DATASHEET
ISL3259E
FN6587
Rev.2.00
Aug 31, 2017
±15kV ESD Protected, 100Mbps, 5V, PROFIBUS, Full Fail-Safe, RS-485/RS-422
Transceiver
The ISL3259E is a ±15kV IEC61000 ESD Protected, 5V
powered, single transceiver that meets both the RS-485 and
RS-422 standards for balanced communication. It also
features the larger output voltage and higher data rate (up to
100Mbps) required by high speed PROFIBUS applications. The
low bus currents (+220µA/-150µA) present a 1/5 unit load to
the RS-485 bus. This allows up to 160 transceivers on the
network without violating the RS-485 specification’s load limit,
and without using repeaters.
This transceiver requires a 5V supply, and delivers at least a 2.1V
differential output voltage. This translates into better noise
immunity (data integrity), longer reach, or the ability to drive up to
six 120Ω terminations in “star” or other non-standard bus
topologies.
SCSI applications benefit from the ISL3259E’s low receiver
and transmitter part-to-part skews. The ISL3259E is perfect for
high speed parallel applications requiring simultaneous
capture of large numbers of bits. The low bit-to-bit skew eases
the timing constraints on the data latching signal.
Features
• IEC61000 ESD protection on RS-485 I/O pins . . . . . . ±15kV
- Class 3 HBM ESD level on all other pins . . . . . . . . . . . >9kV
• Large differential VOUT . . . . . . . . . . . . . . . . . . . 2.8V into 54Ω
Better noise immunity, or drive up to 6 terminations
• Very high data rate. . . . . . . . . . . . . . . . . . . . . . up to 100Mbps
• 11/13ns (maximum) Tx/Rx propagation delays; 1.5ns
(maximum) skew
• 1/5 unit load allows up to 160 devices on the bus
• Full fail-safe (open, shorted, terminated/undriven) receiver
• High Rx IOL to drive opto-couplers for isolated applications
• Hot plug - Tx and Rx outputs remain three-state during
power-up
• Low quiescent supply current. . . . . . . . . . . . . . . . . . . . . . 4mA
• Low current shutdown mode . . . . . . . . . . . . . . . . . . . . . . . 1µA
• -7V to +12V common mode input voltage range
Receiver (Rx) inputs feature a “Full Fail-Safe” design, which
ensures a logic high Rx output if Rx inputs are floating,
shorted, or terminated but undriven. Rx outputs feature high
drive levels (typically >30mA @ VOL = 1V) to ease the design of
optically isolated interfaces.
• Three-State Rx and Tx outputs
Hot plug circuitry ensures that the Tx and Rx outputs remain in
a high impedance state while the power supply stabilizes.
• Pb-free (RoHS compliant)
Driver (Tx) outputs are short-circuit protected, even for voltages
exceeding the power supply voltage. Additionally, on-chip
thermal shutdown circuitry disables the Tx outputs to prevent
damage if power dissipation becomes excessive.
• Operates from a single +5V supply
• Current limiting and thermal shutdown for driver overload
protection
Applications
• PROFIBUS® DP and FMS networks
• SCSI “fast 40” drivers and receivers
• Motor controller/position encoder systems
Related Literature
• Factory automation
• For a full list of related documents, refer to our website
• Field bus networks
- ISL3259E product page
• Security networks
• Building environmental control systems
• Industrial/process control networks
FN6587 Rev.2.00
Aug 31, 2017
Page 1 of 17
ISL3259E
Ordering Information
PART NUMBER
(Note 3)
TEMP. RANGE
(°C)
PART MARKING
PACKAGE
(Pb-Free)
PKG. DWG. #
ISL3259EIBZ (Note 1)
3259 EIBZ
-40 to +85
8 Ld SOIC
M8.15
ISL3259EIUZ (Note 1)
3259Z
-40 to +85
8 Ld MSOP
M8.118
ISL3259EIRZ (Note 2)
3259
-40 to +85
10 Ld 3x3 DFN
L10.3x3C
NOTES:
1. Add “-T” suffix for 2.5k unit tape and reel options. Refer to TB347 for details on reel specifications.
2. Add “-T” suffix for 6k unit tape and reel options. Refer to TB347 for details on reel specifications.
3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin
plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pbfree products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
Pin Configuration
ISL3259E
(10 LD DFN)
TOP VIEW
ISL3259E
(8 LD MSOP, SOIC)
TOP VIEW
RO 1
8
VCC
RE 2
7
B/Z
DE 3
6
A/Y
5
GND
DI 4
R
D
Truth Table
RO
1
10 VCC
RE
2
9 NC
DE
3
8 B/Z
DI
4
7 A/Y
NC
5
6 GND
Truth Table
TRANSMITTING
RECEIVING
INPUTS
OUTPUTS
INPUTS
OUTPUT
RE
DE
DI
B/Z
A/Y
RE
DE
A-B
RO
X
1
1
0
1
0
0
VAB ≥-0.05V
1
X
1
0
1
0
0
0
-0.05V >VAB >-0.2V
Undetermined
0
0
X
High-Z
High-Z
0
0
VAB ≤ -0.2V
0
1
0
X
High-Z*
High-Z*
0
0
Inputs Open/Shorted
1
1
1
X
High-Z
1
0
X
High-Z*
NOTE: *Shutdown Mode
NOTE: *Shutdown Mode
FN6587 Rev.2.00
Aug 31, 2017
Page 2 of 17
ISL3259E
Pin Descriptions
PIN
FUNCTION
RO
Receiver output:
If A - B -50mV, RO is high.
If A - B -200mV, RO is low.
If A and B are unconnected (floating) or shorted, or connected to a terminated bus that is undriven, RO is high.
RE
Receiver output enable.
RO is enabled when RE is low.
RO is high impedance when RE is high.
If the Rx enable function isn’t required, connect RE directly to GND.
DE
Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is low. If the Tx enable
function isn’t required, connect DE to VCC through a 1k or greater resistor.
DI
Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low.
GND
Ground connection. This is also the potential of the DFN thermal pad.
A/Y
±15kV IEC61000 ESD Protected RS-485, RS-422 level, noninverting receiver input and noninverting driver output. Pin is an input (A) if DE
= 0; pin is an output (Y) if DE = 1.
B/Z
±15kV IEC61000 ESD Protected RS-485, RS-422 level, inverting receiver input and inverting driver output.
Pin is an input (B) if DE = 0.
Pin is an output (Z) if DE = 1.
VCC
System power supply input (4.75V to 5.25V).
NC
No Connection.
Typical Operating Circuit
ISL3259E
+5V
+5V
MSOP PIN NUMBERS SHOWN
+
8
0.1µF
0.1µF
+
8
VCC
1 RO
VCC
R
D
2 RE
B/Z
7
3 DE
A/Y
6
4 DI
FN6587 Rev.2.00
Aug 31, 2017
RT
RT
DI 4
7
B/Z
DE 3
6
A/Y
RE 2
R
D
GND
GND
5
5
RO 1
Page 3 of 17
ISL3259E
Absolute Maximum Ratings
Thermal Information
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input/Output Voltages
A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -9V to +13V
RO. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V)
Short-circuit Duration
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . Refer to “Electrical Specifications”
Thermal Resistance (Typical)
JA (°C/W)
105
8 Ld SOIC Package (Note 4). . . . . . . . . . . . . . . . . . . .
8 Ld MSOP Package (Note 4). . . . . . . . . . . . . . . . . . .
140
10 Ld DFN Package (Note 5) . . . . . . . . . . . . . . . . . . .
75
Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . .-65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493
Operating Conditions
Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTE:
4. JA is measured with the component mounted on a high-effective thermal conductivity test board in free air. Refer to TB379 for details.
5. JA is measured in free air with the component mounted on a high-effective thermal conductivity test board with “direct attach” features. Refer to
TB379 for details.
Electrical Specifications Test Conditions: VCC = 4.75V to 5.25V; unless otherwise specified. Typical values are at VCC = 5V, TA = +25°C,
(Note 6).
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(°C)
MIN
(Note 15)
TYP
MAX
(Note 15)
Full
-
-
VCC
UNITS
DC CHARACTERISTICS
Driver Differential VOUT
VOD
No Load
RL = 100Ω (RS-422) (Figure 1A)
Full
2.6
3.4
-
V
RL = 54Ω (RS-485) (Figure 1A)
Full
2.1
2.8
VCC
V
RL = 60Ω, -7V VCM 12V (Figure 1B)
Full
1.9
2.7
-
V
VOD
RL = 54Ω or 100Ω (Figure 1A)
Full
-
0.01
0.2
V
Driver Common-Mode VOUT
VOC
RL = 54Ω or 100Ω (Figure 1A)
Full
-
2
3
V
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
VOC
RL = 54Ω or 100Ω (Figure 1A)
Full
-
0.01
0.2
V
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
Logic Input High Voltage
VIH
DI, DE, RE
Full
2
-
-
V
Logic Input Low Voltage
VIL
DI, DE, RE
Full
-
-
0.8
V
Logic Input Current
IIN1
DI = DE = RE = 0V or VCC
Input Current (A/Y, B/Z)
IIN2
DE = 0V, VCC = 0V or
5.25V
Driver Short-Circuit Current,
VO = High or Low
IOSD1
Full
-2
-
2
µA
VIN = 12V
Full
-
-
220
µA
VIN = -7V
Full
-160
-
-
µA
Full
-
-
±250
mA
DE = VCC, -7V VY or VZ 12V (Note 8)
Differential Capacitance
CD
A/Y to B/Z
25
-
9
-
pF
Receiver Differential Threshold
Voltage
V TH
-7V VCM 12V
Full
-200
-
-50
mV
Receiver Input Hysteresis
V TH
VCM = 0V
25
-
28
-
mV
Receiver Output High Voltage
VOH
IO = -8mA, VID = -50mV
Full
VCC - 0.5
-
-
V
Receiver Output Low Voltage
VOL
IO = +10mA, VID = -200mV
Full
-
-
0.4
V
Receiver Output Low Current
IOL
VOL = 1V, VID = -200mV
Full
25
40
-
mA
Three-State (High Impedance)
Receiver Output Current
IOZR
0.4V VO 2.4V
Full
-1
0.015
1
µA
FN6587 Rev.2.00
Aug 31, 2017
Page 4 of 17
ISL3259E
Electrical Specifications Test Conditions: VCC = 4.75V to 5.25V; unless otherwise specified. Typical values are at VCC = 5V, TA = +25°C,
(Note 6). (Continued)
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(°C)
MIN
(Note 15)
TYP
MAX
(Note 15)
UNITS
Receiver Input Resistance
RIN
-7V VCM 12V
Full
54
80
-
kΩ
Receiver Short-Circuit Current
IOSR
0V VO VCC
Full
±20
-
±110
mA
DI = DE = 0V or VCC
Full
-
2.6
4
mA
DE = 0V, RE = VCC, DI = 0V or VCC
Full
-
0.05
1
µA
SUPPLY CURRENT
No-Load Supply Current (Note 7)
Shutdown Supply Current
ICC
ISHDN
ESD PERFORMANCE
RS-485 Pins (A/Y, B/Z)
IEC61000-4-2, Air-Gap Discharge Method
25
-
±15
-
kV
IEC61000-4-2, Contact Discharge Method
25
-
±8
-
kV
Human Body Model, From Bus Pins to GND
25
-
±16.5
-
kV
HBM, per MIL-STD-883 Method 3015
25
-
±9
-
kV
Machine Model
25
-
±400
-
V
VOD ±1.5V, RD = 54Ω, CL = 100pF (Figure 4)
Full
100
-
-
Mbps
tDD
RD = 54Ω, CD = 50pF (Figure 2)
Full
-
8
12
ns
Driver Differential Output Skew
tSKEW
RD = 54Ω, CD = 50pF (Figure 2)
Full
-
0.5
1.5
ns
Prop Delay Part-to-Part Skew
tSKP-P
RD = 54Ω, CD = 50pF (Figure 2), (Note 14)
Full
-
-
4
ns
Driver Differential Rise or Fall
Time
tR, tF
RD = 54Ω, CD = 50pF (Figure 2)
Full
2
5
8
ns
Driver Enable to Output High
tZH
RL = 110Ω, CL = 50pF, SW = GND (Figure 3),
(Note 9)
Full
-
13
20
ns
Driver Enable to Output Low
tZL
RL = 110Ω, CL = 50pF, SW = VCC (Figure 3),
(Note 9)
Full
-
11
20
ns
|tZH (Y or Z) - tZL (Z or Y)|
Full
-
2.5
-
ns
All Pins
DRIVER SWITCHING CHARACTERISTICS
Maximum Data Rate
Driver Differential Output Delay
Driver Enable Time Skew
fMAX
tENSKEW
Driver Disable from Output High
tHZ
RL = 110Ω, CL = 50pF, SW = GND (Figure 3)
Full
-
14
20
ns
Driver Disable from Output Low
tLZ
RL = 110Ω, CL = 50pF, SW = VCC (Figure 3)
Full
-
12
20
ns
|tHZ (Y or Z) - tLZ (Z or Y)|
Full
-
3
-
ns
(Note 11)
Full
60
-
600
ns
Full
-
-
1000
ns
RL = 110Ω, CL = 50pF, SW = VCC (Figure 3),
(Notes 11, 12)
Full
-
-
1000
ns
VID = ±1.5V
Full
100
-
-
Mbps
Full
-
9
13
ns
(Figure 5)
Full
-
0
1.5
ns
(Figure 5), (Note 14)
Full
-
-
4
ns
Driver Disable Time Skew
Time to Shutdown
tDISSKEW
tSHDN
Driver Enable from Shutdown to
Output High
tZH(SHDN) RL = 110Ω, CL = 50pF, SW = GND (Figure 3),
(Notes 11, 12)
Driver Enable from Shutdown to
Output Low
tZL(SHDN)
RECEIVER SWITCHING CHARACTERISTICS
Maximum Data Rate
Receiver Input to Output Delay
fMAX
tPLH, tPHL (Figure 5)
Receiver Skew | tPLH - tPHL |
tSKD
Prop Delay Part-to-Part Skew
tSKP-P
Receiver Enable to Output High
tZH
RL = 1kΩ, CL = 15pF, SW = GND (Figure 6),
(Note 10)
Full
-
-
12
ns
Receiver Enable to Output Low
tZL
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6),
(Note 10)
Full
-
-
12
ns
Receiver Disable from Output High
tHZ
RL = 1kΩ, CL = 15pF, SW = GND (Figure 6)
Full
-
-
12
ns
Receiver Disable from Output Low
tLZ
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6)
Full
-
-
12
ns
FN6587 Rev.2.00
Aug 31, 2017
Page 5 of 17
ISL3259E
Electrical Specifications Test Conditions: VCC = 4.75V to 5.25V; unless otherwise specified. Typical values are at VCC = 5V, TA = +25°C,
(Note 6). (Continued)
PARAMETER
SYMBOL
Time to Shutdown
tSHDN
TEST CONDITIONS
(Notes 11)
Receiver Enable from Shutdown to
Output High
tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6),
(Notes 11, 13)
Receiver Enable from Shutdown to
Output Low
tZL(SHDN)
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6),
(Notes 11, 13)
TEMP
(°C)
MIN
(Note 15)
TYP
MAX
(Note 15)
UNITS
Full
60
-
600
ns
Full
-
-
1000
ns
Full
-
-
1000
ns
NOTES:
6. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise
specified.
7. Supply current specification is valid for loaded drivers when DE = 0V.
8. Applies to peak current. See “Typical Performance Curves” starting on page 11 for more information.
9. Because of the shutdown feature, keep RE = 0 to prevent the device from entering SHDN.
10. Because of the shutdown feature, the RE signal high time must be short enough (typically 700ns to ensure that the device enters SHDN.
13. Set the RE signal high time >700ns to ensure that the device enters SHDN.
14. This is the part-to-part skew between any two units tested with identical test conditions (Temperature, VCC, etc.).
15. Parts are 100% tested at +25°C. Over-temperature limits are established by characterization and are not production tested.
Test Circuits and Waveforms
VCC
RL/2
DE
DI
VCC
Z
Z
DI
VOD
D
375Ω
DE
Y
Y
RL/2
FIGURE 1A. VOD AND VOC
VOD
D
RL = 60
VCM
-7V TO +12V
375Ω
VOC
FIGURE 1B. VOD WITH COMMON MODE LOAD
FIGURE 1. DC DRIVER TEST CIRCUITS
FN6587 Rev.2.00
Aug 31, 2017
Page 6 of 17
ISL3259E
Test Circuits and Waveforms (Continued)
3V
DI
1.5V
1.5V
0V
VCC
tPHL
tPLH
DE
Z
DI
RD
D
OUT (Z)
VOH
OUT (Y)
VOL
CD
Y
SIGNAL
GENERATOR
90%
DIFF OUT (Y - Z)
+VOD
90%
10%
10%
tR
-VOD
tF
SKEW = |tPLH - tPHL|
FIGURE 2A. TEST CIRCUIT
FIGURE 2B. MEASUREMENT POINTS
FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
DE
110Ω
Z
DI
VCC
D
SIGNAL
GENERATOR
SW
Y
GND
3V
50pF
DE
(NOTE 10)
1.5V
1.5V
0V
tZH, tZH(SHDN)
PARAMETER
OUTPUT
RE
DI
SW
tHZ
Y/Z
X
1/0
GND
tLZ
Y/Z
X
0/1
VCC
tZH
Y/Z
0 (Note 9)
1/0
GND
tZL
Y/Z
0 (Note 9)
0/1
VCC
tHZ(SHDN)
Y/Z
1 (Note 12)
1/0
GND
tLZ(SHDN)
Y/Z
1 (Note 12)
0/1
VCC
OUTPUT HIGH
(NOTE 10)
tHZ
VOH - 0.5V
50%
OUT (Y, Z)
VOH
0V
tZL, tZL(SHDN)
tLZ
(NOTE 10)
VCC
OUT (Y, Z)
50%
OUTPUT LOW
VOL + 0.5V V
OL
FIGURE 3B. MEASUREMENT POINTS
FIGURE 3A. TEST CIRCUIT
FIGURE 3. DRIVER ENABLE AND DISABLE TIMES
VCC
DE
+
Z
DI
54Ω
D
Y
SIGNAL
GENERATOR
VOD
CL
3V
DI
0V
-
CL
+VOD
DIFF OUT (Y - Z)
-VOD
FIGURE 4A. TEST CIRCUIT
0V
FIGURE 4B. MEASUREMENT POINTS
FIGURE 4. DRIVER DATA RATE
FN6587 Rev.2.00
Aug 31, 2017
Page 7 of 17
ISL3259E
Test Circuits and Waveforms (Continued)
+3V
RE
+1.5V
A
15pF
B
R
A
1.5V
1.5V
RO
0V
tPHL
tPLH
VCC
SIGNAL
GENERATOR
1.7V
RO
1.7V
0V
FIGURE 5A. TEST CIRCUIT
FIGURE 5B. MEASUREMENT POINTS
FIGURE 5. RECEIVER PROPAGATION DELAY
RE
GND
B
A
1kΩ
RO
R
VCC
SW
SIGNAL
GENERATOR
GND
15pF
(NOTE 10)
RE
3V
1.5V
1.5V
0V
PARAMETER
DE
A
SW
tHZ
0
+1.5V
GND
tLZ
0
-1.5V
VCC
tZH (Note 10)
0
+1.5V
GND
tZL (Note 10)
0
-1.5V
VCC
tHZ(SHDN) (Note 13)
0
+1.5V
GND
tLZ(SHDN) (Note 13)
0
-1.5V
VCC
FIGURE 6A. TEST CIRCUIT
tZH, tZH(SHDN)
(NOTE 10)
OUTPUT HIGH
tHZ
VOH - 0.5V
1.5V
RO
VOH
0V
tZL, tZL(SHDN)
tLZ
(NOTE 10)
VCC
RO
1.5V
OUTPUT LOW
VOL + 0.5V V
OL
FIGURE 6B. MEASUREMENT POINTS
FIGURE 6. RECEIVER ENABLE AND DISABLE TIMES
FN6587 Rev.2.00
Aug 31, 2017
Page 8 of 17
ISL3259E
Application Information
RS-485 and RS-422 are differential (balanced) data
transmission standards for use in long haul or noisy
environments. RS-422 is a subset of RS-485, so RS-485
transceivers are also RS-422 compliant. RS-422 is a
point-to-multipoint (multidrop) standard, which allows only one
driver and up to 10 receivers on each bus, assuming one unit
load devices. RS-485 is a true multipoint standard, which allows
up to 32 one unit load devices (any mix of drivers and receivers)
on each bus. To allow for multipoint operation, the RS-485
specification requires that drivers must handle bus contention
without sustaining any damage.
Another important advantage of RS-485 is the extended
Common Mode Range (CMR), which specifies that the driver
outputs and receiver inputs withstand signals that range from
+12V to -7V. RS-422 and RS-485 are intended for cable lengths
as long as 4000ft (~1200m), so the wide CMR is necessary to
handle ground potential differences, as well as voltages induced
in the cable by external fields.
Receiver (Rx) Features
This transceiver uses a differential input receiver for maximum
noise immunity and common mode rejection. Input sensitivity is
±200mV, as required by the RS-422 and RS-485 specifications.
Receiver inputs function with common mode voltages as great
as 7V outside the power supplies (that is, +12V and -7V), making
them ideal for long networks, or industrial environments, where
induced voltages are a realistic concern.
The receiver input resistance of 50kΩ surpasses the RS-422
specification of 4kΩ, and is five times the RS-485 “Unit Load”
(UL) requirement of 12kΩ minimum. Thus, the ISL3259E is
known as a “one-fifth UL” transceiver, and there can be up to 160
devices on the RS-485 bus while still complying with the RS-485
loading specification.
The receiver is a “full fail-safe” version that guarantees a high
level receiver output if the receiver inputs are unconnected
(floating), shorted together, or connected to a terminated bus
with all the transmitters disabled (terminated/undriven).
Rx outputs deliver large low state currents (typically >30mA) at
VOL = 1V, to ease the design of optically coupled isolated
networks.
Receivers easily meet the 100Mbps data rate supported by the
driver, and the receiver output is tri-statable using the active low
RE input.
Driver (Tx) Features
The RS-485/RS-422 driver is a differential output device that
delivers at least 2.1V across a 54Ω load (RS-485/
PROFIBUS), and at least 2.6V across a 100Ω load (RS-422) even
with VCC = 4.75V. The drivers feature low propagation delay skew
to maximize bit width, and to minimize EMI.
Driver outputs are not slew rate limited, so faster output
transition times allow data rates up to 100Mbps. Driver outputs
are tri-statable using the active high DE input.
FN6587 Rev.2.00
Aug 31, 2017
For parallel applications, bit-to-bit skews between any two
ISL3259E transmitter and receiver pairs are guaranteed to be no
worse than 8ns (4ns maximum for any two Tx, 4ns maximum for
any two Rx).
High VOD Improves Noise Immunity and Flexibility
The ISL3259E driver design delivers larger differential output
voltages (VOD) than the RS-485 standard requires, or than most
RS-485 transmitters can deliver. The minimum ±2.1V VOD
guarantees at least ±600mV more noise immunity than
networks built using standard 1.5V VOD transmitters.
Another advantage of the large VOD is the ability to drive more than
two bus terminations, which allows for use of the ISL3259E in “star”
and other multi-terminated, non-standard network topologies.
Figure 8 on page 11 details the transmitter’s VOD vs IOUT
characteristic, and includes load lines for four (30Ω) and six (20Ω)
120Ω terminations. The figure shows that the driver typically
delivers 1.9/1.5V into 4/6 terminations, even at +85°C. The RS-485
standard requires a minimum 1.5V VOD into two terminations, but
the ISL3259E typically delivers RS-485 voltage levels with 2x to 3x
the number of terminations.
ESD Protection
All pins on the ISL3259E include Class 3 (>9kV) Human Body
Model (HBM) ESD protection structures, but the RS-485 pins
(driver outputs and receiver inputs) incorporate advanced
structures allowing them to survive ESD events in excess of
±16.5kV HBM and ±15kV IEC61000-4-2. The RS-485 pins are
particularly vulnerable to ESD strikes because they typically
connect to an exposed port on the exterior of the finished
product. Simply touching the port pins, or connecting a cable,
can cause an ESD event that can destroy unprotected ICs. These
new ESD structures protect the device whether or not it is
powered up, and without degrading the RS-485 common mode
range of -7V to +12V. This built-in ESD protection eliminates the
need for board level protection structures (for example, transient
suppression diodes), and the associated, undesirable capacitive
load they present.
IEC61000-4-2 Testing
The IEC61000 test method applies to finished equipment, rather
than to an individual IC. Therefore, the pins most likely to suffer
an ESD event are those that are exposed to the outside world (the
RS-485 pins in this case), and the IC is tested in its typical
application configuration (power applied) rather than testing
each pin-to-pin combination. The IEC61000 standard’s lower
current limiting resistor coupled with the larger charge storage
capacitor yields a test that is much more severe than the HBM
test. The extra ESD protection built into this device’s RS-485 pins
allows the design of equipment meeting Level 4 criteria without
the need for additional board level protection on the RS-485 port.
AIR-GAP DISCHARGE TEST METHOD
For this test method, a charged probe tip moves toward the IC pin
until the voltage arcs to it. The current waveform delivered to the
IC pin depends on approach speed, humidity, temperature, etc,
so it is more difficult to obtain repeatable results. The ISL3259E
RS-485 pins withstand ±15kV air-gap discharges.
Page 9 of 17
ISL3259E
CONTACT DISCHARGE TEST METHOD
During the contact discharge test, the probe contacts the tested
pin before the probe tip is energized, thereby eliminating the
variables associated with the air-gap discharge. The result is a
more repeatable and predictable test, but equipment limits
prevent testing devices at voltages higher than ±9kV. The RS-485
pins of the ISL3259E survive ±8kV contact discharges.
Hot Plug Function
When a piece of equipment powers up, a period of time occurs in
which the processor or ASIC driving the RS-485 control lines (DE,
RE) is unable to ensure that the RS-485 Tx and Rx outputs are
kept disabled. If the equipment is connected to the bus, a driver
activating prematurely during power-up may crash the bus. To
avoid this scenario, the ISL3259E incorporates a hot plug
function. Circuitry monitoring VCC ensures that, during power-up and
power-down, the Tx and Rx outputs remain disabled, regardless of
the state of DE and RE, if VCC is less than ~3.2V. This gives the
processor/ASIC a chance to stabilize and drive the RS-485 control
lines to the proper states.
RE = GND
3.3V
3.1V
2.5
VCC
0
5.0
RL = 1k
2.5
0
A/Y
ISL3259E
RL = 1k
RO
ISL3259E
5.0
2.5
0
RECEIVER OUTPUT (V)
DRIVER Y OUTPUT (V)
5.0
VCC (V)
DE, DI = VCC
TIME (40s/DIV)
FIGURE 7. HOT PLUG PERFORMANCE (ISL3259E) vs ISL83088E
WITHOUT HOT PLUG CIRCUITRY
Data Rate, Cables, and Terminations
Twisted pair is the cable of choice for RS-485, RS-422, and
PROFIBUS networks. Twisted pair cables tend to pick up noise
and other electromagnetically induced voltages as common
mode signals, which are effectively rejected by the differential
receivers in these ICs.
According to guidelines in the RS-422 and PROFIBUS
specifications, networks operating at data rates in excess of
3Mbps should be limited to cable lengths of 100m (328 ft) or
less, and the PROFIBUS specification recommends that the more
expensive “Type A” (22AWG) cable be used. The ISL3259E’s large
differential output swing, fast transition times, and high drivecurrent output stages allow operation even at 100Mbps over
standard “CAT-5” cables up to 31m (100ft). Figures 16 and 17
detail the ISL3259E performance at this condition, with a 120Ω
termination resistor at both the driver and the receiver ends.
Note that the differential signal delivered to the receiver at the
end of the cable (A - B) still exceeds 1V, so even longer cables
FN6587 Rev.2.00
Aug 31, 2017
could be driven if lower noise margins are acceptable. Of course,
jitter or some other criteria may limit the network to shorter
cable lengths than those discussed here. If more noise margin is
desired, shorter cables may produce a larger receiver input
signal. Performance should be even better if using the “Type A”
cable.
The ISL3259E can also be used at slower data rates over longer
cables, but some limitations apply. The Rx is optimized for high
speed operation, so its output may glitch if the Rx input
differential transition times are too slow. Keeping the transition
times below 500ns, (which equates to the Tx driving a 1000ft
(305m) CAT-5 cable) yields excellent performance over the full
operating temperature range.
To minimize reflections, proper termination is imperative when
using this high data rate transceiver. In point-to-point, or
point-to-multipoint (single driver on bus) networks, the main cable
should be terminated in its characteristic impedance (typically
120Ω for “CAT-5”, and 220Ω for “Type A”) at the end farthest from
the driver. In multi-receiver applications, stubs connecting
receivers to the main cable should be kept as short as possible.
Multipoint (multi-driver) systems require that the main cable be
terminated in its characteristic impedance at both ends. Stubs
connecting a transceiver to the main cable should be kept as short
as possible.
Built-In Driver Overload Protection
As stated previously, the RS-485 specification requires that
drivers survive worst case bus contentions undamaged. These
transmitters meet this requirement using driver output short
circuit current limits, and on-chip thermal shutdown circuitry.
The driver output stages incorporate short circuit current limiting
circuitry, which ensures that the output current never exceeds the
RS-485 specification, even at the common mode voltage range
extremes. In the event of a major short circuit condition, the device
also includes a thermal shutdown feature that disables the drivers
whenever the die temperature becomes excessive. This eliminates
the power dissipation, allowing the die to cool. The drivers
automatically reenable after the die temperature drops about
+15 degrees. If the contention persists, the thermal
shutdown/re-enable cycle repeats until the fault is cleared.
Receivers stay operational during thermal shutdown.
Low Power Shutdown Mode
This BiCMOS transceiver uses a fraction of the power required by
its bipolar counterparts, but it also includes a shutdown feature
that reduces the already low quiescent ICC to a 50nA trickle. It
enters shutdown whenever the receiver and driver are
simultaneously disabled (RE = VCC and DE = GND) for a period of
at least 600ns. Disabling both the driver and the receiver for less
than 60ns guarantees that the transceiver will not enter
shutdown.
Note that receiver and driver enable times increase when the
transceiver enables from shutdown. Refer to Notes 9, 10, 11, 12,
and 13 in the “Electrical Specifications” section for more
information.
Page 10 of 17
ISL3259E
Typical Performance Curves VCC = 5V, TA = +25°C; Unless Otherwise Specified
DRIVER OUTPUT CURRENT (mA)
90
RD = 30Ω
+85°C
80
3.5
RD = 20Ω
+25°C
DIFFERENTIAL OUTPUT VOLTAGE (V)
110
100
70
RD = 54Ω
60
50
40
RD = 100Ω
30
20
10
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
DIFFERENTIAL OUTPUT VOLTAGE (V)
4.5
3.4
3.2
3.1
3.0
2.9
2.8
2.7
RD = 54Ω
2.6
2.5
-40
5.0
-15
10
35
60
85
TEMPERATURE (°C)
FIGURE 9. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs
TEMPERATURE
FIGURE 8. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT
VOLTAGE
2.55
200
150
2.50
Y OR Z = LOW
100
ICC (mA)
OUTPUT CURRENT (mA)
RD = 100Ω
3.3
50
0
2.45
2.40
-50
2.35
Y OR Z = HIGH
-100
-150
-7 -6
-4
-2
0
2
4
6
OUTPUT VOLTAGE (V)
8
10
2.30
-40
12
-15
10
35
60
85
TEMPERATURE (°C)
FIGURE 11. SUPPLY CURRENT vs TEMPERATURE
FIGURE 10. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT
VOLTAGE
9.0
0.9
8.8
|tPLH - tPHL|
0.8
8.6
8.4
0.7
8.2
SKEW (ns)
PROPAGATION DELAY (ns)
DE = VCC, RE = X OR DE = GND, RE = GND
tPHL
8.0
7.8
0.6
0.5
7.6
tPLH
7.4
0.4
7.2
7.0
-40
-15
10
35
60
TEMPERATURE (°C)
FIGURE 12. DRIVER DIFFERENTIAL PROPAGATION DELAY vs
TEMPERATURE
FN6587 Rev.2.00
Aug 31, 2017
85
0.3
-40
-15
10
35
TEMPERATURE (°C)
60
FIGURE 13. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE
Page 11 of 17
85
ISL3259E
RO
0
3
2
1
0
-1
DI
Y-Z
-2
-3
0
5
RO
0
3
2
1
0
-1
Y-Z
-2
-3
TIME (5ns/DIV)
TIME (5ns/DIV)
FIGURE 15. DRIVER AND RECEIVER WAVEFORMS
0
5.0
RO
0
3.0
1.5
A-B
0
-1.5
-3.0
TIME (20ns/DIV)
FIGURE 16. WORST CASE (NEGATIVE) SINGLE PULSE DRIVER AND
RECEIVER WAVEFORMS DRIVING 100 FEET (31
METERS) OF CAT5 CABLE (DOUBLE TERMINATED
WITH 120Ω)
FN6587 Rev.2.00
Aug 31, 2017
VCC = 4.75V
T = +85°C
DI = 100Mbps
5
0
5.0
0
RO
(~150ns)
RECEIVER INPUT (V)
DRIVER + CABLE DELAY
RECEIVER INPUT (V)
5
RECEIVER OUTPUT (V)
VCC = 4.75V
T = +85°C
DRIVER INPUT (V)
RECEIVER OUTPUT (V)
FIGURE 14. DRIVER AND RECEIVER WAVEFORMS
DI = 100Mbps
5
DRIVER + CABLE DELAY
3.0
DRIVER INPUT (V)
5
RDIFF = 54Ω, CD = 50pF
DRIVER INPUT (V)
0
RECEIVER OUTPUT (V)
DI
5
DRIVER INPUT (V)
RDIFF = 54Ω, CD = 50pF
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
RECEIVER OUTPUT (V)
Typical Performance Curves VCC = 5V, TA = +25°C; Unless Otherwise Specified
(~150ns)
1.5
0
A-B
-1.5
-3.0
TIME (20ns/DIV)
FIGURE 17. DRIVER AND RECEIVER SEVEN PULSE WAVEFORMS
DRIVING 100 FEET (31 METERS) OF CAT5 CABLE
(DOUBLE TERMINATED WITH 120Ω)
Page 12 of 17
ISL3259E
Typical Performance Curves VCC = 5V, TA = +25°C; Unless Otherwise Specified
Die Characteristics
RECEIVER OUTPUT CURRENT (mA)
70
SUBSTRATE AND DFN THERMAL PAD POTENTIAL
(POWERED UP)
VOL, +25°C
60
VOH, +25°C
VOL, +85°C
GND
50
TRANSISTOR COUNT
40
VOH, +85°C
768
30
PROCESS
Si Gate BiCMOS
20
10
0
0
1
2
3
4
5
RECEIVER OUTPUT VOLTAGE (V)
FIGURE 18. RECEIVER OUTPUT CURRENT vs RECEIVER OUTPUT
VOLTAGE
FN6587 Rev.2.00
Aug 31, 2017
Page 13 of 17
ISL3259E
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted.
Please visit our website to make sure you have the latest revision.
DATE
REVISION
CHANGE
Aug 31, 2017
FN6587.2
Added Related Literature section.
Added VAB information to Receiving Truth Table on page 2.
Applied new header/footer.
Feb 18, 2008
FN6587.1
Initial release
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing, and high-end consumer markets.
For the most updated datasheet, application notes, related documentation, and related parts, see the respective product information
page found at www.intersil.com.
For a listing of definitions and abbreviations of common terms used in our documents, visit www.intersil.com/glossary.
You can report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask.
Reliability reports are also available from our website at www.intersil.com/support.
© Copyright Intersil Americas LLC 2008-2017. All Rights Reserved.
All trademarks and registered trademarks are the property of their respective owners.
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its
subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6587 Rev.2.00
Aug 31, 2017
Page 14 of 17
ISL3259E
Package Outline Drawing
For the most recent package outline drawing, see M8.118.
M8.118
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 7/11
5
3.0±0.05
A
DETAIL "X"
D
8
1.10 MAX
SIDE VIEW 2
0.09 - 0.20
4.9±0.15
3.0±0.05
5
0.95 REF
PIN# 1 ID
1
2
B
0.65 BSC
GAUGE
PLANE
TOP VIEW
0.55 ± 0.15
0.25
3°±3°
0.85±010
H
DETAIL "X"
C
SEATING PLANE
0.25 - 0.36
0.08 M C A-B D
0.10 ± 0.05
0.10 C
SIDE VIEW 1
(5.80)
NOTES:
(4.40)
(3.00)
1. Dimensions are in millimeters.
(0.65)
(0.40)
(1.40)
TYPICAL RECOMMENDED LAND PATTERN
FN6587 Rev.2.00
Aug 31, 2017
2. Dimensioning and tolerancing conform to JEDEC MO-187-AA
and AMSEY14.5m-1994.
3. Plastic or metal protrusions of 0.15mm max per side are not
included.
4. Plastic interlead protrusions of 0.15mm max per side are not
included.
5. Dimensions are measured at Datum Plane "H".
6. Dimensions in ( ) are for reference only.
Page 15 of 17
ISL3259E
Package Outline Drawing
For the most recent package outline drawing, see L10.3x3C.
L10.3x3C
10 LEAD DUAL FLAT PACKAGE (DFN)
Rev 4, 3/15
3.00
5
PIN #1 INDEX AREA
A
B
10
5
PIN 1
INDEX AREA
1
2.38
3.00
0.50
2
10 x 0.25
6
(4X)
0.10 C B
1.64
TOP VIEW
10x 0.40
BOTTOM VIEW
(4X)
0.10 M C B
SEE DETAIL "X"
(10 x 0.60)
(10x 0.25)
0.90
MAX
0.10 C
BASE PLANE
2.38
0.20
C
SEATING PLANE
0.08 C
SIDE VIEW
(8x 0.50)
1.64
2.80 TYP
C
TYPICAL RECOMMENDED LAND PATTERN
0.20 REF
4
0.05
DETAIL "X"
NOTES:
FN6587 Rev.2.00
Aug 31, 2017
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Tiebar shown (if present) is a non-functional feature and may be
located on any of the 4 sides (or ends).
5.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
6.
Compliant to JEDEC MO-229-WEED-3 except for E-PAD
dimensions.
Page 16 of 17
ISL3259E
Package Outline Drawing
For the most recent package outline drawing, see M8.15.
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 1/12
DETAIL "A"
1.27 (0.050)
0.40 (0.016)
INDEX
6.20 (0.244)
5.80 (0.228)
AREA
0.50 (0.20)
x 45°
0.25 (0.01)
4.00 (0.157)
3.80 (0.150)
1
2
8°
0°
3
0.25 (0.010)
0.19 (0.008)
SIDE VIEW “B”
TOP VIEW
2.20 (0.087)
SEATING PLANE
5.00 (0.197)
4.80 (0.189)
1.75 (0.069)
1.35 (0.053)
1
8
2
7
0.60 (0.023)
1.27 (0.050)
3
6
4
5
-C-
1.27 (0.050)
0.51(0.020)
0.33(0.013)
SIDE VIEW “A
0.25(0.010)
0.10(0.004)
5.20(0.205)
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
16. Dimensioning and tolerancing per ANSI Y14.5M-1994.
17. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
18. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
19. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
20. Terminal numbers are shown for reference only.
21. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
22. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
23. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
FN6587 Rev.2.00
Aug 31, 2017
Page 17 of 17
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