2]. When high, indicates link partner supports 10GBASE-KR 6 AN_LP_ABILITY[1] D22 bits of the link partner base page. Consists of technology ability field bits [1]. 5 AN_LP_ABILITY[0] D21 bits of the link partner base page. Consists of technology ability field bit [0]. When high, indicates link partner supports 1000BASE-KX 4:0 AN_LP_TRANS_NONCE_ FIELD D20:D16 bits of the link partner base page. Consists of transmitted nonce value 104 Detailed Description Access RO Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Table 5-156. AN_LP_ADVERTISEMENT_3 Device Address: 0x07 Register Address: 0x0015 Default: 0x0000 Bit Name Description 15 AN_LP_FEC_REQUESTED D47 bits of the link partner base page. When high, indicates link partner request to enable FEC on the link Access 14 AN_LP_FEC_ABILITY D46 bits of the link partner base page. When high, indicates link partner has FEC ability 13:0 AN_LP_ABILITY[24:11] D45:D32 bits of the link partner base page. Consists of link partner technology ability field bits [24:11] RO Table 5-157. AN_XNP_TRANSMIT_1 Device Address: 0x07 Register Address: 0x0016 Default: 0x2000 Bit Name Description 15 AN_XNP_NEXT_PAGE NP bit (D15) in next page code word 1 = Next page available 0 = Next page not available (Default 1’b0) Access 14 RESERVED Always reads 0. RO 13 AN_MP Message page bit (D13) in next page code word 1 = Sets MP bit to 1 indicating next page is a message page (Default 1’b1) 0 = Sets MP bit to 0 indicating next page is unformatted next page RW 12 AN_ACKNOWLEDGE_2 Value to be set in D12 bit of the next page code word. When set, indicates device is able to act on the information defined in the message (Default 1’b0) RW 11 AN_TOGGLE Not used. Toggle value is generated by hardware. Read value always reflects value written, not the actual Toggle field (Default 1’b0) RW 10:0 AN_CODE_FIELD Value to be set in D10:D0 bits of the next page code word. Consists of Message/Unformatted code field value (Default 11’b00000000000) RW RW Table 5-158. AN_XNP_TRANSMIT_2 Device Address: 0x07 Register Address: 0x0017 Default: 0x0000 Bit Name Description Access 15:0 AN_MSG_CODE_1 Value to be set in D31:D16 bits of the next page code word. Consists of Message/Unformatted code field value (Default 16’b0000000000000000) RW Table 5-159. AN_XNP_TRANSMIT_3 Device Address: 0x07 Register Address: 0x0018 Default: 0x0000 Bit Name Description 15:0 AN_MSG_CODE_2 Value to be set in D47:D32 bits of the next page code word. Consists of Message/Unformatted code field value (Default 16’b0000000000000000) Access RW Table 5-160. AN_LP_XNP_ABILITY_1 (1) Device Address: 0x07 Register Address: 0x0019 Default: 0x0000 Bit Name Description 15 AN_LP_XNP_NEXT_PAGE NP bit (D15) in next page code word 1 = Next page available 0 = Next page not available (Default 1’b0) RO 14 AN_LP_XNP_ACKNOWLEDGE Value in D14 bit of the next page code word. When set, indicates device is able to act on the information defined in the message (Default 1’b0) RO 13 AN_LP_MP Message page bit (D13) in next page code word 1 = Sets MP bit to 1 indicating next page is a message page 0 = Sets MP bit to 0 indicating next page is unformatted next page (Default 1’b0) RO 12 AN_LP_ACKNOWLEDGE_2 Value in D12 bit of the next page code word. When set, indicates device is able to act on the information defined in the message (Default 1’b0) RO (1) Access To get accurate AN_LP_XNP_ABILITYT read value, Register 7.25 should be read first before reading 7.26 and 7.27 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 105 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com Table 5-160. AN_LP_XNP_ABILITY_1(1) (continued) Device Address: 0x07 Register Address: 0x0019 Default: 0x0000 Bit Name Description Access 11 AN_LP_TOGGLE Value of D11 bit of the next page code word. Consists of Toggle field value(Default 1’b0) RO 10:0 AN_ LP_CODE_FIELD Value in D10:D0 bits of the next page code word. Consists of Message/Unformatted code field value (Default 11’b00000000000) RO Table 5-161. AN_LP_XNP_ABILITY_2 Device Address: 0x07 Register Address: 0x001A Default: 0x0000 Bit Name Description 15:0 AN_LP_MSG_CODE_1 Value to be set in D31:D16 bits of the next page code word. Consists of Message/Unformatted code field value (Default 16’b0000000000000000) Access RO Table 5-162. AN_LP_XNP_ABILITY_3 Device Address: 0x07 Register Address: 0x001B Default: 0x0000 Bit Name Description Access 15:0 AN_LP_MSG_CODE_2 Value to be set in D47:D32 bits of the next page code word. Consists of Message/Unformatted code field value (Default 16’b0000000000000000) RO Table 5-163. AN_BP_STATUS Device Address: 0x07 Register Address: 0x0030 Default: 0x0001 Bit Name Description Access 4 AN_10G_KR_FEC 1 = PMA/PMD is negotiated to perform 10GBASE-KR FEC 3 AN_10G_KR 1 = PMA/PMD is negotiated to perform 10GBASE-KR 1 AN_1G_KX 1 = PMA/PMD is negotiated to perform 1000BASE-KX 0 AN_BP_AN_ABILITY Always reads 1. 1 = Indicates 1000BASE-KX, 10GBASE-KR is implemented RO Table 5-164. AN_VS_CONTROL Device Address: 0x03 Register Address: 0x0023 Default: 0x0000 Bit Name Description 7.32768.0 RESERVED For TI use only. (Default 1’b0) 5.6.2 Access RW 1G-KX Programmers Reference 5.6.2.1 Vendor Specific Device Registers The registers below can be accessed directly through Clause 22 and Clause 45. In Clause 45 mode, these registers can be accessed by setting device address field to 0x1E (DA[4:0] = 5’b11110). In Clause 22 mode, these registers can be accessed by setting 5 bit register address field to same value as 5 LSB bits of Register Address field specified for each register. For example, 16 bit register address 0x001C in clause 45 mode can be accessed by setting register address field to 5’h1C in clause 22 mode. 106 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Table 5-165. GLOBAL_CONTROL_1 (1) Device Address: 0x1E Register Address: 0x0000 Default: 0x0020 Bit Name Description 15 GLOBAL_RESET Global reset. 0 = Normal operation (Default 1’b0) 1 = Resets TX and RX data path including MDIO registers. Equivalent to asserting RESET_N. 11 GLOBAL_WRITE Global write enable. 0 = Control settings are specific to channel addressed (Default 1’b0) 1 = Control settings in channel specific registers are applied to all 4 channels regardless of channel addressed RW 5:0 PRBS_PASS_OVERLAY[5:0] PRBS_PASS pin status selection. Applicable only when PRBS test pattern verification is enabled on HS side or LS side. PRBS_PASS pin reflects PRBS verification status on selected Channel HS/LS side 1xx000 = PRBS_PASS reflects combined status of Channel A/B/C/D HS serdes PRBS verification. If PRBS verification fails on any channel HS serdes, PRBS_PASS will be asserted low. (Default 6’b100000) 000000 = Status from Channel A HS Serdes side 000100 = Status from Channel A LS Serdes side Lane 0 001000 = Status from Channel B HS Serdes side 001100 = Status from Channel B LS Serdes side Lane 0 010000 = Status from Channel C HS Serdes side 010100 = Status from Channel C LS Serdes side Lane 0 011000 = Status from Channel D HS Serdes side 011100 = Status from Channel D LS Serdes side Lane 0 Rest = NA RW (1) (2) Access RW SC (2) This global register is channel independent. After reset bit is set to one, it automatically sets itself back to zero on the next MDC clock cycle. Table 5-166. CHANNEL_CONTROL_1 Device Address: 0x1E Register Address: 0x0001 Default: 0x0B88 Bit Name Description 15 POWERDOWN Setting this bit high powers down entire data path with exception that MDIO interface stays active. 0 = Normal operation (Default 1’b0) 1 = Power Down mode is enabled. Access RW 14 HSRX_CLKOUT_POWERDOWN 0 = Normal operation (Default 1’b0) 1 = Enable HSRXx_CLKOUTP/N Power Down RW 11 SW_PCS_SEL Applicable in Clause 45 mode only. Valid only when MODE_SEL pin is 0, AN_ENABLE (7.0.12) is 0 and SW_DEV_MODE_SEL (30.1.10) is 0. 1 = NA (Default 1’b1) 0 = Set device to 1G-KX mode RW 10 SW_DEV_MODE_SEL Valid only when MODE_SEL pin is 0 1 = NA 0 = In clause 45 mode, device mode is set using Auto negotiation. In clause 22 mode, device set to 1G-KX mode(Default 1’b0) RW 7:4 HSRX_CLKOUT_DIV[3:0] Output clock divide setting. This value is used to divide selected clock (Selected using HSRX_CLKOUT_SEL) before giving it out onto respective channel HSRXx_CLKOUTP/N. 0000 = Divide by 1 0001 = RESERVED 0010 = RESERVED 0011 = RESERVED 0100 = Divide by 2 0101 = RESERVED 0110 = RESERVED 0111 = RESERVED 1000 = Divide by 4 (Default 4’b1000) 1001 = Divide by 8 1010 = Divide by 16 1011 = RESERVED 1100 = Divide by 5 1101 = Divide by 10 1110 = Divide by 20 1111 = Divide by 25 RW Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 107 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com Table 5-166. CHANNEL_CONTROL_1 (continued) Device Address: 0x1E Register Address: 0x0001 Default: 0x0B88 Bit Name Description Access 3 HSRX_CLKOUT_ EN Output clock enable. 0 = Holds HSRXx_CLKOUTP/N output to a fixed value. 1 = Allows HSRXx_CLKOUTP/N output to toggle normally (Default 1’b1) RW 2 HSRX_CLKOUT_SEL Output clock select. Selected Recovered clock sent out on HSRXx_CLKOUTP/N pins 0 = Selects respective Channel HSRX recovered byte clock as output clock (Default 1’b0) 1 = Selects respective Channel HSRX VCO divide by 2 clock as output clock RW 1 REFCLK_SW_SEL Channel HS Reference clock selection. Applicable only when REFCLK_SEL pin is LOW. 0 = Selects REFCLK_0_P/N as clock reference to Channel x HS side serdes macro(Default 1’b0) 1 = Selects REFCLK_1_P/N as clock reference to Channel x HS side serdes macro RW 0 LS_REFCLK_SEL Channel LS Reference clock selection. 0 = LS side serdes macro reference clock is same as HS side serdes reference clock (E.g. If REFCLK_0_P/N is selected as HS side serdes macro reference clock, REFCLK_0_P/N is selected as LS side serdes macro reference clock and vice versa) (Default 1’b0) 1 = Alternate reference clock is selected as clock reference to Channel x LS side serdes macro (E.g. If REFCLK_0_P/N is selected as HS side serdes macro reference clock, REFCLK_1_P/N is selected as LS side serdes macro reference clock and vice versa) RW Table 5-167. HS_SERDES_CONTROL_1 Device Address: 0x1E Register Address: 0x0002 Default: 0x811D Bit Name Description 15:10 RESERVED For TI use only (Default 9’b100000) Access 9:8 HS_LOOP BANDWIDTH[1:0] HS Serdes PLL Loop Bandwidth settings 00 = Reserved 01 = Narrow bandwidth (Default 2’b01) 10 = Medium bandwidth 11 = Highest bandwidth. 7 RESERVED For TI use only (Default 1’b0) 6 RESERVED For TI use only (Default 1’b0) 5 RESERVED For TI use only (Default 1’b0) 4 HS_ENPLL HS Serdes PLL enable control. HS Serdes PLL is automatically disabled when PD_TRXx_N is asserted LOW or when register bit 30.1.15 is set HIGH. 0 = Disables PLL in HS serdes 1 = Enables PLL in HS serdes (Default 1’b1) 3:0 HS_PLL_MULT[3:0] HS Serdes PLL multiplier setting (Default 4’b1101). Refer to Table 5-23. This setting is automatically controlled and value set through these register bits is ignored unless REFCLK_FREQ_SEL_1 or related OVERRIDE bit is set. See 1GKX supported rates for more information on valid PLL multiplier settings RW RW Table 5-168. HS PLL Multiplier Control 30.2.3:0 108 30.2.3:0 Value PLL Multiplier factor Value PLL Multiplier factor 0000 Reserved 1000 12x 0001 Reserved 1001 12.5x 0010 4x 1010 15x 0011 5x 1011 16x 0100 6x 1100 16.5x 0101 8x 1101 20x 0110 8.25x 1110 25x Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 TLK10034 www.ti.com SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 Table 5-168. HS PLL Multiplier Control (continued) 30.2.3:0 30.2.3:0 Value PLL Multiplier factor Value PLL Multiplier factor 0111 10x 1111 Reserved Table 5-169. HS_ SERDES_CONTROL_2 Device Address: 0x1E Register Address: 0x0003 Default: 0x8848 Bit Name Description 15:12 HS_SWING[3:0] Transmitter Output swing control for HS Serdes. (Default 4’b1000) Refer to Table 5-25. Access RW 11 HS_ENTX HS Serdes transmitter enable control. HS Serdes transmitter is automatically disabled when PD_TRXx_N is asserted LOW or when register bit 30.1.15 is set HIGH. 0 = Disables HS serdes transmitter 1 = Enables HS serdes transmitter (Default 1’b1) RW 10 HS_EQHLD HSRX Equalizer hold control 0 = Normal operation (Default 1’b0) 1 = Holds equalizer and long tail correction in its current state RW 9:8 HS_RATE_TX [1:0] HS Serdes TX rate settings. This setting is automatically controlled and value set through these register bits is ignored unless REFCLK_FREQ_SEL_1 or related OVERRIDE bit is set. 00 = Full rate (Default 2’b00) 01 = Half rate 10 = Quarter rate 11 = Eighth rate RW 7:4 RESERVED For TI use only (Default 4’b0100) RW 3 HS_ENRX HS Serdes receiver enable control. HS Serdes receiver is automatically disabled when PD_TRXx_N is asserted LOW or when register bit 30.1.15 is set HIGH. 0 = Disables HS serdes receiver 1 = Enables HS serdes receiver (Default 1’b1) RW 2:0 HS_RATE_RX [2:0] HS Serdes RX rate settings. This setting is automatically controlled and value set through these register bits is ignored unless REFCLK_FREQ_SEL_1 or related OVERRIDE bit is set. 000 = Full rate (Default 3’b000) 101 = Half rate 110 = Quarter rate 111 = Eighth rate 001 = Reserved 01x = Reserved 100 = Reserved RW Table 5-170. HSTX AC Mode Output Swing Control Value 30.3[15:12] AC Mode Typical Amplitude (mVdfpp) 0000 130 0001 220 0010 300 0011 390 0100 480 0101 570 0110 660 0111 750 1000 830 1001 930 1010 1020 1011 1110 Detailed Description Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TLK10034 109 TLK10034 SLLSEC7A – AUGUST 2012 – REVISED OCTOBER 2015 www.ti.com Table 5-170. HSTX AC Mode Output Swing Control (continued) Value 30.3[15:12] AC Mode Typical Amplitude (mVdfpp) 1100 1180 1101 1270 1110 1340 1111 1400 Table 5-171. HS_SERDES_CONTROL_3 Device Address: 0x1E Register Address: 0x0004 Default: 0x1400 Bit Name Description 15 HS_ENTRACK HSRX ADC Track mode 0 = Normal operation (Default 1’b0) 1 = Forces ADC into track mode Access RW 14:12 HS_EQPRE[2:0] Serdes Rx precursor equalizer selection 000 = 1/9 cursor amplitude 001 = 3/9 cursor amplitude (Default 3’b001) 010 = 5/9 cursor amplitude 011 = 7/9 cursor amplitude 100 = 9/9 cursor amplitude 101 = 11/9 cursor amplitude 110 = 13/9 cursor amplitude 111 = Disable RW 11:10 HS_CDRFMULT[1:0] Clock data recovery algorithm frequency multiplication selection 00 = First order. Frequency offset thracking disabled 01 = Second order. 1x mode 10 = Second order. 2x mode (Default 2’b10) 11 = Reserved RW 9:8 HS_CDRTHR[1:0] Clock data recovery algorithm frequency threshold selection 00 = Four vote threshold (Default 2'b00) 01 = Eight vote threshold 10 = Sixteen vote threshold 11 = Thirty two vote threshold RW 7 RESERVED For TI use only (Default 1’b0) RW 6 HS_PEAK_DISABLE HS Serdes PEAK_DISABLE control 0 = Normal operation (Default 1’b0) 1 = Disables high frequency peaking. Suitable for
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