FemtoClock® Crystal-to-3.3V LVPECL
Frequency Synthesizer With/Integrated Fanout Buffer
843256
DATASHEET
GENERAL DESCRIPTION
FEATURES
The 843256 is a Crystal-to-3.3V LVPECL Clock Synthesizer/Fanout
Buffer designed for Fibre Channel and Gigabit Ethernet applications.
The output frequency can be set using the frequency select pins and
a 25MHz crystal for Ethernet frequencies, or a 19.44MHz crystal for
SONET. The low phase noise characteristics of the 843256 make it
an ideal clock for these demanding applications.
• Six 3.3V differential LVPECL output pairs
• Output frequency range: 62.5MHz to 625MHz
• Crystal input frequency range: 15.625MHz to 25.5MHz
• RMS phase jitter at 156.25MHz, using a 25MHz crystal
(1.875MHz to 20MHz): 0.41ps (typical) @ 3.3V
• Operating supply modes:
Core/Output
3.3V/3.3V
3.3V/2.5V
• 0°C to 70°C ambient operating temperature
• Available in lead-free (RoHS 6) package
SELECT FUNCTION TABLE
Inputs
Function
FB_SEL
N_SEL1
N_SEL0
M Divide
N Divide
M/N
0
0
0
25
1
25
0
0
1
25
2
12.5
0
1
0
25
4
6.25
0
1
1
25
5
5
1
0
0
32
1
32
1
0
1
32
2
16
1
1
0
32
4
8
1
1
1
32
8
4
Q0
BLOCK DIAGRAM
PIN ASSIGNMENT
nQ0
PLL_BYPASS
Pullup
Q1
1
XTAL_IN
OSC
PLL
0
N
Output
Divider
XTAL_OUT
N_SEL1
N_SEL0
Q2
nQ2
Q3
M
Feedback
Divider
FB_SEL
nQ1
nQ3
Pulldown
Q4
Pullup
nQ4
Pullup
24-Lead TSSOP, E-Pad
4.40mm x 7.8mm x 0.92mm
body package
G Package
Top View
Q5
nQ5
843256 REVISION B DECEMBER 18, 2014
1
©2014 Integrated Device Technology, Inc.
843256 DATA SHEET
TABLE 1. PIN DESCRIPTIONS
Number
Name
Type
Description
1, 2
VCCO
Power
Output supply pins.
3, 4
nQ2, Q2
Output
Differential output pair. LVPECL interface levels.
5, 6
nQ1, Q1
Output
Differential output pair. LVPECL interface levels.
7, 8
nQ0, Q0
Output
Differential output pair. LVPECL interface levels.
Selects between the PLL and crystal inputs as the input to the dividers.
When LOW, selects PLL. When HIGH, selects XTAL_IN, XTAL_OUT.
LVCMOS / LVTTL interface levels.
9
PLL_BYPASS
Input
Pullup
10
VCCA
Power
Analog supply pin.
11
VCC
Power
Core supply pin.
Input
12
FB_SEL
13,
14
15,
18
XTAL_IN, XTAL_
OUT
N_SEL0
N_SEL1
Pulldown
16, 17
VEE
19, 20
nQ5, Q5
Output
Differential output pair. LVPECL interface levels.
21, 22
nQ4, Q4
Output
Differential output pair. LVPECL interface levels.
23, 24
nQ3, Q3
Output
Differential output pair. LVPECL interface levels.
Input
Input
Feedback frequency select pin. LVCMOS/LVTTL interface levels.
Crystal oscillator interface. XTAL_IN is the input.
XTAL_OUT is the output.
Pullup
Output frequency select pin. LVCMOS/LVTTL interface levels.
Negative supply pin.
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
TABLE 2. PIN CHARACTERISTICS
Symbol
Parameter
CIN
Input Capacitance
4
pF
RPULLDOWN
Input Pulldown Resistor
51
kΩ
RPULLUP
Input Pullup Resistor
51
kΩ
FemtoClock® Crystal-to-3.3V LVPECL
Frequency Synthesizer With/Integrated Fanout Buffer
Test Conditions
2
Minimum
Typical
Maximum
Units
REVISION B 12/18/14
843256 DATA SHEET
TABLE 3. CRYSTAL FUNCTION TABLE
Inputs
XTAL (MHz)
FB_SEL
Function
N_SEL1
N_SEL0
M
VCO (MHz)
N
Output (MHz)
20
0
0
0
25
500
1
500
20
0
0
1
25
500
2
250
20
0
1
0
25
500
4
125
20
0
1
1
25
500
5
100
21.25
0
1
1
25
531.25
5
106.25
24
0
0
0
25
600
1
600
24
0
0
1
25
600
2
300
24
0
1
0
25
600
4
150
24
0
1
1
25
600
5
120
25
0
0
0
25
625
1
625
25
0
0
1
25
625
2
312.5
25
0
1
0
25
625
4
156.25
25
0
1
1
25
625
5
125
25.5
0
1
0
25
637.5
4
159.375
15.625
1
1
1
32
500
8
62.5
18.5625
1
1
1
32
594
8
74.25
18.75
1
0
0
32
600
1
600
18.75
1
0
1
32
600
2
300
18.75
1
1
0
32
600
4
150
18.75
1
1
1
32
600
8
75
19.44
1
0
0
32
622.08
1
622.08
19.44
1
0
1
32
622.08
2
311.04
19.44
1
1
0
32
622.08
4
155.52
19.44
1
1
1
32
622.08
8
77.76
19.53125
1
0
0
32
625
1
625
19.53125
1
0
1
32
625
2
312.5
19.53125
1
1
0
32
625
4
156.25
19.53125
1
1
1
32
625
8
78.125
20
1
1
1
32
640
8
80
REVISION B 12/18/14
3
FemtoClock® Crystal-to-3.3V LVPECL
Frequency Synthesizer With/Integrated Fanout Buffer
843256 DATA SHEET
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VCC
4.6V
Inputs, VI
-0.5V to VCC + 0.5V
Outputs, IO
Continuous Current
Surge Current
50mA
100mA
Package Thermal Impedance, θJA
37°C/W (0 mps)
Storage Temperature, TSTG
-65°C to 150°C
N OT E : S t r e s s e s b eyo n d t h o s e l i s t e d u n d e r A b s o l u t e
Maximum Ratings may cause permanent damage to the
device. These ratings are stress specifications only. Functional
operation of product at these conditions or any conditions beyond
those listed in the DC Characteristics or AC Characteristics is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability.
TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VCC = VCCO = 3.3V±5%, TA = 0°C TO 70°C
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
VCC
Core Supply Voltage
3.135
3.3
3.465
V
VCCA
VCCO
Analog Supply Voltage
V– 0.12
3.3
3.465
V
Output Supply Voltage
3.135
3.3
3.465
V
IEE
Power Supply Current
190
mA
ICCA
Analog Supply Current
12
mA
cc
TABLE 4B. POWER SUPPLY DC CHARACTERISTICS, VCC = 3.3V±5%, VCCO = 2.5V±5%, TA = 0°C TO 70°C
Symbol
Parameter
VCC
Core Supply Voltage
VCCA
VCCO
IEE
ICCA
Test Conditions
Minimum
Typical
Maximum
Units
3.135
3.3
3.465
V
Analog Supply Voltage
V– 0.12
3.3
3.465
V
Output Supply Voltage
2.375
2.5
2.625
V
Power Supply Current
190
mA
Analog Supply Current
12
mA
cc
TABLE 4C. LVCMOS / LVTTL DC CHARACTERISTICS, VCC = 3.3V±5%, VCCO = 3.3V±5% OR 2.5V±5%, TA = 0°C TO 70°C
Symbol
Parameter
Maximum
Units
VIH
Input High Voltage
Test Conditions
2
VCC + 0.3
V
VIL
Input Low Voltage
-0.3
0.8
V
FB_SEL
VCC = VIN = 3.465V
150
µA
IIH
Input High Current
PLL_BYPASS,
N_SEL0, N_SEL1
VCC = VIN = 3.465V
5
µA
FB_SEL
VCC = 3.465V, VIN = 0V
-5
µA
IIL
Input Low Current
PLL_BYPASS,
N_SEL0, N_SEL1
VCC = 3.465V, VIN = 0V
-150
µA
FemtoClock® Crystal-to-3.3V LVPECL
Frequency Synthesizer With/Integrated Fanout Buffer
4
Minimum
Typical
REVISION B 12/18/14
843256 DATA SHEET
TABLE 4D. LVPECL DC CHARACTERISTICS, VCC = 3.3V±5%, VCCO = 3.3V±5% OR 2.5V±5%, TA = 0°C TO 70°C
Symbol
Parameter
Test Conditions
VOH
Output High Voltage; NOTE 1
VOL
Output Low Voltage; NOTE 1
VSWING
Peak-to-Peak Output Voltage Swing
Minimum
Typical
Maximum
Units
V - 1.4
V - 0.9
V
V - 2.0
V - 1.7
V
0.6
1.0
V
CCO
CCO
CCO
CCO
NOTE 1: Outputs terminated with 50 to VCCO - 2V.
Ω
TABLE 5. CRYSTAL CHARACTERISTICS
Parameter
Test Conditions
Minimum
Mode of Oscillation
Typical Maximum
Units
Fundamental
Frequency
15.625
25.5
MHz
Equivalent Series Resistance (ESR)
50
Ω
Shunt Capacitance
7
pF
Drive Level
1
mW
Maximum
Units
625
MHz
NOTE: Characterized using an 18pF parallel resonant crystal.
TABLE 6A. AC CHARACTERISTICS, VCC = VCCO = 3.3V±5%, TA = 0°C TO 70°C
Symbol
Parameter
FOUT
Output Frequency
tjit(Ø)
RMS Phase Jitter (Random)
tsk(o)
Output Skew; NOTE 1, 2
tR / tF
Output Rise/Fall Time
odc
Output Duty Cycle
tLOCK
PLL Lock Time
Test Conditions
Minimum
Typical
62.5
156.25MHz, Integration Range:
1.875MHz - 20MHz
156.25MHz, Integration Range:
12kHz - 20MHz
0.41
ps
0.85
ps
40
ps
20% to 80%
200
650
ps
F ≤ 312.5MHz
47
53
%
F > 312.5MHz
45
OUT
OUT
55
%
20
ms
Maximum
Units
625
MHz
See Parameter Measurement Information section.
NOTE 1: Defined as skew between outputs at the same supply voltage and with equal load conditions.
Measured at the output differential crossing points.
NOTE 2: This parameter is defined in accordance with JEDEC Standard 65.
TABLE 6B. AC CHARACTERISTICS, VCC = 3.3V±5%, VCCO = 2.5V±5%, TA = 0°C TO 70°C
Symbol
Parameter
FOUT
Output Frequency
tjit(Ø)
RMS Phase Jitter (Random)
tsk(o)
Output Skew; NOTE 1, 2
tR / tF
Output Rise/Fall Time
odc
Output Duty Cycle
tLOCK
PLL Lock Time
Test Conditions
Minimum
Typical
62.5
156.25MHz, Integration Range:
1.875MHz - 20MHz
156.25MHz, Integration Range:
12kHz - 20MHz
20% to 80%
0.41
ps
0.85
ps
45
ps
200
650
ps
46
54
%
20
ms
For NOTES, please see Table 6A above.
REVISION B 12/18/14
5
FemtoClock® Crystal-to-3.3V LVPECL
Frequency Synthesizer With/Integrated Fanout Buffer
843256 DATA SHEET
➤
TYPICAL PHASE NOISE AT 156.25MHZ @ 3.3V
Ethernet Filter
156.25MHz
Raw Phase Noise Data
➤
➤
NOISE POWER dBc
Hz
RMS Phase Jitter (Random)
1.875MHz to 20MHz = 0.41ps (typical)
Phase Noise Result by adding
Ethernet Filter to raw data
OFFSET FREQUENCY (HZ)
FemtoClock® Crystal-to-3.3V LVPECL
Frequency Synthesizer With/Integrated Fanout Buffer
6
REVISION B 12/18/14
843256 DATA SHEET
PARAMETER MEASUREMENT INFORMATION
3.3V CORE/3.3V OUTPUT LOAD AC TEST CIRCUIT
3.3V CORE/2.5V OUTPUT LOAD AC TEST CIRCUIT
OUTPUT SKEW
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
RMS PHASE JITTER
OUTPUT RISE/FALL TIME
REVISION B 12/18/14
7
FemtoClock® Crystal-to-3.3V LVPECL
Frequency Synthesizer With/Integrated Fanout Buffer
843256 DATA SHEET
APPLICATION INFORMATION
POWER SUPPLY FILTERING TECHNIQUES
As in any high speed analog circuitry, the power supply pins are
vulnerable to random noise. The 843256 provides separate power
supplies to isolate any high switching noise from the outputs to the
internal PLL. VCC, VCCA, and VCCO should be individually connected to
the power supply plane through vias, and bypass capacitors should
be used for each pin. To achieve optimum jitter performance, power
supply isolation is required. Figure 1 illustrates how a 10Ω resistor
along with a 10μF and a .01μF bypass capacitor should be connected to each VCCA pin.
3.3V
VCC
.01μF
10Ω
VCCA
.01μF
10μF
FIGURE 1. POWER SUPPLY FILTERING
RECOMMENDATIONS FOR UNUSED INPUT AND OUTPUT PINS
OUTPUTS:
INPUTS:
LVCMOS CONTROL PINS
LVPECL OUTPUTS
All control pins have internal pull-ups or pull-downs; additional
resistance is not required but can be added for additional
protection. A 1kΩ resistor can be used.
All unused LVPECL outputs can be left floating. We recommend
that there is no trace attached. Both sides of the differential output
pair should either be left floating or terminated.
CRYSTAL INPUT INTERFACE
The 843256 has been characterized with 18pF parallel resonant
crystals. The capacitor values shown in Figure 2 below were
determined using an 18pF parallel resonant crystal and
were chosen to minimize the ppm error.
XTAL_IN
C1
18p
X1
18pF Parallel Crystal
XTAL_OUT
C2
22p
FIGURE 2. CRYSTAL INPUt INTERFACE
FemtoClock® Crystal-to-3.3V LVPECL
Frequency Synthesizer With/Integrated Fanout Buffer
8
REVISION B 12/18/14
843256 DATA SHEET
LVCMOS TO XTAL INTERFACE
impedance of the driver (Ro) plus the series resistance (Rs) equals
the transmission line impedance. In addition, matched termination
at the crystal input will attenuate the signal in half. This can be done
in one of two ways. First, R1 and R2 in parallel should equal the
transmission line impedance. For most 50Ω applications, R1 and
R2 can be 100Ω. This can also be accomplished by removing R1
and making R2 50Ω.
The XTAL_IN input can accept a single-ended LVCMOS signal
through an AC coupling capacitor. A general interface diagram
is shown in Figure 3 The XTAL_OUT pin can be left floating. The
input edge rate can be as slow as 10ns. For LVCMOS inputs, it is
recommended that the amplitude be reduced from full swing to
half swing in order to prevent signal interference with the power
rail and to reduce noise. This configuration requires that the output
VDD
VDD
R1
Ro
Rs
.1uf
Zo = 50
Zo = Ro + Rs
XTAL_IN
R2
XTAL_OUT
FIGURE 3. GENERAL DIAGRAM FOR LVCMOS DRIVER TO XTAL INPUT INTERFACE
TERMINATION FOR LVPECL OUTPUTS
The clock layout topology shown below is a typical termination for
LVPECL outputs. The two different layouts mentioned are recommended only as guidelines.
lines. Matched impedance techniques should be used to maximize
operating frequency and minimize signal distortion. Figures 4A
and 4B show two different layouts which are recommended only
as guidelines. Other suitable clock layouts may exist and it would
be recommended that the board designers simulate to guarantee
compatibility across all printed circuit and clock component process
variations.
FOUT and nFOUT are low impedance follower outputs that generate
ECL/LVPECL compatible outputs. Therefore, terminating resistors
(DC current path to ground) or current sources must be used for
functionality. These outputs are designed to drive 50Ω transmission
FIGURE 4A. LVPECL OUTPUT TERMINATION
REVISION B 12/18/14
FIGURE 4B. LVPECL OUTPUT TERMINATION
9
FemtoClock® Crystal-to-3.3V LVPECL
Frequency Synthesizer With/Integrated Fanout Buffer
843256 DATA SHEET
TERMINATION FOR 2.5V LVPECL OUTPUT
Figure 5A and Figure 5B show examples of termination for 2.5V
LVPECL driver. These terminations are equivalent to terminat-ing
50Ω to VCC - 2V. For VCC = 2.5V, the VCC - 2V is very close to ground
2.5V
VCCO=2.5V
Zo = 50 Ohm
R1
250
level. The R3 in Figure 5B can be eliminated and the termination
is shown in Figure 5C.
2.5V
2.5V
VCCO=2.5V
R3
250
Zo = 50 Ohm
+
+
Zo = 50 Ohm
Zo = 50 Ohm
-
2,5V LVPECL
Driv er
R2
62.5
2,5V LVPECL
Driv er
R4
62.5
R1
50
R2
50
R3
18
FIGURE 5B. 2.5V LVPECL DRIVER TERMINATION EXAMPLE
FIGURE 5A. 2.5V LVPECL DRIVER TERMINATION EXAMPLE
2.5V
VCCO=2.5V
Zo = 50 Ohm
+
Zo = 50 Ohm
2,5V LVPECL
Driv er
R1
50
R2
50
FIGURE 5C. 2.5V LVPECL TERMINATION EXAMPLE
FemtoClock® Crystal-to-3.3V LVPECL
Frequency Synthesizer With/Integrated Fanout Buffer
10
REVISION B 12/18/14
843256 DATA SHEET
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the 843256.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the 843256 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
·
·
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 190mA = 658.35mW
Power (outputs)MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 6 * 30mW = 180mW
Total Power_MAX (3.465V, with all outputs switching) = 658;.35mW + 180mW = 838.35mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming no air flow
and a multi-layer board, the appropriate value is 37°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.838W * 37°C/W = 101°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 7B. THERMAL RESISTANCE θJA FOR 24-PIN TSSOP, E-PAD FORCED CONVECTION
θJA by Velocity (Meters per Second)
Multi-Layer PCB, JEDEC Standard Test Boards
REVISION B 12/18/14
0
1
2.5
37°C/W
31°C/W
30°C/W
11
FemtoClock® Crystal-to-3.3V LVPECL
Frequency Synthesizer With/Integrated Fanout Buffer
843256 DATA SHEET
3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load.
LVPECL output driver circuit and termination are shown in Figure 6.
FIGURE 6. LVPECL DRIVER CIRCUIT AND TERMINATION
To calculate worst case power dissipation into the load, use the following equations which assume a 50Ω load, and a termination
voltage of VCCO- 2V.
•
For logic high, VOUT = VOH_MAX = VCCO_MAX – 0.9V
(VCCO_MAX - VOH_MAX) = 0.9V
•
For logic low, VOUT = VOL_MAX = VCCO_MAX – 1.7V
(VCCO_MAX - VOL_MAX) = 1.7V
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = [(VOH_MAX – (VCCO_MAX - 2V))/RL] * (VCCO_MAX - VOH_MAX) = [(2V - (VCCO_MAX - VOH_MAX))/RL] * (VCCO_MAX - VOH_MAX) =
[(2V - 0.9V)/50Ω] * 0.9V = 19.8mW
Pd_L = [(VOL_MAX – (VCCO_MAX - 2V))/RL] * (VCCO_MAX - VOL_MAX) = [(2V - (VCCO_MAX - VOL_MAX))/RL] * (VCCO_MAX - VOL_MAX) =
[(2V - 1.7V)/50Ω] * 1.7V = 10.2mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 30mW
FemtoClock® Crystal-to-3.3V LVPECL
Frequency Synthesizer With/Integrated Fanout Buffer
12
REVISION B 12/18/14
843256 DATA SHEET
RELIABILITY INFORMATION
TABLE 8. θJAVS. AIR FLOW TABLE FOR 24 LEAD TSSOP, E-PAD
θJA by Velocity (Meters per Second)
Multi-Layer PCB, JEDEC Standard Test Boards
0
1
2.5
37°C/W
31°C/W
30°C/W
TRANSISTOR COUNT
The transistor count for 843256 is: 3863
REVISION B 12/18/14
13
FemtoClock® Crystal-to-3.3V LVPECL
Frequency Synthesizer With/Integrated Fanout Buffer
843256 DATA SHEET
PACKAGE OUTLINE - G SUFFIX FOR 24 LEAD TSSOP, E-PAD
TABLE 9. PACKAGE DIMENSIONS
SYMBOL
Millimeters
Minimum
N
Nominal
Maximum
24
A
--
A1
0.05
A2
0.85
b
0.19
b1
0.19
c
0.09
c1
0.09
0.127
0.16
D
7.70
7.80
7.90
E
E1
0.15
0.90
0.95
0.30
0.22
0.25
0.20
6.40 BASIC
4.30
e
L
1.10
4.40
4.50
0.65 BASIC
0.50
0.60
0.70
P
5.0
P1
α
3.2
0°
8°
aaa
0.076
bbb
0.10
Reference Document: JEDEC Publication 95, MO-153
FemtoClock® Crystal-to-3.3V LVPECL
Frequency Synthesizer With/Integrated Fanout Buffer
14
REVISION B 12/18/14
843256 DATA SHEET
TABLE 10. ORDERING INFORMATION
Part/Order Number
Marking
Package
Shipping Packaging
Temperature
ICS843256BGLF
ICS843256BGLF
24 Lead “Lead-Free” TSSOP, E-Pad
tube
0°C to 70°C
ICS843256BGLFT
ICS843256BGLF
24 Lead “Lead-Free” TSSOP, E-Pad
tape & reel
0°C to 70°C
NOTE: Parts that are ordered with an “LF” suffix to the part number are the Pb-Free configuration and are RoHS compliant.
REVISION B 12/18/14
15
FemtoClock® Crystal-to-3.3V LVPECL
Frequency Synthesizer With/Integrated Fanout Buffer
Corporate Headquarters
6024 Silver Creek Valley Road
San Jose, California 95138
Sales
800-345-7015 or +408-284-8200
Fax: 408-284-2775
www.IDT.com
Technical Support
email: clocks@idt.com
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in
this document, including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined
in the independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT’s products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others.
This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties.
IDT’s products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Other trademarks and service marks used herein, including protected names, logos and designs, are the property of IDT or
their respective third party owners.
Copyright 2014. All rights reserved.
IMPORTANT NOTICE AND DISCLAIMER
RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL
SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING
REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND
OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED,
INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A
PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible
for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3)
ensuring your application meets applicable standards, and any other safety, security, or other requirements. These
resources are subject to change without notice. Renesas grants you permission to use these resources only for
development of an application that uses Renesas products. Other reproduction or use of these resources is strictly
prohibited. No license is granted to any other Renesas intellectual property or to any third party intellectual property.
Renesas disclaims responsibility for, and you will fully indemnify Renesas and its representatives against, any claims,
damages, costs, losses, or liabilities arising out of your use of these resources. Renesas' products are provided only subject
to Renesas' Terms and Conditions of Sale or other applicable terms agreed to in writing. No use of any Renesas resources
expands or otherwise alters any applicable warranties or warranty disclaimers for these products.
(Rev.1.0 Mar 2020)
Corporate Headquarters
Contact Information
TOYOSU FORESIA, 3-2-24 Toyosu,
Koto-ku, Tokyo 135-0061, Japan
www.renesas.com
For further information on a product, technology, the most
up-to-date version of a document, or your nearest sales
office, please visit:
www.renesas.com/contact/
Trademarks
Renesas and the Renesas logo are trademarks of Renesas
Electronics Corporation. All trademarks and registered
trademarks are the property of their respective owners.
© 2020 Renesas Electronics Corporation. All rights reserved.