ICS728M

DATASHEET ICS728 LOW COST 27 MHZ 3.3 VOLT VCXO Description Features The ICS728 combines the functions of a VCXO (Voltage Controlled Crystal Oscillator) and PLL (Phase Locked Loop) frequency doubler onto a single chip. Used in conjunction with an external pullable quartz crystal, this monolithic integrated circuit replaces more costly hybrid (canned) VCXO devices. The ICS728 is designed primarily for data and clock recovery applications within end products such as set-top box receivers. • Ideal for set-top box applications using 13.5 MHz external pullable crystal to generate lock 27 MHz clock transport video clock • On-chip VCXO with guaranteed pull range of ±110 ppm minimum • VCXO input tuning voltage 0 to 3.3 V • Packaged in 8-pin SOIC (150 mil wide) • Available in Pb (lead) free package The ICS728 exhibits a moderate VCXO gain of 110 ppm/V typical, when used with a high quality external pullable quartz crystal. NOTE: EOL for non-green parts to occur on 5/13/10 per PDN U-09-01 The frequency of the on-chip VCXO is adjusted by an external control voltage input into pin VIN. Because VIN is a high impedance input, it can be driven directly from an PWM RC integrator circuit. Frequency output increases with VIN voltage input. The usable range of VIN is 0 to 3.3 V. Block Diagram VIN 13.5 MHz Pullable Crystal X1 X2 IDT™ / ICS™ LOW COST 27 MHZ 3.3 VOLT VCXO Voltage Controlled Crystal Oscillator PLL Frequency Doubler 1 27 MHz (2x Crystal Frequency) ICS728 REV C 110409 ICS728 LOW COST 27 MHZ 3.3 VOLT VCXO VCXO Pin Assignment X1 1 8 X2 VDD 2 7 GN D VI N 3 6 DC GN D 4 5 CL K 8 - pi n ( 1 5 0 mi l ) S OI C Pin Descriptions Pin Number Pin Name Pin Type 1 XI Input Crystal connection. Connect to the external pullable crystal. 2 VDD Power Connect to +3.3 V (0.01uf decoupling capacitor recommended). 3 VIN Input Voltage input to VCXO. Zero to 3.3 V analog input which controls the oscillation frequency of the VCXO. 4 GND Power Connect to ground. 5 CLK Output Clock output. 6 DC __ 7 GND Power Connect to ground. 8 X2 Input Crystal connection. Connect to the external pullable crystal. IDT™ / ICS™ LOW COST 27 MHZ 3.3 VOLT VCXO Pin Description Do not connect to this pin 2 ICS728 REV C 110409 ICS728 LOW COST 27 MHZ 3.3 VOLT VCXO VCXO External Component Selection measured with a physical load of 14 pF. The ICS728 requires a minimum number of external components for proper operation. The external crystal must be connected as close to the chip as possible and should be on the same side of the PCB as the ICS728. There should be no vias between the crystal pins and the X1 and X2 device pins. There should be no signal traces underneath or close to the crystal. Decoupling Capacitor A decoupling capacitor of 0.01µF must be connected between VDD (pin 2) and GND (pin 4), as close to these pins as possible. For optimum device performance, the decoupling capacitor should be mounted on the component side of the PCB. Avoid the use of vias in the decoupling circuit. Crystal Tuning Load Capacitors The crystal traces should include pads for small fixed capacitors, one between X1 and ground, and another between X2 and ground. Stuffing of these capacitors on the PCB is optional. The need for these capacitors is determined at system prototype evaluation, and is influenced by the particular crystal used and by PCB layout. The typical required capacitor value is 1 to 4 pF. Series Termination Resistor When the PCB trace between the clock output (CLK, pin 5) and the load is over 1 inch, series termination should be used. To series terminate a 50Ω trace (a commonly used trace impedance) place a 33Ω resistor in series with the clock line, as close to the clock output pin as possible. The nominal impedance of the clock output is 20Ω. To determine the need for and value of the crystal adjustment capacitors, you will need a PC board of your final layout, a frequency counter capable of 1 ppm resolution and accuracy, two power supplies, and some samples of the crystals which you plan to use in production, along with measured initial accuracy for each crystal at the specified crystal load capacitance, CL. Quartz Crystal The ICS728 VCXO function consists of the external crystal and the integrated VCXO oscillator circuit. To assure the best system performance (frequency pull range) and reliability, a crystal device with the recommended parameters (shown below) must be used, and the layout guidelines discussed in the following section shown must be followed. To determine the value of the crystal capacitors: 1. Connect VDD of the ICS728 to 3.3 V. Connect pin 3 of the ICS728 to the second power supply. Adjust the voltage on pin 3 to 0V. Measure and record the frequency of the CLK output. The frequency of oscillation of a quartz crystal is determined by its “cut” and by the load capacitors connected to it. The ICS728 incorporates on-chip variable load capacitors that “pull” (change) the frequency of the crystal. The crystal specified for use with the ICS728 is designed to have zero frequency error when the total of on-chip + stray capacitance is 14 pF. Recommended Crystal Parameters: Initial Accuracy at 25° C Temperature Stability Aging Load Capacitance Shunt Capacitance, C0 C0/C1 Ratio Equivalent Series Resistance 2. Adjust the voltage on pin 3 to 3.3 V. Measure and record the frequency of the same output. To calculate the centering error: 6 ( f 3.0V – f t arg et ) + ( f 0V – f t arg et ) Error = 10 x ------------------------------------------------------------------------------ – error xtal f t arg et Where: ±20 ppm ±30 ppm ±20 ppm 14 pf 7 pF Max 250 Max 35 Ω Max ftarget = nominal crystal frequency errorxtal =actual initial accuracy (in ppm) of the crystal being measured If the centering error is less than ±25 ppm, no adjustment is needed. If the centering error is more than 25 ppm negative, the PC board has excessive stray capacitance and a new PCB layout should be considered to reduce stray The third overtone mode of the crystal and all spurs must be >100 ppm distant from 3x the fundamental resonance IDT™ / ICS™ LOW COST 27 MHZ 3.3 VOLT VCXO 3 ICS728 REV C 110409 ICS728 LOW COST 27 MHZ 3.3 VOLT VCXO VCXO capacitance. (Alternately, the crystal may be re-specified to a higher load capacitance. Contact IDT for details.) If the centering error is more than 25 ppm positive, add identical fixed centering capacitors from each crystal pin to ground. The value for each of these caps (in pF) is given by: External Capacitor = 2 x (centering error)/(trim sensitivity) Trim sensitivity is a parameter which can be supplied by your crystal vendor. If you do not know the value, assume it is 30 ppm/pF. After any changes, repeat the measurement to verify that the remaining error is acceptably low (typically less than ±25 ppm). Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the ICS728. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Item Rating Supply Voltage, VDD 7V All Inputs and Outputs -0.5 V to VDD+0.5 V Storage Temperature -65 to +150° C Soldering Temperature 260° C Recommended Operation Conditions Parameter Min. Ambient Operating Temperature Power Supply Voltage (measured in respect to GND) Reference crystal parameters IDT™ / ICS™ LOW COST 27 MHZ 3.3 VOLT VCXO Typ. Max. Units 0 +70 °C +3.15 +3.45 V Refer to page 3 4 ICS728 REV C 110409 ICS728 LOW COST 27 MHZ 3.3 VOLT VCXO VCXO DC Electrical Characteristics VDD=3.3 V ±5% , Ambient temperature 0 to +70° C, unless stated otherwise Parameter Symbol Conditions Operating Voltage VDD Output High Voltage VOH IOH = -12 mA Output Low Voltage VOL IOL = 12 mA Output High Voltage (CMOS Level) VOH IOH = -4 mA Operating Supply Current IDD Output = 27 MHz, no load Short Circuit Current IOS VIN, VCXO Control Voltage VIA Min. Typ. 3.15 Max. Units 3.45 V 2.4 V 0.4 V VDD-0.4 V 12 mA ±50 mA 0 3.3 V AC Electrical Characteristics VDD = 3.3 V ±5%, Ambient Temperature 0 to +70° C, unless stated otherwise Parameter Symbol Output Frequency FO Crystal Pullability FP VCXO Gain Conditions Min. Typ. Max. Units 27 0V< VIN < 3.3 V, Note 1 MHz + 110 VIN = VDD/2 +1 V, Note 1 ppm 120 ppm/V Output Rise Time tOR 0.8 to 2.0 V, CL=15 pF 1.5 ns Output Fall Time tOF 2.0 to 0.8 V, CL=15 pF 1.5 ns Output Clock Duty Cycle tD Measured at 1.4 V, CL=15 pF 60 % Maximum Output Jitter, short term tJ CL=15 pF 40 50 100 ps Note 1: External crystal device must conform with Pullable Crystal Specifications listed on page 3. Thermal Characteristics Parameter Thermal Resistance Junction to Ambient Thermal Resistance Junction to Case IDT™ / ICS™ LOW COST 27 MHZ 3.3 VOLT VCXO Symbol Conditions Min. Typ. Max. Units θJA Still air 150 ° C/W θJA 1 m/s air flow 140 ° C/W θJA 3 m/s air flow 120 ° C/W 40 ° C/W θJC 5 ICS728 REV C 110409 ICS728 LOW COST 27 MHZ 3.3 VOLT VCXO VCXO Marking Diagram 8 Marking Diagram (Pb free) 5 8 ICS728M ###### YYWW$$ 1 5 728MLF ###### YYWW 4 1 4 Notes: 1. ###### is the lot number. 2. YYWW is the last two digits of the year and week that the part was assembled. 3. “LF” denotes Pb (lead) free package. 4. Bottom marking: (origin) Origin = country of origin of not USA. IDT™ / ICS™ LOW COST 27 MHZ 3.3 VOLT VCXO 6 ICS728 REV C 110409 ICS728 LOW COST 27 MHZ 3.3 VOLT VCXO VCXO Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Narrow Body) Package dimensions are kept current with JEDEC Publication No. 95 8 E Symbol Millimeters Min Max Inches Min Max A A1 B C D E e H h L a 1.35 1.75 1.10 0.25 0.33 0.51 0.19 0.25 4.80 5.00 3.80 4.00 1.27 Basic 5.80 6.20 0.25 0.50 0.40 1.27 8° 0° 0.0532 0.0688 0.0040 0.0098 0.013 0.020 0.0075 0.0098 .1890 .1968 0.1497 0.1574 0.050 Basic 0.2284 0.2440 0.010 0.020 0.016 0.050 0° 8° H INDEX AREA 1 2 D A h x 45 A1 C -Ce B SEATING PLANE L .10 (.004) C Ordering Information Part / Order Number 728M* 728MT* 728MLF 728MLFT Marking Shipping Packaging Package see page 6 Tubes Tape and Reel Tubes Tape and Reel 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC Temperature 0 to +70° 0 to +70° 0 to +70° 0 to +70° C C C C *NOTE: EOL for non-green parts to occur on 5/13/10 per PDN U-09-01 Parts that are ordered with a “LF” suffix to the part number are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. IDT™ / ICS™ LOW COST 27 MHZ 3.3 VOLT VCXO 7 ICS728 REV C 110409 ICS728 LOW COST 27 MHZ 3.3 VOLT VCXO VCXO Revision History Rev. Originator Date A J. Sarma 12/14/04 Release from Prelim to Final; release as General purpose device. B J. Sarma 01/25/05 Add marking diagrams; add LF. 11/04/09 Added EOL note for non-green parts. C Description of Change IDT™ / ICS™ LOW COST 27 MHZ 3.3 VOLT VCXO 8 ICS728 REV C 110409 ICS728 LOW COST 27 MHZ 3.3 VOLT VCXO VCXO Innovate with IDT and accelerate your future networks. Contact: www.IDT.com For Sales For Tech Support 800-345-7015 408-284-8200 Fax: 408-284-2775 ww.idt.com/go/clockhelp Corporate Headquarters Integrated Device Technology, Inc. www.idt.com © 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. Printed in USA