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MK2308S-2TR

MK2308S-2TR

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    SOIC16_150MIL

  • 描述:

    IC PLL ZD BUFFER HS 16-SOIC

  • 数据手册
  • 价格&库存
MK2308S-2TR 数据手册
DATASHEET MK2308-2 ZERO DELAY, LOW SKEW BUFFER Description Features The MK2308-2 is a low jitter, low skew, high performance Phase-Lock Loop (PLL) based zero delay buffer for high speed applications. Based on IDT’s proprietary low jitter PLL techniques, the device provides eight low skew outputs at speeds up to 133.3 MHz at 3.3 V. The MK2308-2 includes a bank of four outputs running at 1/2X. In the zero delay mode, the rising edge of the input clock is aligned with the rising edges of all eight outputs. Compared to competitive CMOS devices, the MK2308-2 has the lowest jitter. • • • • • • • • Packaged in 16-pin SOIC Pb (lead) free package Zero input-output delay Four 1X outputs plus four 1/2X outputs Output to output skew is less than 250 ps Output clocks up to 133.3 MHz at 3.3 V Ability to generate 2X the input Full CMOS outputs with 18 mA output drive capability at TTL levels at 3.3 V • Spread SmartTM technology works with spread spectrum clock generators • Advanced, low power, sub micron CMOS process • Operating voltage of 3.3 V Block Diagram VDD 2 CLKA1 FBIN CLKA2 PLL CLKIN CLKA3 BANK A CLKA4 /2 CLKB1 CLKB2 S2, S1 2 Control Logic CLKB3 BANK B CLKB4 2 GND IDT™ ZERO DELAY, LOW SKEW BUFFER 1 MK2308-2 REV E 051310 MK2308-2 ZERO DELAY, LOW SKEW BUFFER ZDB Pin Assignment Feedback Configuration Table CLKIN 1 16 FBIN CLKA1 2 15 CLKA4 CLKA2 3 14 CLKA3 VDD 4 13 VDD GND 5 12 GND CLKB1 6 11 CLKB4 CLKB2 7 10 CLKB3 S2 8 9 Feedback From Bank A Bank B CLKA1:A4 CLKIN 2XCLKIN CLKB1:B4 CLKIN/2 CLKIN S1 16-pin (150 mil) SOIC Output Clock Mode Select Table S2 0 0 1 1 S1 0 1 0 1 Clocks A1:A4 Tri-state (high impedance) Running Running Running Clocks B1:B4 Tri-state (high impedance) Tri-state (high impedance) Running Running Internet Generation None PLL Buffer only (no zero delay) PLL PLL Status On On Off On Pin Descriptions Pin Number Pin Name Pin Type 1 CLKIN Input 2-3 CLKA1:A4 Output Clock A bank of four outputs. 4 VDD Power Power supply. Connect pin to same voltage as pin 13 (either 3.3 V ). 5 GND Power Connect to ground. 6-7 CLKB1:B4 Output Clock B bank of four outputs. These are low skew divide by two of bank A. 8 S2 Input Select input 2. Selects mode for outputs per table above. 9 S1 Input Select input 1. Selects mode for outputs per table above. 10 - 11 CLKB1:B4 Output Clock B bank of four outputs. These are low skew divide by two of bank A. 12 GND Power Connect to ground. 13 VDD Power Power supply. Connect pin to same voltage as pin 4 (either 3.3 V ). 14 - 15 CLKA1:A4 Output Clock A bank of four outputs. 16 FBIN Input IDT™ ZERO DELAY, LOW SKEW BUFFER Pin Description Clock input. Connect to input clock source. Feedback input. Determines outputs per table above. 2 MK2308-2 REV E 051310 MK2308-2 ZERO DELAY, LOW SKEW BUFFER ZDB External Components The MK2308-2 requires a minimum number of external components for proper operation. Decoupling capacitors of 0.1µF should be connected between VDD and GND, as close to the part as possible. A 33Ω series terminating resistor should be used on each clock output to reduce reflections. Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the MK2308-2. These ratings, which are standard values for ICS commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Item Rating Supply Voltage, VDD 7V All Inputs and Outputs -0.5 V to VDD+0.5 V Ambient Operating Temperature 0 to +70 ° C Storage Temperature -65 to +150 ° C Junction Temperature 175 ° C Soldering Temperature 260 ° C Recommended Operation Conditions Parameter Min. Max. Units 0 +70 °C +3.0 +5.5 V Ambient Operating Temperature Power Supply Voltage (measured in respect to GND) Typ. DC Electrical Characteristics VDD=3.3 V ±10%, Temp 0 to +70° / -40 to +85° C Parameter Symbol Conditions Operating Voltage VDD Input High Voltage VIH CLKIN pin only Input Low Voltage VIL CLKIN pin only Input High Voltage VIH Input Low Voltage VIL Output High Voltage VOH IOH = -18 mA Output Low Voltage VOL IOL = 18 mA Output High Voltage VOH IOH = -5 mA IDT™ ZERO DELAY, LOW SKEW BUFFER Min. Typ. Max. Units 3.0 3.3 3.6 V (VDD/2)+1 VDD/2 VDD/2 V (VDD/2)-1 2 V 0.8 3 V 2.4 V V 0.4 VDD-0.4 V V MK2308-2 REV E 051310 MK2308-2 ZERO DELAY, LOW SKEW BUFFER Parameter ZDB Symbol Conditions Operating Supply Current 100 MHz, CLKIN IDD No Load S1=S2=1 Short Circuit Current IOS Input Capacitance CIN Min. Typ. Max. Units 44 mA Each output ± 65 mA S1, S1, FBIN 7 pF AC Electrical Characteristics VDD = 3.3V ±10%, Temp 0 to +70° / -40 to +85° C Parameter Symbol Conditions Min. Typ. Max. Units Input Frequency FBIN to CLKA1 S1=S2=1 20 133. 3 MHz Output Frequency FBIN to CLKA1 S1=S2=1 20 133. 3 MHz Output Rise Time tOR 0.8 to 2.0 V, CL=30 pF 1.5 ns Output Fall Time tOF 0.8 to 2.0 V, CL=30 pF 1.5 ns 60 % Output Clock Duty Cycle at 1.4V 40 Device to Device skew, equally loaded rising edges at VDD/2 700 ps Output to Output skew, equally loaded rising edges at VDD/2 200 ps Maximum Absolute Jitter 50 300 Cycle to Cycle Jitter ps 30 pF loads 66.67 MHz outputs 400 ps 15 pF loads 66.67 MHz outputs 400 ps Skew from Output Bank A to Output Bank B All outputs equally loaded 400 ps Delay CLKIN Rising Edge to FBIN Rising Edge measured at VDD/2 ±250 ps 1 ms PLL Lock Time tLOCK Stable power supply, valid clocks on CLKIN, FBIN Thermal Characteristics Parameter Thermal Resistance Junction to Ambient Thermal Resistance Junction to Case IDT™ ZERO DELAY, LOW SKEW BUFFER Symbol Conditions Min. Typ. Max. Units θJA Still air 120 ° C/W θJA 1 m/s air flow 115 ° C/W θJA 3 m/s air flow 105 ° C/W 58 ° C/W θJC 4 MK2308-2 REV E 051310 MK2308-2 ZERO DELAY, LOW SKEW BUFFER ZDB Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body) Package dimensions are kept current with JEDEC Publication No. 95 Millimeters Symbol 16 E A A1 B C D E e H h L α H INDEX AREA 1 2 D Min Inches* Max 1.35 1.75 0.10 0.25 0.33 0.51 0.19 0.25 9.80 10.00 3.80 4.00 1.27 BASIC 5.80 6.20 0.25 0.50 0.40 1.27 0° 8° Min Max .0532 .0688 .0040 .0098 .013 .020 .0075 .0098 .3859 .3937 .1497 .1574 0.050 BASIC .2284 .2440 .010 .020 .016 .050 0° 8° *For reference only. Controlling dimensions in mm. A h x 45 A1 C -Ce B SEATING PLANE L .10 (.004) C Ordering Information Part / Order Number Marking Shipping Packaging Package Temperature MK2308S-2LF MK2308S-2LF Tubes 16-pin SOIC 0 to 70° C MK2308S-2LFT MK2308S-2LF Tape and Reel 16-pin SOIC 0 to 70° C MK2308S-2ILF 2308S-2ILF Tubes 16-pin SOIC -40 to +85° C MK2308S-2ILFT 2308S-2ILF Tape and Reel 16-pin SOIC -40 to +85° C "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. IDT™ ZERO DELAY, LOW SKEW BUFFER 5 MK2308-2 REV E 051310 MK2308-2 ZERO DELAY, LOW SKEW BUFFER ZDB Innovate with IDT and accelerate your future networks. Contact: www.IDT.com For Sales For Tech Support 800-345-7015 408-284-8200 Fax: 408-284-2775 www.idt.com/go/clockhelp Corporate Headquarters Integrated Device Technology, Inc. www.idt.com © 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. Printed in USA IMPORTANT NOTICE AND DISCLAIMER RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. Renesas grants you permission to use these resources only for development of an application that uses Renesas products. Other reproduction or use of these resources is strictly prohibited. No license is granted to any other Renesas intellectual property or to any third party intellectual property. Renesas disclaims responsibility for, and you will fully indemnify Renesas and its representatives against, any claims, damages, costs, losses, or liabilities arising out of your use of these resources. Renesas' products are provided only subject to Renesas' Terms and Conditions of Sale or other applicable terms agreed to in writing. No use of any Renesas resources expands or otherwise alters any applicable warranties or warranty disclaimers for these products. (Rev.1.0 Mar 2020) Corporate Headquarters Contact Information TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan www.renesas.com For further information on a product, technology, the most up-to-date version of a document, or your nearest sales office, please visit: www.renesas.com/contact/ Trademarks Renesas and the Renesas logo are trademarks of Renesas Electronics Corporation. All trademarks and registered trademarks are the property of their respective owners. © 2020 Renesas Electronics Corporation. All rights reserved.
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