ICS574MI

DATASHEET ICS574 ZERO DELAY, LOW SKEW BUFFER Description Features The ICS574 is a low jitter, low-skew, high performance PLL-based zero delay buffer for high speed applications. Based on IDT’s proprietary low jitter Phase Locked Loop (PLL) techniques, the device provides four low skew outputs at speeds up to 160 MHz at 3.3 V. When one of the outputs is connected directly to FBIN, the rising edge of each output is aligned with the rising edge of the input clock. External delay elements connected in the feedback loops will cause the outputs to occur before the inputs by the amount of propagation delay of the external element. • • • • • • • Packaged in 8 pin narrow SOIC, Pb (lead) free available Zero input-to-output delay Four 1X outputs Output to output skew is less than 150 ps Output clocks up to 160 MHz at 3.3 V External feedback path for output edge placement Spread Smart™ technology works with spread spectrum clock generators • Full CMOS outputs with 18 mA output drive capability at TTL levels at 3.3 V • Advanced, low power, sub-micron CMOS process • Operating voltage from 3.0 to 5.5 V • Industrial temperature version available NOTE: EOL for non-green parts to occur on 5/13/10 per PDN U-09-01 Block Diagram CLK1 FBIN CLKIN CLK2 PLL CLK3 CLK4 IDT™/ ICS™ ZERO DELAY, LOW SKEW BUFFER 1 ICS574 REV F 092509 ICS574 ZERO DELAY, LOW SKEW BUFFER ZDB Pin Assignment CLKIN 1 8 FBIN CLK1 2 7 CLK4 CLK2 3 6 CLK3 GND 4 5 VDD Pin Descriptions Pin Number Pin Name Pin Type 1 CLKIN Input 2, 3, 6, 7 CLK1:4 Output Clock Outputs (4). 4 GND Power Connect to ground. 5 VDD Power Power supply. Connect both pins to same voltage (either 3.3 V or 5 V). 8 FBIN Input Feedback input. IDT™/ ICS™ ZERO DELAY, LOW SKEW BUFFER Pin Description Clock input. Connect to input clock source. 2 ICS574 REV F 092509 ICS574 ZERO DELAY, LOW SKEW BUFFER ZDB External Components The ICS574 requires a minimum number of external components for proper operation. Decoupling capacitors of 0.1µF should be connected between VDD and GND on pins 4 and 5, as close to the device as possible. A series termination resistor of 33Ω may be used close to the pin for each clock output to reduce reflections. Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the ICS574. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Item Rating Supply Voltage, VDD (referenced to ground) -0.5 V to 7 V All Inputs and Outputs -0.5 V to VDD+0.5 V Electrostatic Discharge (MIl-STD-883) 2000 V (minimum) Ambient Operating Temperature -40° C to +85° C Soldering Temperature (10 seconds max.) 260° C Junction Temperature 150° C Storage Temperature -65 to +150° C IDT™/ ICS™ ZERO DELAY, LOW SKEW BUFFER 3 ICS574 REV F 092509 ICS574 ZERO DELAY, LOW SKEW BUFFER ZDB DC Electrical Characteristics Unless stated otherwise, VDD = 3.3 V, Ambient Temperature -40 to +85° C Parameter Symbol Operating Supply Voltage Conditions Min. Typ. Max. Units 5.5 V VDD 3 Input High Voltage VIH VDD/2+1 Input Low Voltage VIL Output High Voltage, CMOS level VOH IOH = -5 mA VDD-0.4 V Output High Voltage VOH IOH = -18 mA 2.4 V Output Low Voltage VOL IOL = 18 mA IDD Operating Supply Current Short Circuit Current IOS Input Capacitance CIN V VDD/2-1 0.4 V V No load (Note 2) 36 mA Each output ±65 mA 7 pF AC Electrical Characteristics Unless stated otherwise, VDD = 3.3 V, Ambient Temperature -40 to +85° C Parameter Input Frequency, clock Symbol fIN Conditions Min. Typ. Max. Units FBIN from CLK4 20 160 MHz Output Frequency, clock FBIN from CLK4 20 160 MHz Output Clock Rise Time 0.8 to 2.0 V, 15 pF load 1.5 ns Output Clock Fall Time 2.0 to 0.8 V, 15 pF load 1.5 ns Output Clock Duty Cycle, 3.3 V At 1.4 V 60 % Device-to-device Skew, equally loaded Rising edges at VDD/2 700 ps Outpu-to-output Skew, equally loaded Rising edges at VDD/2 150 ps Maximum Absolute Jitter Cycle-to-cycle Jitter, 15 pF loads 40 50 170 66.67 MHz outputs ps 250 ps Notes: 1. Stresses beyond those listed in Absolute Maximum Ratings can permanently damage the device. Prolonged exposure to levels above the operating limits but below the Absolute Maximum Ratings may affect device reliability. 2. With CLKIN = 160 MHz, FBIN to CLK4. Using Spread Spectrum Input Clocks The ICS574 uses IDT’s Spread Smart technology, allowing it to accurately track (pass through) any clocks that implement spread spectrum techniques. IDT™/ ICS™ ZERO DELAY, LOW SKEW BUFFER 4 ICS574 REV F 092509 ICS574 ZERO DELAY, LOW SKEW BUFFER ZDB Thermal Characteristics Parameter Thermal Resistance Junction to Ambient Symbol Min. Typ. Max. Units θJA Still air 150 ° C/W θJA 1 m/s air flow 140 ° C/W θJA 3 m/s air flow 120 ° C/W 40 ° C/W 20 ° C/W Thermal Resistance Junction to Case θJC Thermal Resistance Junction to Top of Case ΨJT IDT™/ ICS™ ZERO DELAY, LOW SKEW BUFFER Conditions Still air 5 ICS574 REV F 092509 ICS574 ZERO DELAY, LOW SKEW BUFFER ZDB Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Body) Package dimensions are kept current with JEDEC Publication No. 95 8 Millimeters Symbol E Min A A1 B C D E e H h L α H INDEX AREA 1 2 D A Inches Max Min 1.35 1.75 0.10 0.25 0.33 0.51 0.19 0.25 4.80 5.00 3.80 4.00 1.27 BASIC 5.80 6.20 0.25 0.50 0.40 1.27 0° 8° Max .0532 .0688 .0040 .0098 .013 .020 .0075 .0098 .1890 .1968 .1497 .1574 0.050 BASIC .2284 .2440 .010 .020 .016 .050 0° 8° h x 45 A1 C -Ce B SEATING PLANE L .10 (.004) C Ordering Information Part / Order Number Marking Shipping Packaging Package Temperature 574M* 574MT* 574MI* 574MIT* 574MLF 574MLFT 574MILF 574MILFT ICS574M Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC 0 to +70° C 0 to +70° C -40 to +85° C -40 to +85° C 0 to +70° C 0 to +70° C -40 to +85° C -40 to +85° C ICS574MI 574MLF 574MILF *NOTE: EOL for non-green parts to occur on 5/13/10 per PDN U-09-01 Parts that are ordered with a "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. IDT™/ ICS™ ZERO DELAY, LOW SKEW BUFFER 6 ICS574 REV F 092509 ICS574 ZERO DELAY, LOW SKEW BUFFER ZDB Innovate with IDT and accelerate your future networks. Contact: www.IDT.com For Sales For Tech Support 800-345-7015 408-284-8200 Fax: 408-284-2775 www.idt.com/go/clockhelp Corporate Headquarters Integrated Device Technology, Inc. www.idt.com © 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. Printed in USA