MK1491-09F

DATASHEET MK1491-09 AMD GEODE™ GX2 CLOCK SOURCE Description Features The MK1491-09 is a low-cost, low-jitter, high-performance clock synthesizer for AMD’s Geode-based computer and portable appliance applications. Using patented analog Phased-Locked Loop (PLL) techniques, the device accepts a 14.318 MHz crystal input to produce multiple output clocks. It provides selectable PCI local bus clocks, 48 MHz clocks for Super I/O and USB, as well as multiple Reference outputs. • Packaged in 28-pin SSOP (209 mil body) • Pb free, RoHS compliant package • Provides all critical timing for the AMD Geode companion chip • • • • • • • The device has multiple power-down modes to reduce power consumption. Four selectable PCI clocks Three LPC interface clocks One Fixed 66 MHz clock 2 Reference clocks 48 MHz USB and 48 MHz IO support Power down mode Low EMI Enable pin reduces EMI radiation on PCI clocks, LCLKS, and 66 MHz clock • Operating voltage of 3.3 V ±5% • Down Spread of 0.5% for PCI, LPC and 66 MHz clocks • Industrial and commercial temperature ranges available Block Diagram VDD GND 6 6 4 Sel66/33# Clocks PCI&LPC Clocks with Spread Option PD# USB Clock 3 PCI (66/33 MHz) LCLK or LPC, (33 MHz) 66 MHz 48/TS# 48 MHz REFCLK1 XI 14.31818 MHz crystal Crystal Oscillator REFCLK0/Spread# XO IDT™ AMD GEODE™ GX2 CLOCK SOURCE 1 MK1491-09 REV M 051310 MK1491-09 AMD GEODE™ GX2 CLOCK SOURCE CLOCK SYNTHESIZER Pin Assignment GND 1 28 VDD XI 2 27 RefCLK0/Spread# XO 3 26 RefCLK1 VDD 4 25 VDD LCLK0/33M 5 24 PCICLK3/33-66M LCLK1/33M 6 23 PCICLK2/33-66M GND 7 22 GND VDD 8 21 GND LCLK2/33M 9 20 PCICLK1/33-66M Sel66/33# 10 19 VDD GND 11 18 PCICLK0/33-66M VDD 12 17 PD# 48M 13 16 66M 48M/TS# 14 15 GND PCI Frequency Select Table Sel66/33# PCI Frequency 0 33 MHz 1 66 MHz EMI Control Spread# PCI, LPC and 66MHz Clocks Down Spread amount 0 ON -0.5% 1 OFF 0 Spread direction is DOWN. IDT™ AMD GEODE™ GX2 CLOCK SOURCE 2 MK1491-09 REV M 051310 MK1491-09 AMD GEODE™ GX2 CLOCK SOURCE CLOCK SYNTHESIZER Pin Descriptions Pin Number Pin Name Pin Type Pin Description 1, 7, 11, 15, 21, 22 GND P Connect to Ground. 2 XI I Crystal connection. Connect to a 14.31818 MHz crystal or input clock. 3 XO O Crystal connection. Connect to a 14.31818 MHz crystal or leave unconnected. 4, 8, 12, 19, 25, 28 VDD P Connect to 3.3 V. 5, 6, 9 LPC or LCLK O 33 MHz low skew clock outputs for LPC interface. These clocks are synchronous outputs with low skew. 10 Sel66/33# I When high, the PCICLK runs at 66 MHz; when low, the PCICLK runs at 33 MHz. This pin has a weak internal pull-up resistor. This is an active input, not a latched input. 13 48M O 48 MHz clock output. 14 48M/TS# I/O 48 MHz clock output. TS# is a latched input at power up and tristates all outputs when low upon power up. When high upon power up, all outputs are enabled. Power must be cycled for a change of state to be detected. This pin has a weak internal pull-up resistor. 16 66M O 66 MHz clock output. 17 PD# I Power-down input. This is an active input not latched input. When this pin is set low, all clock outputs will be stopped, all PLL’s will be stopped, and the oscillator will be powered off. Weak pull-up resistor (see Power Down table). 18, 20, 23, 24 PCICLK O 33 to 66 MHz PCI synchronous clock outputs with low skew. 26 RefCLK1 O Buffered reference output of 14.31818 MHz. 27 RefCLK0/ Spread# I/O Buffered reference output of 14.31818 MHz. Spread# is a latched input upon power up. Spread is applied to all clocks except REFCLK’s and 48 MHz. Power must be cycled for a change of state to be detected. This pin has a weak internal pull-up resistor. See spread table. KEY: I = Input, TI = Tri-level, O = Output, P = Power supply connection, (T)I/O = Input on power up, becomes an Output after 10 ms, Weak internal pull-up resistors are present on TS#, Spread#, PD#, and Sel66/33. IDT™ AMD GEODE™ GX2 CLOCK SOURCE 3 MK1491-09 REV M 051310 MK1491-09 AMD GEODE™ GX2 CLOCK SOURCE CLOCK SYNTHESIZER Power Down Control Table PD# Functions 0 All clocks are stopped low. 1 All clocks are running. Power-on Default Conditions Pin # Function Default Condition 14 TS# H Latched input. All outputs enabled when high. When low, all outputs are in tristate. 27 Spread# H Latched input. Spread disabled when high. When low, spread is enabled on all outputs except ref clocks and 48 MHz. 10 Sel66/33# H This is an active input. When high, it selects PCI=66 MHz outputs; when low, selects PCI frequency = 33 MHz outputs. External Components I/O Structure The MK1491-09 requires some inexpensive external components for proper operation. Decoupling capacitors of 0.1µF should be connected on each VDD pin to ground, as close to the MK1491-09 as possible. A series termination resistor of 33Ω may be used for each clock output. See the discussion below for other external resistors required for proper I/O operation. The 14.318 MHz oscillator has internal caps that provide the proper load for a parallel resonant crystal with CL=18 pF. For tuning with other values of CL, the formula 2*(CL-18) gives the value of each capacitor that should be connected between X1 and ground and X2 and ground. The MK1491-09 provides more functionality in a 28-pin package by using a unique I/O technique. The device checks the status of all I/O pins during power-up. This status (pulled high or low) then determines the frequency selections and power down modes (see the tables on pages 2 and 3). Within 10ms after power up, the inputs change to outputs and the clocks start up. In the diagrams below, the 33Ω resistors are the normal output termination resistors. The 10kΩ resistor pulls low to generate a logic zero when needed. Weak internal pull-up resistors are present on TS#, Spread#, PD#, and Sel66/33 to pull the pin to high when left floating. 33 For select = 0 (low) To load* I/O 10 k Do not stuff for “1” selection *Note: Do not use a TTL load. This will overcome the 10 kΩ pull-down and force the input to a logic 1. IDT™ AMD GEODE™ GX2 CLOCK SOURCE 4 MK1491-09 REV M 051310 MK1491-09 AMD GEODE™ GX2 CLOCK SOURCE CLOCK SYNTHESIZER Absolute Maximum Ratings Item Rating Supply Voltage, VDD (referenced to VSS) 4.6 V All Inputs and Outputs (referenced to VSS) -0.5 V to VDD+0.5 V Ambient Operating Temperature (commercial) 0 to +70° C Ambient Operating Temperature (industrial) -40 to +85° C Storage Temperature -65 to +150° C Junction Temperature 125° C Soldering Temperature (10 seconds max) 260° C Spread Spectrum Enabled for PCI and LPC Clocks 30 kHz min., 33 kHz max. DC Electrical Characteristics VDD = 3.3 V Parameter Symbol 0 to +70° C (commercial); -40 to 85° C (industrial) Conditions Min. Typ. Max. Units 3.3 3.46 V Operating Voltage VDD 3.13 Input High Voltage VIH 2 VDD V Input Low Voltage VIL VSS 0.8 V Output High Voltage VOH IOH = -12 mA Output Low Voltage VOL IOL = 12 mA 0.4 V Operating Supply Current IDD VDD = 3.3 V 60 mA 0.5 mA 2.4 V Clock Disable Mode Supply Current Internal Pull-up Resistor All inputs except XI 120 kΩ 5 pF Input Capacitance CIN All inputs except XI Spread Spectrum Modulation Rate fmod Enabled for PCI and LPC Clocks IDT™ AMD GEODE™ GX2 CLOCK SOURCE 5 30 33 MK1491-09 KHz REV M 051310 MK1491-09 AMD GEODE™ GX2 CLOCK SOURCE CLOCK SYNTHESIZER AC Electrical Characteristics Unless stated otherwise, VDD = 3.3 V, Ambient Temp. 0 to +70° C (commercial); -40 to 85° C (industrial), CL=30pf Parameter Input Frequency Symbol Conditions Min. FIN Typ. Max. Units 14.31818 Output Clock Skew Rate (PCI and LPC), load=30 pF Between 0.4 V and 2.4 V Output Clock Rise and Fall Time (all but PCI and LPC), load=30 pF tOR, tOF Output Clock Duty Cycle, all MHz Clocks tOD MHz 4 V/ns Between 0.4 V and 2.4 V 0.5 2 ns At 1.5 V 40 60 % PCI Output to Output Skew, at 33 MHz Rising edges at 1.5 V 500 ps PCI Output to Output Skew, at 66 MHz Rising edges at 1.5 V 250 ps LPC Output to Output Skew Rising edges at 1.5 V 500 ps PCI to LPC Output to Output Skew (note 1) Rising edge at 1.5 V 500 ps Cycle-to-Cycle Jitter, PCICLK 300 ps Cycle-to-Cycle Jitter, LPCCLK 500 ps Cycle-to-Cycle Jitter, USBCLK and 48 MHz 500 ps Cycle-to-Cycle Jitter, REFCLK’s 1400 ps Power-on Time, applied VDD to all Clocks Stable 5 ms 30 pF Load Capacitance Crystal 18 Note 1: Only valid when PCI is at 33 MHz. Thermal Characteristics Parameter Thermal Resistance Junction to Ambient Thermal Resistance Junction to Case IDT™ AMD GEODE™ GX2 CLOCK SOURCE Symbol Conditions Min. Typ. Max. Units θJA Still air 100 ° C/W θJA 1 m/s air flow 80 ° C/W θJA 3 m/s air flow 67 ° C/W 60 ° C/W θJC 6 MK1491-09 REV M 051310 MK1491-09 AMD GEODE™ GX2 CLOCK SOURCE CLOCK SYNTHESIZER Marking Diagram (MK1491-09FLN) 28 Marking Diagram (MK1491-09FILN) 28 15 MK149109FILN ###### YYWW MK1491-09FLN ###### YYWW 1 15 1 14 14 Notes: 1. ###### is the lot code. 2. YYWW is the last two digits of the year, and the week number that the part was assembled. 3. “LN” designates RoHS compliant package. 4. “I” designates industrial temperature grade. 5. Bottom marking: country of origin if not USA. IDT™ AMD GEODE™ GX2 CLOCK SOURCE 7 MK1491-09 REV M 051310 MK1491-09 AMD GEODE™ GX2 CLOCK SOURCE CLOCK SYNTHESIZER Package Outline and Package Dimensions (28-pin SSOP, 209 mil Body) Package dimensions are kept current with JEDEC Publication No. 95, MO-150 28 Inches* Symbol E1 INDEX AREA A A1 A2 b c D E E1 e L α E 1 2 D Max Min — 2.00 0.05 — 1.65 1.85 0.22 0.38 0.09 0.25 9.90 10.50 7.40 8.20 5.00 5.60 0.65 Basic 0.55 0.95 0° 8° Max — 0.079 0.002 — 0.065 0.073 0.009 0.015 0.0035 0.010 0.390 0.413 0.291 0.323 0.197 0.220 0.0256 Basic 0.022 0.037 0° 8° *For reference only. Controlling dimensions in mm. A A2 Min A1 c - Ce SEATING PLANE b L Ordering Information Part / Order Number Marking MK1491-09FLN see page 7 Low EMI Feature Shipping Packaging Package Temperature Yes Tubes 28-pin SSOP 0 to +70° C MK1491-09FLNTR Yes Tape and Reel 28-pin SSOP 0 to +70° C MK1491-09FILN Yes Tubes 28-pin SSOP -40 to +85° C MK1491-09FILNTR Yes Tape and Reel 28-pin SSOP -40 to +85° C Parts that are ordered with a “LN” suffix to the part number are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. IDT™ AMD GEODE™ GX2 CLOCK SOURCE 8 MK1491-09 REV M 051310 MK1491-09 AMD GEODE™ GX2 CLOCK SOURCE CLOCK SYNTHESIZER Revision History Rev. Originator Date Description of Change F S.Gardner 06/23/04 Corrected pitch dimension on package diagram. G S.Gardner 08/02/04 Added LF. H A.Ilkbahar 01/11/06 Changed units from “ns” to “ps” for “PCI to LPC Output to Output Skew” spec in AC char table I J.Sarma 02/15/06 Updates to Block Diagram; corrections and additions to Pin Descriptions; updates to EMI Control table; updated Power Default table; updates to AC table. J J.Sarma 07/05/06 Corrections to device markings/diagrams. K R.Willner 07/24/06 Added industrial temperature range markings and ordering info. L 12/18/09 Added EOL note for non-green parts. M 05/13/10 Removed EOL note and non-green orderables IDT™ AMD GEODE™ GX2 CLOCK SOURCE 9 MK1491-09 REV M 051310 MK1491-09 AMD GEODE™ GX2 CLOCK SOURCE CLOCK SYNTHESIZER Innovate with IDT and accelerate your future networks. Contact: www.IDT.com For Sales For Tech Support 800-345-7015 408-284-8200 Fax: 408-284-2775 www.idt.com/go/clockhelp Corporate Headquarters Integrated Device Technology, Inc. www.idt.com © 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. 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