DATASHEET
HIP4082
FN3676
Rev 5.00
September 30, 2015
80V, 1.25A Peak Current H-Bridge FET Driver
The HIP4082 is a medium frequency, medium voltage
H-Bridge N-Channel MOSFET driver IC, available in 16 lead
plastic SOIC (N) and DIP packages.
Specifically targeted for PWM motor control and UPS
applications, bridge based designs are made simple and
flexible with the HIP4082 H-bridge driver. With operation up
to 80V, the device is best suited to applications of moderate
power levels.
Features
• Independently Drives 4 N-Channel FET in Half Bridge or
Full Bridge Configurations
• Bootstrap Supply Max Voltage to 95VDC
• Drives 1000pF Load in Free Air at 50°C with Rise and Fall
Times of Typically 15ns
• User-Programmable Dead Time (0.1 to 4.5s)
Similar to the HIP4081, it has a flexible input protocol for
driving every possible switch combination except those
which would cause a shoot-through condition. The
HIP4082’s reduced drive current allows smaller packaging
and it has a much wider range of programmable dead times
(0.1 to 4.5s) making it ideal for switching frequencies up to
200kHz. The HIP4082 does not contain an internal charge
pump, but does incorporate non-latching level-shift
translation control of the upper drive circuits.
• DIS (Disable) Overrides Input Control and Refreshes
Bootstrap Capacitor when Pulled Low
This set of features and specifications is optimized for
applications where size and cost are important. For
applications needing higher drive capability the HIP4080A
and HIP4081A are recommended.
Applications
• Input Logic Thresholds Compatible with 5V to 15V Logic
Levels
• Shoot-Through Protection
• Undervoltage Protection
• Pb-Free Plus Anneal Available (RoHS Compliant)
• UPS Systems
• DC Motor Controls
• Full Bridge Power Supplies
• Switching Power Amplifiers
• Noise Cancellation Systems
• Battery Powered Vehicles
• Peripherals
• Medium/Large Voice Coil Motors
• Related Literature
- TB363, Guidelines for Handling and Processing
Moisture Sensitive Surface Mount Devices (SMDs)
FN3676 Rev 5.00
September 30, 2015
Page 1 of 14
HIP4082
HIP4082
Ordering Information
PART NUMBER
TEMP.
RANGE (°C)
PART MARKING
PACKAGE
PKG.
DWG. #
HIP4082IB*
HIP4082IB
-55 to +125
16 Ld SOIC (N)
M16.15
HIP4082IBZ*
(Note)
4082IBZ
-55 to +125
16 Ld SOIC (N) (Pb-free)
M16.15
HIP4082IP
HIP4082IP (No longer available, recommended replacement: HIP4082IPZ)
-55 to +125
16 Ld PDIP
E16.3
HIP4082IPZ (Note)
-55 to +125
16 Ld PDIP** (Pb-free)
E16.3
HIP4082IPZ
*Add “T” suffix for tape and reel.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
Pinout
HIP4082
(PDIP, SOIC)
TOP VIEW
FN3676 Rev 5.00
September 30, 2015
BHB 1
16 BHO
BHI 2
15 BHS
BLI 3
14 BLO
ALI 4
13 ALO
DEL 5
12 VDD
VSS
6
11 AHS
AHI 7
10 AHO
DIS 8
9 AHB
Page 2 of 14
HIP4082
HIP4082
Application Block Diagram
80V
12V
BHO
BHS
BHI
LOAD
BLO
BLI
HIP4082
ALI
ALO
AHS
AHI
AHO
GND
GND
Functional Block Diagram
9
LEVEL
SHIFT
U/V
BHI
2
AHI
7
DIS
8
AHB BHB
1
DRIVER
DRIVER
LEVEL
SHIFT
10 AHO BHO 16
11 AHS
U/V
BHS 15
TURN-ON
DELAY
TURN-ON
DELAY
VDD
VDD
12
ALI
4
DEL
5
BLI
3
VSS
6
DETECTOR
UNDERVOLTAGE
FN3676 Rev 5.00
September 30, 2015
DRIVER
TURN-ON
DELAY
DRIVER
13 ALO
BLO 14
TURN-ON
DELAY
Page 3 of 14
HIP4082
HIP4082
Typical Application (PWM Mode Switching)
80V
12V
PWM
INPUT
DELAY RESISTOR
DIS
FROM
OPTIONAL
OVERCURRENT
LATCH
1 BHB
BHO 16
2 BHI
BHS 15
3 BLI
BLO 14
4 ALI
ALO 13
5 DEL
VDD 12
6 VSS
AHS 11
7 AHI
AHO 10
8 DIS
AHB 9
LOAD
12V
GND
TO OPTIONAL
CURRENT CONTROLLER OR
OVERCURRENT LATCH
RDIS
+
-
RSH
GND
FN3676 Rev 5.00
September 30, 2015
Page 4 of 14
HIP4082
HIP4082
Absolute Maximum Ratings
Thermal Information
Supply Voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 16V
Logic I/O Voltages . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VDD +0.3V
Voltage on AHS, BHS . . . . . -6V (Transient) to 80V (25°C to 150°C)
Voltage on AHS, BHS . . . . . -6V (Transient) to 70V (-55°C to150°C)
Voltage on AHB, BHB . . . . . . . . VAHS, BHS -0.3V to VAHS, BHS +VDD
Voltage on ALO, BLO. . . . . . . . . . . . . . . . . . VSS -0.3V to VDD +0.3V
Voltage on AHO, BHO . . . VAHS, BHS -0.3V to VAHB, BHB +0.3V Input
Current, DEL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -5mA to 0mA
Phase Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V/ns
NOTE: All voltages are relative VSS unless otherwise specified.
Thermal Resistance
JA (°C/W)
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
115
DIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
90
Maximum Power Dissipation. . . . . . . . . . . . . . . . . . . . . . . . See Curve
Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C
Operating Max. Junction Temperature. . . . . . . . . . . . . . . . . . +150°C
Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . . +300°C
(For SOIC - Lead Tips Only))
Operating Conditions
Supply Voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . +8.5V to +15V
Voltage on VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to +1.0V
Voltage on AHB, BHB . . . . . . . . VAHS, BHS +7.5V to VAHS, BHS +VDD
Input Current, DEL . . . . . . . . . . . . . . . . . . . . . . . . . -4mA to -100A
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Electrical Specifications
VDD = VAHB = VBHB = 12V, VSS = VAHS = VBHS = 0V, RDEL = 100K
TJ = -55°C
TO +150°C
TJ = +25°C
PARAMETER
SYMBOL
MIN
TYP
MAX
MIN
All inputs = 0V, RDEL = 100K
1.2
2.3
3.5
0.85
4
mA
All inputs = 0V, RDEL = 10K
2.2
4.0
5.5
1.9
6.0
mA
f = 50kHz, no load
1.5
2.6
4.0
1.1
4.2
mA
50kHz, no load, RDEL = 10k
2.5
4.0
6.4
2.1
6.6
mA
TEST CONDITIONS
MAX UNITS
SUPPLY CURRENTS & UNDER VOLTAGE PROTECTION
VDD Quiescent Current
VDD Operating Current
IDD
IDDO
AHB, BHB Off Quiescent Current
IAHBL, IBHBL
AHI = BHI = 0V
0.5
1.0
1.5
0.4
1.6
mA
AHB, BHB On Quiescent Current
IAHBH, IBHBH
AHI = BHI = VDD
65
145
240
40
250
A
AHB, BHB Operating Current
IAHBO, IBHBO
f = 50kHz, CL = 1000pF
.65
1.1
1.8
.45
2.0
mA
AHS, BHS Leakage Current
IHLK
-
-
1.0
-
-
A
VAHS = VBHS = 80V
VAHB = VBHB = 96
VDD = Not Connected
VDD Rising Undervoltage Threshold
VDDUV+
6.8
7.6
8.25
6.5
8.5
V
VDD Falling Undervoltage Threshold
VDDUV-
6.5
7.1
7.8
6.25
8.1
V
Undervoltage Hysteresis
UVHYS
0.17
0.4
0.75
0.15
0.90
V
AHB, BHB Undervoltage Threshold
VHBUV
Referenced to AHS & BHS
5
6.0
7
4.5
7.5
V
0.8
V
INPUT PINS: ALI, BLI, AHI, BHI, & DIS
Low Level Input Voltage
VIL
Full Operating Conditions
-
-
1.0
-
High Level Input Voltage
VIH
Full Operating Conditions
2.5
-
-
2.7
-
35
-
-
-
mV
Input Voltage Hysteresis
V
Low Level Input Current
IIL
VIN = 0V, Full Operating Conditions
-145
-100
-60
-150
-50
A
High Level Input Current
IIH
VIN = 5V, Full Operating Conditions
-1
-
+1
-10
+10
A
RDEL = 100K
2.5
4.5
8.0
2.0
8.5
s
RDEL = 10K
0.27
0.5
0.75
0.2
0.85
s
TURN-ON DELAY PIN DEL
Dead Time
FN3676 Rev 5.00
September 30, 2015
TDEAD
Page 5 of 14
HIP4082
HIP4082
Electrical Specifications
VDD = VAHB = VBHB = 12V, VSS = VAHS = VBHS = 0V, RDEL = 100K (Continued)
TJ = -55°C
TO +150°C
TJ = +25°C
PARAMETER
SYMBOL
MIN
TEST CONDITIONS
TYP
MAX
MIN
MAX UNITS
GATE DRIVER OUTPUT PINS: ALO, BLO, AHO, & BHO
Low Level Output Voltage
VOL
IOUT = 50mA
0.65
1.1
0.5
1.2
V
High Level Output Voltage
VDD-VOH
IOUT = -50mA
0.7
1.2
0.5
1.3
V
Peak Pullup Current
IO +
VOUT = 0V
1.1
1.4
2.5
0.85
2.75
A
Peak Pulldown Current
IO-
VOUT = 12V
1.0
1.3
2.3
0.75
2.5
A
Switching Specifications
VDD = VAHB = VBHB = 12V, VSS = VAHS = VBHS = 0V, RDEL= 100K, CL = 1000pF.
TJ = -55°C TO
+150°C
TJ = +25°C
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
MIN
MAX
UNITS
Lower Turn-off Propagation Delay
(ALI-ALO, BLI-BLO)
TLPHL
-
25
50
-
70
ns
Upper Turn-off Propagation Delay
(AHI-AHO, BHI-BHO)
THPHL
-
55
80
-
100
ns
Lower Turn-on Propagation Delay
(ALI-ALO, BLI-BLO)
TLPLH
-
40
85
-
100
ns
Upper Turn-on Propagation Delay
(AHI-AHO, BHI-BHO)
THPLH
-
75
110
-
150
ns
Rise Time
TR
-
9
20
-
25
ns
Fall Time
TF
-
9
20
-
25
ns
TPWIN-ON/OFF
50
-
-
50
-
ns
80
ns
Minimum Input Pulse Width
Output Pulse Response to 50 ns Input Pulse
63
TPWOUT
Disable Turn-off Propagation Delay
(DIS - Lower Outputs)
TDISLOW
-
50
80
-
90
ns
Disable Turn-off Propagation Delay
(DIS - Upper Outputs)
TDISHIGH
-
75
100
-
125
ns
Disable Turn-on Propagation Delay
(DIS - ALO & BLO)
TDLPLH
-
40
70
-
100
ns
Disable Turn-on Propagation Delay
(DIS- AHO & BHO)
TDHPLH
-
1.2
2
-
3
s
Refresh Pulse Width (ALO & BLO)
TREF-PW
375
580
900
350
950
ns
RDEL = 10K
TRUTH TABLE
INPUT
OUTPUT
ALI, BLI
AHI, BHI
VDDUV
VHBUV
DIS
ALO, BLO
AHO, BHO
X
X
X
X
1
0
0
X
X
1
X
X
0
0
0
X
0
1
0
0
0
1
X
0
X
0
1
0
0
1
0
0
0
0
1
0
0
0
0
0
0
0
NOTE:
X signifies that input can be either a “1” or “0”.
FN3676 Rev 5.00
September 30, 2015
Page 6 of 14
HIP4082
HIP4082
Pin Descriptions
PIN
NUMBER
SYMBOL
DESCRIPTION
1
BHB
B High-side Bootstrap supply. External bootstrap diode and capacitor are required. Connect cathode of bootstrap
diode and positive side of bootstrap capacitor to this pin.
2
BHI
B High-side Input. Logic level input that controls BHO driver (Pin 16). BLI (Pin 3) high level input overrides BHI high
level input to prevent half-bridge shoot-through, see Truth Table. DIS (Pin 8) high level input overrides BHI high level
input. The pin can be driven by signal levels of 0V to 15V (no greater than VDD).
3
BLI
B Low-side Input. Logic level input that controls BLO driver (Pin 14). If BHI (Pin 2) is driven high or not connected
externally then BLI controls both BLO and BHO drivers, with dead time set by delay currents at DEL (Pin 5). DIS (Pin
8) high level input overrides BLI high level input. The pin can be driven by signal levels of 0V to 15V (no greater than
VDD).
4
ALI
A Low-side Input. Logic level input that controls ALO driver (Pin 13). If AHI (Pin 7) is driven high or not connected
externally then ALI controls both ALO and AHO drivers, with dead time set by delay currents at DEL (Pin 5). DIS (Pin
8) high level input overrides ALI high level input. The pin can be driven by signal levels of 0V to 15V (no greater than
VDD).
5
DEL
Turn-on DELay. Connect resistor from this pin to VSS to set timing current that defines the dead time between drivers.
All drivers turn-off with no adjustable delay, so the DEL resistor guarantees no shoot-through by delaying the turn-on
of all drivers. The voltage across the DEL resistor is approximately Vdd -2V.
6
VSS
Chip negative supply, generally will be ground.
7
AHI
A High-side Input. Logic level input that controls AHO driver (Pin 10). ALI (Pin 4) high level input overrides AHI high
level input to prevent half-bridge shoot-through, see Truth Table. DIS (Pin 8) high level input overrides AHI high level
input. The pin can be driven by signal levels of 0V to 15V (no greater than VDD).
8
DIS
DISable input. Logic level input that when taken high sets all four outputs low. DIS high overrides all other inputs. When
DIS is taken low the outputs are controlled by the other inputs. The pin can be driven by signal levels of 0V to 15V (no
greater than VDD).
9
AHB
A High-side Bootstrap supply. External bootstrap diode and capacitor are required. Connect cathode of bootstrap
diode and positive side of bootstrap capacitor to this pin.
10
AHO
A High-side Output. Connect to gate of A High-side power MOSFET.
11
AHS
A High-side Source connection. Connect to source of A High-side power MOSFET. Connect negative side of bootstrap
capacitor to this pin.
12
VDD
Positive supply to control logic and lower gate drivers. De-couple this pin to VSS (Pin 6).
13
ALO
A Low-side Output. Connect to gate of A Low-side power MOSFET.
14
BLO
B Low-side Output. Connect to gate of B Low-side power MOSFET.
15
BHS
B High-side Source connection. Connect to source of B High-side power MOSFET. Connect negative side of bootstrap
capacitor to this pin.
16
BHO
B High-side Output. Connect to gate of B High-side power MOSFET.
FN3676 Rev 5.00
September 30, 2015
Page 7 of 14
HIP4082
HIP4082
Timing Diagrams
X = A OR B, A AND B HALVES OF BRIDGE CONTROLLER ARE INDEPENDENT
TLPHL
THPHL
DIS=0
and UV
XLI
XHI
XLO
XHO
THPLH
TLPLH
TR
(10% - 90%)
TF
(10% - 90%)
FIGURE 1. INDEPENDENT MODE
DIS=0
and UV
XLI
XHI = HI OR NOT CONNECTED
XLO
XHO
FIGURE 2. BISTATE MODE
TDLPLH
DIS or UV
TDIS
TREF-PW
XLI
XHI
XLO
XHO
TDHPLH
FIGURE 3. DISABLE FUNCTION
FN3676 Rev 5.00
September 30, 2015
Page 8 of 14
HIP4082
HIP4082
Performance Curves
16
200kHz
15
3.25
VDD = 16V
3
IDD SUPPLY CURRENT (mA)
IDD SUPPLY CURRENT (mA)
3.5
VDD = 15V
2.75
2.5
VDD = 12V
2.25
VDD = 10V
2
VDD = 8V
1.75
1.5
-60
-40
-20
0
20
40
60
80 100
JUNCTION TEMPERATURE (°C)
120
14
13
12
11
10
8
50kHz
7
6
5
4
140
100kHz
9
10kHz
-60
1.925
7
PEAK GATE CURRENT (A)
LOADED, NL BIAS CURRENTS (mA)
8
6
5
4
1000pF LOAD
3
NO LOAD
2
-20
100
FREQUENCY (kHz)
150
140
2
1.5
SOURCE
ISRC(BIAS)
1.25
SINK
ISNK(BIAS)
1
0.75
0.815
0.5
50
120
1.75
1
0
0
20
40
60
80 100
JUNCTION TEMPERATURE (°C)
FIGURE 5. VDD SUPPLY CURRENT vs TEMPERATURE AND
SWITCHING FREQUENCY (1000pF LOAD)
FIGURE 4. IDD SUPPLY CURRENT vs TEMPERATURE AND
VDD SUPPLY VOLTAGE
0
-40
8
8
200
FIGURE 6. FLOATING (IXHB) BIAS CURRENT vs
FREQUENCY AND LOAD
9
10
11
12
13
14
BIAS
BIAS SUPPLY VOLTAGE (V) AT 25°C
15
15
FIGURE 7. GATE SOURCE/SINK PEAK CURRENT vs BIAS
SUPPLY VOLTAGE AT 25°C
1.2
-40°C
1.1
-55°C
1.2
VDD-VOH (V)
NORMALIZED GATE
SINK/SOURCE CURRENT (A)
1.4
1
0°C
25°C
1
125°C
150°C
0.8
0.9
0.6
0.8
-75
-50
-25
0
25
50
75
100
JUNCTION TEMPERATURE (°C)
FIGURE 8. GATE CURRENT vs TEMPERATURE,
NORMALIZED TO 25°C
FN3676 Rev 5.00
September 30, 2015
125
150
8
9
10
11
12
13
VDD SUPPLY VOLTAGE (V)
14
FIGURE 9. VDD-VOH vs BIAS VOLTAGE TEMPERATURE
Page 9 of 14
15
HIP4082
HIP4082
Performance Curves
(Continued)
8
VDD, BIAS SUPPLY VOLTAGE (V)
1.4
VOL (V)
1.2
-40°C
-55°C
0°C
25°C
1
0.8
125°C
150°C
0.6
8
9
10
11
12
13
VDD SUPPLY VOLTAGE (V)
14
LOWER U/V SET
6.5
6
UPPER U/V SET/RESET
5.5
-40
-20
0
20
40
60
80 100
JUNCTION TEMPERATURE (°C)
DIS TO TURN-ON/OFF TIME (ns)
80
UPPER tON
70
60
UPPER tOFF
LOWER tON
50
40
30
LOWER tOFF
20
-60
-40
-20
0
20
40
60
80
100
120
DISHTON
1000
DISHTOFF
100
DISLOFF
DISLTON
10
140 160
-60 -40
-20
0
20
40
60
80 100
JUNCTION TEMPERATURE (°C)
JUNCTION TEMPERATURE (°C)
FIGURE 12. UPPER LOWER TURN-ON / TURN-OFF
PROPAGATION DELAY vs TEMPERATURE
120 140 160
FIGURE 13. UPPER/LOWER DIS(ABLE) TO TURN-ON/OFF vs
TEMPERATURE (°C)
2
2.5
TOTAL POWER DISSIPATION (W)
LEVEL-SHIFT CURRENT (mA)
140 160
104
90
1.5
1
0.5
120
FIGURE 11. UNDERVOLTAGE TRIP VOLTAGES vs
TEMPERATURE
100
PROPAGATION DELAYS (ns)
7
5
-60
15
FIGURE 10. VOL vs BIAS VOLTAGE AND TEMPERATURE
LOWER U/V RESET
7.5
0
20
40
60
80
SWITCHING FREQUENCY (kHz)
FIGURE 14. FULL BRIDGE LEVEL-SHIFT CURRENT vs
FREQUENCY (kHz)
FN3676 Rev 5.00
September 30, 2015
100
2
16 PIN DIP
1.5
SOIC
1
0.5
QUIESCENT BIAS COMPONENT
0
-60
-30
0
30
60
90
AMBIENT TEMPERATURE (°C)
120
150
FIGURE 15. MAXIMUM POWER DISSIPATION vs AMBIENT
TEMPERATURE
Page 10 of 14
HIP4082
HIP4082
Performance Curves
(Continued)
104
90
VDD = 15V
VDD = 12V
VXHS-VSS
DEAD TIME (ns)
85
VDD = 9V
1000
80
75
100
0
10
20
30
40
50
60
70
DEAD TIME RESISTANCE (k)
80
90 100
FIGURE 16. DEAD-TIME vs DEL RESISTANCE AND BIAS
SUPPLY (VDD) VOLTAGE
FN3676 Rev 5.00
September 30, 2015
70
100
50
0
50
TEMPERATURE (°C)
100
FIGURE 17. MAXIMUM OPERATING PEAK AHS/BHS
VOLTAGE vs TEMPERATURE
Page 11 of 14
150
HIP4082
HIP4082
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make
sure that you have the latest revision.
DATE
REVISION
September 30, 2015
FN3676.5
CHANGE
Updated the Ordering Information Table on page 2.
Added Revision History and About Intersil sections.
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com.
You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask.
Reliability reports are also available from our website at www.intersil.com/support.
FN3676 Rev 5.00
September 30, 2015
Page 12 of 14
HIP4082
HIP4082
Dual-In-Line Plastic Packages (PDIP)
N
E16.3 (JEDEC MS-001-BB ISSUE D)
E1
INDEX
AREA
1 2 3
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
N/2
INCHES
-B-
SYMBOL
-AE
D
BASE
PLANE
-C-
SEATING
PLANE
A2
A
L
D1
e
B1
D1
B
0.010 (0.25) M
C
L
eA
A1
eC
C A B S
C
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
MILLIMETERS
MIN
MAX
MIN
MAX
A
-
A1
0.015
NOTES
0.210
-
5.33
4
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.045
0.070
1.15
1.77
8, 10
C
0.008
0.014
0.204
0.355
-
D
0.735
0.775
18.66
19.68
5
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
2.54 BSC
-
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
eA
0.300 BSC
7.62 BSC
6
eB
-
0.430
-
10.92
7
4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3.
L
0.115
0.150
2.93
3.81
4
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
N
16
16
9
Rev. 0 12/93
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
FN3676 Rev 5.00
September 30, 2015
Page 13 of 14
HIP4082
HIP4082
Small Outline Plastic Packages (SOIC)
M16.15 (JEDEC MS-012-AC ISSUE C)
N
INDEX
AREA
H
0.25(0.010) M
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
B M
INCHES
E
-B-
1
2
3
L
SEATING PLANE
-A-
A
D
h x 45°
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.3859
0.3937
9.80
10.00
3
E
0.1497
0.1574
3.80
4.00
4
e
B S
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
NOTES:
MILLIMETERS
16
0°
16
8°
0°
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
7
8°
Rev. 1 6/05
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
© Copyright Intersil Americas LLC 2003-2015. All Rights Reserved.
All trademarks and registered trademarks are the property of their respective owners.
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its
subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN3676 Rev 5.00
September 30, 2015
Page 14 of 14
工商网监
湘ICP备2023018690号
