DATASHEET
ICS180-03
LOW EMI CLOCK GENERATOR
Description
Features
The ICS180-03 generates a low EMI output clock from
a clock or crystal input. The device uses IDT’s
proprietary mix of analog and digital Phase Locked
Loop (PLL) technology to spread the frequency
spectrum of the output, thereby reducing the frequency
amplitude peaks by several dB.
•
•
•
•
Pin and function compatible to Cypress W180-03
Packaged in 8-pin SOIC
Provides a spread spectrum output clock
Accepts a clock input and provides same frequency
dithered output
• Input frequency of 15 to 28 MHz
• Peak reduction by 7dB - 14dB typical on 3rd - 19th
The ICS180-03 offers down spread selection of -1.25%
and -3.75%. Refer to the MK1714-01/02 for the widest
selection of input frequencies and multipliers.
odd harmonics
• Spread percentage selection for -1.25% and -3.75%
• Operating voltage of 3.3 V and 5 V
• Advanced, low-power CMOS process
IDT offers a complete line of EMI reducing clock
generators. Consult us when you need to remove
crystals and oscillators from your board.
Block Diagram
VDD
FS1
SSON#
PLL Clock
Synthesis
and Spread
Spectrum
Circuitry
SS%
X1/CLKIN
X2
Clock Buffer/
Crystal
Oscillator
CLK
GND
IDT™ / ICS™ LOW EMI CLOCK GENERATOR
1
ICS180-03
REV B 081009
ICS180-03
LOW EMI CLOCK GENERATOR
SSCG
Pin Assignment
Spread Spectrum Select Table
X1/CLKIN
1
8
SSON#
X2
2
7
FS1
GND
3
6
VDD
SS%
4
5
CLKOUT
SS%
(Pin 4)
Spread
Direction
Spread
Percentage (%)
0
1
Down
Down
-1.25%
-3.75%
0 = connect to GND
1 = connect directly to VDD
Note: SS% pin has an internal pull-up resistor
8-pin (150 mil) SOIC
Frequency Range Selection Table
FS1
(Pin 7)
Frequency Range Selection
(MHz)
0
1
15-18
18-28
Pin Descriptions
Pin
Number
Pin
Name
Pin Type
1
X1/CLKIN
Input
2
X2
Output
Crystal output. Float for a clock input.
3
GND
Power
Connect to ground.
4
SS%
Input
Select pin for spread amount. See table above. Internal pull-up resistor.
5
CLKOUT
Output
Spread spectrum clock output per table above.
6
VDD
Power
Connect to 3.3 V or 5 V.
7
FS1
Input
Select pin for input frequency. See table above. Internal pull-up resistor.
8
SSON#
Input
Spread Spectrum Control. This pin enables spread spectrum when low.
Internal pull-down resistor.
IDT™ / ICS™ LOW EMI CLOCK GENERATOR
Pin Description
Crystal or Clock Input.
2
ICS180-03
REV B 081009
ICS180-03
LOW EMI CLOCK GENERATOR
SSCG
External Components
PCB Layout Recommendations
The ICS180-03 requires a minimum number of external
components for proper operation.
For optimum device performance and lowest output
phase noise, the following guidelines should be
observed.
Decoupling Capacitor
A decoupling capacitor of 0.01µF must be connected
between VDD and GND on pins 6 and 3, as close to
these pins as possible. For optimum device
performance, the decoupling capacitor should be
mounted on the component side of the PCB. Avoid the
use of vias in the decoupling circuit.
1) The 0.01µF decoupling capacitor should be mounted
on the component side of the board as close to the VDD
pin as possible. No vias should be used between the
decoupling capacitor and VDD pin. The PCB trace to
VDD pin should be kept as short as possible, as should
the PCB trace to the ground via.
Series Termination Resistor
2) To minimize EMI the 33Ω series termination resistor,
if needed, should be placed close to the clock output.
When the PCB trace between the clock output and the
load is over 1 inch, series termination should be used.
To series terminate a 50Ω trace (a commonly used trace
impedance) place a 33Ω resistor in series with the clock
line, as close to the clock output pin as possible. The
nominal impedance of the clock output is 20Ω.
3) An optimum layout is one with all components on the
same side of the board, minimizing vias through other
signal layers. Other signal traces should be routed away
from the ICS180-03. This includes signal traces just
underneath the device, or on layers adjacent to the
ground plane layer used by the device.
value of these capacitors is given by the following
equation:
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICS180-03. These ratings,
which are standard values for ICS commercially rated parts, are stress ratings only. Functional operation of
the device at these or any other conditions above those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can
affect product reliability. Electrical parameters are guaranteed only over the recommended operating
temperature range.
Item
Rating
Supply Voltage, VDD
7V
All Inputs and Outputs
-0.5 V to VDD+0.5 V
Ambient Operating Temperature
0 to +70° C
Storage Temperature
-65 to +150° C
Junction Temperature
125° C
Soldering Temperature
260° C
Recommended Operation Conditions
Parameter
Min.
Ambient Operating Temperature
Power Supply Voltage (measured in respect to GND)
IDT™ / ICS™ LOW EMI CLOCK GENERATOR
3
Typ.
Max.
Units
0
+70
°C
+3.135
+5.5
V
ICS180-03
REV B 081009
ICS180-03
LOW EMI CLOCK GENERATOR
SSCG
DC Electrical Characteristics
Unless stated otherwise, VDD = 3.3 V ± 5%, Ambient Temperature 0 to +70° C
Parameter
Symbol
Conditions
Min.
Typ.
3.135
Max.
Units
3.465
V
32
mA
Operating Voltage
VDD
Supply Current
IDD
Input High Voltage
VIH
Input Low Voltage
VIL
Output High Voltage
VOH
IOH = -4 mA
VDD-0.4
V
Output High Voltage
VOH
IOH = -15 mA
2.4
V
Output Low Voltage
VOL
IOL = 15 mA
Input Capacitance
CIN
5
Output Impedance
Rout
25
Ω
500
KΩ
No load
18
2.4
0.8
Input Pull-up Resistor
Power-up Time
V
First locked clock
cycle after steady
power
V
0.4
V
7
pF
5
ms
Unless stated otherwise, VDD = 5 V, ±10%, Ambient Temperature 0 to +70° C
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
4.5
5
5.5
V
30
50
mA
Operating Voltage
VDD
Supply Current
IDD
Input High Voltage
VIH
Input Low Voltage
VIL
Output High Voltage
VOH
IOH = -24 mA
Output Low Voltage
VOL
IOL = 24 mA
Output Impedance
Rout
20
Input Capacitance
CIN
5
Output Impedance
Rout
25
Ω
500
KΩ
No load
0.7VDD
0.15VDD
IDT™ / ICS™ LOW EMI CLOCK GENERATOR
2.4
First locked clock
cycle after steady
power
4
V
V
0.4
Input Pull-up Resistor
Power-up Time
V
V
ohms
7
5
ICS180-03
pF
ms
REV B 081009
ICS180-03
LOW EMI CLOCK GENERATOR
SSCG
AC Electrical Characteristics
Unless stated otherwise, VDD = 3.3 V±5% or 5 V±10%, Ambient Temperature 0 to +70° C, CL=15 pf
Parameter
Symbol
Conditions
Input/Output Frequency
Min.
Typ.
Max. Units
15
28
MHz
60
%
50
60
%
Input Clock Duty Cycle
Time above VDD/2
40
Output Clock Duty Cycle
Note 1
40
Output Rise Time
tOR
0.8 to 2.4 V, note 1
2
5
ns
Output Fall Time
tOF
2.4 to 0.8 V, note 1
2
5
ns
250
300
ps
Jitter
Cycle-to-cycle
Note 1: Measured with 15 pF load
Thermal Characteristics
Parameter
Thermal Resistance Junction to
Ambient
Thermal Resistance Junction to Case
Symbol
Conditions
Min.
Typ.
Max. Units
θJA
Still air
150
° C/W
θJA
1 m/s air flow
140
° C/W
θJA
3 m/s air flow
120
° C/W
40
° C/W
θJC
Marking Diagram
8
5
180M03LF
######
YYWW
1
4
Notes:
1. ###### is the lot number.
2. YYWW is the last two digits of the year and week that the part was assembled.
3. “LF” denotes Pb (lead) free package.
4. Bottom marking: country of origin.
IDT™ / ICS™ LOW EMI CLOCK GENERATOR
5
ICS180-03
REV B 081009
ICS180-03
LOW EMI CLOCK GENERATOR
SSCG
Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Body)
Package dimensions are kept current with JEDEC Publication No. 95
Millimeters
8
Symbol
E
Min
A
A1
B
C
D
E
e
H
h
L
α
H
INDEX
AREA
1 2
D
A
Inches
Max
Min
1.35
1.75
0.10
0.25
0.33
0.51
0.19
0.25
4.80
5.00
3.80
4.00
1.27 BASIC
5.80
6.20
0.25
0.50
0.40
1.27
0°
8°
Max
.0532
.0688
.0040
.0098
.013
.020
.0075
.0098
.1890
.1968
.1497
.1574
0.050 BASIC
.2284
.2440
.010
.020
.016
.050
0°
8°
h x 45
A1
C
-Ce
B
SEATING
PLANE
L
.10 (.004)
C
Ordering Information
Part / Order Number
Marking
Shipping
packaging
Package
Temperature
180M-03LF
180M-03LFT
see page 5
Tubes
Tape and Reel
8-pin SOIC
8-pin SOIC
0 to +70° C
0 to +70° C
LF denotes Pb free packaging.
While the information presented herein has been checked for both accuracy and reliability, IDT assumes no responsibility for
either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits,
patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such
as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not
recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without
notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.
IDT™ / ICS™ LOW EMI CLOCK GENERATOR
6
ICS180-03
REV B 081009
ICS180-03
LOW EMI CLOCK GENERATOR
SSCG
Innovate with IDT and accelerate your future networks. Contact:
www.IDT.com
For Sales
For Tech Support
800-345-7015
408-284-8200
Fax: 408-284-2775
www.idt.com/go/clockhelp
Corporate Headquarters
Integrated Device Technology, Inc.
www.idt.com
© 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device
Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered
trademarks used to identify products or services of their respective owners.
Printed in USA
IMPORTANT NOTICE AND DISCLAIMER
RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL
SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING
REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND
OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED,
INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A
PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible
for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3)
ensuring your application meets applicable standards, and any other safety, security, or other requirements. These
resources are subject to change without notice. Renesas grants you permission to use these resources only for
development of an application that uses Renesas products. Other reproduction or use of these resources is strictly
prohibited. No license is granted to any other Renesas intellectual property or to any third party intellectual property.
Renesas disclaims responsibility for, and you will fully indemnify Renesas and its representatives against, any claims,
damages, costs, losses, or liabilities arising out of your use of these resources. Renesas' products are provided only subject
to Renesas' Terms and Conditions of Sale or other applicable terms agreed to in writing. No use of any Renesas resources
expands or otherwise alters any applicable warranties or warranty disclaimers for these products.
(Rev.1.0 Mar 2020)
Corporate Headquarters
Contact Information
TOYOSU FORESIA, 3-2-24 Toyosu,
Koto-ku, Tokyo 135-0061, Japan
www.renesas.com
For further information on a product, technology, the most
up-to-date version of a document, or your nearest sales
office, please visit:
www.renesas.com/contact/
Trademarks
Renesas and the Renesas logo are trademarks of Renesas
Electronics Corporation. All trademarks and registered
trademarks are the property of their respective owners.
© 2020 Renesas Electronics Corporation. All rights reserved.