DATASHEET
MK2308-2
ZERO DELAY, LOW SKEW BUFFER
Description
Features
The MK2308-2 is a low jitter, low skew, high performance
Phase-Lock Loop (PLL) based zero delay buffer for high
speed applications. Based on IDT’s proprietary low jitter
PLL techniques, the device provides eight low skew outputs
at speeds up to 133.3 MHz at 3.3 V. The MK2308-2
includes a bank of four outputs running at 1/2X. In the zero
delay mode, the rising edge of the input clock is aligned
with the rising edges of all eight outputs. Compared to
competitive CMOS devices, the MK2308-2 has the lowest
jitter.
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Packaged in 16-pin SOIC
Pb (lead) free package
Zero input-output delay
Four 1X outputs plus four 1/2X outputs
Output to output skew is less than 250 ps
Output clocks up to 133.3 MHz at 3.3 V
Ability to generate 2X the input
Full CMOS outputs with 18 mA output drive capability at
TTL levels at 3.3 V
• Spread SmartTM technology works with spread spectrum
clock generators
• Advanced, low power, sub micron CMOS process
• Operating voltage of 3.3 V
Block Diagram
VDD
2
CLKA1
FBIN
CLKA2
PLL
CLKIN
CLKA3
BANK
A
CLKA4
/2
CLKB1
CLKB2
S2, S1
2
Control
Logic
CLKB3
BANK
B
CLKB4
2
GND
IDT™ ZERO DELAY, LOW SKEW BUFFER
1
MK2308-2
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ZERO DELAY, LOW SKEW BUFFER
ZDB
Pin Assignment
Feedback Configuration Table
CLKIN
1
16
FBIN
CLKA1
2
15
CLKA4
CLKA2
3
14
CLKA3
VDD
4
13
VDD
GND
5
12
GND
CLKB1
6
11
CLKB4
CLKB2
7
10
CLKB3
S2
8
9
Feedback From
Bank A
Bank B
CLKA1:A4
CLKIN
2XCLKIN
CLKB1:B4
CLKIN/2
CLKIN
S1
16-pin (150 mil) SOIC
Output Clock Mode Select Table
S2
0
0
1
1
S1
0
1
0
1
Clocks A1:A4
Tri-state (high impedance)
Running
Running
Running
Clocks B1:B4
Tri-state (high impedance)
Tri-state (high impedance)
Running
Running
Internet Generation
None
PLL
Buffer only (no zero delay)
PLL
PLL Status
On
On
Off
On
Pin Descriptions
Pin
Number
Pin
Name
Pin
Type
1
CLKIN
Input
2-3
CLKA1:A4
Output
Clock A bank of four outputs.
4
VDD
Power
Power supply. Connect pin to same voltage as pin 13 (either 3.3 V ).
5
GND
Power
Connect to ground.
6-7
CLKB1:B4
Output
Clock B bank of four outputs. These are low skew divide by two of bank A.
8
S2
Input
Select input 2. Selects mode for outputs per table above.
9
S1
Input
Select input 1. Selects mode for outputs per table above.
10 - 11
CLKB1:B4
Output
Clock B bank of four outputs. These are low skew divide by two of bank A.
12
GND
Power
Connect to ground.
13
VDD
Power
Power supply. Connect pin to same voltage as pin 4 (either 3.3 V ).
14 - 15
CLKA1:A4
Output
Clock A bank of four outputs.
16
FBIN
Input
IDT™ ZERO DELAY, LOW SKEW BUFFER
Pin Description
Clock input. Connect to input clock source.
Feedback input. Determines outputs per table above.
2
MK2308-2
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ZERO DELAY, LOW SKEW BUFFER
ZDB
External Components
The MK2308-2 requires a minimum number of external components for proper operation. Decoupling capacitors of
0.1µF should be connected between VDD and GND, as close to the part as possible. A 33Ω series terminating
resistor should be used on each clock output to reduce reflections.
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the MK2308-2. These ratings, which are
standard values for ICS commercially rated parts, are stress ratings only. Functional operation of the device at
these or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical
parameters are guaranteed only over the recommended operating temperature range.
Item
Rating
Supply Voltage, VDD
7V
All Inputs and Outputs
-0.5 V to VDD+0.5 V
Ambient Operating Temperature
0 to +70 ° C
Storage Temperature
-65 to +150 ° C
Junction Temperature
175 ° C
Soldering Temperature
260 ° C
Recommended Operation Conditions
Parameter
Min.
Max.
Units
0
+70
°C
+3.0
+5.5
V
Ambient Operating Temperature
Power Supply Voltage (measured in respect to GND)
Typ.
DC Electrical Characteristics
VDD=3.3 V ±10%, Temp 0 to +70° / -40 to +85° C
Parameter
Symbol
Conditions
Operating Voltage
VDD
Input High Voltage
VIH
CLKIN pin only
Input Low Voltage
VIL
CLKIN pin only
Input High Voltage
VIH
Input Low Voltage
VIL
Output High Voltage
VOH
IOH = -18 mA
Output Low Voltage
VOL
IOL = 18 mA
Output High Voltage
VOH
IOH = -5 mA
IDT™ ZERO DELAY, LOW SKEW BUFFER
Min.
Typ.
Max.
Units
3.0
3.3
3.6
V
(VDD/2)+1
VDD/2
VDD/2
V
(VDD/2)-1
2
V
0.8
3
V
2.4
V
V
0.4
VDD-0.4
V
V
MK2308-2
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ZERO DELAY, LOW SKEW BUFFER
Parameter
ZDB
Symbol
Conditions
Operating Supply Current
100 MHz, CLKIN
IDD
No Load
S1=S2=1
Short Circuit Current
IOS
Input Capacitance
CIN
Min.
Typ.
Max.
Units
44
mA
Each output
± 65
mA
S1, S1, FBIN
7
pF
AC Electrical Characteristics
VDD = 3.3V ±10%, Temp 0 to +70° / -40 to +85° C
Parameter
Symbol
Conditions
Min.
Typ.
Max. Units
Input Frequency
FBIN to CLKA1
S1=S2=1
20
133.
3
MHz
Output Frequency
FBIN to CLKA1
S1=S2=1
20
133.
3
MHz
Output Rise Time
tOR
0.8 to 2.0 V, CL=30 pF
1.5
ns
Output Fall Time
tOF
0.8 to 2.0 V, CL=30 pF
1.5
ns
60
%
Output Clock Duty Cycle
at 1.4V
40
Device to Device skew, equally
loaded
rising edges at VDD/2
700
ps
Output to Output skew, equally
loaded
rising edges at VDD/2
200
ps
Maximum Absolute Jitter
50
300
Cycle to Cycle Jitter
ps
30 pF loads
66.67 MHz outputs
400
ps
15 pF loads
66.67 MHz outputs
400
ps
Skew from Output Bank A to
Output Bank B
All outputs equally
loaded
400
ps
Delay CLKIN Rising Edge to
FBIN Rising Edge
measured at VDD/2
±250
ps
1
ms
PLL Lock Time
tLOCK
Stable power supply,
valid clocks on CLKIN,
FBIN
Thermal Characteristics
Parameter
Thermal Resistance Junction to
Ambient
Thermal Resistance Junction to Case
IDT™ ZERO DELAY, LOW SKEW BUFFER
Symbol
Conditions
Min.
Typ.
Max. Units
θJA
Still air
120
° C/W
θJA
1 m/s air flow
115
° C/W
θJA
3 m/s air flow
105
° C/W
58
° C/W
θJC
4
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ZERO DELAY, LOW SKEW BUFFER
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Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
Package dimensions are kept current with JEDEC Publication No. 95
Millimeters
Symbol
16
E
A
A1
B
C
D
E
e
H
h
L
α
H
INDEX
AREA
1 2
D
Min
Inches*
Max
1.35
1.75
0.10
0.25
0.33
0.51
0.19
0.25
9.80
10.00
3.80
4.00
1.27 BASIC
5.80
6.20
0.25
0.50
0.40
1.27
0°
8°
Min
Max
.0532
.0688
.0040
.0098
.013
.020
.0075
.0098
.3859
.3937
.1497
.1574
0.050 BASIC
.2284
.2440
.010
.020
.016
.050
0°
8°
*For reference only. Controlling dimensions in mm.
A
h x 45
A1
C
-Ce
B
SEATING
PLANE
L
.10 (.004)
C
Ordering Information
Part / Order Number
Marking
Shipping Packaging
Package
Temperature
MK2308S-2LF
MK2308S-2LF
Tubes
16-pin SOIC
0 to 70° C
MK2308S-2LFT
MK2308S-2LF
Tape and Reel
16-pin SOIC
0 to 70° C
MK2308S-2ILF
2308S-2ILF
Tubes
16-pin SOIC
-40 to +85° C
MK2308S-2ILFT
2308S-2ILF
Tape and Reel
16-pin SOIC
-40 to +85° C
"LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes
no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No
other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications
such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not
recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT
does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.
IDT™ ZERO DELAY, LOW SKEW BUFFER
5
MK2308-2
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MK2308-2
ZERO DELAY, LOW SKEW BUFFER
ZDB
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