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ICS409MT

ICS409MT

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    SOIC8_150MIL

  • 描述:

    IC PC PERIPHERAL CLOCK 8-SOIC

  • 数据手册
  • 价格&库存
ICS409MT 数据手册
DATASHEET ICS409 PC PERIPHERAL CLOCK Description Features The ICS409 is a cost-effective clock synthesizer developed to optimize component count for PC peripheral applications. The device supports a common, low cost 14.31818 MHz crystal using an on-chip crystal oscillator. The device locks all output frequencies to enhance system performance. By supporting common PC peripheral interface frequencies including dual 25 MHz and 40/80 MHz frequencies the clock lowers chip count enhancing system cost and reliability. • • • • • • • • • The ICS409 utilizes a low pin count 8-pin SOIC package to optimize board space. Pin compatible with FS6286-01 Low operating voltage of 3.3V On-chip oscillator supports 14.31818 MHz crystal Fixed dual 25 MHz clocks for Ethernet 40/80 MHz selected on rising edge of OE/LAT pin Power consumption of 15 mA (typ) Duty cycle of 45 to 55% Packaged in 8-pin SOIC Available in Pb (lead) free package NOTE: EOL for non-green parts to occur on 5/13/10 per PDN U-09-01 IDT is a leader in low jitter and power consumer application clock sources. These devices are capable of supporting CCD, video, audio, USB, CPU, and other peripherals. Block Diagram VDD 25M X1 14.31818 MHz Fundamental Crystal X2 Crystal Oscillator PLL 40/80M 25M GND IDT™ / ICS™ PC PERIPHERAL CLOCK 1 OE/LAT ICS409 REV D 092109 ICS409 PC PERIPHERAL CLOCK CLOCK SYNTHESIZER Pin Assignment 40/80M Frequency Selection 1 8 25M X1 2 7 25M X2 3 6 GND VDD 4 5 40/80M OE /LAT 40/80M (pin 5) Output Freq 0 40M 1 80M Note: See below for operations of frequency selection 8 Pin (150 mil) S OIC Pin Descriptions Pin Number Pin Name 1 2 3 4 5 OE/LAT X1 X2 VDD 40/80M 6 7 8 GND 25M 25M Pin Type Pin Description Input Input Input Power Input/ Output Power Output Output Disables or latches 40/80 MHz output dependant on pin 5 level. Crystal connection. Connect to 14.31818 MHz parallel mode crystal. Crystal connection. Connect to 14.31818 MHz parallel mode crystal. Connect to voltage supply. 40M or 80M selection pin and clock output (see below for operation). Tri-state when OE/LAT is low. Connect to ground. 25 MHz clock output. 25 MHz clock output. External Components Series Termination Resistor Crystal Load Capacitors Clock output traces over one inch should use series termination. To series terminate a 50Ω trace (a commonly used trace impedance), place a 33Ω resistor in series with the clock line, as close to the clock output pin as possible. The nominal impedance of the clock output is 20Ω. As with any high performance mixed-signal IC, the ICS409 must be isolated from system power supply noise to perform optimally. The device crystal connections should include pads for small capacitors from X1 to ground and from X2 to ground. These capacitors are used to adjust the stray capacitance of the board to match the nominally required crystal load capacitance. Because load capacitance can only be increased in this trimming process, it is important to keep stray capacitance to a minimum by using very short PCB traces (and no vias) between the crystal and device. Crystal capacitors must be connected from each of the pins X1 and X1 to ground. A decoupling capacitor of 0.01µF must be connected between VDD and the PCB ground plane. The value (in pF) of these crystal caps should equal (CL -6pF)*2. In this equation, CL= crystal load capacitance Decoupling Capacitor IDT™ / ICS™ PC PERIPHERAL CLOCK 2 ICS409 REV D 092109 ICS409 PC PERIPHERAL CLOCK CLOCK SYNTHESIZER spaces, instead they should be separated and away from other traces. in pF. Example: For a crystal with a 15 pF load capacitance, each crystal capacitor would be 18 pF [(15-6) x 2] = 18. 3) To minimize EMI the 33Ω series termination resistor, if needed, should be placed close to the clock output. PCB Layout Recommendations For optimum device performance and lowest output phase noise, the following guidelines should be observed. 4) An optimum layout is one with all components on the same side of the board, minimizing vias through other signal layers. Other signal traces should be routed away from the ICS409. This includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device. 1) The 0.01µF decoupling capacitor should be mounted on the component side of the board as close to the VDD pin as possible. No vias should be used between decoupling capacitor and VDD pin. The PCB trace to VDD pin should be kept as short as possible, as should the PCB trace to the ground via. Selection of 40M/80M Clock The 40/80M output clock is selected by a soft pull-up or pull-down on 40/80M pin (pin 5). A rising edge on OE/LAT latches in the high or low level on pin 5 which starts the appropriate frequency. 2) The external crystal should be mounted just next to the device with short traces. The X1 and X2 traces should not be routed next to each other with minimum Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the ICS409. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Item Rating Supply Voltage, VDD 7V All Inputs and Outputs -0.5 V to VDD+0.5 V Ambient Operating Temperature 0 to +70 ° C Storage Temperature -65 to +150 ° C Junction Temperature 175 ° C Soldering Temperature 260 ° C Recommended Operation Conditions Parameter Ambient Operating Temperature Power Supply Voltage (measured in respect to GND) IDT™ / ICS™ PC PERIPHERAL CLOCK 3 Min. Typ. Max. Units 0 – +70 °C +3.60 V +3.00 ICS409 REV D 092109 ICS409 PC PERIPHERAL CLOCK CLOCK SYNTHESIZER DC Electrical CharacteristicsDC Electrical Characteristics (continued) VDD=3.3V ±10% Parameter Symbol Conditions Min. Typ. Max. Units 3.6 V Operating Voltage VDD 3.0 Input High Voltage VIH Vdd-0.5 Input Low Voltage VIL Output High Voltage VOH IOH = -25 mA Output Low Voltage VOL IOL = 25 mA Operating Supply Current IDD No load 15 mA Short Circuit Current IOS Each output 50 mA 10 kΩ Suggested Pull-up or Pull-down resistor on pin 5 V 0.5 2.4 V V 0.8 R V AC Electrical Characteristics VDD = 3.3V ±10%, Ambient Temperature 0 to +70× C Parameter Symbol Conditions Min. Input Frequency Typ. Max. Units 14.318 MHz Output Rise Time tOR 0.8 to 2.0 V, CL=15 pF 0.8 ns Output Fall Time tOF 2.0 to 0.8 V, CL=15 pF 0.6 ns Output Clock Duty Cycle at VDD/2 Absolute Jitter, Short Term variation from mean IDT™ / ICS™ PC PERIPHERAL CLOCK 4 45 50 ±250 ICS409 55 % ps REV D 092109 ICS409 PC PERIPHERAL CLOCK CLOCK SYNTHESIZER Package Outline and Package Dimensions (8 pin SOIC, 150 Mil. Narrow Body) Package dimensions are kept current with JEDEC Publication No. 95 Millimeters In d e x A re a Symbol Min Max Min Max A 1.35 1.75 0.0532 0.0688 A1 1.10 0.25 0.0040 0.0098 B 0.33 0.51 0.013 0.020 C 0.19 0.25 0.0075 0.0098 D 4.80 5.00 .1890 .1968 E 3.80 4.00 0.1497 0.1574 e E P in 1 H Inches 1.27 Basic 0.050 Basic H 5.80 6.20 0.2284 0.2440 h 0.25 0.50 0.010 0.020 L 0.40 1.27 0.016 0.050 a 0° 8° 0° 8° h x 450 D A Q c e b Ordering Information Part / Order Number Marking Shipping Packaging Package Temperature 409M* 409MT* 409MLF 409MLFT ICS409 ICS409 409MLF 409MLF Tubes Tape and Reel Tubes Tape and Reel 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC 0 to 70 ° C 0 to 70 ° C 0 to 70 ° C 0 to 70 ° C *NOTE: EOL for non-green parts to occur on 5/13/10 per PDN U-09-01 Parts that are ordered with a "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. IDT™ / ICS™ PC PERIPHERAL CLOCK 5 ICS409 REV D 092109 ICS409 PC PERIPHERAL CLOCK CLOCK SYNTHESIZER Innovate with IDT and accelerate your future networks. Contact: www.IDT.com For Sales For Tech Support 800-345-7015 408-284-8200 Fax: 408-284-2775 www.idt.com/go/clockhelp Corporate Headquarters Integrated Device Technology, Inc. www.idt.com © 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. Printed in USA
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