DATASHEET
ISL9209B
FN6400
Rev 0.00
March 21, 2007
Charging System Safety Circuit
The ISL9209B is an integrated circuit (IC) optimized to
provide a redundant safety protection to a Li-ion battery from
failures of a charging system. The IC monitors the input
voltage, the battery voltage and the charge current. When
any of the three parameters exceeds its limit, the IC turns off
an internal P-Channel MOSFET to remove the power from
the charging system. In addition to the above protected
parameters, the IC also monitors its own internal
temperature and turns off the P-Channel MOSFET when the
temperature exceeds +140°C. Together with the battery
charger IC and the protection module in a battery pack, the
charging system using the ISL9209B has triple-level
protection and is two-fault tolerant.
The IC is designed to turn on the internal PFET slowly to
avoid inrush current at power up but will turn off the PFET
quickly when the input is overvoltage in order to remove the
power before any damage occurs. The ISL9209B has a logic
warning output to indicate the fault and an enable input to
allow the system to remove the input power.
PART NUMBER
PART
TEMP.
(Note)
MARKING RANGE (°C)
09BZ
-40 to +85
PACKAGE
(Pb-Free)
PKG.
DWG. #
12 Ld 4x3 TDFN L12.4x3A
*Add “-T” suffix for tape and reel.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100% matte
tin plate termination finish, which are RoHS compliant and compatible
with both SnPb and Pb-free soldering operations. Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
Typical Application Circuit
INPUT
VIN
• Fully Integrated Protection Circuit for Three Protected
Variables
• High Accuracy Protection Thresholds
• User Programmable Overcurrent Protection Threshold
• Input Overvoltage Protection in Less than 1s
• High Immunity of False Triggering Under Transients
• Warning Output to Indicate the Occurrence of Faults
• Enable Input
• Easy to Use
• Thermal Enhanced TDFN Package
• Pb-Free Plus Anneal Available (RoHS Compliant)
Applications
• Cell Phones
• Digital Still Cameras
Ordering Information
ISL9209BIRZ*
Features
OUT
C1
• PDAs and Smart Phones
• Portable Instruments
• Desktop Chargers
Related Literature
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
• Technical Brief TB379 “Thermal Characterization of
Packaged Semiconductor Devices”
• Technical Brief TB389 “PCB Land Pattern Design and
Surface Mount Guidelines for QFN Packages”
ISL6292
BATTERY
CHARGER
Pinout
ISL9209B
(12 LD 4x3 TDFN)
TOP VIEW
ISL9209B
ILIM
VB
EN
RILIM
GND
FN6400 Rev 0.00
March 21, 2007
WRN
RVB
BATTERY
PACK
VIN
1
12 NC
VIN
2
11 OUT
GND
3
WRN
4
EPAD
10 OUT
9
ILIM
NC
5
8
VB
NC
6
7
EN
Page 1 of 11
ISL9209B
Absolute Maximum Ratings (Reference to GND)
Thermal Information
Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 30V
Output and VB Pin (OUT, VB) (Note 1) . . . . . . . . . . . . . -0.3 to 7.0V
Other Pins (ILIM, WRN, EN) . . . . . . . . . . . . . . . . . . . . . -0.3 to 5.5V
ESD Rating
Human Body Model (Per MIL-STD-883 Method 3015.7) . . .3500V
Machine Model (Per EIAJ ED-4701 Method C-111) . . . . . . . .350V
Thermal Resistance (Typical, Notes 2, 3) JA (°C/W) JC (°C/W)
4x3 TDFN Package . . . . . . . . . . . . . . .
41
3.5
Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C
Recommended Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . . .-40°C to +85°C
Supply Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3V to 5.5V
Operating Current Range. . . . . . . . . . . . . . . . . . . . . . . . . 0A to 1.5A
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
+150°C max junction temperature is intended for short periods of time to prevent shortening the lifetime. Operation close to +150°C junction may trigger the shutdown of
the device even before +150°C, since this number is specified as typical.
NOTES:
1. The maximum voltage rating for the VB pin under continuous operating conditions is 5.5V. All other pins are allowed to operate continuously at
the absolute maximum ratings.
2. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
3. JC, “case temperature” location is at the center of the exposed metal pad on the package underside. See Tech Brief TB379.
Electrical Specifications
Typical values are tested at VIN = 5V and +25°C Ambient Temperature, maximum and minimum values are
guaranteed over the recommended operating conditions, unless otherwise noted.
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
2.45
-
3.00
V
POWER-ON RESET
Rising VIN Threshold
VPOR
POR Hysteresis
VIN Bias Current
IVIN
VIN Bias Current
-
0.125
-
V
When enabled
0.75
0.90
1.05
mA
When disabled
30
60
100
A
5.65
5.85
6.00
V
-
0.050
0.100
V
PROTECTIONS
Input Overvoltage Protection (OVP)
VOVP
Input OVP Hysteresis
Input OVP Falling Threshold
5.55
-
-
V
Input OVP Propagation Delay
-
-
1
s
Overcurrent Protection
IOCP
0.93
1.00
1.07
A
Overcurrent Protection Blanking Time
BTOCP
VVB = 3V, RILIM = 25k
-
170
-
s
Battery Overvoltage Protection Threshold
VBOVP
4.28
4.34
4.40
V
Battery OVP Threshold Hysteresis
Battery OVP Falling Threshold
Battery OVP Blanking Time
VB Pin Leakage Current
BTBOVP
VVB = 4.34V
-
0.03
-
V
4.25
-
-
V
-
180
-
s
-
-
20
nA
Over-Temperature Protection Rising Threshold
-
140
-
°C
Over-Temperature Protection Falling Threshold
-
90
-
°C
1.5
-
-
V
LOGIC
EN Input Logic HIGH
EN Input Logic LOW
EN Internal Pull Down Resistor
WRN Output Logic Low
WRN Output Logic High Leakage Current
FN6400 Rev 0.00
March 21, 2007
Sink 5mA current
-
-
0.4
V
100
200
400
k
-
0.35
0.80
V
-
-
1
A
Page 2 of 11
ISL9209B
Electrical Specifications
Typical values are tested at VIN = 5V and +25°C Ambient Temperature, maximum and minimum values are
guaranteed over the recommended operating conditions, unless otherwise noted. (Continued)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
-
250
450
m
POWER MOSFET
ON-Resistance
rDS(ON)
Measured at 500mA, 4.3V < VIN < 5.5V
Pin Descriptions
VB (Pin 8)
VIN (Pin1, 2)
Battery voltage monitoring input. This pin is connected to the
battery pack positive terminal via an isolation resistor.
The input power source. The VIN can withstand 30V input.
ILIM (Pin 9)
GND (Pin 3)
Overcurrent protection threshold setting pin. Connect a
resistor between this pin and GND to set the OCP threshold.
System ground reference.
WRN (Pin 4)
WRN is an open-drain logic output that turns LOW when any
protection event occurs.
OUT (Pin 10, 11)
Output pin.
EPAD
NC (Pin 5, 6, 12)
The exposed pad at the bottom of the TDFN package for
enhancing thermal performance. Must be electrically
connected to the GND pin.
No connection and must be left floating.
EN (Pin 7)
Enable input. Pull this pin to low or leave it floating to enable
the IC and force it to high, which will disable the IC.
Typical Applications
INPUT
VIN
OUT
C1
ISL6292
BATTERY
CHARGER
PART
ISL9209B
ILIM
VB
EN
RILIM
GND
FN6400 Rev 0.00
March 21, 2007
WRN
RVB
DESCRIPTION
RILIM
25k
RVB
200k to 1M
C1
1µF/16V X5R ceramic capacitor
BATTERY
PACK
Page 3 of 11
ISL9209B
Block Diagram
INPUT
OUT
VIN
Q1
Q2
POR
Pre-reg
PRE-REG
REF
Ref
R1
FET
DRIVER
Driver
RILIM
CP2
EA
CP3
Logic
LOGIC
1.2V
VB
Q4
R4
Q5
GND
WRN
ILIM
0.8V
CP1
R2
Q3
ISL6292
Battery
BATTERY
Charger
CHARGER
RVB
R3 BUF
R5
EN
FIGURE 1. BLOCK DIAGRAM
Typical Operating Performance
The test conditions for the Typical Operating Performance are: VIN = 5V, TA = +25°C,
RILIM = 25.5k, RVB = 200k, Unless Otherwise Noted.
VVIN
(2V/div)
IN (2V/DIV)
VIN (1V/div)
(1V/DIV)
VIN
OUT(1V/div)
(1V/DIV)
OUT
Load CURRENT
Current
LOAD
200mA/DIV
(200mA/div)
OUT(2V/div)
(2V/DIV)
OUT
WRN (5V/DIV)
WRN
(5V/div)
TIME: 5ms/DIV
Time:
5ms/div
FIGURE 2. CAPTURED WAVEFORMS FOR POWER-UP. THE
OUTPUT IS LOADED WITH A 10 RESISTOR
Time:
500ms/div
TIME: 500ms/DIV
TIME: 5s/div
5µs/DIV
Time:
FIGURE 3. CAPTURED WAVEFORMS WHEN THE INPUT
VOLTAGE STEPS FROM 5.5V TO 9.5V
V
VIN
(2V/div)
IN (2V/DIV)
VIN (2V/div)
(2V/DIV)
VIN
OUT (2V/div)
(2V/DIV)
OUT
OUT (2V/DIV)
OUT
(2V/div)
WRN (5V/DIV)
WRN
(5V/div)
FIGURE 4. CAPTURED WAVEFORMS WHEN THE INPUT
GRADUALLY RISES TO THE INPUT
OVERVOLTAGE THRESHOLD
FN6400 Rev 0.00
March 21, 2007
WRN (5V/DIV)
WRN
(5V/div)
TIME:5ms/div
5ms/DIV
Time:
FIGURE 5. TRANSIENT WHEN THE INPUT VOLTAGE STEPS
FROM 6.5V TO 5.5V
Page 4 of 11
ISL9209B
Typical Operating Performance
The test conditions for the Typical Operating Performance are: VIN = 5V, TA = +25°C,
RILIM = 25.5k, RVB = 200k, Unless Otherwise Noted. (Continued)
Time:
TIME: 20s/DIV
20s/div
VIN (2V/DIV)
VIN
(2V/div)
VIN(1V/div)
(1V/DIV)
VIN
VB
(1V/div)
VB (1V/DIV)
OUT (2V/DIV)
OUT
(2V/div)
OUT (1V/div)
(1V/DIV)
OUT
ILIM (2V/DIV)
ILIM
(1V/div)
WRN (5V/DIV)
WRN
(5V/div)
WRN (5V/div)
(5V/DIV) Time:
TIME: 500s/div
500µs/DIV
WRN
FIGURE 6. TRANSIENT WAVEFORMS WHEN INPUT STEPS
FROM ZERO TO 9V
FIGURE 7. BATTERY OVERVOLTAGE PROTECTION. THE IC
IS LATCHED OFF AFTER 16 COUNTS OF
PROTECTION. VB VOLTAGE VARIES BETWEEN
4.3V TO 4.5V
TIME: 200ms/DIV
Time:
200ms/div
VIN (1V/DIV)
VIN
(1V/div)
TIME: 10ms/DIV
Time:
10ms/div
VIN (1V/DIV)
VIN
(1V/div)
OUT (1V/DIV)
OUT
(1V/div)
LOAD
Load CURRENT
Current
500mA/DIV
(500mA/div)
LOAD
LoadCURRENT
Current
500mA/DIV
(500mA/div)
OUT (1V/DIV)
OUT
(1V/div)
WRN (5V/DIV)
WRN
(5V/div)
WRN
WRN(5V/DIV)
(5V/div)
FIGURE 9. ZOOMED-IN VIEW OF FIGURE 8 (BLUE: LOAD
CURRENT; PINK: OUT PIN VOLTAGE)
1000
1000
900
900
800
800
700
ENABLED
CURRENT (µA)
INPUT BIAS CURRENT (µA)
FIGURE 8. POWER-UP WAVEFORMS WHEN OUTPUT IS
SHORT-CIRCUITED
600
500
400
DISABLED
300
700
600
400
300
200
100
100
0
5
10
15
20
25
30
35
INPUT VOLTAGE (V)
FIGURE 10. INPUT BIAS CURRENT vs INPUT VOLTAGE
WHEN ENABLED AND DISABLED
FN6400 Rev 0.00
March 21, 2007
30V/ENABLED
500
200
0
4.3V/ENABLED
5V/ENABLED
0
-50
30V/DISABLED
5V/DISABLED
-20
10
40
4.3V/DISABLED
70
100
130
TEMPERATURE (°C)
FIGURE 11. INPUT BIAS CURRENT AT DIFFERENT INPUT
VOLTAGES WHEN ENABLED AND DISABLED
Page 5 of 11
ISL9209B
Typical Operating Performance
The test conditions for the Typical Operating Performance are: VIN = 5V, TA = +25°C,
RILIM = 25.5k, RVB = 200k, Unless Otherwise Noted. (Continued)
5.86
2.82
2.80
5.84
2.78
RISING THRESHOLD
5.82
2.74
VOVP (V)
VPOR (V)
2.76
2.72
2.70
RISING THRESHOLD
5.80
5.78
FALLING THRESHOLD
2.68
5.76
FALLING THRESHOLD
2.66
5.74
2.64
2.62
-50
-20
10
40
70
100
5.72
-50
130
-20
10
40
70
100
130
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 12. VPOR vs TEMPERATURE
FIGURE 13. INPUT OVERVOLTAGE PROTECTION
THRESHOLDS vs TEMPERATURE
1040
200
CURRENT
LIMIT = 1A
1030
195
5V
190
185
4.3V
1010
BTOCP (µs)
IOCP (mA)
1020
3V
1000
180
175
170
165
990
160
5.5V
980
155
970
-50
-20
10
40
70
100
150
-50
130
-20
TEMPERATURE (°C)
FIGURE 14. OVERCURRENT PROTECTION THRESHOLDS vs
TEMPERATURE AT VARIOUS INPUT VOLTAGES
70
100
130
4.380
CURRENT
LIMIT = 0.5A
510
4.370
4.3V
4.350
4.340
5V
VB
500
495
4.330
4.320
490
4.310
5.5V
485
4.300
480
4.290
475
-50
RISING MAX
4.360
3V
505
IOCP (mA)
40
FIGURE 15. OVERCURRENT PROTECTION BLANKING TIME
vs TEMPERATURE
520
515
10
TEMPERATURE (°C)
-20
10
40
70
100
130
TEMPERATURE (°C)
FIGURE 16. OVERCURRENT PROTECTION THRESHOLDS vs
TEMPERATURE AT VARIOUS INPUT VOLTAGES
FN6400 Rev 0.00
March 21, 2007
4.280
-60 -40 -20
FALLING MIN
0
20
40
60
80 100 120 140
TEMPERATURE (°C)
FIGURE 17. BATTERY VOLTAGE OVP THRESHOLDS vs
TEMPERATURE AT VARIOUS INPUT VOLTAGES
Page 6 of 11
ISL9209B
Typical Operating Performance
The test conditions for the Typical Operating Performance are: VIN = 5V, TA = +25°C,
RILIM = 25.5k, RVB = 200k, Unless Otherwise Noted. (Continued)
3.0
200
VB PIN LEAKAGE CURRENT (nA)
195
190
BTBOVP (µs)
185
180
175
170
165
160
155
150
-50
-20
10
40
70
100
TESTED AT 5V
2.5
2.0
1.5
1.0
0.5
0
-50
130
-20
240
EN PIN INTERNAL PULL-DOWN (k)
250
1.8
EN THRESHOLD (V)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
10
40
70
100
130
FIGURE 19. VB PIN LEAKAGE CURRENT vs TEMPERATURE
2.0
-20
40
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 18. BATTERY OVP BLANKING TIME
0
-50
10
70
100
230
220
210
200
190
180
170
160
150
130
-50
-20
TEMPERATURE (°C)
10
40
70
100
130
TEMPERATURE (°C)
FIGURE 20. EN INPUT THRESHOLD vs TEMPERATURE
FIGURE 21. EN PIN INTERNAL PULL-DOWN RESISTANCE
0.5
rDS(ON) ()
0.4
3V
4.3V
0.3
0.2
5V
0.1
5.5V
0
-50
-20
10
40
70
100
130
TEMPERATURE (°C)
FIGURE 22. ON-RESISTANCE vs TEMPERATURE AT DIFFERENT INPUT VOLTAGES
FN6400 Rev 0.00
March 21, 2007
Page 7 of 11
ISL9209B
Theory of Operation
The ISL9209B is an integrated circuit (IC) optimized to
provide a redundant safety protection to a Li-ion battery from
charging system failures. The IC monitors the input voltage,
the battery voltage and the charge current. When any of the
above three parameters exceeds its limit, the IC turns off an
internal P-Channel MOSFET to remove the power from the
charging system. In addition to the above protected
parameters, the IC also monitors its own internal
temperature and turns off the P-Channel MOSFET when the
temperature exceeds +140°C. Together with the battery
charger IC and the protection module in a battery pack, the
charging system has triple-level protection from
overcharging the Li-ion battery and is two-fault tolerant. The
ISL9209B protects up to 30V input voltage.
Power-Up
The ISL9209B has a power-on reset (POR) threshold of
2.6V with a built-in hysteresis of 125mV. Before the input
voltage reaches the POR threshold, the internal power PFET
is off. Approximately 10ms after the input voltage exceeds
the POR threshold, the IC resets itself and begins the softstart. The 10ms delay allows any transients at the input
during a hot insertion of the power supply to settle down
before the IC starts to operate. The soft-start slowly turns on
the power PFET to reduce the inrush current as well as the
input voltage drop during the transition. The power-up
behavior is illustrated in Figure 2.
Input Overvoltage Protection (OVP)
The input voltage is monitored by the comparator CP1 in the
Block Diagram (Figure 1). CP1 has an accurate reference of
1.2V from the bandgap reference. The OVP threshold is set
by the resistive divider consisting of R1 and R2. The
protection threshold is set to 5.85V. When the input voltage
exceeds the threshold, the CP1 outputs a logic signal to turn
off the power PFET within 1µs (see Figure 3) to prevent the
high input voltage from damaging the electronics in the
handheld system. The hysteresis for the input OVP
threshold is given in “Electrical Specifications” on page 2.
When the input overvoltage condition is removed, the
ISL9209B re-enables the output by running through the softstart, as shown in Figure 5. Because of the 10ms second
delay before the soft-start, the output is never enabled if the
input rises above the OVP threshold quickly, as shown in
Figure 6.
The control logic contains a 4-bit binary counter that if the
battery overvoltage event occurs 16 times, the power PFET
is turned off permanently, as shown in Figure 7. Recycling
the input power or toggling the enable (EN) input will reset
the counter and restart the ISL9209B.
The resistor between the VB pin and the battery, RVB, (as
shown in the “Typical Application Circuit” on page 1) is an
important component. This resistor provides a current limit in
case the VB pin is shorted to the input voltage under a failure
mode. The VB pin leakage current under normal operation is
negligible to allow a resistance of 200k to 1M be used.
Overcurrent Protection (OCP)
The current in the power PFET is limited to prevent charging
the battery with an excessive current. The current is sensed
using the voltage drop across the power FET after the FET is
turned on. The reference of the OCP is generated using a
sensing FET Q2, as shown in Figure 1. The current in the
sensing FET is forced to the value programmed by the ILIM
pin. The size of the power FET Q1 is 31,250 times the size
of the sensing FET. Therefore, when the current in the power
FET is 31,250 times the current in the sensing FET, the drain
voltage of the power FET falls below that of the sensing FET.
The comparator CP2 then outputs a signal to turn off the
power FET.
The OCP threshold can be calculated using Equation 1:
0.8V
25000
I LIM = --------------- 31250 = ---------------R ILIM
R ILIM
(EQ. 1)
where the 0.8V is the regulated voltage at the ILIM pin. The
OCP comparator CP2 has a built-in 170µs delay to prevent
false triggering by transient signals. The OCP function also
has a 4-bit binary counter that accumulates during an OCP
event. When the total count reaches 16, the power PFET is
turned off permanently, unless the input power is recycled or
the enable pin is toggled. Figure 8 and Figure 9 illustrate the
waveforms during the power-up when the output is
short-circuited to ground.
Internal Over-Temperature Protection
The ISL9209B monitors its own internal temperature to
prevent thermal failures. When the internal temperature
reaches +140°C, the IC turns off the P-Channel power
MOSFET. The IC does not resume operation until the
internal temperature drops below +90°C.
Battery Overvoltage Protection
External Enable Control
The battery voltage OVP is realized with the VB pin. The
comparator CP3, as shown in Figure 1, monitors the VB pin
and issues an overvoltage signal when the battery voltage
exceeds the 4.34V (nominal) battery OVP threshold. The
threshold has 30mV built-in hysteresis. The comparator CP3
has a built-in 180µs blanking time to prevent any transient
voltage from triggering the OVP. If the OVP situation still
exists after the blanking time, the power PFET is turned off.
The ISL9209B offers an enable (EN) input. When the EN pin
is pulled to logic HIGH, the protection IC is shut down. The
internal control circuit as well as the power PFET are turned
off. Both 4-bit binary counters for the battery OVP and the
OCP are reset to zero when the IC is re-enabled. The EN pin
has an internal 200k pull-down resistor. Leaving the EN pin
floating or driving it to below 0.4V enables the IC.
FN6400 Rev 0.00
March 21, 2007
Page 8 of 11
ISL9209B
The WRN pin is an open-drain output that indicates a LOW
signal when any of the three protection events happens. This
allows the microprocessor to give an indication to the user to
further enhance the safety of the charging system.
Applications Information
The ISL9209B is designed to meet the “Lithium-Safe” criteria
when operating together with the ISL6292 family Li-ion
battery chargers. The “Lithium-Safe” criteria requires the
charger output to fall within the green region shown in
Figure 23 under normal operating conditions and NOT to fall
in the red region when there is a single fault in the charging
system. Taking into account the safety circuit in a Li-ion
battery pack, the charging system is allowed to have two
faults without creating hazardous conditions for the battery
cell. The output of any ISL6292 family chargers, such as the
ISL6292C, has a typical I-V curve shown with the blue lines
under normal operation, which is within the green region.
The function of the ISL9209B is to add a redundant
protection layer such that, under any single fault condition,
the charging system output does not exceed the I-V limits
shown with the red lines. As a result, the charging system
adopting the ISL9209B and the ISL6292C chip set can
easily pass the “Lithium-Safe” criteria test procedures.
The ISL9209B is a simple device that requires only three
external components, in addition to the ISL6292 charger
circuit, to meet the “Lithium-Safe” criteria, as shown in the
“Typical Application Circuit” on page 1. The selection of the
current limit resistor RILIM is given in the “Overcurrent
Protection (OCP)” on page 8.
RVB Selection
1000
1
2
3
4
6
5
BATTERY VOLTAGE (V)
FIGURE 23. LITHIUM-SAFE OPERATING REGIONS
Interfacing to MCU
The ISL9209B has the enable (EN) and the warning (WRN)
digital signals that can be interfaced to a microcontroller unit
(MCU). Both signals can be left floating if not used. When
interfacing to an MCU, it is highly recommended to insert a
resistor between the ISL9209B signal pin and the MCU
GPIO pin, as shown in Figure 24. The resistor creates an
isolation to limit the current, in case a high voltage shows up
at the ISL9209B pins under a failure mode. The
recommended resistance ranges from 10k to 100k. The
selection of the REN is dependent on the IO voltage (VIO) of
the MCU. REN should be selected so that the ISL9209B EN
pin voltage is above the disable threshold when the GPIO
output of the MCU is high.
ISL9209
ISL9209
VIO
WRN
WRN
Q4
MCU
RR
PU
PU
RRWRN
WRN
(EQ. 2)
assuming the VB pin voltage is 30V under a failure mode
and the battery voltage is 4.2V. Such a small current can be
easily absorbed by the bias current of other components in
the handheld system. Increasing the RVB value reduces the
worst case current, but at the same time increases the error
for the 4.34V battery OVP threshold.
The error of the battery OVP threshold is the original
accuracy at the VB pin (given in “Electrical Specifications” on
page 2) plus the voltage built across the RVB by the VB pin
leakage current. The VB pin leakage current is less than
20nA, as given in “Electrical Specifications” on page 2. With
the 200k resistor, the worst-case additional error is 4mV
and with a 1M resistor, the worst-case additional error is
20mV.
FN6400 Rev 0.00
March 21, 2007
ISL6292C
LIMITS
0
The RVB prevents a large current from the VB pin to the
battery terminal in case the ISL9209B fails. The
recommended value should be between 200k to 1M.
With 200k resistance, the worst case current flowing from
the VB pin to the charger output is:
30V – 4.2V 200k = 130A
ISL9209
LIMITS
CHARGE CURRENT (mA)
Warning Indication Output
EN
EN
QQ55
RR55
RREN
EN
FIGURE 24. DIGITAL SIGNAL INTERFACE BETWEEN
ISL9209B AND MCU
Capacitor Selection
The input capacitor (C1 in the “Typical Application Circuit” on
page 1) is for decoupling. Higher value reduces the voltage
drop or the over shoot during transients.
Page 9 of 11
ISL9209B
Two scenarios can cause the input voltage over shoot. The
first one is when the AC adapter is inserted live (hot
insertion) and the second one is when the current in the
power PFET of the ISL9209B has a step-down change.
Figure 25 shows an equivalent circuit for the ISL9209B
input. The cable between the AC/DC converter output and
the handheld system input has a parasitic inductor. The
parasitic resistor is the lumped sum of various components,
such as the cable, the adapter output capacitor ESR, the
connector contact resistance, and so on.
C1
L
R
AC/DC
ADAPTER
The output of the ISL9209B and the input of the charging
circuit typically share one decoupling capacitor. The
selection of that capacitor is mainly determined by the
requirement of the charging circuit. When using the ISL6292
family chargers, a 1µF, 6.3V, X5R capacitor is
recommended.
Layout Recommendation
C2
ISL9209
CABLE
In practice, the input decoupling capacitor is recommended
to use a 16V X5R dielectric ceramic capacitor with a value
between 0.1µF to 1µF.
HANDHELD SYSTEM
FIGURE 25. EQUIVALENT CIRCUIT FOR THE ISL9209B INPUT
During the load current step-down transient, the energy
stored in the parasitic inductor is used to charge the input
decoupling capacitor, C2. The ISL9209B is designed to turn
off the power PFET slowly during the OCP, the battery OVP
event, and when the device is disabled via the EN pin.
Because of such design, the input over shoot during those
events is not significant. During an input OVP, however, the
PFET is turned in less than 1µs and can lead to significant
over shoot. Higher capacitance reduces this type of over
shoot.
The over shoot caused by a hot insertion is not very
dependent on the decoupling capacitance value, especially
when ceramic type capacitors are used for decoupling. In
theory, the over shoot can rise up to twice of the DC output
voltage of the AC adapter. The actual peak voltage is
dependent on the damping factor that is mainly determined
by the parasitic resistance (R in Figure 25).
The ISL9209B uses a thermally enhanced DFN package.
The exposed pad under the package should be connected to
the ground plane electrically as well as thermally. A grid of
1.0mm to 1.2mm pitch thermal vias in two rows and 4 to 5
vias per row is recommended (refer to the ISL9200EVAL1
evaluation board layout). The vias should be about 0.3mm to
0.33mm in diameter. Use some copper on the component
layer if possible to further improve the thermal performance
but it is not mandatory.
Since the ISL9209B is a protection device, the layout should
also pay attention to the spacing between tracks. When the
distance between the edges of two tracks is less than
0.76mm, an FMEA (failure mechanism and effect analysis)
should be performed to ensure that a short between those
two tracks does not lead to the charger output exceeding the
“Lithium-Safe” region limits. Intersil will have the FMEA
document for the solution using the ISL9209B and the
ISL6292C chip set but the layout FMEA should be added as
part of the analysis.
© Copyright Intersil Americas LLC 2007. All Rights Reserved.
All trademarks and registered trademarks are the property of their respective owners.
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its
subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6400 Rev 0.00
March 21, 2007
Page 10 of 11
ISL9209B
Thin Dual Flat No-Lead Plastic Package (TDFN)
L12.4x3A
12 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-229-WGED-4 ISSUE C)
2X
0.15 C A
A
D
MILLIMETERS
2X
0.15 C B
SYMBOL
0.70
A1
-
A3
E
b
6
INDEX
AREA
D2
B
0.18
//
A
SIDE VIEW
C
SEATING
PLANE
0.08
A3
C
-
-
0.05
-
0.23
0.30
5,8
3.15
3.30
3.40
7,8
3.00 BSC
1.55
e
1.70
1.80
7,8
0.50 BSC
-
k
0.20
-
-
-
L
0.30
0.40
0.50
8
N
12
2
Nd
6
3
7
NOTES:
8
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
D2/2
1
C
NOTES
0.80
Rev. 0 1/06
D2
(DATUM B)
0.10
MAX
0.75
4.00 BSC
E
E2
NOMINAL
0.20 REF
D
TOP VIEW
6
INDEX
AREA
MIN
A
2. N is the number of terminals.
3. Nd refers to the number of terminals on D.
2
4. All dimensions are in millimeters. Angles are in degrees.
NX k
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
E2
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
(DATUM A)
E2/2
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
NX L
N
8
N-1
NX b
e
(Nd-1)Xe
REF.
BOTTOM VIEW
NX (b)
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
5
0.10
M C A B
CL
(A1)
L
5
e
SECTION "C-C" TERMINAL TIP
FOR EVEN TERMINAL/SIDE
FN6400 Rev 0.00
March 21, 2007
Page 11 of 11
工商网监
湘ICP备2023018690号
