ISL32614EMHZ-T

DATASHEET ISL32613E, ISL32614E FN7906 Rev.4.01 Sep 27, 2019 ±16.5kV ESD Protected, +125°C, 1.8V to 3.6V, Low Power, SOT-23, RS-485/RS-422 Transmitters The ISL32613E and ISL32614E are ±16.5kV HBM ESD protected (7kV IEC61000 contact), 1.8V powered, single transmitters for differential communication. These drivers have very low bus currents (±40µA), so they present less than a 1/8 unit load to the bus. The low bus currents allow more than 256 transmitters on the network without violating the RS-485 specification’s 32 unit load maximum and without using repeaters. Features Hot plug circuitry ensures that the Tx outputs remain in a high impedance state while the power supply stabilizes. • Specified for +125°C Both ICs use slew rate limited drivers, which reduce EMI and minimize reflections from improperly terminated transmission lines or unterminated stubs in multidrop and multipoint applications. The ISL32613E is more slew rate limited for data rates up to 128kbps, while the less limited ISL32614E is useful for data rates up to 256kbps. • Low Tx leakage allows >256 devices on the bus For companion low power single RS-485 receivers, see the ISL32610E datasheet. • Pb-Free (RoHS Compliant) Related Literature Applications For a full list of related documents, visit our website: • Industrial/process control networks • Wide supply voltage range . . . . . . . . . . . . . . . . . . 1.8V to 3.6V • Low quiescent supply current. . . . . . . . . . . . . . . . 80µA (max) - Very low shutdown supply current . . . . . . . . . . . 2µA (max) • High ESD protection on RS-485 outputs . . . . ±16.5kV HBM - Class 3 ESD level on all other pins. . . . . . . . . . . >8kV HBM • Hot plug - Tx outputs remain three-state during power-up • Slew rate limited for data rates up to 256kbps • Current limiting and thermal shutdown for driver overload protection • 5V tolerant logic inputs • Space-constrained systems • ISL32613E and ISL32614E device pages • Factory automation • Building environmental control/lighting systems 10m Truth Table RD = ∞, CD = 50pF TRANSMITTING INPUTS DYNAMIC (128kbps) ICC (A) 1m STATIC 100µ OUTPUTS DE (Note 9) DI Z Y 1 1 0 1 1 0 1 0 0 X High-Z * High-Z * NOTE: *Shutdown Mode 10µ 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 VCC (V) FIGURE 1. ISL32613E WITH VCC = 1.8V REDUCES OPERATING ICC BY A FACTOR OF 177 COMPARED WITH ICC AT VCC = 3.6V FN7906 Rev.4.01 Sep 27, 2019 Page 1 of 12 ISL32613E, ISL32614E Typical Operating Circuits 1. 8V 1. 8V 100nF 1 100nF 2 VCC 3 RO 1k VCC A 5 6 Y B 4 4 Z DI 1 DE 3 GND GND 2 5 ISL32610E ISL32613E FIGURE 2. POINT-TO-POINT LINK WITH FIXED ENABLE-PINS 1.8V 1 VCC 10k 1.8V 100nF 100nF 5.6k A 6 3 RO 5 RE 6 Y B 4 GND 2 2 VCC DI 1 4 Z 5.6k ISL32611E DE 3 GND 5 ISL32613E FIGURE 3. POINT-TO-POINT LINK WITH PROGRAMMABLE ENABLE-PINS FN7906 Rev.4.01 Sep 27, 2019 Page 2 of 12 ISL32613E, ISL32614E Ordering Information PART MARKING (Note 4) PART NUMBER (Notes 2, 3) TEMP RANGE (°C) TAPE AND REEL (UNITS) (Note 1) PACKAGE (RoHS Compliant) PKG. DWG. # ISL32613EFHZ-T 613F -40 to +125 3k 6 Ld SOT-23 P6.064 ISL32613EFHZ-T7A 613F -40 to +125 250 6 Ld SOT-23 P6.064 ISL32614EFHZ-T 614F -40 to +125 3k 6 Ld SOT-23 P6.064 ISL32614EFHZ-T7A 614F -40 to +125 250 6 Ld SOT-23 P6.064 NOTES: 1. See TB347 for details about reel specifications. 2. These Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), see the ISL32613E and ISL32614E device pages. For more information about MSL, see TB363. 4. SOT-23 “PART MARKING” is branded on the bottom side. NOTES: TABLE 1. SUMMARY OF FEATURES AT VCC = 1.8V PART NUMBER FUNCTION DATA RATE (kbps) SLEW-RATE LIMITED? HOT PLUG? TX ENABLED? (Note 9) MAXIMUM QUIESCENT ICC (µA) LOW POWER SHUTDOWN? PIN COUNT ISL32613E 1 Tx 128 Yes Yes Yes 80 Yes 6 Ld SOT ISL32614E 1 Tx 256 Yes Yes Yes 80 Yes 6 Ld SOT Pin Configuration 6 LD SOT-23 TOP VIEW DI 1 VCC 2 DE 3 6 Y D 5 GND 4 Z Pin Descriptions PIN # PIN NAME 1 DI 2 VCC System power supply input (1.8V to 3.6V). 3 DE Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high, and are high impedance when DE is low. If the driver enable function is not needed, connect DE to VCC through a 1kΩ to 2kΩ resistor. 4 Z 5 GND 6 Y FN7906 Rev.4.01 Sep 27, 2019 FUNCTION Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. ±16.5kV HBM, ±7kV IEC61000 (contact method) ESD protected inverting differential transmitter output. Ground connection. ±16.5kV HBM, ±7kV IEC61000 (contact method) ESD protected noninverting differential transmitter output. Page 3 of 12 ISL32613E, ISL32614E Absolute Maximum Ratings Thermal Information VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Input Voltages DI, DE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Output Voltages Y, Z (VCC = 0V or ≥ 2.7V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V Y, Z (VCC = 1.8V, Output Enabled) . . . . . . . . . . . . . . . . . . . . . . . -8V to +3V Y, Z (VCC = 1.8V, Output Disabled) . . . . . . . . . . . . . . . . . . . . . . -8V to +8V Short Circuit Duration Y, Z. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indefinite ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see “ESD PERFORMANCE” Latch-Up (per JESD78, Level 2, Class A). . . . . . . . . . . . . . . . . . . . . . +125°C JA (°C/W) JC (°C/W) Thermal Resistance (Typical) 6 Ld SOT-23 Package (Notes 5, 6). . . . . . . . 177 95 Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . . . . . -65°C to +150°C Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .see TB493 Recommended Operating Conditions Supply Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.8V to 3.3V Common-Mode Range; VCC = 1.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2V VCC ≥ 2.7V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -7V to +12V Temperature Range (F Suffix) . . . . . . . . . . . . . . . . . . . . . -40°C to +125°C Differential Load (RD); VCC = 1.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . ≥10kΩ VCC ≥ 2.7V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≥60Ω CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions can adversely impact product reliability and result in failures not covered by warranty. NOTES: 5. JA is measured with the component mounted on a high-effective thermal conductivity test board in free air. See TB379 for details. 6. For JC, the “case temp” location is taken at the package top center. Electrical Specifications operating temperature range. (Note 7) PARAMETER VCC = 1.8V; typical values are at TA = +25°C; unless otherwise specified. Boldface limits apply across the SYMBOL TEST CONDITIONS TEMP MIN (°C) (Note 10) TYP MAX (Note 10) UNIT DC CHARACTERISTICS Driver Differential VOUT Change in Magnitude of Driver Differential VOUT for Complementary Output States Driver Common-Mode VOUT Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States Logic Input High Voltage (DI, DE) Logic Input Low Voltage (DI, DE) VOD VCC = 1.8V Full 0.8 0.92 - V VCC ≥ 3.15V Full 2 - - V RL = 54Ω (Figure 4), VCC ≥ 3V Full 1.5 - - V No Load Full 1.1 1.45 VCC V VOD RL = 100Ω (Figure 4) Full - 0.01 0.2 V V0C RL = 100Ω (Figure 4) Full - 1.1 1.4 V VOC RL = 100Ω (Figure 4) Full - 0.01 0.2 V VCC = 1.8V Full 1.26 - - V 2.7V ≤ VCC ≤ 3.6V Full 2.2 - - V VCC = 1.8V Full - - 0.4 V 2.7V ≤ VCC ≤ 3.6V Full - - 0.8 V VIH VIL RL = 100Ω (Figure 4) Logic Input Current IIN DI = DE = 0V or VCC (Note 9) Full -2 - 2 µA Output Leakage Current (Y, Z, Note 9) IOZ DE = 0V, VCC = 0V or 1.8V, or 3.6V Full - 0.1 30 µA Driver Short-Circuit Current, VO = High or Low (Note 8) IOS VO = 7V at VCC = 1.8V VO = 12V at VCC = 3.6V Full - 0.1 40 µA VO = -7V Full -40 -8 - µA VCC = 1.8V, DE = VCC, -2V ≤ VO ≤ 2V Full - - ±250 mA VCC ≥ 2.7V, DE = VCC, -7V ≤ VO ≤ 12V Full - ±150 - mA DE = VCC = 1.8V, DI = 0V or VCC Full - 20 80 µA DE = VCC, 2.7V ≤ VCC ≤ 3.6V, DI = 0V or VCC Full - 100 150 µA SUPPLY CURRENT No-Load Supply Current FN7906 Rev.4.01 Sep 27, 2019 ICC Page 4 of 12 ISL32613E, ISL32614E Electrical Specifications VCC = 1.8V; typical values are at TA = +25°C; unless otherwise specified. Boldface limits apply across the operating temperature range. (Note 7) (Continued) PARAMETER Shutdown Supply Current SYMBOL ISHDN TEST CONDITIONS TEMP MIN (°C) (Note 10) TYP MAX (Note 10) UNIT 1.8V ≤ VCC ≤ 3.6V, DE = 0V, DI = 0V or VCC Full - 0.01 2 µA Human Body Model, from bus pins to GND 25 - ±16.5 - kV IEC61000 Contact, from bus pins to GND 25 - ±7 - kV HBM, per MIL-STD-883 Method 3015 25 - ±8 - kV Machine Model 25 - ±400 - V VCC = 1.8V Full 128 - - kbps 3V ≤ VCC ≤ 3.6V Full 256 - - kbps VCC = 1.8V Full - 1700 2600 ns 3V ≤ VCC ≤ 3.6V Full - 1100 1500 ns VCC = 1.8V Full - 30 200 ns 3V ≤ VCC ≤ 3.6V Full - 2 30 ns VCC = 1.8V Full - 1600 2600 ns ESD PERFORMANCE RS-485 Pins (Y, Z) All Pins DRIVER SWITCHING CHARACTERISTICS (ISL32613E, 128kbps Version) Maximum Data Rate Driver Differential Output Delay Driver Differential Output Skew Driver Differential Rise or Fall Time fMAX tDD tDSK tR, tF CD = 50pF (Figure 5) CD = 50pF (Figure 5) CD = 50pF (Figure 5) 3V ≤ VCC ≤ 3.6V Full 400 960 1500 ns Driver Enable to Output High tZH RL = 500Ω, CL = 50pF, SW = GND (Figure 6) Full - 460 800 ns Driver Enable to Output Low tZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 6) Full - 460 800 ns Driver Disable from Output High tHZ RL = 500Ω, CL = 50pF, SW = GND (Figure 6) Full - 60 250 ns Driver Disable from Output Low tLZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 6) Full - 60 250 ns VCC = 1.8V Full 256 - - kbps 3V ≤ VCC ≤ 3.6V Full 500 - - kbps RD = ∞, CD = 50pF (Figure 5) VCC = 1.8V Full - 700 2000 ns 3V ≤ VCC ≤ 3.6V Full - 350 500 ns RD = ∞, CD = 50pF (Figure 5) VCC = 1.8V Full - 30 200 ns 3V ≤ VCC ≤ 3.6V Full - 2 30 ns VCC = 1.8V Full - 1700 2600 ns 3V ≤ VCC ≤ 3.6V Full 200 350 800 ns DRIVER SWITCHING CHARACTERISTICS (ISL32614E, 256kbps Version) Maximum Data Rate Driver Differential Output Delay Driver Differential Output Skew Driver Differential Rise or Fall Time fMAX tDD tDSK tR, tF RD = ∞, CD = 50pF RD = ∞, CD = 50pF (Figure 5) Driver Enable to Output High tZH RL = 500Ω, CL = 50pF, SW = GND (Figure 6) Full - 460 800 ns Driver Enable to Output Low tZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 6) Full - 460 800 ns Driver Disable from Output High tHZ RL = 500Ω, CL = 50pF, SW = GND (Figure 6) Full - 60 250 ns Driver Disable from Output Low tLZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 6) Full - 60 250 ns NOTES: 7. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 8. Applies to peak current. See “Typical Performance Curves” on page 7 for more information. 9. If the Driver Enable function is not needed, connect DE to VCC through a 1kΩ to 2kΩ resistor. 10. Compliance to datasheet limits is assured by one or more methods: production test, characterization, and/or design. FN7906 Rev.4.01 Sep 27, 2019 Page 5 of 12 ISL32613E, ISL32614E Test Circuits and Waveforms VCC RL/2 DE Z DI VOD D Y RL/2 VOC FIGURE 4. DC DRIVER TEST CIRCUITS VCC DI 50% 50% 0V tSD2 tSD1 DE VCC Z DI VOH OUT (Z) RD D 50% CD 50% VOL OUT (Y) Y tDDHL tDDLH SIGNAL GENERATOR DIFF OUT (Y - Z) 90% 50% 10% tR -VOD tF tDSK = |tDDLH - tDDHL| tSSK = |tSD1(Y) - tSD2(Y)| OR |tSD1(Z) - tSD2(Z)| FIGURE 5A. TEST CIRCUIT +VOD 90% 50% 10% FIGURE 5B. MEASUREMENT POINTS FIGURE 5. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DE VCC Z DI 500Ω D SIGNAL GENERATOR VCC SW Y DE 50% 50% 0V GND 50pF tZH tHZ OUTPUT HIGH PARAMETER OUTPUT DI SW tHZ Y/Z 1/0 GND tLZ Y/Z 0/1 VCC tZH Y/Z 1/0 GND tZL Y/Z 0/1 FIGURE 6A. TEST CIRCUIT VOH - 0.25V 50% OUT (Y, Z) VOH 0V tLZ tZL VCC OUT (Y, Z) 50% OUTPUT LOW VCC VOL + 0.25V V OL FIGURE 6B. MEASUREMENT POINTS FIGURE 6. DRIVER ENABLE AND DISABLE TIMES FN7906 Rev.4.01 Sep 27, 2019 Page 6 of 12 ISL32613E, ISL32614E Typical Performance Curves VCC = 1.8V, TA = +25°C; unless otherwise specified. 22 60 DE = VCC 18 50 -40°C 16 14 40 +125°C 12 ICC (µA) DRIVER OUTPUT CURRENT (mA) 20 RD = 120Ω 10 8 10 4 +25°C 2 0 20 +85°C 6 30 0 0.2 RD = 1kΩ 0.4 0.6 0.8 1.0 1.2 1.4 DIFFERENTIAL OUTPUT VOLTAGE (V) 1.6 0 -40 1.8 10 35 60 85 110 125 TEMPERATURE (°C) FIGURE 7. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE 10m -15 FIGURE 8. STATIC SUPPLY CURRENT vs TEMPERATURE 10m RD = ∞, CD = 50pF RD = ∞, CD = 50pF 128kbps 128kbps 256kbps 1m 1m 100µ 56kbps ICC (A) ICC (A) 56kbps 100µ 9.6kbps 9.6kbps 10µ 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 10µ 1.8 3.6 2.0 2.2 2.4 VCC (V) 2.6 2.8 3.0 3.2 3.4 VCC (V) FIGURE 9. ISL32613E DYNAMIC SUPPLY CURRENT vs SUPPLY VOLTAGE AT DIFFERENT DATA RATES FIGURE 10. ISL32614E DYNAMIC SUPPLY CURRENT vs SUPPLY VOLTAGE AT DIFFERENT DATA RATES 110 100 OUTPUT CURRENT (mA) 90 -40°C 80 70 60 +25°C 50 40 30 +125°C 20 10 0 -10 Y OR Z = LOW +125°C -20 Y OR Z = HIGH -30 -2.0 -1.5 -1.0 -0.5 0 0.5 OUTPUT VOLTAGE (V) 1.0 1.5 2.0 FIGURE 11. DRIVER OUTPUT CURRENT vs SHORT-CIRCUIT VOLTAGE FN7906 Rev.4.01 Sep 27, 2019 3.6 Page 7 of 12 ISL32613E, ISL32614E DI 1.5 1.5 1 1 0.5 Y-Z 0 -0.5 -1 -1.5 -0.5 -1 0 DRIVER INPUT (V) 2 DI 1.5 1.5 1 1 0.5 Y-Z 0 -0.5 -1 -1.5 TIME (400ns/DIV) FIGURE 14. ISL32614E DRIVER WAVEFORMS, LOW-TO-HIGH Application Information Driver Features The ISL32613E and ISL32614E transmitters are differential output devices that operate with VCC as low as 1.8V and up to 3.6V. The devices are RS-485 compliant with VCC ≥ 3V, but significant power savings are obtained by operating at VCC = 1.8V. The transmitter outputs are tri-statable with the active high DE input. If the Tx enable function is not needed, tie DE to VCC through a 1kΩ to 2kΩ resistor. Outputs are slew rate limited to minimize EMI and to reduce reflections in unterminated or improperly terminated networks. FN7906 Rev.4.01 Sep 27, 2019 TIME (1µs/DIV) RD = 10kΩ, CD = 50pF DRIVER OUTPUT (V) DRIVER OUTPUT (V) DI Y-Z 0 FIGURE 13. ISL32614E DRIVER WAVEFORMS, HIGH-TO-LOW FIGURE 12. ISL32613E DRIVER WAVEFORMS, LOW-TO-HIGH RD = 10kΩ, CD = 50pF 0 0.5 -1.5 TIME (1µs/DIV) 2 DRIVER INPUT (V) 0 RD = 10kΩ, CD = 50pF DRIVER OUTPUT (V) DRIVER OUTPUT (V) DI 2 2 0 DRIVER INPUT (V) RD = 10kΩ, CD = 50pF VCC = 1.8V, TA = +25°C; unless otherwise specified. (Continued) DRIVER INPUT (V) Typical Performance Curves 0.5 Y-Z 0 -0.5 -1 -1.5 TIME (400ns/DIV) FIGURE 15. ISL32614E DRIVER WAVEFORMS, HIGH-TO-LOW 1.8V Operation The ISL32613E and ISL32614E operate with VCC as low as 1.8V. When coupled with the ISL32610E or ISL32611E 1.8V receivers, they provide a differential communication link optimized for very low power and for slow data rates. Figures 9 and 10 illustrate the static and dynamic power savings from using these transmitters at low supply voltages. With VCC = 1.8V rather than 3.3V, using the ISL32613E at 128kbps reduces the operating supply current from 9.9mA to 56µA (a factor of 177). 5.5V Tolerant Logic Pins The logic input pins (DI and DE) contain no ESD or parasitic diodes to VCC, so they withstand input voltages exceeding 5.5V, regardless of the VCC voltage. Page 8 of 12 ISL32613E, ISL32614E Hot Plug Function Driver Overload Protection When a piece of equipment powers up, there is a period of time during when the processor or ASIC driving the RS-485 control line (DE) is unable to ensure that the RS-485 Tx outputs are kept disabled. If the equipment is connected to the bus, a driver activating prematurely during power-up may crash the bus. To avoid crashes, these transmitters incorporate a hot plug function. During power-up, circuitry monitoring VCC ensures that the Tx outputs remain disabled for a period of time, regardless of the state of DE. The disabled Tx outputs allow the processor/ASIC a chance to stabilize and drive the control lines to the proper states. The driver output stages incorporate short-circuit, current-limiting circuitry that ensures that the output current never exceeds the RS-485 specification over a ±2V (-7V to +12V for VCC ≥ 2.7V) common mode voltage range. ESD Protection All pins on these devices include Class 3 (8kV) Human Body Model (HBM) ESD protection structures, but the driver outputs incorporate advanced structures that allow them to survive ESD events in excess of ±16.5kV HBM and ±7kV to the IEC61000 contact test method. The RS-485 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Touching the port pins or connecting a cable can cause an ESD event that destroy unprotected ICs. The new ESD structures protect the device whether it is powered up or not, and without degrading the common-mode range. This built-in ESD protection eliminates the need for board-level protection structures (for example, transient suppression diodes) and the associated, undesirable capacitive load they present. The ISL32613E and ISL32614E's thermal shutdown feature disables the drivers whenever the die temperature becomes excessive in the event of a major short-circuit condition. Thermal shutdown eliminates power dissipation, allowing the die to cool. The drivers automatically reenable after the die temperature drops by about +20°C. If the condition persists, the thermal shutdown/reenable cycle repeats until the fault is cleared. Low Power Shutdown Mode Th BiCMOS transmitters use a fraction of the power required by its bipolar counterparts, but they also include a shutdown feature that reduces the already low quiescent ICC to a 10nA trickle. These devices enter shutdown whenever the driver disables (DE = GND). Die Characteristics SUBSTRATE POTENTIAL (POWERED UP): GND PROCESS: Si Gate BiCMOS FN7906 Rev.4.01 Sep 27, 2019 Page 9 of 12 ISL32613E, ISL32614E Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please visit our website to ensure you have the latest revision. DATE REVISION Sep 27, 2019 FN7906.4.01 Feb 14, 2019 FN7906.4 Updated both Typical Operating Circuits. Updated links throughout document. Updated disclaimer. Jun 12, 2018 FN7906.3 Added Related Literature section on page 1. Updated Ordering information table by switching Notes 1 and 2 and adding the tape and reel units column. Removed military temperature range from Features on page 1. Removed 55°C curves from Figures 7 and 11 on page 8. Removed About Intersil section and added Renesas disclaimer. Jul 27, 2015 FN7906.2 Ordering Information Table on page 3: Removed part numbers ISL32614EMHZ-T and ISL32614EMHZ-T7A. Recommended Operating Conditions table on page 4: Removed the line referencing “M Suffix”. Replaced “Product” section with “About Intersil” on page 10. May 2, 2012 FN7906.1 Page 1, “Features” - changed “Specified for +125°C Operation” to “Specified for +125°C or Full Mil Temperature Operation”. Also changed Figure 1 title. Page 2, added new part “ISL32614EMHZ-T” to the “Ordering Information”. Page 4, changed “Y, Z (VCC = 1.8V)” to “Y, Z (VCC = 1.8V, Output Enabled)” and added “Y, Z (VCC = 1.8V, Output Disabled)... -8V to +8V” under the “Absolute Maximum Rating”. Also added “(F Suffix)” and “(M Suffix)...-55°C to +125°C” under the “Recommended Operating Conditions”. Page 8, replaced Figure 7 and added -55°C curve to Figure 11 under the “Typical Performance Curves”. Aug 30, 2011 FN7906.0 Initial Release FN7906 Rev.4.01 Sep 27, 2019 CHANGE Replaced Figures 2 and 3. Removed Note on page 2. Page 10 of 12 ISL32613E, ISL32614E Package Outline Drawing For the most recent package outline drawing, see P6.064. P6.064 6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE Rev 4, 2/10 0-8° 1.90 0.95 0.08-0.22 D A 6 5 4 2.80 PIN 1 INDEX AREA 1.60 +0.15/-0.10 3 3 (0.60) 1 2 3 0.20 C 2x 0.40 ±0.10 B SEE DETAIL X 3 0.20 M C A-B D END VIEW TOP VIEW 10° TYP (2 PLCS) 2.90 ±0.10 3 1.15 +0.15/-0.25 C 0.10 C SEATING PLANE 0.00-0.15 SIDE VIEW (0.25) GAUGE PLANE 1.45 MAX DETAIL "X" 0.45±0.1 4 (0.95) (0.60) (1.20) (2.40) NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5M-1994. 3. Dimension is exclusive of mold flash, protrusions or gate burrs. 4. Foot length is measured at reference to gauge plane. 5. Package conforms to JEDEC MO-178AB. TYPICAL RECOMMENDED LAND PATTERN FN7906 Rev.4.01 Sep 27, 2019 Page 11 of 12 1RWLFH  'HVFULSWLRQVRIFLUFXLWVVRIWZDUHDQGRWKHUUHODWHGLQIRUPDWLRQLQWKLVGRFXPHQWDUHSURYLGHGRQO\WRLOOXVWUDWHWKHRSHUDWLRQRIVHPLFRQGXFWRUSURGXFWV DQGDSSOLFDWLRQH[DPSOHV