Datasheet
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
One Microamp Supply-Current, +3V to +5.5V, 250kbps, RS-232
Transmitters/Receivers
The ICL3221, ICL3222, ICL3223, ICL3232, ICL3241,
ICL3243 (ISL32xx) devices are 3.0V to 5.5V powered
RS-232 transmitters/receivers that meet ElA/TIA-232
and V.28/V.24 specifications, even at VCC = 3.0V.
Targeted applications are PDAs, notebook, and laptop
computers where the low operational power
consumption and even lower standby power
consumption are critical. Efficient on-chip charge
pumps, coupled with manual and automatic
power-down functions (except for the ICL3232),
reduce the standby supply current to a 1µA trickle.
Small footprint packaging, and the use of small, low
value capacitors ensure board space savings as well.
Data rates greater than 250kbps are ensured at worst
case load conditions. This family is fully compatible
with 3.3V only systems, mixed 3.3V and 5.0V
systems, and 5.0V only systems.
The ICL324x are 3-driver, 5-receiver devices that
provide a complete serial port suitable for laptop or
notebook computers. Both devices also include
noninverting always-active receivers for “wake-up”
capability.
The ICL3221, ICL3223 and ICL3243 feature an
automatic powerdown function that powers down the
on-chip power-supply and driver circuits. Power-down
occurs when an attached peripheral device is shut off
or the RS-232 cable is removed, conserving system
power automatically without changes to the hardware
or operating system. These devices power up again
when a valid RS-232 voltage is applied to any
receiver input.
Table 1 on page 6 summarizes the features of the
devices represented by this datasheet, while
Application Note AN9863 summarizes the features of
each device comprising the ICL32xx 3V family.
Features
• RoHS Compliant
• 15kV ESD protected (Human Body Model)
• Drop-in replacements for MAX3221, MAX3222,
MAX3223, MAX3232, MAX3241, MAX3243,
SP3243
• ICL3221 is a low-power, pin compatible upgrade for
5V MAX221
• ICL3222 is a low-power, pin compatible upgrade for
5V MAX242, and SP312A
• ICL3232 is a low-power upgrade for HIN232/ICL232
and pin compatible competitor devices
• RS-232 compatible with VCC = 2.7V
• Meets EIA/TIA-232 and V.28/V.24 specifications at
3V
• Latch-up free
• On-chip voltage converters require only four
external 0.1µF capacitors
• Manual and automatic powerdown features (except
ICL3232)
• Assured mouse driveability (ICL324x only)
• Receiver hysteresis for improved noise immunity
• Assured minimum data rate: 250kbps
• Assured minimum slew rate: 6V/μs
• Wide power supply range: single +3V to +5.5V
• Low supply current in powerdown state:1µA
Applications
• Any system requiring RS-232 communication ports
Related Literature
○ Battery powered, hand-held, and portable
equipment
For a full list of related documents, visit our website:
○ Laptop computers, Notebooks
• ICL3221, ICL3222, ICL3223, ICL3232, ICL3241,
and ICL3243 device pages
○ Modems, printers, and other peripherals
○ Digital cameras
○ Cellular/mobile phones
FN4805 Rev.23.00
Apr.26.19
Page 1 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
Contents
1.
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1
1.2
1.3
1.4
2.
Typical Operating Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
4
6
8
Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.1
2.2
2.3
2.4
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Thermal Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.
Typical Performance Curves. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.
Application Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.1
4.1.1
4.2
4.3
4.4
4.5
4.5.1
4.5.2
4.5.3
4.6
4.7
4.8
4.9
4.10
4.11
4.12
4.13
4.14
Charge Pump. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Charge Pump Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Transmitters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Low Power Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Powerdown Functionality (Except ICL3232) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Software Controlled (Manual) Powerdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
INVALID Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Automatic Powerdown (ICL3221/23/43 Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver ENABLE Control (ICL3221/22/23/41 Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Capacitor Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Supply Decoupling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operation Down to 2.7V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Transmitter Outputs when Exiting Powerdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Mouse Driveability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
High Data Rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interconnection with 3V and 5V Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Compatible Replacements For 5V Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13
13
14
14
15
15
15
16
18
19
19
19
19
20
20
20
21
22
5.
Die Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
7.
Package Outline Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
FN4805 Rev.23.00
Apr.26.19
Page 2 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
Overview
1.1
Typical Operating Circuits
ICL3221
ICL3222
C3 (Optional Connection, Note)
C3 (Optional Connection, Note)
VCC
V- 7
T1
11
T1IN
V+
13
9
R1OUT
3
8
+ C3
0.1µF
C4
+ 0.1µF
T1OUT
R1IN
5kΩ
R1
1 EN
FORCEOFF
12
INVALID
FORCEON
GND
16
10
C1
0.1µF
+
C2
0.1µF
+
2
4
5
6
+
17
C1+
T2
C4
0.1µF
T1OUT
8
T2OUT
14
R1IN
5kΩ
R1
9
10
R2OUT
7
15
13
R1OUT
+ C3
0.1µF
+
T1
VCC
To Power
Control
Logic
3
V+
V-
C2-
11
T2IN
VCC
C1C2+
12
T1IN
TTL/CMOS
Logic Levels
C2
0.1µF
+
0.1µF
15
2
+ C1+
4
C15
+ C2+
6
C2-
C1
0.1µF
TTL/CMOS
Logic Levels
0.1µF
RS-232
Levels
+
+
+3.3V
+3.3V
RS-232
Levels
1.
1. Overview
1 EN
R2IN
5kΩ
R2
14
GND
NOTE: The negative terminal of C3 can be
connected to either VCC or GND
SHDN
18
VCC
16
NOTE: The negative terminal of C3 can be
connected to either VCC or GND
ICL3223
R1OUT
C1C2+
V- 7
C2T1
13
17
T2
12
8
15
16
5kΩ
R1
R2OUT
V+
10
1
9
EN
5kΩ
R2
FORCEOFF
14
3
INVALID
FORCEON
GND
20
11
+ C3
0.1µF
C4
0.1µF
+
+
+
C2
0.1µF
+
T1IN
T2OUT
R1IN
1
C1
0.1µF
T1OUT
T2IN
R1OUT
0.1μF
3
4
5
11
10
V+
C1C2+
V-
C2T1
2
+ C3
0.1µF
6
C4
0.1µF
+
14
T2
T1OUT
7
T2OUT
13
R1
R2OUT
To Power
Control Logic
16
VCC
12
R2IN
VCC
C1+
R1IN
RS-232
Levels
5
+
6
VCC
+3.3V
+
C2
0.1µF
C1+
19
TTL/CMOS
Logic Levels
2
+
4
T2IN
C3 (Optional Connection, Note)
0.1µF
C1
0.1µF
T1IN
TTL/CMOS
Logic Levels
+
RS-232
Levels
+3.3V
ICL3232
5kΩ
9
8
R2
R2IN
5kΩ
GND
15
18
NOTE: The negative terminal of C3 can be
connected to either VCC or GND
FN4805 Rev.23.00
Apr.26.19
Page 3 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
1. Overview
ICL3241
V+
V-
14
T1
13
T2
12
T3
27
3
+ C3
0.1µF
TTL/CMOS
Logic Levels
R2OUTB
R1OUT
9
10
T2IN
11
C1+
VCC
24
C11
C2+
+
2
C2-
VT1
+
C3
0.1µF
C4
0.1µF
+
9
T1OUT
T2
13
10
T3
12
T2OUT
11
T3OUT
20
19
4
19
R1IN
5kΩ
18
5
R2IN
4
R1OUT
R1IN
R1
R2OUT
5
R2
R3IN
5kΩ
16
R4OUT
6
R3OUT
R3IN
R3
R4OUT
7
7
R4
5kΩ
15
8
R5OUT
R5OUT
R5IN
GND
25
VCC
22
21
R4IN
5kΩ
15
23
To Power
Control Logic
SHDN
5kΩ
R5
EN
5kΩ
16
R4IN
R4
R2IN
5kΩ
17
6
R3
5kΩ
18
5kΩ
17
22
3
T3IN
20
23
27
V+
R2OUTB
R3OUT
1.2
+
26
14
21
R2
VCC
T2OUT
28
T1IN
T1OUT
T3OUT
R1
R2OUT
C2
0.1µF
C4
0.1µF
+
T3IN
R1OUTB
C1
0.1µF
0.1µF
RS-232
Levels
T2IN
VCC
+
RS-232
Levels
T1IN
28
C1+
+
24
C11
C2+
+
2
C2-
26
TTL/CMOS
Logic Levels
C2
0.1µF
0.1µF
RS-232
Levels
C1
0.1µF
+3.3V
+
RS-232
Levels
+3.3V
ICL3243
8
5kΩ
R5
R5IN
FORCEON
FORCEOFF
INVALID
GND
25
Ordering Information
Temp. Range (°c)
Tape and Reel
(Units) (Note 1)
ICL3221CAZ
0 to 70
-
16 Ld SSOP
ICL3221CAZ-T
ICL3221CAZ
0 to 70
1k
16 Ld SSOP
M16.209
ICL3221CVZ
3221CVZ
0 to 70
-
16 Ld TSSOP
M16.173
ICL3221CVZ-T
3221CVZ
0 to 70
2.5k
16 Ld TSSOP
M16.173
ICL3221IAZ
ICL3221IAZ
-40 to 85
-
16 Ld SSOP
M16.209
Part Number (Notes 2, 3)
ICL3221CAZ
Part Marking
Package
(RoHS Compliant)
Pkg. Dwg. #
M16.209
ICL3221IAZ-T
ICL3221IAZ
-40 to 85
1k
16 Ld SSOP
M16.209
ICL3221IAZ-T7A
ICL3221IAZ
-40 to 85
250
16 Ld SSOP
M16.209
ICL3222CAZ (No longer available,
recommended replacement:
ICL3222ECAZ)
ICL3222CAZ
0 to 70
-
20 Ld SSOP
M20.209
FN4805 Rev.23.00
Apr.26.19
Page 4 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
Part Number (Notes 2, 3)
Part Marking
1. Overview
Temp. Range (°c)
Tape and Reel
(Units) (Note 1)
0 to 70
-
Package
(RoHS Compliant)
ICL3222CBZ (No longer available,
recommended replacement:
ICL3222EIBZ)
3222CBZ
ICL3222CVZ
ICL3222CVZ
0 to 70
-
20 Ld TSSOP
M20.173
ICL3222CVZ-T
ICL3222CVZ
0 to 70
2.5k
20 Ld TSSOP
M20.173
ICL3222IAZ (No longer available,
recommended replacement:
ICL3222EIAZ)
ICL3222IAZ
-40 to 85
-
20 Ld SSOP
M20.209
ICL3222IVZ (No longer available,
recommended replacement:
ICL3222EIVZ)
ICL3222IVZ
-40 to 85
-
20 Ld TSSOP
M20.173
ICL3223CAZ (No longer available,
recommended replacement:
ICL3223ECAZ)
ICL3223CAZ
0 to 70
-
20 Ld SSOP
M20.209
ICL3223IAZ
ICL3223IAZ
-40 to 85
-
20 Ld SSOP
M20.209
ICL3223IAZ-T
ICL3223IAZ
-40 to 85
1k
20 Ld SSOP
M20.209
ICL3223IVZ
ICL3223IVZ
-40 to 85
-
20 Ld TSSOP
M20.173
ICL3223IVZ-T
ICL3223IVZ
-40 to 85
2.5k
20 Ld TSSOP
M20.173
ICL3232CAZ (No longer available,
recommended replacement:
ICL3232ECAZ)
3232CAZ
0 to 70
-
16 Ld SSOP
M16.209
ICL3232CBZ (No longer available,
recommended replacement:
ICL3232ECBZ)
3232CBZ
0 to 70
-
16 Ld SOIC
M16.3
ICL3232CBNZ
3232CBNZ
0 to 70
-
16 Ld SOIC (N)
M16.15
ICL3232CBNZ-T
3232CBNZ
0 to 70
2.5k
16 Ld SOIC (N)
M16.15
ICL3232CPZ
ICL3232CPZ
0 to 70
-
16 Ld PDIP
E16.3
ICL3232CVZ
3232CVZ
0 to 70
-
16 Ld TSSOP
M16.173
ICL3232CVZ-T
3232CVZ
0 to 70
2.5k
16 Ld TSSOP
M16.173
ICL3232IAZ (No longer available,
recommended replacement:
ICL3232EIAZ)
3232IAZ
-40 to 85
-
16 Ld SSOP
M16.209
ICL3232IBZ (No longer available,
recommended replacement:
ICL3232EIBZ)
3232IBZ
-40 to 85
-
16 Ld SOIC
M16.3
ICL3232IBNZ
3232IBNZ
-40 to 85
-
16 Ld SOIC (N)
M16.15
ICL3232IBNZ-T
3232IBNZ
-40 to 85
2.5k
16 Ld SOIC (N)
M16.15
ICL3232IBNZ-T7A
3232IBNZ
-40 to 85
250
16 Ld SOIC (N)
M16.15
ICL3232IVZ
3232IVZ
-40 to 85
-
16 Ld TSSOP
M16.173
ICL3232IVZ-T
3232IVZ
-40 to 85
2.5k
16 Ld TSSOP
M16.173
ICL3232IVZ-T7A
3232IVZ
-40 to 85
250
16 Ld TSSOP
M16.173
ICL3241CAZ (No longer available,
recommended replacement:
ICL3241ECAZ)
ICL3241CAZ
0 to 70
-
28 Ld SSOP
M28.209
ICL3241CVZ (No longer available,
recommended replacement:
ICL3241ECVZ)
ICL3241CVZ
0 to 70
-
28 Ld TSSOP
M28.173
ICL3241IAZ (No longer available,
recommended replacement:
ICL3241EIAZ)
ICL3241IAZ
-40 to 85
-
28 Ld SSOP
M28.209
FN4805 Rev.23.00
Apr.26.19
18 Ld SOIC
Pkg. Dwg. #
M18.3
Page 5 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
Part Number (Notes 2, 3)
Part Marking
1. Overview
Temp. Range (°c)
Tape and Reel
(Units) (Note 1)
Package
(RoHS Compliant)
-
28 Ld SSOP
M28.209
Pkg. Dwg. #
ICL3243CAZ (No longer available,
recommended replacement:
ICL3243ECAZ)
ICL3243CAZ
0 to 70
ICL3243CBZ
ICL3243CBZ
0 to 70
-
28 Ld SOIC
M28.3
ICL3243CBZ-T
ICL3243CBZ
0 to 70
1k
28 Ld SOIC
M28.3
ICL3243CVZ (No longer available,
recommended replacement:
ICL3243ECVZ)
ICL3243CVZ
0 to 70
-
28 Ld TSSOP
M28.173
ICL3243IAZ (No longer available,
recommended replacement:
ICL3243EIAZ)
ICL3243IAZ
-40 to 85
-
28 Ld SSOP
M28.209
Notes:
1. See TB347 for details about reel specifications.
2. Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J-STD-020.
3. For Moisture Sensitivity Level (MSL), see the ICL3221, ICL3222, ICL3223, ICL3232, ICL3241,and ICL3243 device pages. For more
information about MSL, see TB363.
Table 1.
Summary of Features
Part Number
1.3
No. of Tx.
No. of Rx.
No. of Monitor
Rx. (ROUTB)
Data Rate
(kbps)
Rx. Enable
Function?
Ready
Output?
Manual
Power- Down?
Automatic
Powerdown
Function?
ICL3221
1
1
0
250
Yes
No
Yes
Yes
ICL3222
2
2
0
250
Yes
No
Yes
No
ICL3223
2
2
0
250
Yes
No
Yes
Yes
ICL3232
2
2
0
250
No
No
No
No
ICL3241
3
5
2
250
Yes
No
Yes
No
ICL3243
3
5
1
250
No
No
Yes
Yes
Pin Configurations
ICL3221 (SSOP, TSSOP)
Top View
EN 1
C1+ 2
V+
3
16 FORCEOFF
15 VCC
14 GND
C1- 4
13 T1OUT
C2+ 5
12 FORCEON
C2- 6
11 T1IN
V- 7
R1IN
8
FN4805 Rev.23.00
Apr.26.19
10 INVALID
9 R1OUT
ICL3222 (SOIC)
Top View
EN 1
C1+ 2
V+
3
18 SHDN
17 VCC
16 GND
C1- 4
15 T1OUT
C2+ 5
14 R1IN
C2- 6
13 R1OUT
V- 7
12 T1IN
T2OUT
8
11 T2IN
R2IN
9
10 R2OUT
Page 6 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
1. Overview
ICL3222 (SSOP, TSSOP)
Top View
EN 1
ICL3223 (SSOP, TSSOP)
Top View
20 SHDN
20 FORCEOFF
EN 1
19 VCC
C1+ 2
18 GND
V+
C1- 4
17 T1OUT
C1- 4
17 T1OUT
C2+ 5
16 R1IN
C2+ 5
16 R1IN
C2- 6
15 R1OUT
C2- 6
15 R1OUT
C1+ 2
V+
3
V-
7
14 NC
T2OUT
8
R2IN
9
R2OUT 10
7
14 FORCEON
13 T1IN
T2OUT
8
13 T1IN
12 T2IN
R2IN
9
12 T2IN
11 NC
C2+ 1
28 C1+
C2- 2
27 V+
14 T1OUT
V-
3
26 VCC
13 R1IN
R1IN
4
25 GND
12 R1OUT
R2IN
5
24 C1-
6
11 T1IN
R3IN
6
23 EN
7
10 T2IN
R4IN
7
22 SHDN
R5IN
8
21 R1OUTB
T1OUT
9
20 R2OUTB
3
C2+ 4
C2- 5
R2IN
ICL3241 (SSOP, TSSOP)
Top View
15 GND
V+ 2
T2OUT
11 INVALID
R2OUT 10
16 VCC
C1+ 1
V-
18 GND
V-
ICL3232 (PDIP, SOIC, SSOP, TSSOP)
Top View
C1-
19 VCC
3
8
9 R2OUT
T2OUT 10
19 R1OUT
T3OUT 11
18 R2OUT
T3IN 12
17 R3OUT
T2IN 13
16 R4OUT
T1IN 14
15 R5OUT
ICL3243 (SOIC, SSOP, TSSOP)
Top View
FN4805 Rev.23.00
Apr.26.19
C2+ 1
28 C1+
C2- 2
27 V+
V-
3
26 VCC
R1IN
4
25 GND
R2IN
5
24 C1-
R3IN
6
23 FORCEON
R4IN
7
22 FORCEOFF
R5IN
8
21 INVALID
T1OUT
9
20 R2OUTB
T2OUT 10
19 R1OUT
T3OUT 11
18 R2OUT
T3IN 12
17 R3OUT
T2IN 13
16 R4OUT
T1IN 14
15 R5OUT
Page 7 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
1.4
1. Overview
Pin Descriptions
Pin
Function
VCC
System power supply input (3.0V to 5.5V).
V+
Internally generated positive transmitter supply (+5.5V).
V-
Internally generated negative transmitter supply (-5.5V).
GND
Ground connection.
C1+
External capacitor (voltage doubler) is connected to this lead.
C1-
External capacitor (voltage doubler) is connected to this lead.
C2+
External capacitor (voltage inverter) is connected to this lead.
C2-
External capacitor (voltage inverter) is connected to this lead.
TIN
TTL/CMOS compatible transmitter Inputs.
TOUT
RS-232 level (nominally ±5.5V) transmitter outputs.
RIN
RS-232 compatible receiver inputs.
ROUT
TTL/CMOS level receiver outputs.
ROUTB
TTL/CMOS level, noninverting, always enabled receiver outputs.
INVALID
EN
SHDN
Active low output that indicates if no valid RS-232 levels are present on any receiver input.
Active low receiver enable control; doesn’t disable ROUTB outputs.
Active low input to shut down transmitters and on-board power supply to place device in low power mode.
FORCEOFF Active low to shut down transmitters and on-chip power supply. This overrides any automatic circuitry and FORCEON (See
Table 5 on page 15).
FORCEON
Active high input to override automatic powerdown circuitry thereby keeping transmitters active. (FORCEOFF must be high).
FN4805 Rev.23.00
Apr.26.19
Page 8 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
2.
2. Specifications
Specifications
2.1
Absolute Maximum Ratings
Minimum
Maximum
Unit
VCC to Ground
Parameter
-0.3
6
V
V+ to Ground
-0.3
7
V
V- to Ground
+0.3
-7
V
14
V
6
V
±25
V
±13.2
V
VCC +0.3
V
V+ to VInput Voltages
TIN, FORCEOFF, FORCEON, EN, SHDN
-0.3
RIN
Output Voltages
TOUT
ROUT, INVALID
-0.3
Short-Circuit Duration
Continuous
TOUT
ESD Rating
(See ESD Performance)
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions can adversely
impact product reliability and result in failures not covered by warranty.
2.2
Thermal Information
θJA (°C/W)
Thermal Resistance (Typical, Note 4)
16 Ld PDIP Package (Note 5)
90
16 Ld Wide SOIC Package
100
16 Ld Narrow SOIC Package
115
18 Ld SOIC Package
75
28 Ld SOIC Package
75
16 Ld SSOP Package
135
20 Ld SSOP Package
122
16 Ld TSSOP Package
145
20 Ld TSSOP Package
140
28 Ld SSOP and TSSOP Packages
100
Notes:
4. θJA is measured with the component mounted on a low-effective thermal conductivity test board in free air. See TB379.
5. Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing
applications.
Parameter
Minimum
Maximum Junction Temperature (Plastic Package)
Maximum Storage Temperature Range
Pb-Free Reflow Profile (SOIC, SSOP, TSSOP Only)
FN4805 Rev.23.00
Apr.26.19
-65
Maximum
Unit
+150
°C
+150
°C
see TB493
Page 9 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
2.3
2. Specifications
Recommended Operating Conditions
Parameter
Minimum
Maximum
Unit
ICL32xxCx
0
+70
°C
ICL32xxIx
-40
+85
°C
Temperature Range
2.4
Electrical Specifications
Test Conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1µF; unless otherwise specified. Typicals are at TA = 25°C
Parameter
Test Conditions
Tem
p
(°C)
Min
Typ
Max
Uni
t
25
-
1.0
10
µA
DC Characteristics
Supply Current, Automatic
Power-Down
All RIN open, FORCEON = GND, FORCEOFF = VCC
(ICL3221, ICL3223, ICL3243 only)
Supply Current, Powerdown
FORCEOFF = SHDN = GND (except ICL3232)
Supply Current, Automatic
Power-Down Disabled
All outputs unloaded,
FORCEON = FORCEOFF =
SHDN = VCC
25
-
1.0
10
µA
VCC = 3.15V,
ICL3221-32
25
-
0.3
1.0
mA
VCC = 3.0V, ICL3241-43
25
-
0.3
1.0
mA
Logic and Transmitter Inputs and Receiver Outputs
Input Logic Threshold Low
TIN, FORCEON, FORCEOFF, EN, SHDN
Full
-
-
0.8
V
Input Logic Threshold High
TIN, FORCEON, FORCEOFF,
EN, SHDN
Full
2.0
-
-
V
Full
2.4
-
-
V
Input Leakage Current
TIN, FORCEON, FORCEOFF, EN, SHDN
Full
-
±0.01
±1.0
µA
Output Leakage Current
(Except ICL3232)
FORCEOFF = GND or EN = VCC
Full
-
±0.05
±10
µA
Output Voltage Low
IOUT = 1.6mA
Full
-
-
0.4
V
Output Voltage High
IOUT = -1.0mA
Full
VCC 0.6
VCC 0.1
-
V
VCC = 3.3V
VCC = 5.0V
Automatic Powerdown (ICL3221, ICL3223, ICL3243 only, FORCEON = GND, FORCEOFF = VCC)
Receiver Input Thresholds to Enable
Transmitters
ICL32xx powers up (See Figure 12)
Full
-2.7
-
2.7
V
Receiver Input Thresholds to Disable
Transmitters
ICL32xx powers down (See Figure 12)
Full
-0.3
-
0.3
V
INVALID Output Voltage Low
IOUT = 1.6mA
Full
-
-
0.4
V
INVALID Output Voltage High
IOUT = -1.0mA
Full
VCC-0.6
-
-
V
Receiver Threshold to Transmitters
Enabled Delay (tWU)
25
-
100
-
µs
Receiver Positive or Negative
Threshold to INVALID High Delay
(tINVH)
25
-
1
-
µs
Receiver Positive or Negative
Threshold to INVALID Low Delay
(tINVL)
25
-
30
-
µs
Receiver Inputs
Input Voltage Range
Input Threshold Low
Input Threshold High
Input Hysteresis
FN4805 Rev.23.00
Apr.26.19
Full
-25
-
25
V
VCC = 3.3V
25
0.6
1.2
-
V
VCC = 5.0V
25
0.8
1.5
-
V
VCC = 3.3V
25
-
1.5
2.4
V
VCC = 5.0V
25
-
1.8
2.4
V
25
-
0.3
-
V
Page 10 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
2. Specifications
Test Conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1µF; unless otherwise specified. Typicals are at TA = 25°C (Continued)
Parameter
Test Conditions
Input Resistance
Tem
p
(°C)
Min
Typ
Max
Uni
t
25
3
5
7
kΩ
Transmitter Outputs
Output Voltage Swing
All Transmitter Outputs Loaded with 3kΩ to Ground
Full
±5.0
±5.4
-
V
Output Resistance
VCC = V+ = V- = 0V, Transmitter Output = ±2V
Full
300
10M
-
W
Full
-
±35
±60
mA
VOUT = ±12V, VCC = 0V or 3V to 5.5V
Automatic Powerdown or FORCEOFF = SHDN = GND
Full
-
-
±25
µA
T1IN = T2IN = GND, T3IN = VCC, T3OUT loaded with 3kΩ to
GND, T1OUT and T2OUT loaded with 2.5mA each
Full
±5
-
-
V
Maximum Data Rate
RL = 3kΩ, CL = 1000pF, one transmitter switching
Full
250
500
-
kbp
s
Receiver Propagation Delay
Receiver input to receiver output, tPHL
CL = 150pF
tPLH
25
-
0.3
-
µs
25
-
0.3
-
µs
Output Short-Circuit Current
Output Leakage Current
Mouse Driveability (ICL324X Only)
Transmitter Output Voltage
(See Figure 15)
Timing Characteristics
Receiver Output Enable Time
Normal operation (except ICL3232)
25
-
200
-
ns
Receiver Output Disable Time
Normal operation (except ICL3232)
25
-
200
-
ns
Transmitter Skew
tPHL - tPLH
Full
-
200
100
0
ns
Receiver Skew
tPHL - tPLH
Full
-
100
500
ns
Transition Region Slew Rate
VCC = 3.3V,
RL = 3kΩ to 7kΩ,
Measured from 3V to -3V or -3V
to 3V
CL = 200pF to 2500pF
25
4
8.0
30
V/µ
s
CL = 200pF to 1000pF
25
6
-
30
V/µ
s
Human Body Model
ICL3221 - ICL3243
25
-
±15
-
kV
IEC61000-4-2 Contact Discharge ICL3221 - ICL3243
25
-
±8
-
kV
IEC61000-4-2 Air Gap Discharge ICL3221 - ICL3232
25
-
±8
-
kV
ESD Performance
RS-232 Pins (TOUT, RIN)
All Other Pins
FN4805 Rev.23.00
Apr.26.19
Human Body Model
ICL3241 - ICL3243
25
-
±6
-
kV
ICL3221 - ICL3243
25
-
±2
-
kV
Page 11 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
3.
3. Typical Performance Curves
Typical Performance Curves
VCC = 3.3V, TA = 25°C
6
25
20
2
Slew Rate (V/µs)
Transmitter Output Voltage (V)
VOUT+
4
1 Transmitter at 250kbps
1 or 2 Transmitters at 30kbps
0
-2
15
-SLEW
+SLEW
10
VOUT -
-4
-6
0
1000
2000
3000
4000
5
5000
0
1000
Figure 1. Transmitter Output Voltage vs Load
Capacitance
5000
ICL3222 - ICL3232
40
35
30
25
20
120kbps
15
10
250kbps
35
250kbps
Supply Current (mA)
Supply Current (mA)
4000
45
ICL3221
40
30
25
120kbps
20
15
20kbps
10
20kbps
5
5
0
1000
2000
3000
4000
0
5000
0
1000
Load Capacitance (pF)
2000
3000
ICL324X
40
5000
Figure 4. Supply Current vs Load Capacitance when
Transmitting Data
3.5
45
4000
Load Capacitance (pF)
Figure 3. Supply Current vs Load Capacitance when
Transmitting Data
No Load
All Outputs Static
250kbps
3.0
ICL3221 - ICL3232
30
Supply Current (mA)
35
Supply Current (mA)
3000
Figure 2. Slew Rate vs Load Capacitance
45
0
2000
Load Capacitance (pF)
Load Capacitance (pF)
120kbps
25
20
20kbps
15
2.5
2.0
1.5
1.0
10
0
ICL324X
0.5
5
ICL324X
0
1000
2000
3000
4000
5000
Load Capacitance (pF)
Figure 5. Supply Current vs Load Capacitance when
Transmitting Data
FN4805 Rev.23.00
Apr.26.19
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Supply Voltage (V)
Figure 6. Supply Current vs Supply Voltage
Page 12 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
4.
4. Application Information
Application Information
The ICL32xx interface ICs operate from a single +3V to +5.5V supply, ensure a 250kbps minimum data rate,
require only four small external 0.1µF capacitors, feature low-power consumption, and meet all ElA RS-232C and
V.28 specifications. The circuit is divided into three sections:
• Charge-pump
• Transmitters
• Receivers
4.1
Charge Pump
The ICL32xx family uses regulated on-chip dual charge pumps as voltage doublers, and voltage inverters to
generate ±5.5V transmitter supplies from a VCC supply as low as 3.0V, which allows these devices to maintain
RS-232 compliant output levels over the ±10% tolerance range of 3.3V powered systems. The efficient on-chip
power supplies require only four small, external 0.1µF capacitors for the voltage doubler and inverter functions at
VCC = 3.3V. See Capacitor Selection and Table 6 on page 19 for capacitor recommendations for other operating
conditions. The charge pumps operate discontinuously (for example, they turn off as soon as the V+ and Vsupplies are pumped up to the nominal values), resulting in significant power savings.
4.1.1 Charge Pump Absolute Maximum Ratings
These 3V to 5V RS-232 transceivers have been fully characterized for 3.0V to 3.6V operation, and at critical
points for 4.5V to 5.5V operation. Furthermore, load conditions were favorable using static logic states only.
The specified maximum values for V+ and V- are +7V and -7V, respectively. These limits apply for VCC values set
to 3.0V and 3.6V (see Table 2). For VCC values set to 4.5V and 5.5V, the maximum values for V+ and V- can
approach +9V and -7V respectively (see Table 3). The breakdown characteristics for V+ and V- were measured
with ±13V.
Table 2.
V+ and V- Values for VCC = 3.0V to 3.6V
V+ (V)
V- (V)
C1 (μF)
C2, C3, C4 (μF)
Load
T1IN (Logic
State)
0.1
0.1
Open
H
5.8
6.56
-5.6
-5.88
L
5.8
6.56
-5.6
-5.88
2.4kbps
5.8
6.56
-5.6
-5.88
H
5.88
6.6
-5.56
-5.92
3kΩ // 1000pF
0.047
0.33
Open
3kΩ // 1000pF
1
1
Open
3kΩ // 1000pF
FN4805 Rev.23.00
Apr.26.19
VCC = 3.0V
VCC = 3.6V
VCC = 3.0V
VCC = 3.6V
L
5.76
6.36
-5.56
-5.76
2.4kbps
6
6.64
-5.64
-5.96
H
5.68
6
-5.6
-5.6
L
5.68
6
-5.6
-5.6
2.4kbps
5.68
6
-5.6
-5.6
H
5.76
6.08
-5.64
-5.64
L
5.68
6.04
-5.6
-5.6
2.4kbps
5.84
6.16
-5.64
-5.72
H
5.88
6.24
-5.6
-5.6
L
5.88
6.28
-5.6
-5.64
2.4kbps
5.8
6.2
-5.6
-5.6
H
5.88
6.44
-5.64
-5.72
L
5.88
6.04
-5.64
-5.64
2.4kbps
5.92
6.4
-5.64
-5.64
Page 13 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
Table 3.
4. Application Information
V+ and V- Values for Vcc = 4.5V to 5.5V
V+ (V)
V- (V)
C1 (μF)
C2, C3, C4 (μF)
Load
T1IN (Logic
State)
0.1
0.1
Open
H
7.44
8.48
-6.16
-6.4
L
7.44
8.48
-6.16
-6.44
2.4kbps
7.44
8.48
-6.17
-6.44
H
7.76
8.88
-6.36
-6.72
3kΩ // 1000pF
0.047
0.33
Open
3kΩ // 1000pF
1
1
Open
3kΩ // 1000pF
VCC = 4.5V
VCC = 5.5V
VCC = 4.5V
VCC = 5.5V
L
7.08
8
-5.76
-5.76
2.4kbps
7.76
8.84
-6.4
-6.64
H
6.44
6.88
-5.8
-5.88
L
6.48
6.88
-5.84
-5.88
2.4kbps
6.44
6.88
-5.8
-5.88
H
6.64
7.28
-5.92
-6.04
L
6.24
6.6
-5.52
-5.52
2.4kbps
6.72
7.16
-5.92
-5.96
H
6.84
7.6
-5.76
-5.76
L
6.88
7.6
-5.76
-5.76
2.4kbps
6.92
7.56
-5.72
-5.76
H
7.28
8.16
-5.8
-5.92
L
6.44
6.84
-5.64
-6.84
2.4kbps
7.08
7.76
-5.8
-5.8
The resulting new maximum voltages at V+ and V- are listed in Table 4.
Table 4.
New Measured Withstanding Voltages
V+, V- to Ground
±13V
V+ to V-
20V
4.2
Transmitters
The transmitters are proprietary, low dropout, inverting drivers that translate TTL/CMOS inputs to EIA/TIA-232
output levels. These transmitters are coupled with the on-chip ± 5.5V supplies and deliver true RS-232 levels
across a wide range of single supply system voltages.
Except for the ICL3232, all transmitter outputs disable and assume a high impedance state when the device
enters the powerdown mode (See Table 5 on page 15). These outputs can be driven to ±12V when disabled.
All devices ensure a 250kbps data rate for full load conditions (3kΩ and 1000pF), VCC ≥ 3.0V, with one transmitter
operating at full speed. Under more typical conditions of VCC ≥ 3.3V, RL = 3kΩ, and CL = 250pF, one transmitter
easily operates at 900kbps.
Transmitter inputs float if left unconnected and may cause ICC increases. Connect unused inputs to GND for the
best performance.
4.3
Receivers
All the ICL32xx devices contain standard inverting receivers that three-state (except for the ICL3232) using the
EN or FORCEOFF control lines. Additionally, the two ICL324X products include noninverting (monitor) receivers
(denoted by the ROUTB label) that are always active, regardless of the state of any control lines. All the receivers
convert RS-232 signals to CMOS output levels and accept inputs up to ±25V while presenting the required 3kΩ to
7kΩ input impedance (see Figure 7) even if the power is off (VCC = 0V). The receivers’ Schmitt trigger input stage
uses hysteresis to increase noise immunity and decrease errors due to slow input signal transitions.
FN4805 Rev.23.00
Apr.26.19
Page 14 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
4. Application Information
VCC
RXOUT
RXIN
-25V ≤ VRIN ≤ +25V
GND ≤ VROUT ≤ VCC
5kΩ
GND
Figure 7. Inverting Receiver Connections
The ICL3221/22/23/41 inverting receivers disable only when EN is driven high. ICL3243 receivers disable during
forced (manual) powerdown, but not during automatic powerdown (See Table 5).
ICL324X monitor receivers remain active even during manual powerdown and forced receiver disable, making
them extremely useful for Ring Indicator monitoring. Standard receivers driving powered down peripherals must
be disabled to prevent current flow through the peripheral’s protection diodes (See Figures 8 and 9). When
disabled, the receivers cannot be used for wake up functions, but the corresponding monitor receiver can be
dedicated to this task as shown in Figure 9 on page 17.
4.4
Low Power Operation
The 3V devices require a nominal supply current of 0.3mA, even at VCC = 5.5V, during normal operation (not in
powerdown mode), which is considerably less than the 5mA to 11mA current required by comparable 5V RS-232
devices, allowing you to reduce system power simply by switching to this new family.
4.5
Powerdown Functionality (Except ICL3232)
The already low current requirement drops significantly when the device enters powerdown mode. In
power-down, supply current drops to 1µA, because the on-chip charge pump turns off (V+ collapses to VCC,
V- collapses to GND), and the transmitter outputs three-state. Inverting receiver outputs may disable in
power-down; see Table 5 for details. This micro-power mode makes these devices ideal for battery powered and
portable applications.
4.5.1 Software Controlled (Manual) Powerdown
Most devices in the ICL32xx family provide pins that allow you to force the IC into the low power, standby state.
On the ICL3222 and ICL3241, the powerdown control is using a simple shutdown (SHDN) pin. Driving this pin
high enables normal operation, and driving it low forces the IC into its powerdown state. Connect SHDN to VCC if
the powerdown function is not needed. Note that all the receiver outputs remain enabled during shutdown (See
Table 5). For the lowest power consumption during powerdown, the receivers should also be disabled by driving
the EN input high (See next section, and Figures 8 and 9).
The ICL3221, ICL3223, and ICL3243 use a two pin approach where the FORCEON and FORCEOFF inputs
determine the IC’s mode. For always enabled operation, FORCEON and FORCEOFF are both strapped high.
Under logic or software control, only the FORCEOFF input needs to be driven to switch between active and
powerdown modes. The FORCEON state is not critical because FORCEOFF overrides FORCEON. However, if
strictly manual control over powerdown is needed, you must strap FORCEON high to disable the automatic
power-down circuitry. ICL3243 inverting (standard) receiver outputs also disable when the device is in manual
powerdown, thereby eliminating the possible current path through a shutdown peripheral’s input protection diode
(See Figures 8 and 9).
Table 5.
Powerdown and Enable Logic Truth Table
RS-232
Signal Present at
Receiver Input?
FORCEOFF
ROUTB
or SHDN
FORCEON EN Transmitter Receiver Outputs INVALID
Input
Input
Input
Outputs
Outputs (Note 6) Output
Mode of Operation
ICL3222, ICL3241
N.A.
L
N.A.
L
High-Z
Active
Active
N.A.
Manual Powerdown
N.A.
L
N.A.
H
High-Z
High-Z
Active
N.A.
Manual Powerdown w/Rcvr.
Disabled
N.A.
H
N.A.
L
Active
Active
Active
N.A.
Normal Operation
FN4805 Rev.23.00
Apr.26.19
Page 15 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
Table 5.
4. Application Information
Powerdown and Enable Logic Truth Table (Continued)
RS-232
Signal Present at
Receiver Input?
FORCEOFF
ROUTB
or SHDN
FORCEON EN Transmitter Receiver Outputs INVALID
Input
Input
Input
Outputs
Outputs (Note 6) Output
Mode of Operation
ICL3222, ICL3241
N.A.
H
N.A.
H
Active
High-Z
Active
N.A.
Normal Operation w/Rcvr.
Disabled
No
H
H
L
Active
Active
N.A.
L
No
H
H
H
Active
High-Z
N.A.
L
Yes
H
L
L
Active
Active
N.A.
H
Yes
H
L
H
Active
High-Z
N.A.
H
No
H
L
L
High-Z
Active
N.A.
L
No
H
L
H
High-Z
High-Z
N.A.
L
Yes
L
X
L
High-Z
Active
N.A.
H
Manual Powerdown
Yes
L
X
H
High-Z
High-Z
N.A.
H
Manual Powerdown w/Rcvr.
Disabled
No
L
X
L
High-Z
Active
N.A.
L
Manual Powerdown
No
L
X
H
High-Z
High-Z
N.A.
L
Manual Powerdown w/Rcvr.
Disabled
No
H
H
N.A.
Active
Active
Active
L
Normal Operation
(Auto Powerdown Disabled)
Yes
H
L
N.A.
Active
Active
Active
H
Normal Operation
(Auto Powerdown Enabled)
No
H
L
N.A.
High-Z
Active
Active
L
Powerdown Due to Auto
Power-Down Logic
Yes
L
X
N.A.
High-Z
High-Z
Active
H
Manual Powerdown
No
L
X
N.A.
High-Z
High-Z
Active
L
Manual Powerdown
ICL3221, ICL3223
Normal Operation
(Auto Powerdown Disabled)
Normal Operation
(Auto Powerdown Enabled)
Powerdown Due to Auto
Power-Down Logic
ICL3243
Note:
6. Applies only to the ICL3241 and ICL3243.
4.5.2 INVALID Output
The INVALID output always indicates whether a valid RS-232 signal is present at any of the receiver inputs (See
Table 5), giving you a way to determine when the interface block should power down. In the case of a
disconnected interface cable where all the receiver inputs are floating (but pulled to GND by the internal receiver
pull down resistors), the INVALID logic detects the invalid levels and drives the output low. The power
management logic then uses this indicator to power down the interface block. Reconnecting the cable restores
valid levels at the receiver inputs, INVALID switches high, and the power management logic wakes up the
interface block. INVALID can also be used to indicate the DTR or RING INDICATOR signal as long as the other
receiver inputs are floating or driven to GND (as in the case of a powered down driver). Connecting FORCEOFF
and FORCEON together disables the automatic powerdown feature, enabling them to function as a manual
SHUTDOWN input (See Figure 10).
FN4805 Rev.23.00
Apr.26.19
Page 16 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
4. Application Information
VCC
VCC
Current
Flow
VCC
VOUT = VCC
Rx
Powered
Down
UART
Tx
Old
RS-232 Chip
SHDN = GND
GND
Figure 8. Power Drain Through Powered Down Peripheral
VCC
Transition
Detector
To
Wake-Up
Logic
ICL324X
VCC
R2OUTB
RX
Powered
Down
UART
VOUT = HI-Z
R2OUT
TX
R2IN
T1IN
T1OUT
FORCEOFF = GND
OR SHDN = GND, EN = VCC
Figure 9. Disabled Receivers Prevent Power Drain
FORCEOFF
PWR
MGT
Logic
FORCEON
INVALID
ICL3221/23/43
I/O
UART
CPU
Figure 10. Connections for Manual Powerdown when No Valid Receiver Signals are Present
With any of the above control schemes, the time required to exit powerdown and resume transmission is only
100µs. A mouse or other application may need more time to wake up from shutdown. If automatic powerdown is
being used, the RS-232 device reenters powerdown if valid receiver levels are not re-established within 30µs of
the ICL32xx powering up. Figure 11 on page 18 shows a circuit that keeps the ICL32xx from initiating automatic
FN4805 Rev.23.00
Apr.26.19
Page 17 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
4. Application Information
power-down for 100ms after powering up, which gives the slow-to-wake peripheral circuit time to re-establish valid
RS-232 output levels.
Power
Management
Unit
Master Powerdown Line
0.1µF
FORCEOFF
1MΩ
FORCEON
ICL3221/23/43
Figure 11. Circuit to Prevent Auto Powerdown for 100ms After Forced Power-UP
4.5.3 Automatic Powerdown (ICL3221/23/43 Only)
Even greater power savings are available by using the ICL3221, ICL3223, or ICL3243's automatic powerdown
function. When no valid RS-232 voltages (See Figure 12) are sensed on any receiver input for 30μs, the
charge-pump and transmitters powerdown, thereby reducing supply current to 1µA. Invalid receiver levels occur
whenever the driving peripheral’s outputs are shut off (powered down) or when the RS-232 interface cable is
disconnected. The ICL32xx devices power back up whenever they detect a valid RS-232 voltage level on any
receiver input, which provides additional system power savings without changes to the existing operating system.
2.7V
Valid RS-232 Level - ICL32xx is Active
Indeterminate - Powerdown May or
May Not Occur
0.3V
Invalid Level - Powerdown Occurs After 30ms
-0.3V
Indeterminate - Powerdown May or
May Not Occur
-2.7V
Valid RS-232 Level - ICL32xx is Active
Figure 12. Definition of Valid RS-232 Receiver Levels
Automatic powerdown operates when the FORCEON input is low, and the FORCEOFF input is high. Tying
FORCEON high disables automatic powerdown, but manual powerdown is always available using the overriding
FORCEOFF input. Table 5 on page 15 summarizes the automatic powerdown functionality.
Devices with the automatic powerdown feature include an INVALID output signal, which switches low to indicate
that invalid levels have persisted on all of the receiver inputs for more than 30µs (See Figure 13). INVALID
switches high 1µs after detecting a valid RS-232 level on a receiver input. INVALID operates in all modes (forced
or automatic powerdown, or forced on), so it is also useful for systems employing manual powerdown circuitry.
When automatic powerdown is used, INVALID = 0 indicates that the ICL32xx is in powerdown mode.
FN4805 Rev.23.00
Apr.26.19
Page 18 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
4. Application Information
Invalid
} Region
Receiver
Inputs
Transmitter
Outputs
INVALID
Output
VCC
0
tINVH
tINVL
PWR UP
AUTOPWDN
V+
VCC
0
V-
Figure 13. Automatic Powerdown and INVALID Timing Diagrams
The time to recover from automatic powerdown mode is typically 100µs.
4.6
Receiver ENABLE Control (ICL3221/22/23/41 Only)
ICL3221, ICL3222, ICL3223, and ICL3241 also feature an EN input to control the receiver outputs. Driving EN
high disables all the inverting (standard) receiver outputs placing them in a high impedance state, which is useful
to eliminate supply current, due to a receiver output forward biasing the protection diode, when driving the input of
a powered down (VCC = GND) peripheral (See Figure 8 on page 17). The enable input has no effect on
transmitter nor monitor (ROUTB) outputs.
4.7
Capacitor Selection
The charge pumps require 0.1µF capacitors for 3.3V operation. For other supply voltages see Table 6 for
capacitor values. Do not use values smaller than those listed in Table 6. Increasing the capacitor values (by a
factor of 2) reduces ripple on the transmitter outputs and slightly reduces power consumption. C2, C3, and C4 can
be increased without increasing C1’s value; however, do not increase C1 without also increasing C2, C3, and C4 to
maintain the proper ratios (C1 to the other capacitors).
When using minimum required capacitor values, make sure that capacitor values do not degrade excessively with
temperature. If in doubt, use capacitors with a larger nominal value. The capacitor’s Equivalent Series Resistance
(ESR) usually rises at low temperatures and it influences the amount of ripple on V+ and V-.
Table 6.
4.8
Required Capacitor Values
VCC (V)
C1 (µF)
C2, C3, C4 (µF)
3.0 to 3.6
0.1
0.1
4.5 to 5.5
0.047
0.33
3.0 to 5.5
0.1
0.47
Power Supply Decoupling
In most circumstances a 0.1µF bypass capacitor is adequate. In applications that are particularly sensitive to
power supply noise, decouple VCC to ground with a capacitor of the same value as the charge-pump capacitor C1.
Connect the bypass capacitor as close as possible to the IC.
4.9
Operation Down to 2.7V
ICL32xx transmitter outputs meet RS-562 levels (±3.7V), at full data rate, with VCC as low as 2.7V. RS-562 levels
typically ensure interoperability with RS-232 devices.
FN4805 Rev.23.00
Apr.26.19
Page 19 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
4.10
4. Application Information
Transmitter Outputs when Exiting Powerdown
Figure 14 shows the response of two transmitter outputs when exiting powerdown mode. As they activate, the two
transmitter outputs properly go to opposite RS-232 levels, with no glitching, ringing, nor undesirable transients.
Each transmitter is loaded with 3kΩ in parallel with 2500pF. Note that the transmitters enable only when the
magnitude of the supplies exceed approximately 3V.
5V/Div
FORCEOFF
T1
2V/Div
T2
VCC = +3.3V
C1 - C4 = 0.1µF
Time (20µs/Div)
Figure 14. Transmitter Outputs when Exiting Powerdown
4.11
Mouse Driveability
The ICL324X have been specifically designed to power a serial mouse while operating from low voltage supplies.
Figure 15 shows the transmitter output voltages under increasing load current. The on-chip switching regulator
ensures the transmitters will supply at least ±5V during worst case conditions (15mA for paralleled V+
transmitters, 7.3mA for single V- transmitter). The Automatic Powerdown feature does not work with a mouse, so
FORCEOFF and FORCEON should be connected to VCC.
6
Transmitter Output Voltage (V)
5
VOUT+
4
3
VCC = 3.0V
2
1
T1
0
VOUT+
-1
T2
-2
ICL3241/43
-3
-4
VCC
T3
1
2
VOUT -
VOUT -
-5
-6
0
3
4
5
6
7
8
9
10
Load Current per Transmitter (mA)
Figure 15. Transmitter Output Voltage vs Load Current (per Transmitter, Such as, Double Current Axis for Total VOUT+
Current)
4.12
High Data Rates
The ICL32xx maintain the RS-232 ±5V minimum transmitter output voltages even at high data rates. Figure 16
details a transmitter loopback test circuit, and Figure 17 illustrates the loopback test result at 120kbps. For this
test, all transmitters were simultaneously driving RS-232 loads in parallel with 1000pF at 120kbps. Figure 18
shows the loopback results for a single transmitter driving 1000pF and an RS-232 load at 250kbps. The static
transmitters were also loaded with an RS-232 receiver.
FN4805 Rev.23.00
Apr.26.19
Page 20 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
VCC
+
0.1µF
+
C1+
C1
4. Application Information
VCC
V+
+
C3
C1ICL32xx
+
V-
C2+
C2
C4
+
C2TIN
TOUT
ROUT
RIN
EN
5k
1000pF
SHDN OR
FORCEOFF
VCC
Figure 16. Transmitter Loopback Test Circuit
5V/Div
5V/Div
T1IN
T1IN
T1OUT
T1OUT
R1OUT
R1OUT
VCC = +3.3V
C1 - C4 = 0.1µF
VCC = +3.3V
C1 - C4 = 0.1μF
5µs/Div
2µs/Div
Figure 17. Loopback Test at 120kbps
4.13
Figure 18. Loopback Test at 250kbps
Interconnection with 3V and 5V Logic
The ICL32xx directly interface with 5V CMOS and TTL logic families. With the ICL32xx at 3.3V, and the logic
supply at 5V, AC, HC, and CD4000 outputs can drive ICL32xx inputs, but ICL32xx outputs do not reach the
minimum VIH for these logic families. See Table 7 for more information.
Table 7.
Logic Family Compatibility with Various Supply Voltages
System Power-Supply
Voltage (V)
VCC Supply
Voltage (V)
3.3
3.3
5
5
5
3.3
FN4805 Rev.23.00
Apr.26.19
Compatibility
Compatible with all CMOS families.
Compatible with all TTL and CMOS logic families.
Compatible with ACT and HCT CMOS, and with TTL. ICL32xx outputs
are incompatible with AC, HC, and CD4000 CMOS inputs.
Page 21 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
4.14
4. Application Information
Pin Compatible Replacements For 5V Devices
The ICL3221/22/32 are pin compatible with existing 5V RS-232 transceivers (see the “Features” on page 1 for
details), which coupled with the low ICC and wide operating supply range, make the ICL32xx potential lower
power, higher performance, drop-in replacements for existing 5V applications. As long as the ±5V RS-232 output
swings are acceptable, and transmitter input pull-up resistors are not required, the ICL32xx should work in most
5V applications.
When replacing a device in an existing 5V application, it is acceptable to terminate C3 to VCC as shown on the
“Typical Operating Circuits” on page 3. Terminate C3 to GND if possible, as slightly better performance results
from this configuration.
FN4805 Rev.23.00
Apr.26.19
Page 22 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
5.
5. Die Characteristics
Die Characteristics
Substrate Potential (Powered Up)
GND
Transistor Count
ICL3221: 286
ICL3222: 338
ICL3223: 357
ICL3232: 296
ICL324X: 464
Process
Si Gate CMOS
FN4805 Rev.23.00
Apr.26.19
Page 23 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
6.
6. Revision History
Revision History
Rev.
Date
Description
23
Apr 26, 2019
Updated to latest formatting.
Added Related Literature section.
Updated Ordering information table by adding active tape and reel information, updated notes, adding note 3,
removed retired parts, and stamped EOL parts.
Added “Charge Pump Absolute Maximum Ratings” on page 13.
Removed About Intersil section.
Updated M16.15 to the latest revision changes are as follows:
Update graphics to new standard layout, removing the dimension table.
Updated disclaimer.
22
Sep 1, 2015
- Ordering Information Table on page 2.
- Added Revision History.
- Added About Intersil Verbiage.
- Updated POD M16.173 to latest revision changes are as follow:
Convert to new POD format by moving dimensions from table onto drawing and adding land pattern. No
dimension changes.
- Updated POD M20.173 to most current version changes are as follow:
Convert to new POD format by moving dimensions from table onto drawing and adding land pattern. No
dimension changes.
- Updated POD M28.173 to most current version changes are as follow:
Convert to new POD format by moving dimensions from table onto drawing and adding land pattern. No
dimension changes.
-Updated POD M28.3 to most current version change is as follows:
Added land pattern.
FN4805 Rev.23.00
Apr.26.19
Page 24 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
7.
Package Outline Drawings
For the most recent package outline drawing, see E16.3.
E16.3 (JEDEC MS-001-BB ISSUE D)
N
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE (PDIP)
E1
INDEX
AREA
7. Package Outline Drawings
1 2 3
INCHES
N/2
SYMBOL
-B-
-C-
SEATING
PLANE
A2
e
B1
D1
B
0.010 (0.25) M
A1
eC
C A B S
MAX
NOTES
-
0.210
-
5.33
4
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
C
L
B1
0.045
0.070
1.15
1.77
8, 10
eA
C
0.008
0.014
0.204
0.355
-
D
0.735
0.775
18.66
19.68
5
D1
0.005
-
0.13
-
5
A
L
D1
MIN
A
E
BASE
PLANE
MAX
A1
-AD
MILLIMETERS
MIN
C
eB
Notes:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
6
eB
-
0.430
-
10.92
7
L
0.115
0.150
2.93
3.81
4
N
16
16
9
Rev. 0 12/93
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
FN4805 Rev.23.00
Apr.26.19
Page 25 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
M16.15 (JEDEC MS-012-AC ISSUE C)
16 Lead Narrow Body Small Outline Plastic Package
Rev 2, 11/17
FN4805 Rev.23.00
Apr.26.19
7. Package Outline Drawings
For the most recent package outline drawing, see M16.15.
Page 26 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
7. Package Outline Drawings
M16.173
16 Lead Thin Shrink Small Outline Package (TSSOP)
Rev 2, 5/10
For the most recent package outline drawing, see M16.173.
A
1
3
5.00 ±0.10
SEE DETAIL "X"
9
16
6.40
PIN #1
I.D. MARK
4.40 ±0.10
2
3
0.20 C B A
1
8
B
0.65
0.09-0.20
END VIEW
TOP VIEW
H
1.00 REF
- 0.05
C
1.20 MAX
SEATING
PLANE
0.90 +0.15/-0.10
GAUGE
PLANE
0.25 +0.05/-0.06 5
0.10 M C B A
0.10 C
0°-8°
0.05 MIN
0.15 MAX
SIDE VIEW
0.25
0.60 ±0.15
DETAIL "X"
(1.45)
NOTES:
1. Dimension does not include mold flash, protrusions or gate burrs.
(5.65)
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.08mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead
(0.65 TYP)
(0.35 TYP)
TYPICAL RECOMMENDED LAND PATTERN
is 0.07mm.
6. Dimension in ( ) are for reference only.
7. Conforms to JEDEC MO-153.
FN4805 Rev.23.00
Apr.26.19
Page 27 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
7. Package Outline Drawings
For the most recent package outline drawing, see M16.209.
N
INDEX
AREA
H
0.25(0.010) M
2
INCHES
GAUGE
PLANE
SYMBOL
3
0.25
0.010
SEATING PLANE
-A-
16 Lead Shrink Small Outline Plastic Package (SSOP)
E
-B-
1
M16.209 (JEDEC MO-150-AC ISSUE B)
B M
A
D
-C-
e
α
A1
B
0.25(0.010) M
L
A2
C
0.10(0.004)
C A M
B S
MAX
MIN
MAX
NOTES
A
-
0.078
-
2.00
-
A1
0.002
-
0.05
-
-
A2
0.065
0.072
1.65
1.85
-
B
0.009
0.014
0.22
0.38
9
C
0.004
0.009
0.09
0.25
-
D
0.233
0.255
5.90
6.50
3
E
0.197
0.220
5.00
5.60
4
e
0.026 BSC
0.65 BSC
-
H
0.292
0.322
7.40
8.20
-
L
0.022
0.037
0.55
0.95
6
8°
0°
N
Notes:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
MILLIMETERS
MIN
α
16
0°
16
7
8°
Rev. 3
6/05
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.13mm (0.005 inch) total in excess of “B”
dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
FN4805 Rev.23.00
Apr.26.19
Page 28 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
7. Package Outline Drawings
For the most recent package outline drawing, see M16.3.
M16.3 (JEDEC MS-013-AA ISSUE C)
16 Lead Wide Body Small Outline Plastic Package (SOIC)
N
INCHES
INDEX
AREA
H
0.25(0.010) M
SYMBOL
B M
E
-B-
1
2
3
L
SEATING PLANE
-A-
A
D
h x 45°
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
B S
Notes:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
MILLIMETERS
MAX
MIN
MAX
NOTES
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.3977
0.4133
10.10
10.50
3
E
0.2914
0.2992
7.40
7.60
4
e
α
MIN
0.050 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.010
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
8°
0°
N
α
16
0°
16
7
8°
Rev. 1 6/05
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm (0.024
inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
FN4805 Rev.23.00
Apr.26.19
Page 29 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
7. Package Outline Drawings
For the most recent package outline drawing, see M18.3.
M18.3 (JEDEC MS-013-AB ISSUE C)
18 Lead Wide Body Small Outline Plastic Package (SOIC)
N
INCHES
INDEX
AREA
H
0.25(0.010) M
SYMBOL
B M
E
-B-
1
2
3
L
SEATING PLANE
-A-
A
D
h x 45°
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
B S
MILLIMETERS
MAX
MIN
MAX
NOTES
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.4469
0.4625
11.35
11.75
3
E
0.2914
0.2992
7.40
7.60
4
e
α
MIN
0.050 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.010
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N
α
18
0°
18
8°
0°
7
8°
Rev. 1 6/05
Notes:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
FN4805 Rev.23.00
Apr.26.19
Page 30 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
7. Package Outline Drawings
M20.173
20 Lead Thin Shrink Small Outline Package (TSSOP)
Rev 2, 5/10
For the most recent package outline drawing, see M20.173.
A
1
3
6.50 ±0.10
6.40
PIN #1
I.D. MARK
4.40 ±0.10
2
SEE DETAIL "X"
10
20
3
0.20 C B A
1
9
B
0.65
0.09-0.20
TOP VIEW
END VIEW
1.00 REF
H
- 0.05
C
0.90 +0.15/-0.10
1.20 MAX
SEATING
PLANE
0.10 C
GAUGE
PLANE
0.25 +0.05/-0.06 5
0.10 M C B A
0°-8°
0.05 MIN
0.15 MAX
SIDE VIEW
0.25
0.60 ±0.15
DETAIL "X"
(1.45)
NOTES:
1. Dimension does not include mold flash, protrusions or gate burrs.
(5.65)
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.08mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead
(0.65 TYP)
(0.35 TYP)
TYPICAL RECOMMENDED LAND PATTERN
is 0.07mm.
6. Dimension in ( ) are for reference only.
7. Conforms to JEDEC MO-153.
FN4805 Rev.23.00
Apr.26.19
Page 31 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
7. Package Outline Drawings
For the most recent package outline drawing, see M20.209.
M20.209 (JEDEC MO-150-AE ISSUE B)
20 Lead Shrink Small Outline Plastic Package (SSOP)
INCHES
N
INDEX
AREA
H
0.25(0.010) M
E
GAUGE
PLANE
-B1
2
3
0.25
0.010
SEATING PLANE
-A-
B M
L
A
D
α
e
A1
B
0.25(0.010) M
A2
C
0.10(0.004)
C A M
SYMBOL
MIN
MAX
MIN
MAX
A
0.068
0.078
1.73
1.99
A1
0.002
0.008’
0.05
0.21
A2
0.066
0.070’
1.68
1.78
B
0.010’
0.015
0.25
0.38
C
0.004
0.008
0.09
0.20’
D
0.278
0.289
7.07
7.33
3
E
0.205
0.212
5.20’
5.38
4
e
-C-
B S
MILLIMETERS
0.026 BSC
0.301
0.311
7.65
7.90’
L
0.025
0.037
0.63
0.95
8 deg.
0 deg.
α
20
0 deg.
9
0.65 BSC
H
N
NOTES
6
20
7
8 deg.
Rev. 3 11/02
Notes:
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.13mm (0.005 inch) total in excess
of “B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
FN4805 Rev.23.00
Apr.26.19
Page 32 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
7. Package Outline Drawings
M28.173
28 Lead Thin Shrink Small Outline Package (TSSOP)
Rev 1, 5/10
For the most recent package outline drawing, see M28.173.
A
9.70± 0.10
1
3
SEE DETAIL "X"
15
28
6.40
PIN #1
I.D. MARK
4.40 ± 0.10
2
3
0.20 C B A
1
14
0.15 +0.05
-0.06
B
0.65
TOP VIEW
END VIEW
1.00 REF
H
- 0.05
0.90 +0.15
-0.10
C
GAUGE
PLANE
1.20 MAX
SEATING PLANE
+0.05
5
-0.06
0.10 M C B A
0.25
0.10 C
0.25
0°-8°
0.05 MIN
0.15 MAX
0.60 ±0.15
SIDE VIEW
DETAIL "X"
(1.45)
NOTES:
1. Dimension does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
(5.65)
2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.08mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead
(0.65 TYP)
TYPICAL RECOMMENDED LAND PATTERN
(0.35 TYP)
is 0.07mm.
6. Dimension in ( ) are for reference only.
7. Conforms to JEDEC MO-153.
FN4805 Rev.23.00
Apr.26.19
Page 33 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
7. Package Outline Drawings
For the most recent package outline drawing, see M28.209.
M28.209 (JEDEC MO-150-AH ISSUE B)
28 Lead Shrink Small Outline Plastic Package (SSOP)
N
INCHES
INDEX
AREA
H
0.25(0.010) M
E
GAUGE
PLANE
-B1
2
3
0.25
0.010
SEATING PLANE
-A-
SYMBOL
B M
A
D
e
α
A1
B
A2
C
0.10(0.004)
C A M
B S
Notes:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
MAX
MIN
MAX
NOTES
A
-
0.078
-
2.00
-
A1
0.002
-
0.05
-
-
A2
0.065
0.072
1.65
1.85
-
B
0.009
0.014
0.22
0.38
9
C
0.004
0.009
0.09
0.25
-
D
0.390
0.413
9.90
10.50
3
E
0.197
0.220
5.00
5.60
4
e
-C-
0.25(0.010) M
L
MILLIMETERS
MIN
0.026 BSC
0.65 BSC
-
H
0.292
0.322
7.40
8.20
-
L
0.022
0.037
0.55
0.95
6
8°
0°
N
α
28
0°
28
7
8°
Rev. 2 6/05
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.13mm (0.005 inch) total in excess of
“B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
FN4805 Rev.23.00
Apr.26.19
Page 34 of 36
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
7. Package Outline Drawings
For the most recent package outline drawing, see M28.3.
M28.3 (JEDEC MS-013-AE ISSUE C)
28 Lead Wide Body Small Outline Plastic Package (SOIC)
INCHES
N
INDEX
AREA
H
0.25(0.010) M
B M
E
-B-
1
2
3
L
SEATING PLANE
-A-
A
D
h x 45o
a
e
A1
B
C
C A M
MIN
MAX
A
0.0926
0.1043
2.35
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.6969
0.7125
17.70
18.10
3
E
0.2914
0.2992
7.40
7.60
4
0.419
MAX
NOTES
2.65
-
1.27 BSC
10.00
-
H
0.394
h
0.01
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
α
B S
MIN
0.05 BSC
N
0.10(0.004)
0.25(0.010) M
SYMBOL
e
-C-
MILLIMETERS
28
0o
10.65
-
28
8o
0o
7
8o
Rev. 1, 1/13
Notes:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
TYPICAL RECOMMENDED LAND PATTERN
(1.50mm)
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
(9.38mm)
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
(1.27mm TYP)
FN4805 Rev.23.00
Apr.26.19
(0.51mm TYP)
Page 35 of 36
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