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9DB1904BKLFT

9DB1904BKLFT

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    VFQFN-72

  • 描述:

    IC CLK FANOUT/BUFF ZD 72VFQFN

  • 数据手册
  • 价格&库存
9DB1904BKLFT 数据手册
Datasheet 9DB1904B 19 Output Differential Buffer for PCIe Gen2 and QPI Description Features/Benefits The 9DB1904 is electrically compatible to the Intel DB1900GS • Differential Buffer Specification. This buffer provides 19 output clocks for PCI-Express Gen2 or Intel QPI 6.4GT/s applications. A differential clock from a CK410B+ main clock generator, such as the • ICS932S421 drives the 9DB1904. The 9DB1904 can provide • outputs up to 400MHz in Bypass Mode. • Recommended Application 19 Output Differential Buffer for PCIe Gen2 and QPI • Key Specifications • DIF output cycle-to-cycle jitter < 50ps DIF output-to-output skew < 150ps across all outputs Functionality at Power Up (PLL Mode) CLK_IN 100M_133M# MHz 1 100MHz 0 133MHz OUTPUTS PLL State ON OFF DIF_14 DIF_14# DIF/DIF# Running Hi-Z CKPWRGD_PD# DIF_15 DIF_15# OE15_16# DIF_ 16 DIF_16# VDD DIF_17 DIF_17# DIF_18 DIF_18# OE17_18# CLK_IN GND INPUTS CKPWRGD_ CLK_IN/ PD# CLK_IN# 1 Running 0 X DIF_(18:0) MHz CLK_IN CLK_IN SMB_A2_PLLBYP# Pin Configuration Power Down Functionality CLK_IN# • • Power up default is all outputs in 1:1 mode/No SMBus programming Spread spectrum compatible/EMI reductions Supports output frequencies up to 400 MHz in bypass mode/flexible fanout buffer 8 Selectable SMBus addresses/no SMBus segmentation required SMBus address determines PLL or Bypass mode/pin savings Dedicated VDDA and CKPWRGD_PD# pins/easy board design 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 IREF GNDA VDDA HIGH_BW# 100M_133M#_LV DIF_0 DIF_0# DIF_1 DIF_1# GND VDD DIF_2 DIF_2# DIF_3 DIF_3# DIF_4 DIF_4# OE_01234# 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 9DB1904BKLF OE14# DIF_13# DIF_13 OE13# DIF_12# DIF_12 OE12# VDD GND DIF_11# DIF_11 OE11# DIF_10# DIF_10 OE10# DIF_9# DIF_9 OE9# 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 SMB_A1 SMB_A0 DIF_8# DIF_8 OE8# DIF_7# DIF_7 OE7# GND VDD DIF_6# DIF_6 OE6# DIF_5# DIF_5 OE5# SMBDAT SMBCLK IDT® 19 Output Differential Buffer for PCIe Gen2 and QPI 1607C —04/19/11 1 9DB1904B 19 Output Differential Buffer for PCIe Gen2 and QPI Pin Description PIN # PIN NAME PIN TYPE 1 IREF OUT 2 3 GNDA VDDA PWR PWR 4 HIGH_BW# IN 5 100M_133M#_LV IN 6 7 8 9 10 11 12 13 14 15 16 17 DIF_0 DIF_0# DIF_1 DIF_1# GND VDD DIF_2 DIF_2# DIF_3 DIF_3# DIF_4 DIF_4# OUT OUT OUT OUT PWR PWR OUT OUT OUT OUT OUT OUT 18 OE_01234# IN 19 20 SMBCLK SMBDAT IN I/O 21 OE5# IN 22 23 DIF_5 DIF_5# 24 OE6# 25 26 27 28 DIF_6 DIF_6# VDD GND 29 OE7# 30 31 DIF_7 DIF_7# 32 OE8# 33 34 35 36 DIF_8 DIF_8# SMB_A0 SMB_A1 OUT OUT IN OUT OUT PWR PWR IN OUT OUT IN OUT OUT IN IN DESCRIPTION This pin establishes the reference for the differential current-mode output pairs. It requires a fixed precision resistor to ground. 475ohm is the standard value for 100ohm differential impedance. Other impedances require different values. See data sheet. Ground pin for the PLL core. 3.3V power for the PLL core. 3.3V input for selecting PLL Band Width 0 = High, 1= Low Low Threshold Input to select operating frequency. See Functionality Table for Definition 0.7V differential true clock output 0.7V differential Complementary clock output 0.7V differential true clock output 0.7V differential Complementary clock output Ground pin. Power supply, nominal 3.3V 0.7V differential true clock output 0.7V differential Complementary clock output 0.7V differential true clock output 0.7V differential Complementary clock output 0.7V differential true clock output 0.7V differential Complementary clock output Active low input for enabling DIF pairs 0, 1, 2, 3 and 4. 1 =disable outputs, 0 = enable outputs Clock pin of SMBUS circuitry, 5V tolerant Data pin of SMBUS circuitry, 5V tolerant Active low input for enabling DIF pair 5. 1 =disable outputs, 0 = enable outputs 0.7V differential true clock output 0.7V differential Complementary clock output Active low input for enabling DIF pair 6. 1 =disable outputs, 0 = enable outputs 0.7V differential true clock output 0.7V differential Complementary clock output Power supply, nominal 3.3V Ground pin. Active low input for enabling DIF pair 7. 1 =disable outputs, 0 = enable outputs 0.7V differential true clock output 0.7V differential Complementary clock output Active low input for enabling DIF pair 8. 1 =disable outputs, 0 = enable outputs 0.7V differential true clock output 0.7V differential Complementary clock output SMBus address bit 0 (LSB) SMBus address bit 1 IDT® 19 Output Differential Buffer for PCIe Gen2 and QPI 1607C—04/19/11 2 9DB1904B 19 Output Differential Buffer for PCIe Gen2 and QPI Pin Description (continued) PIN # PIN NAME PIN TYPE 37 OE9# IN 38 39 DIF_9 DIF_9# OUT OUT 40 OE10# IN 41 42 DIF_10 DIF_10# 43 OE11# 44 45 46 47 DIF_11 DIF_11# GND VDD 48 OE12# 49 50 DIF_12 DIF_12# 51 OE13# 52 53 DIF_13 DIF_13# 54 OE14# 55 56 DIF_14 DIF_14# 57 CKPWRGD_PD# 58 59 DIF_15 DIF_15# 60 OE15_16# 61 62 63 64 65 66 67 68 DIF_ 16 DIF_16# VDD GND DIF_17 DIF_17# DIF_18 DIF_18# 69 OE17_18# IN 70 71 CLK_IN CLK_IN# IN IN 72 SMB_A2_PLLBYP# IN OUT OUT IN OUT OUT PWR PWR IN OUT OUT IN OUT OUT IN OUT OUT IN OUT OUT IN OUT OUT PWR PWR OUT OUT OUT OUT DESCRIPTION Active low input for enabling DIF pair 9. 1 =disable outputs, 0 = enable outputs 0.7V differential true clock output 0.7V differential Complementary clock output Active low input for enabling DIF pair 10. 1 =disable outputs, 0 = enable outputs 0.7V differential true clock output 0.7V differential Complementary clock output Active low input for enabling DIF pair 11. 1 =disable outputs, 0 = enable outputs 0.7V differential true clock output 0.7V differential Complementary clock output Ground pin. Power supply, nominal 3.3V Active low input for enabling DIF pair 12. 1 =disable outputs, 0 = enable outputs 0.7V differential true clock output 0.7V differential Complementary clock output Active low input for enabling DIF pair 13. 1 =disable outputs, 0 = enable outputs 0.7V differential true clock output 0.7V differential Complementary clock output Active low input for enabling DIF pair 14. 1 =disable outputs, 0 = enable outputs 0.7V differential true clock output 0.7V differential Complementary clock output 3.3V Input notifies device to sample latched inputs and start up on first high assertion, or exit Power Down Mode on subsequent assertions. Low enters Power Down Mode. 0.7V differential true clock output 0.7V differential Complementary clock output Active low input for enabling DIF pairs 15 and 16. 1 =disable outputs, 0 = enable outputs 0.7V differential true clock output 0.7V differential Complementary clock output Power supply, nominal 3.3V Ground pin. 0.7V differential true clock output 0.7V differential Complementary clock output 0.7V differential true clock output 0.7V differential Complementary clock output Active low input for enabling DIF pairs 17 and 18. 1 =disable outputs, 0 = enable outputs True Input for differential reference clock. Complementary Input for differential reference clock. SMBus address bit 2. When Low, the part operates as a fanout buffer with the PLL bypassed. When High, the part operates as a zero-delay buffer (ZDB) with the PLL operating. 0 = fanout mode (PLL bypassed), 1 = ZDB mode (PLL used) IDT® 19 Output Differential Buffer for PCIe Gen2 and QPI 1607C—04/19/11 3 9DB1904B 19 Output Differential Buffer for PCIe Gen2 and QPI Functional Block Diagram OE(17_18)# OE(15_16)# OE(14:5)#, OE_01234# 13 PLL (SS Compatible) CLK_IN CLK_IN# HIGH_BW# 100M_133M#_LV CKPWRGD_PD# SMB_A0 SMB_A1 SMB_A2_PLLBYP# SMBDAT SMBCLK 19 DIF(18:0) Logic IREF Power Groups Pin Number VDD GND 3 2 11,27,47,63 10,28,46,64 Description PLL, Analog DIF clocks 9DB1904 Frequency Selects for PLL Mode Byte 9, bit 2 100M_133M#_LV 1 0 Byte9, bit 1 FSB 0 0 Byte 9, bit 0 FSA 1 1 CLK_IN MHz DIF Outputs MHz 100.00 133.33 100.00 133.33 Notes 1 2 Notes:FS_A_410 = 1 1. Powerup Default for 100M_133M# = 1 2. Powerup Default for 100M_133M# = 0 IDT® 19 Output Differential Buffer for PCIe Gen2 and QPI 1607C—04/19/11 4 9DB1904B 19 Output Differential Buffer for PCIe Gen2 and QPI Electrical Characteristics - Absolute Maximum Ratings PARAMETER SYMBOL 3.3V Core Supply Voltage 3.3V Logic Supply Voltage Input Low Voltage Input High Voltage Input High Voltage VDDA VDD VIL VIH VIHSMB Storage Temperature Junction Temperature Input ESD protection Ts Tj ESD prot CONDITIONS MIN TYP MAX 4.6 4.6 GND-0.5 Except for SMBus interface SMBus clock and data pins VDD+0.5V 5.5V -65 Human Body Model 150 125 2000 UNITS NOTES V V V V V ° C °C V 1,2 1,2 1 1 1 1 1 1 1 Guaranteed by design and characterization, not 100% tested in production. 2 Operation under these conditions is neither implied nor guaranteed. Electrical Characteristics - Clock Input Parameters TA = TCOM; Supply Voltage VDD/VDDA = 3.3 V +/-5%, See Test Loads for Loading Conditions PARAMETER SYMBOL Input High Voltage - DIF_IN VIHDIF Input Low Voltage - DIF_IN VILDIF Input Common Mode Voltage - DIF_IN Input Amplitude - DIF_IN Input Slew Rate - DIF_IN Input Leakage Current Input Duty Cycle Input Jitter - Cycle to Cycle CONDITIONS Differential inputs (single-ended measurement) Differential inputs (single-ended measurement) MIN TYP MAX UNITS NOTES 600 800 1150 mV 1 VSS - 300 0 300 mV 1 VCOM Common Mode Input Voltage 300 1000 mV 1 VSWING dv/dt IIN dtin J DIFIn Peak to Peak value Measured differentially VIN = VDD , VIN = GND Measurement from differential wavefrom Differential Measurement 300 0.4 -5 45 0 1450 8 5 55 125 mV V/ns uA % ps 1 1,2 1 1, 3 1 1 Guaranteed by design and characterization, not 100% tested in production. Slew rate measured through +/-75mV window centered around differential zero 3 Input duty cycle will directly impact output duty cycle in bypass mode. It has no impact in PLL mode. 2 Electrical Characteristics - Current Consumption TA = TCOM; Supply Voltage VDD/VDDA = 3.3 V +/-5%, See Test Loads for Loading Conditions PARAMETER Operating Supply Current Powerdown Current 1 SYMBOL CONDITIONS IDD3.3OP IDD3.3AOP I DD3.3PD IDD3.3APD VDD, All outputs active @100MHz VDDA, All outputs active @100MHz VDD VDDA MIN TYP 425 35 20 12 MAX UNITS NOTES 450 45 25 15 mA mA mA mA 1 1 1 1 Guaranteed by design and characterization, not 100% tested in production. Zo = 100Ω IDT® 19 Output Differential Buffer for PCIe Gen2 and QPI 1607C—04/19/11 5 9DB1904B 19 Output Differential Buffer for PCIe Gen2 and QPI Electrical Characteristics - Input/Supply/Common Parameters TA = TCOM; Supply Voltage VDD/VDDA = 3.3 V +/-5%, See Test Loads for Loading Conditions PARAMETER SYMBOL CONDITIONS MIN Ambient Operating Temperature TCOM Commmercial range 0 70 °C 1 Input High Voltage VIH 2 VDD + 0.3 V 1 Input Low Voltage VIL GND - 0.3 0.8 V 1 Low Threshold InputHigh Voltage Low Threshold InputLow Voltage Single-ended inputs, except SMBus, low threshold and tri-level inputs Single-ended inputs, except SMBus, low threshold and tri-level inputs TYP MAX UNITS NOTES VIH_FS 3.3 V +/-5%, Applies to 100M_133M#_LV pin 0.7 VDD + 0.3 V 1 VIL_FS 3.3 V +/-5%, Applies to 100M_133M#_LV pin VSS - 0.3 0.35 V 1 IIN Single-ended inputs, VIN = GND, VIN = VDD -5 5 uA 1 IINP Single-ended inputs VIN = 0 V; Inputs with internal pull-up resistors VIN = VDD; Inputs with internal pull-down resistors -200 200 uA 1 VDD = 3.3 V, Bypass mode VDD = 3.3 V, 100MHz PLL mode VDD = 3.3 V, 133.33MHz PLL mode 33 90 120 CINDIF_IN Logic Inputs, except DIF_IN DIF_IN differential clock inputs 1.5 1.5 400 110 147 7 5 2.7 MHz MHz MHz nH pF pF 2 2 2 1 1 1,4 COUT Output pin capacitance 6 pF 1 Clk Stabilization TSTAB From VDD Power-Up and after input clock stabilization or de-assertion of PD# to 1st clock 1.8 ms 1,2 Input SS Modulation Frequency fMODIN Allowable Frequency (Triangular Modulation) 30 33 kHz 1 OE# Latency tLATOE# 4 12 clocks 1,3 Tdrive_PD# tDRVPD 300 us 1,3 Tfall Trise SMBus Input Low Voltage SMBus Input High Voltage SMBus Output Low Voltage SMBus Sink Current Nominal Bus Voltage SCLK/SDATA Rise Time SCLK/SDATA Fall Time SMBus Operating Frequency tF tR DIF start after OE# assertion DIF stop after OE# deassertion DIF output enable after PD# de-assertion Fall time of control inputs Rise time of control inputs VILSMB VIHSMB VOLSMB IPULLUP VDDSMB t RSMB tFSMB 5 5 0.8 @ IPULLUP @ VOL 3V to 5V +/- 10% (Max VIL - 0.15) to (Min VIH + 0.15) (Min VIH + 0.15) to (Max VIL - 0.15) 5.5 1000 300 ns ns V V V mA V ns ns 1,2 1,2 1 1 1 1 1 1 1 fMAXSMB Maximum SMBus operating frequency 100 kHz 1,5 Input Current Input Frequency Pin Inductance Capacitance Fibyp Fipll Fipll Lpin CIN 2.1 4 2.7 100.00 133.33 VDDSMB 0.4 1 Guaranteed by design and characterization, not 100% tested in production. Control input must be monotonic from 20% to 80% of input swing. 3 Time from deassertion until outputs are >200 mV 4 DIF_IN input 2 5 The differential input clock must be running for the SMBus to be active IDT® 19 Output Differential Buffer for PCIe Gen2 and QPI 1607C—04/19/11 6 9DB1904B 19 Output Differential Buffer for PCIe Gen2 and QPI Electrical Characteristics - DIF 0.7V Current Mode Differential Outputs TA = TCOM; Supply Voltage VDD/VDDA = 3.3 V +/-5%, See Test Loads for Loading Conditions PARAMETER SYMBOL CONDITIONS MIN TYP Slew rate Slew rate matching Trf ΔTrf Scope averaging on Slew rate matching, Scope averaging on 1 2 12.6 Voltage High VHigh 660 797 Voltage Low VLow Statistical measurement on single-ended signal using oscilloscope math function. (Scope averaging on) Max Voltage Min Voltage Vswing Crossing Voltage (abs) Crossing Voltage (var) Vmax Vmin Vswing Vcross_abs Δ-Vcross Measurement on single ended signal using absolute value. (Scope averaging off) Scope averaging off Scope averaging off Scope averaging off MAX UNITS NOTES V/ns 1, 2, 3 4 % 20 1, 2, 4 850 1 mV -150 39 150 857 7 1510 378 57 1150 -300 300 250 550 140 1 mV mV mV mV 1 1 1, 2 1, 5 1, 6 Guaranteed by design and characterization, not 100% tested in production. IREF = VDD/(3xRR). For RR = 475Ω (1%), I REF = 2.32mA. I OH = 6 x I REF and VOH = 0.7V @ ZO=50Ω (100Ω differential impedance). 1 2 Measured from differential waveform 3 Slew rate is measured through the Vswing voltage range centered around differential 0V. This results in a +/-150mV window around differential 0V. 4 Matching applies to rising edge rate of Clock / falling edge rate of Clock#. It is measured in a +/-75mV window centered on the average cross point where Clock rising meets Clock# falling. The median cross point is used to calculate the voltage thresholds the oscilloscope uses for the edge rate calculations. 5 Vcross is defined as voltage where Clock = Clock# measured on a component test board and only applies to the differential rising edge (i.e. Clock rising and Clock# falling). 6 The total variation of all Vcross measurements in any particular system. Note that this is a subset of V_cross_min/max (V_cross absolute) allowed. The intent is to limit Vcross induced modulation by setting V_cross_delta to be smaller than V_cross absolute. 9DBxxx Differential Test Loads Rs Differential Zo 2pF Rs Rp 2pF Rp HSCL Output Buffer Differential Output Termination Table DIF Zo (Ω) Iref (Ω) Rs (Ω) Rp (Ω) 100 475 33 50 85 412 27 43.2 IDT® 19 Output Differential Buffer for PCIe Gen2 and QPI 1607C—04/19/11 7 9DB1904B 19 Output Differential Buffer for PCIe Gen2 and QPI Electrical Characteristics - Output Duty Cycle, Jitter, Skew and PLL Characterisitics TA = TCOM; Supply Voltage VDD = 3.3 V +/-5% PARAMETER SYMBOL PLL Bandwidth BW PLL Jitter Peaking Duty Cycle tJPEAK t DC Duty Cycle Distortion t DCD tpdBYP Skew, Input to Output tpdPLL 1 2 DIF_IN, DIF [x:0] Δt pd_BYP DIF_IN, DIF [x:0] Δ tpd_PLL DIF[X:0] tJPH DIF[X:0] tSSTERROR Skew, Output to Output tsk3 Jitter, Cycle to cycle t jcyc-cyc CONDITIONS MIN TYP MAX UNITS NOTES -3dB point in High BW Mode -3dB point in Low BW Mode Peak Pass band Gain Measured differentially, PLL Mode Measured differentially, Bypass Mode @100MHz Bypass Mode, nominal value @ 25°C, 3.3V, VT = 50% PLL Mode, nominal value @ 25°C, 3.3V, VT = 50% Input-to-Output Skew Variation in Bypass mode (over specified voltage / temperature operating ranges) Input-to-Output Skew Variation in PLL mode (over specified voltage / temperature operating ranges) Differential Phase Jitter (RMS Value) Differential Spread Spectrum Tracking Error (peak to peak) VT = 50% PLL mode Additive Jitter in Bypass Mode 2 0.7 45 3 1 1.4 49.5 4 1.4 2 55 MHz MHz dB % 1 1 1 1,2 -2 1 2 % 1,2,5 2500 3700 4500 ps 1,2,4 100 300 500 ps 1,2,3 |500| |600| ps 1,2,4,6,7, 8,9,13 |250| |350| ps 1,2,3,6,7, 8,9,13 2 10 ps 1,7,10 40 80 ps 1,7,12 100 40 25 150 50 50 ps ps ps 1 1,2 1,2 Guaranteed by design and characterization, not 100% tested in production. CLOAD = 2pF Measured from differential cross-point to differential cross-point 3 PLL mode Input-to-Output skew is measured at the first output edge following the corresponding input. 4 All Bypass Mode Input-to-Output specs refer to the timing between an input edge and the specific output edge created by it. 5 Duty cycle distortion is the difference in duty cycle between the output and the input clock when the device is operated in bypass mode. VT = 50% of Vout 7 This parameter is deterministic for a given device 6 8 Measured with scope averaging on to find mean value. 9 Long-term variation from nominal of input-to-output skew over temperature and voltage for a single device. 10 This parameter is measured at the outputs of two separate 9DB1904 devices driven by a single main clock. The 9DB1904's must be set to high bandwidth. Differential phase jitter is the accumulation of the phase jitter not shared by the outputs (eg. not including the affects of spread spectrum). Target ranges of consideration are agents with BW of 1-22MHz and 11-33MHz. 11 t is the period of the input clock 12 Differential spread spectrum tracking error is the difference in spread spectrum tracking between two 9DB1904 devices This parameter is measured at the outputs of two separate 9DB1904 devices driven by a single main clock in Spread Spectrum mode. The 9DB1904's must be set to high bandwidth. The spread spectrum characteristics are: maximum of 0.5%, 30-33KHz modulation frequency, linear profile. 13 This parameter is an absolute value. It is not a double-sided figure. IDT® 19 Output Differential Buffer for PCIe Gen2 and QPI 1607C—04/19/11 8 9DB1904B 19 Output Differential Buffer for PCIe Gen2 and QPI Electrical Characteristics - Phase Jitter Parameters TA = TCOM; Supply Voltage VDD/VDDA = 3.3 V +/-5%, See Test Loads for Loading Conditions PARAMETER Phase Jitter, PLL Mode SYMBOL tjphPCIeG1 tjphPCIeG2 t jphQPI_SMI tjphPCIeG1 Additive Phase Jitter, Bypass mode tjphPCIeG2 t jphQPI_SMI 1 2 CONDITIONS PCIe Gen 1 PCIe Gen 2 Lo Band 10kHz < f < 1.5MHz PCIe Gen 2 High Band 1.5MHz < f < Nyquist (50MHz) QPI & SMI (100MHz or 133MHz, 4.8Gb/s, 6.4Gb/s 12UI) PCIe Gen 1 PCIe Gen 2 Lo Band 10kHz < f < 1.5MHz PCIe Gen 2 High Band 1.5MHz < f < Nyquist (50MHz) QPI & SMI (100MHz or 133MHz, 4.8Gb/s, 6.4Gb/s 12UI) MIN TYP 35 MAX 86 1.2 3 2.5 3.1 0.30 0.5 3 10 0.01 0.3 0.8 1.3 0.12 0.3 UNITS ps (p-p) ps (rms) ps (rms) ps (rms) ps (p-p) ps (rms) ps (rms) ps (rms) Notes 1,2,3 1,2 1,2 1,5 1,2,3 1,2,6 1,2,6 1,5,6 Applies to all outputs. See http://www.pcisig.com for complete specs 3 Sample size of at least 100K cycles. This figures extrapolates to 108ps pk-pk @ 1M cycles for a BER of 1-12. 4 Subject to final radification by PCI SIG. 5 Calculated from Intel-supplied Clock Jitter Tool v 1.6.3 6 For RMS figures, additive jitter is calculated by solving the following equation: (Additive jitter)^2 = (total jittter)^2 - (input jitter)^2 Clock Periods - Differential Outputs with Spread Spectrum Disabled SSC OFF Center Freq. MHz DIF 100.00 133.33 Measurement Window 1us 0.1s 0.1s 0.1s + ppm -SSC - ppm 0 ppm -c2c jitter Long-Term Short-Term Long-Term Period AbsPer Average Average Average Nominal Min Max Min Min 9.94900 9.99900 10.00000 10.00100 7.44925 7.49925 7.50000 7.50075 1 Clock 1us +SSC Short-Term Average Max 1 Clock +c2c jitter Units Notes AbsPer Max 10.05100 7.55075 ns ns 1,2 1,2 Clock Periods - Differential Outputs with Spread Spectrum Enabled SSC ON Center Freq. MHz DIF 99.75 133.00 Measurement Window 1us 0.1s 0.1s 0.1s + ppm - ppm -SSC 0 ppm -c2c jitter Long-Term Short-Term Long-Term Period AbsPer Average Average Average Nominal Min Max Min Min 9.94906 9.99906 10.02406 10.02506 10.02607 7.44930 7.49930 7.51805 7.51880 7.51955 1 Clock 1us +SSC Short-Term Average Max 10.05107 7.53830 1 Clock +c2c jitter Units Notes AbsPer Max 10.10107 7.58830 ns ns 1,2 1,2 1 Guaranteed by design and characterization, not 100% tested in production. All Long Term Accuracy specifications are guaranteed with the assumption that the input clock complies with CK410B+/CK420BQ accuracy requirements. The 9DB1904 itself does not contribute to ppm error. 2 IDT® 19 Output Differential Buffer for PCIe Gen2 and QPI 1607C—04/19/11 9 9DB1904B 19 Output Differential Buffer for PCIe Gen2 and QPI DIF Reference Clock Common Recommendations for Differential Routing L1 length, route as non-coupled 50ohm trace L2 length, route as non-coupled 50ohm trace L3 length, route as non-coupled 50ohm trace Rs Rt Dimension or Value 0.5 max 0.2 max 0.2 max 33 49.9 Unit inch inch inch ohm ohm Figure 1 1 1 1 1 Down Device Differential Routing L4 length, route as coupled microstrip 100ohm differential trace 2 min to 16 max L4 length, route as coupled stripline 100ohm differential trace 1.8 min to 14.4 max inch inch 1 1 Differential Routing to PCI Express Connector L4 length, route as coupled microstrip 100ohm differential trace 0.25 to 14 max L4 length, route as coupled stripline 100ohm differential trace 0.225 min to 12.6 max inch inch 2 2 Figure 1: Down Device Routing L2 L1 Rs L4 L4' L2' L1' Rs HCSL Output Buffer Rt Rt L3' PCI Express Down Device REF_CLK Input L3 Figure 2: PCI Express Connector Routing L2 L1 Rs L4 L4' L2' L1' HCSL Output Buffer Rs Rt Rt L3' IDT® 19 Output Differential Buffer for PCIe Gen2 and QPI PCI Express Add-in Board REF_CLK Input L3 1607C—04/19/11 10 9DB1904B 19 Output Differential Buffer for PCIe Gen2 and QPI Alternative Termination for LVDS and other Common Differential Signals (figure 3) Vdiff Vp-p Vcm R1 R2 R3 R4 Note 0.45v 0.22v 1.08 33 150 100 100 0.58 0.28 0.6 33 78.7 137 100 0.80 0.40 0.6 33 78.7 none 100 ICS874003i-02 input compatible 0.60 0.3 1.2 33 174 140 100 Standard LVDS R1a = R1b = R1 R2a = R2b = R2 Figure 3 L2 L1 R3 R1a L4 R4 L4' L2' L1' R1b HCSL Output Buffer R2a R2b L3' Down Device REF_CLK Input L3 Cable Connected AC Coupled Application (figure 4) Component Value Note R5a, R5b 8.2K 5% R6a, R6b 1K 5% Cc 0.1 µF Vcm 0.350 volts Figure 4 3.3 Volts R5a R5b R6a R6b Cc L4 L4' Cc IDT® 19 Output Differential Buffer for PCIe Gen2 and QPI PCIe Device REF_CLK Input 1607C—04/19/11 11 9DB1904B 19 Output Differential Buffer for PCIe Gen2 and QPI 9DB1904 SMBus Address Mapping when using CK410/CK410B, 9FG1200, and 9DB403/803 SMB_A(2:0) = 000 SMB Adr: D0 OR SMB_A(2:0) = 000 SMB Adr: D0 9FG1201 (DB1200G) OR SMB_A(2:0) = 001 SMB Adr: D2 9FG1201 (DB1200G) OR SMB_A(2:0) = 010 SMB Adr: D4 9FG1201 (DB1200G) OR SMB_A(2:0) = 011 SMB Adr: D6 9FG1201 (DB1200G) OR SMB_A(2:0) = 100 SMB Adr: D8 9FG1201 (DB1200G) OR SMB_A(2:0) = 101 SMB Adr: DA 9FG1201 (DB1200G) OR SMB_A(2:0) = 110 SMB Adr: DC 9FG1201 (DB1200G) OR SMB_A(2:0) = 111 SMB Adr: DE 9FG1201 (DB1200G) PLL BYPASS MODE SMB_A2_PLLBYP# = 0 9DB1904 SMB_A(2:0) = 001 SMB Adr: D2 9DB1904 SMB_A(2:0) = 010 SMB Adr: D4 9DB1904 SMB_A(2:0) = 011 SMB Adr: D6 9DB1904 SMB_A(2:0) = 100 SMB Adr: D8 9DB1904 PLL ZDB MODE SMB_A2_PLLBYP# = 1 SMB_A(2:0) = 101 SMB Adr: DA 9DB1904 SMB_A(2:0) = 110 SMB Adr: DC 9DB1904 SMB_A(2:0) = 111 SMB Adr: DE 9DB1904 IDT® 19 Output Differential Buffer for PCIe Gen2 and QPI OR SMB Adr: D2 932S421 CK410B OR SMB Adr: DC 9DB403/803 (DB400/800) 1607C—04/19/11 12 9DB1904B 19 Output Differential Buffer for PCIe Gen2 and QPI General SMBus serial interface information for the 9DB1904B How to Write: How to Read: Controller (host) sends a start bit. Controller (host) sends the write address D4(h) IDT clock will acknowledge Controller (host) sends the begining byte location = N IDT clock will acknowledge Controller (host) sends the data byte count = X IDT clock will acknowledge Controller (host) starts sending Byte N through Byte N + X -1 • IDT clock will acknowledge each byte one at a time • Controller (host) sends a Stop bit • • • • • • • • • • • • • • • • • • • • • • Index Block Read Operation Index Block Write Operation Controller (Host) starT bit T Slave Address D4(h)* WR WRite Controller (host) will send start bit. Controller (host) sends the write address D4 (h) IDT clock will acknowledge Controller (host) sends the begining byte location = N IDT clock will acknowledge Controller (host) will send a separate start bit. Controller (host) sends the read address D5 (h) IDT clock will acknowledge IDT clock will send the data byte count = X IDT clock sends Byte N + X -1 IDT clock sends Byte 0 through byte X (if X(h) was written to byte 8). Controller (host) will need to acknowledge each byte Controllor (host) will send a not acknowledge bit Controller (host) will send a stop bit Controller (Host) T starT bit Slave Address D4(h)* WR WRite IDT (Slave/Receiver) IDT (Slave/Receiver) ACK ACK Beginning Byte = N Beginning Byte = N ACK ACK RT Repeat starT Slave Address D5(h)* RD ReaD Data Byte Count = X ACK Beginning Byte N ACK X Byte ACK Data Byte Count = X ACK Beginning Byte N ACK Byte N + X - 1 X Byte ACK P stoP bit Byte N + X - 1 N P IDT® 19 Output Differential Buffer for PCIe Gen2 and QPI Not acknowledge stoP bit 1607C—04/19/11 13 9DB1904B 19 Output Differential Buffer for PCIe Gen2 and QPI SMBusTable: Reserved Register Byte 0 Pin # Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Control Function Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved SMBusTable: Output Control Register Byte 1 Pin # Name DIF_7 Bit 7 DIF_6 Bit 6 DIF_5 Bit 5 DIF_4 Bit 4 DIF_3 Bit 3 DIF_2 Bit 2 DIF_1 Bit 1 DIF_0 Bit 0 Control Function Output Control Output Control Output Control Output Control Output Control Output Control Output Control Output Control Type R R R R R R R R 0 1 PWD 1 1 1 1 1 0 1 1 Type RW RW RW RW RW RW RW RW 0 Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z 1 Enable Enable Enable Enable Enable Enable Enable Enable PWD 1 1 1 1 1 1 1 1 SMBusTable: Output and PLL BW Control Register 0 1 Pin # Name Control Function Type Byte 2 see note PLL_BW# adjust Low BW RW High BW Bit 7 see note BYPASS# test mode / PLL PLL RW Bypass Bit 6 DIF_13 Output Control RW Hi-Z Enable Bit 5 DIF_12 Output Control RW Hi-Z Enable Bit 4 DIF_11 Output Control RW Hi-Z Enable Bit 3 DIF_10 Output Control RW Hi-Z Enable Bit 2 DIF_9 Output Control RW Hi-Z Enable Bit 1 DIF_8 Output Control RW Hi-Z Enable Bit 0 Note: Bit 7 is wired OR to the HIGH_BW# input, any 0 selects High BW Note: Bit 6 is wired OR to the SMB_A2_PLLBYP# input, any 0 selects Fanout Bypass mode SMBusTable: Output Enable Readback Register Pin # Name Control Function Byte 3 Readback - OE9# Input Bit 7 Readback - OE8# Input Bit 6 Readback - OE7# Input Bit 5 Readback - OE6# Input Bit 4 Readback - OE5# Input Bit 3 Readback - OE_01234# Input Bit 2 8 Readback - HIGH_BW# In Bit 1 72 Readback - SMB_A2_PLLBYP# In Bit 0 IDT® 19 Output Differential Buffer for PCIe Gen2 and QPI Type R R R R R R R R 0 1 Readback Readback Readback Readback Readback Readback Readback Readback PWD 1 1 1 1 1 1 1 1 PWD X X X X X X X X 1607C—04/19/11 14 9DB1904B 19 Output Differential Buffer for PCIe Gen2 and QPI SMBusTable: Output Enable Readback Register Byte 4 Pin # Name Control Function Readback - OE17_18# Input 69 Bit 7 60 Readback - OE15_16# Input Bit 6 Reserved Bit 5 54 Readback - OE14# Input Bit 4 51 Readback - OE13# Input Bit 3 Readback - OE12# Input 48 Bit 2 Readback - OE11# Input 43 Bit 1 40 Readback - OE10# Input Bit 0 Type R R 0 Type R R R R R R R R 0 - SMBusTable: DEVICE ID (194 Decimal or C2 Hex) Pin # Name Control Function Byte 6 Device ID 7 (MSB) Bit 7 Device ID 6 Bit 6 Device ID 5 Bit 5 Device ID 4 Bit 4 Device ID 3 Bit 3 Device ID 2 Bit 2 Device ID 1 Bit 1 Device ID 0 Bit 0 Type RW RW RW RW RW RW RW RW 0 Type RW RW RW Writing to this register RW configures how many RW bytes will be read back. RW RW RW 0 - Control Function IDT® 19 Output Differential Buffer for PCIe Gen2 and QPI PWD X X 0 X X X X X 1 - PWD 0 0 0 1 0 0 0 1 1 PWD 1 1 0 0 0 0 1 0 1 - PWD 0 0 0 0 0 1 1 1 Readback Readback Readback Readback Readback R R R R R SMBusTable: Vendor & Revision ID Register Byte 5 Pin # Name Control Function RID3 Bit 7 RID2 Bit 6 REVISION ID RID1 Bit 5 RID0 Bit 4 VID3 Bit 3 VID2 Bit 2 VENDOR ID VID1 Bit 1 VID0 Bit 0 SMBusTable: Byte Count Register Pin # Name Byte 7 BC7 Bit 7 BC6 Bit 6 BC5 Bit 5 BC4 Bit 4 BC3 Bit 3 BC2 Bit 2 BC1 Bit 1 BC0 Bit 0 1 Readback Readback Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved 1607C—04/19/11 15 9DB1904B 19 Output Differential Buffer for PCIe Gen2 and QPI SMBusTable: Control Pin Readback Register Byte 8 Pin # Name Control Function Bit 7 5 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Readback -100M_133M#_LV DIF_18 DIF_17 DIF_16 DIF_15 DIF_14 Type 0 Readback R RESERVED RESERVED Output Control Output Control Output Control Output Control Output Control SMBusTable: PLL Operating Set Point Register Byte 9 Pin # Name Control Function RESERVED Bit 7 RESERVED Bit 6 RESERVED Bit 5 RESERVED Bit 4 RESERVED Bit 3 Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z Enable Enable Enable Enable Enable Type 0 1 - Frequency Select 100M_133M# RW Bit 1 Bit 0 - Frequency Select B Frequency Select A RW RW PWD Latch RW RW RW RW RW Bit 2 IDT® 19 Output Differential Buffer for PCIe Gen2 and QPI 1 See ICS9DB1904 1:1 PLL Programming Table X X 1 1 1 1 1 PWD 0 0 0 0 0 Latch 0 1 1607C—04/19/11 16 9DB1904B 19 Output Differential Buffer for PCIe Gen2 and QPI (Ref. ) Seating Plane (N D - 1)x e (Ref. ) A1 Index Area ND & NE Even A3 N L N Anvil Singulation 1 2 E2 OR E (N E - 1)x e E2 (Ref. ) 2 Sawn Singulation Top View e (Typ.) 2 If N D & N E are Even 1 b (Ref.) A D e D2 2 ND & NE Odd Thermal Base D2 Chamfer 4x 0.6 x 0.6 max OPTIONAL C 0.08 C THERMALLY ENHANCED, VERY THIN, FINE PITCH QUAD FLAT / NO LEAD PLASTIC PACKAGE DIMENSIONS SYMBOL A A1 A3 b e MIN. MAX. 0.8 1.0 0 0.05 0.25 Reference 0.18 0.3 0.50 BASIC SYMBOL N ND NE D x E BASIC D2 MIN. / MAX. E2 MIN. / MAX. L MIN. / MAX. ICS 72L TOLERANCE 72 18 18 10.00 x 10.00 5.75 / 6.15 5.75 / 6.15 0.30/ 0.50 Ordering Information Part / Order Number 9DB1904BKLF 9DB1904BKLFT Shipping Packaging Tubes Tape and Reel Package 72-pin MLF 72-pin MLF Temperature 0 to +70° C 0 to +70° C "LF" suffix to the part number are the Pb-Free configuration, RoHS compliant. "B" is the device revision designator (will not correlate with the datasheet revision). IDT® 19 Output Differential Buffer for PCIe Gen2 and QPI 1607C—04/19/11 17 9DB1904B 19 Output Differential Buffer for PCIe Gen2 and QPI Revision History Rev. 0.1 0.2 A B C Issue Date Description 7/1/2009 Initial release 7/8/2009 Updated revision ID in Byte 5 Updated electrical characteristics tables. 9/21/2010 Added Test loads and terminations Corrected minor typo's, move to release. 1. Updated electrical char tables 9/23/2010 2. Updated test loads and termination figures 3. Added Period PPM tables 1. Updated electrical tabels with Typ. Values 4/19/2011 2. Updated Differential Clock Period PPM tables Page # 13 Various Various Various Innovate with IDT and accelerate your future networks. Contact: www.IDT.com For Sales For Tech Support 800-345-7015 408-284-8200 Fax: 408-284-2775 408-284-6578 pcclockhelp@idt.com Corporate Headquarters Asia Pacific and Japan Europe Integrated Device Technology, Inc. 6024 Silver Creek Valley Road San Jose, CA 95138 United States 800 345 7015 +408 284 8200 (outside U.S.) IDT Singapore Pte. Ltd. 1 Kallang Sector #07-01/06 KolamAyer Industrial Park Singapore 349276 Phone: 65-6-744-3356 Fax: 65-6-744-1764 IDT Europe Limited 321 Kingston Road Leatherhead, Surrey KT22 7TU England Phone: 44-1372-363339 Fax: 44-1372-378851 © 2011 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. Printed in USA 18 IMPORTANT NOTICE AND DISCLAIMER RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. 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