DATASHEET
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
±60V Fault Protected, 5V, RS-485/RS-422 Transceivers with ±25V CMR and ESD Protection
The ISL32490E, ISL32492E, ISL32493E, ISL32495E,
ISL32496E, and ISL32498E are fault protected, 5V powered,
differential transceivers that exceed the RS-485 and RS-422
standards for balanced communication. The RS-485 transceiver
pins (driver outputs and receiver inputs) are fault protected up to
±60V and are protected against ±16.5kV ESD strikes without
latch-up. Additionally, the extended Common-Mode Range
(CMR) allows these transceivers to operate in environments with
common-mode voltages up to ±25V (>2x the RS-485
requirement), making this fault protected RS-485 family one of
the most robust on the market.
The transmitters (Tx) deliver an exceptional 2.5V (typical)
differential output voltage into the RS-485 specified 54Ω load.
This yields better noise immunity than standard RS-485 ICs, or
allows up to six 120Ω terminations in star network topologies.
The receiver (Rx) inputs feature a full fail-safe design that
ensures a logic high Rx output if the Rx inputs are floating,
shorted, or on a terminated but undriven (idle) bus. The Rx
outputs have high drive levels; typically, 15mA at VOL = 1V (for
opto-coupled, isolated applications).
Half duplex (Rx inputs and Tx outputs multiplexed together)
and full duplex pinouts are available. See Table 1 on page 3 for
key features and configurations by device number.
For fault protected or wide common-mode range RS-485
transceivers with cable invert (polarity reversal) pins, see the
ISL32483E datasheet.
Related Literature
FN7786
Rev.6.00
Feb 8, 2019
Features
• Fault protected RS-485 bus pins . . . . . . . . . . . . . . up to ±60V
• Extended CMR . . . . . . . . . . ±25V (more than twice the range
required for RS-485)
• ±16.5kV HBM ESD protection on RS-485 bus pins
• 1/4 unit load for up to 128 devices on the bus
• High transient overvoltage tolerance. . . . . . . . . . . . . . . . ±80V
• Full fail-safe (open, short, terminated) RS-485 receivers
• High Rx IOL for opto-couplers in isolated designs
• Hot plug circuitry; Tx and Rx outputs remain three-state
during power-up/power-down
• Choice of RS-485 data rates. . . . . . . . . . 250kbps to 15Mbps
• Low quiescent supply current. . . . . . . . . . . . . . . . . . . . 2.3mA
• Ultra low shutdown supply current. . . . . . . . . . . . . . . . . . 10µA
Applications
• Utility meters/automated meter reading systems
• High node count RS-485 systems
• PROFIBUS and RS-485 based field bus networks, and factory
automation
• Security camera networks
• Building lighting and environmental control systems
• Industrial/process control networks
• For a full list of related documents, visit our website:
- ISL32490E, ISL32492E, ISL32493E, ISL32495E,
ISL32496E, and ISL32498E device pages
30
VID = ±1V
B
A
20
VOLTAGE (V)
25
COMMON-MODE RANGE
25
15
10
5
RO
0
0
-7
-12
-20
-25
-5
TIME (20ns/DIV)
FIGURE 1. EXCEPTIONAL Rx OPERATES AT >15Mbps EVEN WITH A
±25V COMMON-MODE VOLTAGE
FN7786 Rev.6.00
Feb 8, 2019
12
STANDARD RS-485
TRANSCEIVER
CLOSEST
COMPETITOR
ISL3249xE
FIGURE 2. ISL3249xE DELIVERS SUPERIOR COMMON-MODE
RANGE vs STANDARD RS-485 DEVICES
Page 1 of 22
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
Typical Operating Circuits
+5V
+5V
+
8
0.1µF
0.1µF
+
8
VCC
1 RO
VCC
R
B/Z
7
3 DE
A/Y
6
4 DI
DI 4
D
2 RE
RT
RT
7
B/Z
DE 3
6
A/Y
RE 2
RO 1
R
D
GND
GND
5
5
FIGURE 3. ISL32492E, ISL32495E, ISL32498E HALF DUPLEX EXAMPLE
+5V
+5V
+
13, 14
VCC
2 RO
R
0.1µF
A 12
0.1µF
RT
+
13, 14
VCC
9 Y
B 11
10 Z
D
DI 5
3 RE
DE 4
4 DE
RE 3
5 DI
RT
Z 10
Y 9
D
11 B
R
12 A
GND
RO 2
GND
6, 7
6, 7
FIGURE 4. ISL32490E, ISL32493E, ISL32496E FULL DUPLEX EXAMPLE (SOIC PIN NUMBERS SHOWN)
Ordering Information
PART NUMBER
(Notes 2, 3)
PART
MARKING
TEMP. RANGE
(°C)
TAPE AND REEL
(Units) (Note 1)
PACKAGE
(RoHS COMPLIANT)
PKG.
DWG. #
ISL32490EIBZ
ISL32490 EIBZ
-40 to +85
-
14 Ld SOIC
M14.15
ISL32490EIBZ-T
ISL32490 EIBZ
-40 to +85
2.5k
14 Ld SOIC
M14.15
ISL32490EIBZ-T7A
ISL32490 EIBZ
-40 to +85
250
14 Ld SOIC
M14.15
ISL32490EIUZ
2490E
-40 to +85
-
10 Ld MSOP
M10.118
ISL32490EIUZ-T
2490E
-40 to +85
2.5k
10 Ld MSOP
M10.118
ISL32490EIUZ-T7A
2490E
-40 to +85
250
10 Ld MSOP
M10.118
ISL32492EIBZ
32492 EIBZ
-40 to +85
-
8 Ld SOIC
M8.15
ISL32492EIBZ-T
32492 EIBZ
-40 to +85
2.5k
8 Ld SOIC
M8.15
ISL32492EIBZ-T7A
32492 EIBZ
-40 to +85
250
8 Ld SOIC
M8.15
ISL32492EIUZ
2492E
-40 to +85
-
8 Ld MSOP
M8.118
ISL32492EIUZ-T
2492E
-40 to +85
2.5k
8 Ld MSOP
M8.118
ISL32492EIUZ-T7A
2492E
-40 to +85
250
8 Ld MSOP
M8.118
ISL32493EIBZ
ISL32493 EIBZ
-40 to +85
-
14 Ld SOIC
M14.15
ISL32493EIBZ-T
ISL32493 EIBZ
-40 to +85
2.5k
14 Ld SOIC
M14.15
ISL32493EIBZ-T7A
ISL32493 EIBZ
-40 to +85
250
14 Ld SOIC
M14.15
FN7786 Rev.6.00
Feb 8, 2019
Page 2 of 22
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
Ordering Information (Continued)
PART NUMBER
(Notes 2, 3)
PART
MARKING
TEMP. RANGE
(°C)
TAPE AND REEL
(Units) (Note 1)
PACKAGE
(RoHS COMPLIANT)
PKG.
DWG. #
ISL32493EIUZ
2493E
-40 to +85
-
10 Ld MSOP
M10.118
ISL32493EIUZ-T
2493E
-40 to +85
2.5k
10 Ld MSOP
M10.118
ISL32493EIUZ-T7A
2493E
-40 to +85
250
10 Ld MSOP
M10.118
ISL32495EIBZ
32495 EIBZ
-40 to +85
-
8 Ld SOIC
M8.15
ISL32495EIBZ-T
32495 EIBZ
-40 to +85
2.5k
8 Ld SOIC
M8.15
ISL32495EIBZ-T7A
32495 EIBZ
-40 to +85
250
8 Ld SOIC
M8.15
ISL32495EIUZ
2495E
-40 to +85
-
8 Ld MSOP
M8.118
ISL32495EIUZ-T
2495E
-40 to +85
2.5k
8 Ld MSOP
M8.118
ISL32495EIUZ-T7A
2495E
-40 to +85
250
8 Ld MSOP
M8.118
ISL32496EIBZ
ISL32496 EIBZ
-40 to +85
-
14 Ld SOIC
M14.15
ISL32496EIBZ-T
ISL32496 EIBZ
-40 to +85
2.5k
14 Ld SOIC
M14.15
ISL32496EIBZ-T7A
ISL32496 EIBZ
-40 to +85
250
14 Ld SOIC
M14.15
ISL32496EIUZ
2496E
-40 to +85
-
10 Ld MSOP
M10.118
ISL32496EIUZ-T
2496E
-40 to +85
2.5k
10 Ld MSOP
M10.118
ISL32496EIUZ-T7A
2496E
-40 to +85
250
10 Ld MSOP
M10.118
ISL32498EIBZ
32498 EIBZ
-40 to +85
-
8 Ld SOIC
M8.15
ISL32498EIBZ-T
32498 EIBZ
-40 to +85
2.5k
8 Ld SOIC
M8.15
ISL32498EIBZ-T7A
32498 EIBZ
-40 to +85
250
8 Ld SOIC
M8.15
ISL32498EIUZ
2498E
-40 to +85
-
8 Ld MSOP
M8.118
ISL32498EIUZ-T
2498E
-40 to +85
2.5k
8 Ld MSOP
M8.118
ISL32498EIUZ-T7A
2498E
-40 to +85
250
8 Ld MSOP
M8.118
NOTES:
1. See TB347 for details about reel specifications.
2. These Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate
plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Pb-free products are
MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), see the ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, and ISL32498E device information pages.
For more information about MSL, see TB363.
TABLE 1. SUMMARY OF FEATURES
HALF/FULL
DUPLEX
DATA RATE
(Mbps)
SLEW-RATE
LIMITED?
EN PINS?
HOT
PLUG?
QUIESCENT ICC
(mA)
LOW POWER
SHUTDOWN?
PIN COUNT
ISL32490E
Full
0.25
Yes
Yes
Yes
2.3
Yes
10, 14
ISL32492E
Half
0.25
Yes
Yes
Yes
2.3
Yes
8
ISL32493E
Full
1
Yes
Yes
Yes
2.3
Yes
10, 14
ISL32495E
Half
1
Yes
Yes
Yes
2.3
Yes
8
ISL32496E
Full
15
No
Yes
Yes
2.3
Yes
10, 14
ISL32498E
Half
15
No
Yes
Yes
2.3
Yes
8
PART NUMBER
FN7786 Rev.6.00
Feb 8, 2019
Page 3 of 22
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
Pin Configurations
ISL32490E, ISL32493E, ISL32496E
(10 LD MSOP)
TOP VIEW
ISL32492E, ISL32495E, ISL32498E
(8 LD MSOP, 8 LD SOIC)
TOP VIEW
10 VCC
NC 1
RE 2
9 A
RO 2
A/Y
DE 3
8 B
RE 3
GND
DI 4
7 Z
DE 4
8
VCC
RO 1
2
7
B/Z
DE
3
6
DI
4
5
RO
1
RE
R
D
ISL32490E, ISL32493E, ISL32496E
(14 LD SOIC)
TOP VIEW
R
D
DI 5
6 Y
GND 5
14 VCC
13 VCC
R
12 A
11 B
D
10 Z
GND 6
9 Y
GND 7
8 NC
NOTE: Evaluate creepage and clearance requirements at your maximum fault voltage before using small pitch packages such as MSOP.
Pin Descriptions
PIN 8 LD 10 LD 14 LD
NAME PIN # PIN # PIN #
FUNCTION
RO
1
1
2
Receiver output. If A-B ≥ -10mV, RO is high; if A-B ≤ -200mV, RO is low; if A and B are unconnected (floating), shorted
together, or connected to an undriven, terminated bus, RO is high.
RE
2
2
3
Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. Internally pulled low.
DE
3
3
4
Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is
low. Internally pulled high.
DI
4
4
5
Driver input. A low on DI forces output Y low and output Z high. A high on DI forces output Y high and output Z low.
GND
5
5
6, 7
A/Y
6
-
-
±60V fault and ±16.5kV HBM ESD protected RS-485/RS-422 level, non-inverting receiver input and non-inverting driver
output. Pin is an input if DE = 0; pin is an output if DE = 1.
B/Z
7
-
-
±60V fault and ±16.5kV HBM ESD protected RS-485/RS-422 level, inverting receiver input and inverting driver output.
Pin is an input if DE = 0; pin is an output if DE = 1.
A
-
9
12
±60V fault and ±15kV HBM ESD protected RS-485/RS-422 level, non-inverting receiver input.
B
-
8
11
±60V fault and ±15kV HBM ESD protected RS-485/RS-422 level, inverting receiver input.
Y
-
6
9
±60V fault and ±15kV HBM ESD protected RS-485/RS-422 level, non-inverting driver output.
10
±60V fault and ±15kV HBM ESD protected RS-485/RS-422 level, inverting driver output.
Z
-
7
VCC
8
10
NC
-
-
Ground connection.
13, 14 System power supply input (4.5V to 5.5V).
1, 8
No internal connection.
Truth Tables
RECEIVING
INPUTS
TRANSMITTING
INPUTS
RE
OUTPUTS
RE
DE
DI
Z
Y
X
1
1
0
1
X
1
0
1
0
0
0
X
High-Z
High-Z
1
0
X
High-Z (see Note)
High-Z (see Note)
NOTE: Low Power Shutdown Mode (see Note 11 on page 9).
OUTPUT
DE
DE
Half Duplex Full Duplex
A-B
RO
0
0
X
VAB ≥ -0.01V
1
0
0
X
-0.01V > VAB > -0.2V
Undetermined
0
0
X
VAB ≤ -0.2V
0
0
0
X
Inputs
Open/Shorted
1
1
0
0
X
High-Z (see
Note)
1
1
1
X
High-Z
NOTE: Low Power Shutdown Mode (see Note 11 on page 9).
FN7786 Rev.6.00
Feb 8, 2019
Page 4 of 22
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
Absolute Maximum Ratings
Thermal Information
VCC to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC + 0.3V)
Input/Output Voltages
A/Y, B/Z, A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±60V
A/Y, B/Z, A, B, Y, Z (Transient Pulse Through 100Ω, (Note 15). . . . ±80V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V)
Short-Circuit Duration
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indefinite
ESD Rating . . . . . . . . . . . . . . . . . . . . see “ESD PERFORMANCE” on page 6
Latch-Up (Tested per JESD78, Level 2, Class A) . . . . . . . . . . . . . . . +125°C
Thermal Resistance (Typical)
θJA (°C/W) θJC (°C/W)
8 Ld MSOP Package (Notes 4, 5) . . . . . . . .
140
40
8 Ld SOIC Package (Notes 4, 5) . . . . . . . . .
108
47
10 Ld MSOP Package (Notes 4, 5) . . . . . . .
135
50
14 Ld SOIC Package (Notes 4, 5) . . . . . . . .
88
39
Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . . . . . -65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See TB493
Recommended Operating Conditions
Supply Voltage (VCC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Bus Pin Common-Mode Voltage Range. . . . . . . . . . . . . . . . . . -25V to +25V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions can adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4. θJA is measured with the component mounted on a high-effective thermal conductivity test board in free air. See TB379 for details.
5. For θJC, the “case temp” location is taken at the package top center.
Electrical Specifications VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V, TA = +25°C (Note 6). Boldface
limits apply across the operating temperature range, -40°C to +85°C.
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
MIN
(°C) (Note 14)
TYP
MAX
(Note 14) UNIT
DC CHARACTERISTICS
Driver Differential VOUT (No load)
VOD1
Driver Differential VOUT (Loaded,
Figure 5A)
VOD2
Full
-
-
VCC
V
RL = 100Ω (RS-422)
Full
2.4
3.2
-
V
RL = 54Ω (RS-485)
Full
1.5
2.5
VCC
V
RL = 54Ω (PROFIBUS, VCC ≥ 5V)
Full
2.0
2.5
RL = 21Ω (Six 120Ω terminations for star
configurations, VCC ≥ 4.75V)
Full
0.8
1.3
-
V
Change in Magnitude of Driver
Differential VOUT for Complementary
Output States
ΔVOD
RL = 54Ω or 100Ω (Figure 5A)
Full
-
-
0.2
V
Driver Differential VOUT with
Common-Mode Load (Figure 5B)
VOD3
RL = 60Ω, -7V ≤ VCM ≤ 12V
Full
1.5
2.1
VCC
V
RL = 60Ω, -25V ≤ VCM ≤ 25V (VCC ≥ 4.75V)
Full
1.7
2.3
RL = 21Ω, -15V ≤ VCM ≤ 15V (VCC ≥ 4.75V)
Full
0.8
1.1
-
V
RL = 54Ω or 100Ω
Full
-1
-
3
V
RL = 60Ω or 100Ω, -20V ≤ VCM ≤ 20V
Full
-2.5
-
5
V
Driver Common-Mode VOUT
(Figure 5)
VOC
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
ΔVOC
RL = 54Ω or 100Ω (Figure 5A)
Full
-
-
0.2
V
Driver Short-Circuit Current
IOSD
DE = VCC, -25V ≤ VO ≤ 25V (Note 8)
Full
-250
-
250
mA
IOSD1
At first foldback, 22V ≤ VO ≤ -22V
Full
-83
-
83
mA
IOSD2
At second foldback,
35V ≤ VO ≤ -35V
Full
-13
-
13
mA
Logic Input High Voltage
VIH
DE, DI, RE
Full
2.5
-
-
V
Logic Input Low Voltage
VIL
DE, DI, RE
Full
-
-
0.8
V
Logic Input Current
IIN1
DI
Full
-1
-
1
µA
DE, RE
Full
-15
6
15
µA
FN7786 Rev.6.00
Feb 8, 2019
Page 5 of 22
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
Electrical Specifications VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V, TA = +25°C (Note 6). Boldface
limits apply across the operating temperature range, -40°C to +85°C. (Continued)
PARAMETER
Input/Output Current (A/Y, B/Z)
Input Current (A, B)
(Full Duplex Versions Only)
Output Leakage Current (Y, Z)
(Full Duplex Versions Only)
Receiver Differential Threshold
Voltage
SYMBOL
IIN2
IIN3
IOZD
TEST CONDITIONS
DE = 0V, VCC = 0V
or 5.5V
VCC = 0V or 5.5V
RE = 0V, DE = 0V,
VCC = 0V or 5.5V
TEMP
MIN
(°C) (Note 14)
TYP
MAX
(Note 14) UNIT
VIN = 12V
Full
-
110
250
µA
VIN = -7V
Full
-200
-75
-
µA
VIN = ±25V
Full
-800
±240
800
µA
VIN = ±60V (Note 16)
Full
-6
±0.5
6
mA
VIN = 12V
Full
-
90
125
µA
VIN = -7V
Full
-100
-70
-
µA
VIN = ±25V
Full
-500
±200
500
µA
VIN = ±60V (Note 16)
Full
-3
±0.4
3
mA
VIN = 12V
Full
-
20
200
µA
VIN = -7V
Full
-100
-5
-
µA
VIN = ±25V
Full
-500
±40
500
µA
VIN = ±60V (Note 16)
Full
-3
±0.1
3
mA
V TH
-25V ≤ VCM ≤ 25V
Full
-200
-100
-10
mV
Receiver Input Hysteresis
ΔV TH
-25V ≤ VCM ≤ 25V
25
-
25
-
mV
Receiver Output High Voltage
VOH
IO = -2mA, VID = -10mV
Full
VCC - 0.5
4.75
-
V
IO = -8mA, VID = -10mV
Full
2.8
4.2
-
V
Receiver Output Low Voltage
VOL
IO = 6mA, VID = -200mV
Full
-
0.27
0.4
V
Receiver Output Low Current
IOL
VO = 1V, VID = -200mV
Full
15
22
-
mA
Three-state (High Impedance)
Receiver Output Current
IOZR
0V ≤ VO ≤ VCC
Full
-1
0.01
1
µA
Receiver Short-Circuit Current
IOSR
0V ≤ VO ≤ VCC
Full
±12
-
±110
mA
DE = VCC, RE = 0V or VCC, DI = 0V or VCC
Full
-
2.3
4.5
mA
DE = 0V, RE = VCC, DI = 0V or VCC
Full
-
10
50
µA
Half duplex
25
-
±16.5
-
kV
Full duplex
25
-
±15
-
kV
Human Body Model, per JEDEC
25
-
±8
-
kV
Machine Model
25
-
±700
-
V
SUPPLY CURRENT
No Load Supply Current (Note 7)
Shutdown Supply Current
ICC
ISHDN
ESD PERFORMANCE
RS-485 Pins (A, Y, B, Z, A/Y, B/Z)
Human Body
Model, from bus
pins to GND
All Pins
DRIVER SWITCHING CHARACTERISTICS (250kbps Versions - ISL32490E, ISL32492E)
Driver Differential Output Delay
Driver Differential Output Skew
Driver Differential Rise or Fall Time
Maximum Data Rate
FN7786 Rev.6.00
Feb 8, 2019
tPLH, tPHL
tSKEW
tR, tF
fMAX
RD = 54Ω,
CD = 50pF
(Figure 6)
No CM load
Full
-
320
450
ns
-25V ≤ VCM ≤ 25V
Full
-
-
1000
ns
RD = 54Ω,
CD = 50pF
(Figure 6)
No CM load
Full
-
6
30
ns
-25V ≤ VCM ≤ 25V
Full
-
-
50
ns
RD = 54Ω,
CD = 50pF
(Figure 6)
No CM load
Full
400
650
1200
ns
-25V ≤ VCM ≤ 25V
Full
300
-
1350
ns
Full
0.25
1.5
-
Mbps
CD = 820pF (Figure 8)
Page 6 of 22
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
Electrical Specifications VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V, TA = +25°C (Note 6). Boldface
limits apply across the operating temperature range, -40°C to +85°C. (Continued)
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
MIN
(°C) (Note 14)
TYP
MAX
(Note 14) UNIT
Driver Enable to Output High
tZH
SW = GND (Figure 7), (Note 9)
Full
-
-
1200
ns
Driver Enable to Output Low
tZL
SW = VCC (Figure 7), (Note 9)
Full
-
-
1200
ns
Driver Disable from Output Low
tLZ
SW = VCC (Figure 7)
Full
-
-
120
ns
Driver Disable from Output High
tHZ
SW = GND (Figure 7)
Full
-
-
120
ns
(Note 11)
Full
60
160
600
ns
Time to Shutdown
tSHDN
Driver Enable from Shutdown to
Output High
tZH(SHDN)
SW = GND (Figure 7), (Notes 11, 12)
Full
-
-
2500
ns
Driver Enable from Shutdown to
Output Low
tZL(SHDN)
SW = VCC (Figure 7), (Notes 11, 12)
Full
-
-
2500
ns
DRIVER SWITCHING CHARACTERISTICS (1Mbps Versions - ISL32493E, ISL32495E)
Driver Differential Output Delay
Driver Differential Output Skew
Driver Differential Rise or Fall Time
Maximum Data Rate
tPLH, tPHL
tSKEW
tR, tF
fMAX
RD = 54Ω,
CD = 50pF
(Figure 6)
No CM load
Full
-
70
125
ns
-25V ≤ VCM ≤ 25V
Full
-
-
350
ns
RD = 54Ω,
CD = 50pF
(Figure 6)
No CM load
Full
-
4.5
15
ns
-25V ≤ VCM ≤ 25V (Note 17)
Full
-
-
25
ns
RD = 54Ω,
CD = 50pF
(Figure 6)
No CM load
Full
70
170
300
ns
-25V ≤ VCM ≤ 25V
Full
70
-
550
ns
CD = 820pF (Figure 8)
Full
1
4
-
Mbps
Driver Enable to Output High
tZH
SW = GND (Figure 7), (Note 9)
Full
-
-
350
ns
Driver Enable to Output Low
tZL
SW = VCC (Figure 7), (Note 9)
Full
-
-
300
ns
Driver Disable from Output Low
tLZ
SW = VCC (Figure 7)
Full
-
-
120
ns
Driver Disable from Output High
tHZ
SW = GND (Figure 7)
Full
-
-
120
ns
(Note 11)
Full
60
160
600
ns
Time to Shutdown
tSHDN
Driver Enable from Shutdown to
Output High
tZH(SHDN)
SW = GND (Figure 7), (Notes 11, 12)
Full
-
-
2000
ns
Driver Enable from Shutdown to
Output Low
tZL(SHDN)
SW = VCC (Figure 7), (Notes 11, 12)
Full
-
-
2000
ns
DRIVER SWITCHING CHARACTERISTICS (15Mbps Versions - ISL32496E, ISL32498E)
Driver Differential Output Delay
Driver Differential Output Skew
Driver Differential Rise or Fall Time
Maximum Data Rate
tPLH, tPHL
tSKEW
tR, tF
fMAX
RD = 54Ω,
CD = 50pF
(Figure 6)
No CM load
Full
-
21
45
ns
-25V ≤ VCM ≤ 25V
Full
-
-
80
ns
RD = 54Ω,
CD = 50pF
(Figure 6)
No CM load
Full
-
3
6
ns
-25V ≤ VCM ≤ 25V
Full
-
-
7
ns
RD = 54Ω,
CD = 50pF
(Figure 6)
No CM Load
Full
5
17
30
ns
-25V ≤ VCM ≤ 25V
Full
5
-
30
ns
CD = 470pF (Figure 8)
Full
15
25
-
Mbps
Driver Enable to Output High
tZH
SW = GND (Figure 7), (Note 9)
Full
-
-
100
ns
Driver Enable to Output Low
tZL
SW = VCC (Figure 7), (Note 9)
Full
-
-
100
ns
Driver Disable from Output Low
tLZ
SW = VCC (Figure 7)
Full
-
-
120
ns
Driver Disable from Output High
tHZ
SW = GND (Figure 7)
Full
-
-
120
ns
(Note 11)
Full
60
160
600
ns
Time to Shutdown
FN7786 Rev.6.00
Feb 8, 2019
tSHDN
Page 7 of 22
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
Electrical Specifications VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V, TA = +25°C (Note 6). Boldface
limits apply across the operating temperature range, -40°C to +85°C. (Continued)
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
MIN
(°C) (Note 14)
TYP
MAX
(Note 14) UNIT
Driver Enable from Shutdown to
Output High
tZH(SHDN)
SW = GND (Figure 7), (Notes 11, 12)
Full
-
-
2000
ns
Driver Enable from Shutdown to
Output Low
tZL(SHDN)
SW = VCC (Figure 7), (Notes 11, 12)
Full
-
-
2000
ns
RECEIVER SWITCHING CHARACTERISTICS (250kbps Versions - ISL32490E, ISL32492E)
Maximum Data Rate
Receiver Input to Output Delay
Receiver Skew |tPLH - tPHL |
fMAX
-25V ≤ VCM ≤ 25V (Figure 9)
Full
0.25
5
-
Mbps
tPLH, tPHL
-25V ≤ VCM ≤ 25V (Figure 9)
Full
-
200
280
ns
(Figure 9)
Full
-
4
10
ns
tSKD
Receiver Enable to Output Low
tZL
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 10), (Note 10)
Full
-
-
50
ns
Receiver Enable to Output High
tZH
RL = 1kΩ, CL = 15pF, SW = GND (Figure 10),
(Note 10)
Full
-
-
50
ns
Receiver Disable from Output Low
tLZ
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 10)
Full
-
-
50
ns
Receiver Disable from Output High
tHZ
RL = 1kΩ, CL = 15pF, SW = GND (Figure 10)
Full
-
-
50
ns
(Note 11)
Full
60
160
600
ns
Time to Shutdown
tSHDN
Receiver Enable from Shutdown to
Output High
tZH(SHDN)
RL = 1kΩ, CL = 15pF, SW = GND (Figure 10),
(Notes 11, 13)
Full
-
-
2000
ns
Receiver Enable from Shutdown to
Output Low
tZL(SHDN)
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 10),
(Notes 11, 13)
Full
-
-
2000
ns
RECEIVER SWITCHING CHARACTERISTICS (1Mbps Versions - ISL32493E, ISL32495E)
Maximum Data Rate
Receiver Input to Output Delay
Receiver Skew |tPLH - tPHL |
fMAX
-25V ≤ VCM ≤ 25V (Figure 9)
Full
1
15
-
Mbps
tPLH, tPHL
-25V ≤ VCM ≤ 25V (Figure 9)
Full
-
90
150
ns
(Figure 9)
Full
-
4
10
ns
tSKD
Receiver Enable to Output Low
tZL
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 10), (Note 10)
Full
-
-
50
ns
Receiver Enable to Output High
tZH
RL = 1kΩ, CL = 15pF, SW = GND (Figure 10),
(Note 10)
Full
-
-
50
ns
Receiver Disable from Output Low
tLZ
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 10)
Full
-
-
50
ns
Receiver Disable from Output High
tHZ
RL = 1kΩ, CL = 15pF, SW = GND (Figure 10)
Full
-
-
50
ns
(Note 11)
Full
60
160
600
ns
Time to Shutdown
tSHDN
Receiver Enable from Shutdown to
Output High
tZH(SHDN)
RL = 1kΩ, CL = 15pF, SW = GND (Figure 10),
(Notes 11, 13)
Full
-
-
2000
ns
Receiver Enable from Shutdown to
Output Low
tZL(SHDN)
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 10), (Notes
11, 13)
Full
-
-
2000
ns
RECEIVER SWITCHING CHARACTERISTICS (15Mbps Versions - ISL32496E, ISL32498E)
Maximum Data Rate
Receiver Input to Output Delay
Receiver Skew |tPLH - tPHL |
fMAX
-25V ≤ VCM ≤ 25V (Figure 9)
Full
15
25
-
Mbps
tPLH, tPHL
-25V ≤ VCM ≤ 25V (Figure 9)
Full
-
35
70
ns
(Figure 9)
Full
-
4
10
ns
tSKD
Receiver Enable to Output Low
tZL
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 10), (Note 10)
Full
-
-
50
ns
Receiver Enable to Output High
tZH
RL = 1kΩ, CL = 15pF, SW = GND (Figure 10),
(Note 10)
Full
-
-
50
ns
Receiver Disable from Output Low
tLZ
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 10)
Full
-
-
50
ns
Receiver Disable from Output High
tHZ
RL = 1kΩ, CL = 15pF, SW = GND (Figure 10)
Full
-
-
50
ns
(Note 11)
Full
60
160
600
ns
Time to Shutdown
FN7786 Rev.6.00
Feb 8, 2019
tSHDN
Page 8 of 22
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
Electrical Specifications VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V, TA = +25°C (Note 6). Boldface
limits apply across the operating temperature range, -40°C to +85°C. (Continued)
PARAMETER
SYMBOL
TEMP
MIN
(°C) (Note 14)
TEST CONDITIONS
TYP
MAX
(Note 14) UNIT
Receiver Enable from Shutdown to
Output High
tZH(SHDN)
RL = 1kΩ, CL = 15pF, SW = GND (Figure 10),
(Notes 11, 13)
Full
-
-
2000
ns
Receiver Enable from Shutdown to
Output Low
tZL(SHDN)
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 10),
(Notes 11, 13)
Full
-
-
2000
ns
NOTES:
6. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise
specified.
7. Supply current specification is valid for loaded drivers when DE = 0V.
8. Applies to peak current. See “Typical Performance Curves” beginning on page 11 for more information.
9. Keep RE = 0 to prevent the device from entering shutdown.
10. The RE signal high time must be short enough (typically 600ns to ensure that the device enters shutdown.
13. Set the RE signal high time >600ns to ensure that the device enters shutdown.
14. Compliance to datasheet limits is assured by one or more methods: production test, characterization, and/or design.
15. Tested according to TIA/EIA-485-A, Section 4.2.6 (±80V for 15µs at a 1% duty cycle).
16. See “Caution” statement following “Absolute Maximum Ratings” on page 5.
17. This parameter is not production tested.
Test Circuits and Waveforms
VCC
RL/2
DE
DI
VCC
Z
DI
VOD
D
Y
FIGURE 5A. VOD AND VOC
Z
VOC
VCM
VOD
D
Y
RL/2
375Ω
RL/2
DE
VOC
RL/2
375Ω
FIGURE 5B. VOD AND VOC WITH COMMON-MODE LOAD
FIGURE 5. DC DRIVER TEST CIRCUITS
FN7786 Rev.6.00
Feb 8, 2019
Page 9 of 22
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
Test Circuits and Waveforms (Continued)
3V
DI
1.5V
1.5V
0V
375Ω*
DE
VCC
tPLH
Z
DI
CD
D
RD
Y
SIGNAL
GENERATOR
VCM
375Ω*
*USED ONLY FOR COMMON
MODE LOAD TESTS
tPHL
OUT (Z)
VOH
OUT (Y)
VOL
90%
DIFF OUT (Y - Z)
+VOD
90%
10%
10%
tR
-VOD
tF
SKEW = |tPLH - tPHL |
FIGURE 6A. TEST CIRCUIT
FIGURE 6B. MEASUREMENT POINTS
FIGURE 6. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
DE
Z
DI
110Ω
VCC
D
SIGNAL
GENERATOR
SW
Y
GND
3V
DE
1.5V
1.5V
(Note 11)
0V
CL
tZH, tZH(SHDN)
tHZ
OUTPUT HIGH
(Note 11)
PARAMETER
OUTPUT
RE
DI
SW
CL (pF)
tHZ
Y/Z
X
1/0
GND
50
tLZ
Y/Z
X
0/1
VCC
50
tZH
Y/Z
0 (Note 9)
1/0
GND
100
tZL
Y/Z
0 (Note 9)
0/1
VCC
100
tZH(SHDN)
Y/Z
1 (Note 12)
1/0
GND
100
tZL(SHDN)
Y/Z
1 (Note 12)
0/1
VCC
100
2.3V
OUT (Y, Z)
VOH
VOH - 0.5V
0V
tZL, tZL(SHDN)
tLZ
(Note 11)
VCC
OUT (Y, Z)
2.3V
VOL + 0.5V
VOL
OUTPUT LOW
FIGURE 7A. TEST CIRCUIT
FIGURE 7B. MEASUREMENT POINTS
FIGURE 7. DRIVER ENABLE AND DISABLE TIMES
VCC
DE
+
Z
DI
54Ω
D
Y
SIGNAL
GENERATOR
CD
3V
DI
VOD
0V
-
+VOD
DIFF OUT (Y - Z)
-VOD
FIGURE 8A. TEST CIRCUIT
0V
FIGURE 8B. MEASUREMENT POINTS
FIGURE 8. DRIVER DATA RATE
FN7786 Rev.6.00
Feb 8, 2019
Page 10 of 22
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
Test Circuits and Waveforms (Continued)
B
RE
B
R
A
VCM + 750mV
15pF
RO
VCM
VCM
VCM - 750mV
A
tPLH
SIGNAL
GENERATOR
tPHL
SIGNAL
GENERATOR
VCC
50%
RO
50%
VCM
0V
FIGURE 9A. TEST CIRCUIT
FIGURE 9B. MEASUREMENT POINTS
FIGURE 9. RECEIVER PROPAGATION DELAY AND DATA RATE
RE
B
A
R
1kΩ
RO
SIGNAL
GENERATOR
(Note 11)
VCC
SW
15pF
3V
RE
GND
1.5V
0V
tZH, tZH(SHDN)
PARAMETER
DE
1.5V
A
SW
tHZ
0
+1.5V
GND
tLZ
0
-1.5V
VCC
tZH (Note 10)
0
+1.5V
GND
tZL (Note 10)
0
-1.5V
VCC
tZH(SHDN) (Note 13)
0
+1.5V
GND
tZL(SHDN) (Note 13)
0
-1.5V
VCC
tHZ
OUTPUT HIGH
(Note 11)
VOH
VOH - 0.5V
1.5V
RO
0V
tZL, tZL(SHDN)
tLZ
(Note 11)
VCC
RO
1.5V
VOL + 0.5V
VOL
OUTPUT LOW
FIGURE 10A. TEST CIRCUIT
FIGURE 10B. MEASUREMENT POINTS
FIGURE 10. RECEIVER ENABLE AND DISABLE TIMES
Typical Performance Curves VCC = 5V, TA = +25°C; unless otherwise specified.
RD = 20Ω
80
3.6
RD = 30Ω
DIFFERENTIAL OUTPUT VOLTAGE (V)
DRIVER OUTPUT CURRENT (mA)
90
+25°C
70
RD = 54Ω
+85°C
60
50
40
RD = 100Ω
30
20
10
0
0
1
2
3
4
DIFFERENTIAL OUTPUT VOLTAGE (V)
FIGURE 11. DRIVER OUTPUT CURRENT vs DIFFERENTIAL
OUTPUT VOLTAGE
FN7786 Rev.6.00
Feb 8, 2019
5
3.4
RD = 100Ω
3.2
3.0
2.8
2.6
RD = 54Ω
2.4
2.2
-40
-25
0
25
50
TEMPERATURE (°C)
75
85
FIGURE 12. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs
TEMPERATURE
Page 11 of 22
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
Typical Performance Curves VCC = 5V, TA = +25°C; unless otherwise specified. (Continued)
2.45
2.40
RECEIVER OUTPUT CURRENT (mA)
70
DE = VCC, RE = X
2.35
ICC (mA)
2.30
2.25
DE = GND, RE = GND
2.20
2.15
2.10
2.05
2.00
-40
60
VOL, +25°C
50
40
30
20
10
0
-10
VOH, +85°C
-20
VOH, +25°C
-30
-25
0
25
50
TEMPERATURE (°C)
75
VOL, +85°C
0
85
1
2
3
4
RECEIVER OUTPUT VOLTAGE (V)
5
FIGURE 14. RECEIVER OUTPUT CURRENT vs RECEIVER OUTPUT
VOLTAGE
FIGURE 13. SUPPLY CURRENT vs TEMPERATURE
1000
150
VCC = 0V TO 5.5V
+85°C
800
Y OR Z = LOW
BUS PIN CURRENT (µA)
OUTPUT CURRENT (mA)
100
50
+25°C
0
-50
Y OR Z = HIGH
+25°C
-100
400
200
Y or Z
0
-200
-400
+85°C
-150
-60 -50 -40 -30 -20 -10
600
0
10
20
30
40
50
A/Y or B/Z
-600
-70 -60 -50 -40 -30 -20 -10 0
60
OUTPUT VOLTAGE (V)
FIGURE 16. BUS PIN CURRENT vs BUS PIN VOLTAGE
FIGURE 15. DRIVER OUTPUT CURRENT vs SHORT-CIRCUIT VOLTAGE
340
8
RD = 54Ω, CD = 50pF
335
RD = 54Ω, CD = 50pF
7
330
6
tPLH
325
SKEW (ns)
PROPAGATION DELAY (ns)
10 20 30 40 50 60 70
BUS PIN VOLTAGE (V)
320
315
tPHL
310
5
4
3
2
305
1
300
-40
0
-25
25
0
50
TEMPERATURE (°C)
75
FIGURE 17. DRIVER DIFFERENTIAL PROPAGATION DELAY vs
TEMPERATURE (ISL32490E, ISL32492E)
FN7786 Rev.6.00
Feb 8, 2019
85
|tPLH - tPHL|
-40
-25
0
50
25
TEMPERATURE (°C)
75
FIGURE 18. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE
(ISL32490E, ISL32492E)
Page 12 of 22
85
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
Typical Performance Curves VCC = 5V, TA = +25°C; unless otherwise specified. (Continued)
4.0
85
RD = 54Ω, CD = 50pF
RD = 54Ω, CD = 50pF
3.5
75
SKEW (ns)
PROPAGATION DELAY (ns)
80
70
tPLH
65
3.0
tPHL
60
2.5
55
50
-40
0
-25
25
50
75
2.0
-40
85
|tPLH - tPHL|
0
50
25
TEMPERATURE (°C)
-25
TEMPERATURE (°C)
FIGURE 19. DRIVER DIFFERENTIAL PROPAGATION DELAY vs
TEMPERATURE (ISL32493E, ISL32495E)
3.4
RD = 54Ω, CD = 50pF
RD = 54Ω, CD = 50pF
3.2
25
3.0
23
tPLH
21
19
2.6
2.4
tPHL
2.2
15
-40
2.0
-40
-25
25
0
50
TEMPERATURE (°C)
75
FIGURE 21. DRIVER DIFFERENTIAL PROPAGATION DELAY vs
TEMPERATURE (ISL32496E, ISL32498E)
5
0
-5
-10
-15
-20
-25
85
A
B
VID = ±1V
RO
RO
A
B
TIME (1µs/DIV)
FIGURE 23. RECEIVER PERFORMANCE WITH ±25V CMV
(ISL32490E, ISL32492E)
FN7786 Rev.6.00
Feb 8, 2019
|tPLH - tPHL|
0
50
25
TEMPERATURE (°C)
-25
75
FIGURE 22. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE
(ISL32496E, ISL32498E)
VOLTAGE (V)
VOLTAGE (V)
2.8
17
25
20
15
10
5
0
85
FIGURE 20. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE
(ISL32493E, ISL32495E)
SKEW (ns)
PROPAGATION DELAY (ns)
27
75
25
20
15
10
5
0
5
0
-5
-10
-15
-20
-25
A
B
VID = ±1V
RO
RO
A
B
TIME (400ns/DIV)
FIGURE 24. RECEIVER PERFORMANCE WITH ±25V CMV
(ISL32493E, ISL32495E)
Page 13 of 22
85
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
VID = ±1V
10
5
0
5
0
-5
-10
-15
-20
-25
DRIVER OUTPUT (V)
RO
RO
A
B
RD = 54Ω, CD = 50pF
DI
0
5
RO
0
3
2
1
0
-1
-2
-3
A/Y - B/Z
TIME (1µs/DIV)
TIME (20ns/DIV)
0
5
RO
3
2
1
0
-1
-2
-3
DRIVER OUTPUT (V)
0
DRIVER INPUT (V)
RECEIVER OUTPUT (V)
DRIVER OUTPUT (V)
DI
5
A/Y - B/Z
TIME (400ns/DIV)
FIGURE 27. DRIVER AND RECEIVER WAVEFORMS (ISL32493E,
ISL32495E)
Application Information
RS-485 and RS-422 are differential (balanced) data
transmission standards used for long haul or noisy environments.
RS-422 is a subset of RS-485, so RS-485 transceivers are also
RS-422 compliant. RS-422 is a point-to-multipoint (multidrop)
standard that allows only one driver and up to 10 receivers on
each bus, assuming one-unit load devices. RS-485 is a true
multipoint standard that allows up to 32 one-unit load devices
(any combination of drivers and receivers) on each bus. To allow
for multipoint operation, the RS-485 specification requires that
drivers must handle bus contention without sustaining any
damage.
Another important advantage of RS-485 is the extended
Common-Mode Range (CMR), which specifies that the driver
outputs and receiver inputs withstand signals that range from
+12V to -7V. RS-422 and RS-485 are intended for runs as long as
4000ft; thus, the wide CMR is necessary to handle ground
potential differences and voltages induced in the cable by
external fields.
FN7786 Rev.6.00
Feb 8, 2019
RECEIVER OUTPUT (V)
FIGURE 26. DRIVER AND RECEIVER WAVEFORMS (ISL32490E,
ISL32492E)
FIGURE 25. RECEIVER PERFORMANCE WITH ±25V CMV
(ISL32496E, ISL32498E)
RD = 54Ω, CD = 50pF
5
RD = 54Ω, CD = 50pF
DI
5
0
5
0
3
2
1
0
-1
-2
-3
RO
DRIVER INPUT (V)
B
DRIVER INPUT (V)
A
25
20
15
VOLTAGE (V)
RECEIVER OUTPUT (V)
Typical Performance Curves VCC = 5V, TA = +25°C; unless otherwise specified. (Continued)
A/Y - B/Z
TIME (20ns/DIV)
FIGURE 28. DRIVER AND RECEIVER WAVEFORMS (ISL32496E,
ISL32498E)
The ISL3249xE is a family of ruggedized RS-485 transceivers
that improves on the RS-485 basic requirements and increases
system reliability. The CMR increases to ±25V, while the RS-485
bus pins (receiver inputs and driver outputs) include fault
protection against voltages and transients up to ±60V.
Additionally, larger than required differential output voltages
(VOD) increase noise immunity, while the ±16.5kV built-in ESD
protection complements the fault protection.
Receiver (Rx) Features
These devices use a differential input receiver for maximum
noise immunity and CMR. Input sensitivity is greater than
±200mV as required by the RS-422 and RS-485 specifications.
The receiver input (load) current surpasses the RS-422
specification of 3mA and is four times lower than the RS-485
Unit Load (UL) requirement of 1mA maximum. Therefore, these
products are known as one-quarter UL transceivers, and there
can be up to 128 of these devices on a network while still
complying with the RS-485 loading specification.
Page 14 of 22
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
The receiver (Rx) functions with common-mode voltages as great
as ±25V, making them ideal for industrial or long networks
where induced voltages are a realistic concern.
All the receivers include a full fail-safe function that ensures a
high-level receiver output if the receiver inputs are unconnected
(floating), shorted together, or connected to a terminated bus
with all the transmitters disabled (that is, an idle bus).
Rx outputs feature high drive levels (typically 22mA at VOL = 1V) to
ease the design of optically coupled isolated interfaces.
Receivers easily meet the data rates supported by the
corresponding driver, and all receiver outputs are three-statable
using the active low RE input.
The Rx in the 250kbps and 1Mbps versions includes noise
filtering circuitry to reject high-frequency signals. The 1Mbps
version typically rejects pulses narrower than 50ns (equivalent to
20Mbps), while the 250kbps Rx rejects pulses below 150ns
(6.7Mbps).
Driver (Tx) Features
The RS-485/RS-422 driver is a differential output device that
delivers at least 1.5V across a 54Ω load (RS-485) and at least
2.4V across a 100Ω load (RS-422). The drivers feature low
propagation delay skew to maximize bit width and minimize EMI,
and all drivers are three-statable using the active high DE input.
The 250kbps and 1Mbps driver outputs are slew rate limited to
minimize EMI and reflections in unterminated or improperly
terminated networks. The ISL32496E and ISL32498E driver
outputs are not limited; thus, faster output transition times allow
data rates of at least 15Mbps.
High Overvoltage (Fault) Protection
Increases Ruggedness
Note: The available smaller pitch package (MSOP) may not meet
the Creepage and Clearance (C&C) requirements for ±60V levels.
Determine C&C requirements before selecting a package type.
The ±60V fault protection (referenced to the IC GND) on the
RS-485 pins makes these transceivers some of the most rugged
on the market. This level of protection makes the ISL3249xE
perfect for applications where power (such as 24V and 48V
supplies) must be routed in the conduit with the data lines, or for
outdoor applications where large transients are likely to occur.
When power is routed with the data lines, even a momentary
short between the supply and data lines destroys an unprotected
device. The ±60V fault levels of this family are at least five times
higher than the levels specified for standard RS-485 ICs. The
ISL3249xE protection is active whether the Tx is enabled or
disabled, and even if the IC is powered down, or VCC and Ground
are floating.
Widest Common-Mode Voltage (CMV)
Tolerance Improves Operating Range
RS-485 networks operating in industrial complexes or over long
distances are susceptible to large CMV variations. Either of these
operating environments can suffer from large node-to-node
ground potential differences or CMV pickup from external
electromagnetic sources, and devices with only the minimum
required +12V to -7V CMR can malfunction. The ISL3249xE’s
extended ±25V CMR is the widest available, allowing operation in
environments that would overwhelm lesser transceivers.
Additionally, the Rx does not phase invert (erroneously change
state), even with CMVs of ±40V or differential voltages as large
as 40V.
High VOD Improves Noise Immunity and
Flexibility
The ISL3249xE driver design delivers larger differential output
voltages (VOD) than the RS-485 standard requires or than most
RS-485 transmitters can deliver. The typical ±2.5V VOD provides
more noise immunity than networks built using many other
transceivers.
Another advantage of the large VOD is the ability to drive more
than two bus terminations, which allows for using the ISL3249xE
in star and other multi-terminated, nonstandard network
topologies. Figure 11 on page 11 details the transmitter’s VOD vs
IOUT characteristic and includes load lines for four (30Ω) and six
(20Ω) 120Ω terminations. Figure 11 shows that the driver
typically delivers ±1.3V into six terminations, and the “Electrical
Specifications” on page 5 ensures a VOD of ±0.8V at 21Ω across
the full temperature range. The RS-485 standard requires a
minimum 1.5V VOD into two terminations, but the ISL3249xE
devices deliver RS-485 voltage levels with two to three times the
number of terminations.
Hot Plug Function
When a piece of equipment powers up, there is a period of time
when the processor or ASIC driving the RS-485 control lines (DE,
RE) is unable to ensure that the RS-485 Tx and Rx outputs are
kept disabled. If the equipment is connected to the bus, a driver
activating prematurely during power-up may crash the bus. To
avoid this scenario, the ISL3249xE devices incorporate a hot plug
function. Circuitry monitoring VCC ensures that the Tx and Rx
outputs remain disabled during power-up and power-down if VCC
is less than ≈3.5V, regardless of the state of DE and RE. The
disabled Tx and Rx outputs allow the processor/ASIC to stabilize
and drive the RS-485 control lines to the proper states. Figure 29
illustrates the power-up and power-down performance of the
ISL3249xE compared to an RS-485 IC without the hot plug
feature.
If transients or voltages (including overshoots and ringing)
greater than ±60V are possible, additional external protection is
required.
FN7786 Rev.6.00
Feb 8, 2019
Page 15 of 22
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
RE = GND
3.5V
2.8V
2.5
VCC
0
5.0
RL = 1kΩ
2.5
0
A/Y
ISL3249xE
ISL83088E
RL = 1kΩ
RO
ISL3249xE
5.0
2.5
0
RECEIVER OUTPUT (V)
DRIVER Y OUTPUT (V)
5.0
VCC (V)
DE, DI = VCC
TIME (40µs/DIV)
FIGURE 29. HOT PLUG PERFORMANCE (ISL3249xE) vs ISL83088E
WITHOUT HOT PLUG CIRCUITRY
ESD Protection
All pins on these devices include Class 3 (>8kV) Human Body
Model (HBM) ESD protection structures that can survive ESD
events commonly seen during manufacturing. Even so, the
RS-485 pins (driver outputs and receiver inputs) incorporate
more advanced structures, allowing them to survive ESD events
in excess of ±16.5kV HBM (±15kV for the full-duplex versions).
The RS-485 pins are particularly vulnerable to ESD strikes
because they typically connect to an exposed port on the exterior
of the finished product. Touching the port pins or connecting a
cable can cause an ESD event that can destroy unprotected ICs.
The new ESD structures protect the device whether or not it is
powered up, and without interfering with the exceptional ±25V
CMR. The built-in ESD protection minimizes the need for
board-level protection structures (for example, transient
suppression diodes) and the associated undesirable capacitive
load they present.
Data Rate, Cables, and Terminations
RS-485 and RS-422 are intended for network lengths up to
4000ft, but the maximum system data rate decreases as the
transmission length increases. Devices operating at 15Mbps can
be used at lengths up to 150ft (46m), but the distance can be
increased to 328ft (100m) by operating at 10Mbps. The
ISL32493E and ISL32495E can operate at the full data rate of
1Mbps with lengths up to 800ft (244m). Jitter is the limiting
parameter at these faster data rates, so employing encoded data
streams (for example, Manchester coded or Return-to-Zero) can
allow increased transmission distances. The ISL32490E and
ISL32492E can operate at 115kbps or less at the full 4000ft
(1220m) distance, or at 250kbps for lengths up to 3000ft (915m).
DC cable attenuation is the limiting parameter, so using better
quality cables (such as 22 AWG) may allow increased transmission
distance.
Use a twisted pair cable for RS-485/RS-422 networks. Twisted
pair cables tend to pick up noise and other electromagnetically
induced voltages as common-mode signals that are effectively
rejected by the differential receivers in these ICs.
FN7786 Rev.6.00
Feb 8, 2019
Note: Proper termination is imperative to minimize reflections
when using the 15Mbps ISL32496E and ISL32498E devices.
Short networks using the 250kbps ISL32490E and ISL32492E
versions do not need to be terminated; however, terminations are
recommended unless power dissipation is an overriding concern.
In point-to-point or point-to-multipoint networks (single driver on
bus, such as RS-422), terminate the main cable in its
characteristic impedance (typically 120Ω) at the end farthest from
the driver. In multireceiver applications, keep stubs connecting
receivers to the main cable as short as possible. Multipoint
(multidriver) systems require that the main cable be terminated in
its characteristic impedance at both ends. Keep stubs connecting
a transceiver to the main cable as short as possible.
Built-in Driver Overload Protection
The RS-485 specification requires that drivers survive worst-case
bus contentions undamaged. These transceivers meet this
requirement using driver output short-circuit current limits and
on-chip thermal shutdown circuitry.
The driver output stages incorporate a double foldback,
short-circuit current limiting scheme, which ensures that the
output current never exceeds the RS-485 specification, even at
the common-mode and fault condition voltage range extremes.
The first foldback current level (≈70mA) is set to ensure that the
driver never folds back when driving loads with CMVs up to ±25V.
The very low second foldback current setting (≈9mA) minimizes
power dissipation if the Tx is enabled when a fault occurs.
In the event of a major short-circuit condition, the ISL3249xE’s
thermal shutdown feature disables the drivers whenever the die
temperature becomes excessive. Thermal shutdown eliminates
the power dissipation, allowing the die to cool. The drivers
automatically re-enable after the die temperature drops about
+15°C. If the contention persists, the thermal shutdown/re-enable
cycle repeats until the fault is cleared. Receivers stay operational
during thermal shutdown.
Low Power Shutdown Mode
These BiCMOS transceivers all use a fraction of the power
required by competitive devices, but they also include a
shutdown feature that reduces the already low quiescent ICC to a
10µA trickle. These devices enter shutdown whenever the
receiver and driver are simultaneously disabled (RE = VCC and
DE = GND) for a period of at least 600ns. Disabling both the
driver and the receiver for fewer than 60ns ensures that the
transceiver does not enter shutdown.
Receiver and driver enable times increase when the transceiver
enables from shutdown. See Notes 9 through 13 on page 9 for
more information.
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
PROCESS:
Si Gate BiCMOS
Page 16 of 22
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted.
Please visit our website to make sure you have the latest revision.
DATE
REVISION
Feb 8, 2019
FN7765.6
Updated links throughout document.
Updated ordering information table by adding all tape and reel information and updating notes.
Updated last sentence in the “High Overvoltage (Fault) Protection Increases Ruggedness” section.
Removed About Intersil section.
Updated disclaimer.
Sep 18, 2017
FN7765.5
Added Related Literature section.
Updated Receiving Truth Table on page 3.
Applied Intersil A Renesas Company template.
Apr 20, 2015
FN7786.4
DRIVER SWITCHING CHARACTERISTICS (250kbps Versions; ISL32490E, ISL32492E) Changed MAX limit
from “1200” to “1350” in “Driver Differential Rise or Fall Time” on page 6 that has -25V ≤ VCM ≤ 25V for
test condition.
DRIVER SWITCHING CHARACTERISTICS (1Mbps Versions; ISL32493E, ISL32495E) Changed MAX limit from
“400” to “550” in “Driver Differential Rise or Fall Time” on page 7 that has -25V ≤ VCM ≤ 25V for test
condition.
Oct 14, 2014
FN7786.3
On page 7, added “Note 17” reference to the Driver Differential Output Test condition.
On page 9, added Note 17, “This parameter is not production tested.”
On page 19 replaced M10.118 POD with latest revision.
Mar 7, 2012
FN7786.2
Updated Figure 16 on page 12 to show Pos breakdown between 60V and 70V.
Updated Theta JA in “Thermal Information” on page 5 for 8 Ld SOIC from 116 to 108.
Updated Package Outline Drawing on page 21. Changed Note 1 "1982" to "1994".
Nov 11, 2011
FN7786.1
Added 10 to “Pin Count” for ISL32490E, ISL32493E, ISL32496E in the Summary of Features table.
Added 10 Ld MSOP option for ISL32490E, ISL32493E, ISL32496E in the “Ordering Information” table.
Added 10 Ld MSOP pinout to “Pin Configurations” for ISL32490E, ISL32493E, ISL32496E.
Added 10 Ld Pin # column in the “Pin Description” table.
Added “(SOIC pin numbers shown)” in the “Typical Operating Circuits”.
Added 10 Ld MSOP information in the “Thermal Resistance” section.
Added 10 Ld MSOP package outline drawing.
M8.118 on page 18- Corrected lead width dimension in side view 1 from "0.25 - 0.036" to "0.25 - 0.36"
M8.15 on page 21- In Typical Recommended Land Pattern, changed the following:
2.41(0.095) to 2.20(0.087)
0.76 (0.030) to 0.60(0.023)
0.200 to 5.20(0.205)
Jan 18, 2011
FN7786.0
Initial release
FN7786 Rev.6.00
Feb 8, 2019
CHANGE
Page 17 of 22
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
Package Outline Drawings
For the most recent package outline drawing, see M8.118.
M8.118
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 7/11
5
3.0±0.05
A
DETAIL "X"
D
8
1.10 MAX
SIDE VIEW 2
0.09 - 0.20
4.9±0.15
3.0±0.05
5
0.95 REF
PIN# 1 ID
1
2
B
0.65 BSC
GAUGE
PLANE
TOP VIEW
0.55 ± 0.15
0.25
3°±3°
0.85±010
H
DETAIL "X"
C
SEATING PLANE
0.25 - 0.36
0.08 M C A-B D
0.10 ± 0.05
0.10 C
SIDE VIEW 1
(5.80)
NOTES:
(4.40)
(3.00)
1. Dimensions are in millimeters.
(0.65)
(0.40)
(1.40)
TYPICAL RECOMMENDED LAND PATTERN
FN7786 Rev.6.00
Feb 8, 2019
2. Dimensioning and tolerancing conform to JEDEC MO-187-AA
and AMSEY14.5m-1994.
3. Plastic or metal protrusions of 0.15mm max per side are not
included.
4. Plastic interlead protrusions of 0.15mm max per side are not
included.
5. Dimensions are measured at Datum Plane "H".
6. Dimensions in ( ) are for reference only.
Page 18 of 22
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
M10.118
For the most recent package outline drawing, see M10.118.
10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
Rev 1, 4/12
5
3.0±0.05
A
DETAIL "X"
D
10
1.10 MAX
SIDE VIEW 2
0.09 - 0.20
4.9±0.15
3.0±0.05
5
0.95 REF
PIN# 1 ID
1
2
0.50 BSC
B
GAUGE
PLANE
TOP VIEW
0.55 ± 0.15
0.25
3°±3°
0.85±010
H
DETAIL "X"
C
SEATING PLANE
0.18 - 0.27
0.08 M C A-B D
0.10 ± 0.05
0.10 C
SIDE VIEW 1
(5.80)
NOTES:
(4.40)
(3.00)
1. Dimensions are in millimeters.
2. Dimensioning and tolerancing conform to JEDEC MO-187-BA
and AMSEY14.5m-1994.
3. Plastic or metal protrusions of 0.15mm max per side are not
included.
4. Plastic interlead protrusions of 0.15mm max per side are not
included.
(0.50)
(0.29)
(1.40)
5. Dimensions are measured at Datum Plane "H".
6. Dimensions in ( ) are for reference only.
TYPICAL RECOMMENDED LAND PATTERN
FN7786 Rev.6.00
Feb 8, 2019
Page 19 of 22
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
M14.15
For the most recent package outline drawing, see M14.15.
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 1, 10/09
8.65
A 3
4
0.10 C A-B 2X
6
14
DETAIL"A"
8
0.22±0.03
D
6.0
3.9
4
0.10 C D 2X
0.20 C 2X
7
PIN NO.1
ID MARK
5
0.31-0.51
B 3
(0.35) x 45°
4° ± 4°
6
0.25 M C A-B D
TOP VIEW
0.10 C
1.75 MAX
H
1.25 MIN
0.25
GAUGE PLANE C
SEATING PLANE
0.10 C
0.10-0.25
1.27
SIDE VIEW
(1.27)
DETAIL "A"
(0.6)
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSEY14.5m-1994.
3. Datums A and B to be determined at Datum H.
(5.40)
4. Dimension does not include interlead flash or protrusions.
Interlead flash or protrusions shall not exceed 0.25mm per side.
5. The pin #1 indentifier may be either a mold or mark feature.
(1.50)
6. Does not include dambar protrusion. Allowable dambar protrusion
shall be 0.10mm total in excess of lead width at maximum condition.
7. Reference to JEDEC MS-012-AB.
TYPICAL RECOMMENDED LAND PATTERN
FN7786 Rev.6.00
Feb 8, 2019
Page 20 of 22
ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E
M8.15
For the most recent package outline drawing, see M8.15.
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 1/12
DETAIL "A"
1.27 (0.050)
0.40 (0.016)
INDEX
6.20 (0.244)
5.80 (0.228)
AREA
0.50 (0.20)
x 45°
0.25 (0.01)
4.00 (0.157)
3.80 (0.150)
1
2
8°
0°
3
0.25 (0.010)
0.19 (0.008)
SIDE VIEW “B”
TOP VIEW
2.20 (0.087)
SEATING PLANE
5.00 (0.197)
4.80 (0.189)
1.75 (0.069)
1.35 (0.053)
1
8
2
7
0.60 (0.023)
1.27 (0.050)
3
6
4
5
-C-
1.27 (0.050)
0.25(0.010)
0.10(0.004)
0.51(0.020)
0.33(0.013)
5.20(0.205)
SIDE VIEW “A
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
FN7786 Rev.6.00
Feb 8, 2019
Page 21 of 22
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