MK5811CMILF

DATASHEET MK5811C LOW EMI CLOCK GENERATOR Description Features The MK5811C device generates a low EMI output clock from a clock or crystal input. The device is designed to dither a high emissions clock to lower EMI in consumer applications. Using IDT’s proprietary mix of analog and digital Phase Locked Loop (PLL) technology, the device spreads the frequency spectrum of the output and reduces the frequency amplitude peaks by several dB. The MK5811C offers both centered and down spread from a high-speed clock input. • • • • • Packaged in 8-pin SOIC • • • • • Input frequency range of 4 to 32 MHz • • • • Low EMI feature can be disabled For different multiplier configurations, use the MK5812 (2x) or MK5814C (4x). IDT offers many other clocks for computers and computer peripherals. Consult IDT when you need to remove crystals and oscillators from your board. Pb (lead) free package, RoHS compliant Provides a spread spectrum output clock Supports printers and flat panel controllers Accepts a clock or crystal input (provides same frequency dithered output) Output frequency range of 4 to 32 MHz 1X frequency multiplication Center and down spread Peak reduction by 8 dB to 16 dB typical on 3rd through 19th odd harmonics Operating voltage of 3.3 V Advanced, low-power CMOS process Industrial temperature range available (-40 to +85°C) Block Diagram VDD S1:0 2 Spread Direction PLL Clock Synthesis and Spread Spectrum Circuitry FRSEL X1/CLK SSCLK Clock Buffer/ Crystal Ocsillator X2 The crystal requires external capacitors for accurate tuning of the clock IDT™ LOW EMI CLOCK GENERATOR GND 1 MK5811C REV F 121409 MK5811C LOW EMI CLOCK GENERATOR SSCG Pin Assignment Spread Direction and Spread Percentage X1/ICLK 1 8 X2 GND 2 7 VDD S1 3 6 FRSEL S0 4 5 SSCLK 8-pin (150 mil) SOIC S1 Pin 3 S0 Pin 4 Spread Direction Spread Percentage 0 0 0 M M M 1 1 1 0 M 1 0 M 1 0 M 1 Center Center Center Center No Spread Down Down Down Down ±1.4 ±1.1 ±0.6 ±0.5 -1.6 -2.0 -0.7 -3.0 0 = connect to GND M = unconnected (floating) 1 = connect directly to VDD Frequency Selection Product FRSEL (pin 6) Input Freq. Range Multiplier Output Freq. Range MK5811C 0 4.0 to 8.0 MHz X1 4.0 to 8.0 MHz 1 8.0 to 16.0MHz X1 8.0 to 16.0MHz M 16.0 to 32.0MHz X1 16.0 to 32.0MHz 0 4.0 to 8.0 MHz X2 8.0 to 16.0MHz 1 8.0 to 16.0MHz X2 16.0 to 32.0MHz M 16.0 to 32.0MHz X2 32.0 to 64.0MHz 0 4.0 to 8.0 MHz X4 16.0 to 32.0MHz 1 8.0 to 16.0MHz X4 32.0 to 64.0MHz M 16.0 to 32.0MHz X4 64.0 to 128MHz MK58121 MK5814C1 0 = connect to GND M = unconnected (floating) 1 = connect directly to VDD Note 1: The information in this datasheet does not apply to the MK5812 and MK5814C as each have independent datasheets available at www.idt.com. IDT™ LOW EMI CLOCK GENERATOR 2 MK5811C REV F 121409 MK5811C LOW EMI CLOCK GENERATOR SSCG Pin Descriptions Pin Number Pin Name Pin Type Pin Description 1 X1/ICLK Input Connect to 4-32 MHz crystal or clock. 2 GND Power Connect to ground. 3 S1 Input Function select 1 input. Selects spread amount and direction per table above. (default-internal mid-level). 4 S0 Input Function select 0 input. Selects spread amount and direction per table above. (default-internal mid-level). 5 SSCLK Output 6 FRSEL Input Function select for input frequency range. Default to mid level “M”. 7 VDD Power Connect to +3.3 V. 8 X2 XO Clock output with Spread spectrum Crystal connection to 4-32 MHz crystal. Leave unconnected for clock External Components PCB Layout Recommendations For optimum device performance and lowest output phase noise, observe the following guidelines: The MK5811C requires a minimum number of external components for proper operation. 1) Mount the 0.01µF decoupling capacitor on the component side of the board as close to the VDD pin as possible. No vias should be used between the decoupling capacitor and VDD pin. The PCB trace to the VDD pin and the PCB trace to the ground via should be kept as short as possible. Decoupling Capacitor A decoupling capacitor of 0.01µF must be connected between VDD and GND on pins 7 and 2. Connect the capacitor as close to these pins as possible. For optimum device performance, mount the decoupling capacitor on the component side of the PCB. Avoid the use of vias in the decoupling circuit. 2) To minimize EMI, place the 20Ω series-termination resistor (if needed) close to the clock output. Series Termination Resistor 3) An optimum layout is one with all components on the same side of the board, thus minimizing vias through other signal layers. Other signal traces should be routed away from the MK5811C device. This includes signal traces located underneath the device, or on layers adjacent to the ground plane layer used by the device. Use series termination when the PCB trace between the clock output and the load is over 1 inch. To series terminate a 50Ω trace (a commonly used trace impedance), place a 20Ω resistor in series with the clock line. Place the resistor as close to the clock output pin as possible. The nominal impedance of the clock output is 30Ω. Tri-level Select Pin Operation The S1 and S0 select pins are tri-level, meaning that they have three separate states to make the selections shown in the table on page 2. To select the M (mid) level, the connection to these pins must be eliminated by either floating them originally, or tri-stating the GPIO pins which drive the select pins. IDT™ LOW EMI CLOCK GENERATOR 3 MK5811C REV F 121409 MK5811C LOW EMI CLOCK GENERATOR SSCG Crystal Information Modulation Rate The crystal used should be a fundamental mode (do not use third overtone), parallel resonant crystal. To optimize the initial accuracy, connect crystal capacitors from pins X1 to ground and X2 to ground. The value of these capacitors is given by the following equation: Spread Spectrum Clock Generators utilize frequency modulation (FM) to distribute energy over a specific band of frequencies. The maximum frequency of the clock (fmax) and minimum frequency of the clock (fmin) determine this band of frequencies. The time required to transition from fmin to fmax and back to fmin is the period of the Modulation Rate. The Modulation Rate of SSCG clocks are generally referred to in terms of frequency, or Crystal caps (pF) = (CL - 6) x 2 In the equation, CL is the crystal load capacitance. For example, a crystal with a 16 pF load capacitance uses two 20 pF [(16-6) x 2] capacitors. fmod = 1/Tmod The input clock frequency, fin, and the internal divider determine the Modulation Rate. Spread Spectrum Profile The Spread Spectrum modulation Rate, fmod, is given by the following formula: The MK5811C is a low EMI clock generator using a optimized frequency slew rate algorithm to facilitate down stream tracking of zero delay buffers and other PLL devices. fmod = fin/DR where; fmod is the Modulation Rate, fin is the Input Frequency and DR is the Divider Ratio as given in the “Modulation Rate Divider Ratios” table. Notice that Input Frequency Range is set by FRSEL. Modulation Rate Frequency Modulation Rate Divider Ratios Time IDT™ LOW EMI CLOCK GENERATOR 4 FRSEL Input Freq. Range Divider Ratio (DR) 0 4 to 8 MHz 128 1 8 to 16 MHz 256 M 16 to 32 MHz 512 MK5811C REV F 121409 MK5811C LOW EMI CLOCK GENERATOR SSCG Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the MK5811C. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device, at these or any other conditions, above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Item Rating Supply Voltage, VDD 7V All Inputs and Outputs -0.5 V to VDD+0.5 V Ambient Operating Temperature -40 to +85° C Storage Temperature -65 to +150° C Junction Temperature 125° C Soldering Temperature 260° C Recommended Operation Conditions Parameter Min. Typ. Max. Units Ambient Operating Temperature -40 +85 °C Power Supply Voltage (measured in respect to GND) +3.0 3.63 V Min. Typ. Max. Units 3.0 3.3 3.63 V 23 25 mA No load, at 3.3 V, Fin=24 MHz 30 mA No load, at 3.3 V, Fin=32 MHz 35 mA DC Electrical Characteristics Unless stated otherwise, VDD = 3.3 V ±10%, Ambient Temperature -40 to +85° C Parameter Symbol Operating Voltage VDD Supply Current IDD Input High Voltage Conditions No load, at 3.3 V, Fin=12 MHz VIH 0.85VDD VDD VDD V VIHM 0.4VDD 0.5VDD 0.6VDD V Input Low Voltage VIL 0.0 0.0 0.15VDD V Output High Voltage VOH CMOS, IOH = 12 mA 2.4 V Output High Voltage VOH IOH = 24 mA 2.0 V Output Low Voltage VOL IOL = -12 mA 0.4 V IOL = -24 mA 1.2 V Input middle Voltage Input Capacitance Nominal Output Impedance IDT™ LOW EMI CLOCK GENERATOR CIN1 S0, S1, FRSEL pins 4 6 pF CIN2 X1, X2 pins 6 9 pF ZO Ω 30 5 MK5811C REV F 121409 MK5811C LOW EMI CLOCK GENERATOR SSCG AC Electrical Characteristics Unless stated otherwise, VDD = 3.3 V ±10%, Ambient Temperature 0 to +85° C, CL = 15 pF Parameter Symbol Conditions Min. Typ. Input Clock Frequency 4 12 32 MHz Output Clock Frequency 4 12 32 MHz 60 % 50 55 % Input Clock Duty Cycle Time above VDD/2 40 Output Clock Duty Cycle Time above 1.5 V 45 1 Fin= 4 MHz, Fout = 4 MHz 350 800 ps Jitter1 Fin= 8 MHz, Fout = 8 MHz 250 450 ps Cycle-to-cycle Jitter Cycle-to-cycle Max. Units Output Rise Time tR 0.4 to 2.4 V 4.4 ns Output Fall Time tF 2.4 to 0.4 V 3.57 ns 8 to 16 dB EMI Peak Frequency Reduction Note 1: Spread is enabled. AC Electrical Characteristics Unless stated otherwise, VDD = 3.3 V ±10%, Ambient Temperature -40 to +85° C, CL = 15 pF Parameter Symbol Conditions Min. Typ. Input Clock Frequency 4 12 32 MHz Output Clock Frequency 4 12 32 MHz 60 % 50 55 % Fin = 6 MHz 450 650 ps Fin = 12 MHz 300 630 ps Fin = 24 MHz 300 520 ps Input Clock Duty Cycle Time above VDD/2 40 Output Clock Duty Cycle Time above 1.5 V 45 Cycle-to-cycle Jitter2 Max. Units Output Rise Time tR 0.4 to 2.4 V 4.4 ns Output Fall Time tF 2.4 to 0.4 V 3.57 ns 8 to 16 dB EMI Peak Frequency Reduction Note 2: Spread is enabled. IDT™ LOW EMI CLOCK GENERATOR 6 MK5811C REV F 121409 MK5811C LOW EMI CLOCK GENERATOR SSCG Thermal Characteristics for 8-pin SOIC Parameter Symbol Thermal Resistance Junction to Ambient Conditions Min. Max. Units θJA Still air 150 ° C/W θJA 1 m/s air flow 140 ° C/W θJA 3 m/s air flow 120 ° C/W 40 ° C/W θJC Thermal Resistance Junction to Case Typ. Characteristic Curves The following curves determine the characteristic behavior of the MK5811C when tested over a number of environmental and application-specific parameters. These are typical performance curves and are not meant to replace any parameter specified in DC and AC Characteristics tables. Jitter vs Input frequency (No Load) Bandwidth % vs Temperature 2.95 600 2.75 400 BW % CCJ (ps) 500 300 200 2.55 2.35 2.15 1.95 100 1.75 0 4 8 12 16 20 24 28 -40 32 -25 -10 5 20 35 Input Frequency (MHz) 6MHz IDD vs Frequency (FRSEL=0,1,M) 20 BW (%) IDD (mA) 25 15 10 5 0 4.5 5 5.5 6 6.5 7 7.5 8 FRSEL=1 IDT™ LOW EMI CLOCK GENERATOR 80 95 110 125 32MHz 3 2.9 2.8 2.7 2.6 2.5 2.4 2.3 2.2 2.1 2 1.9 1.8 2.8 Frequency (MHz), no load normalized to FRSEL=0, (4-8MHz) FRSEL=0 65 Bandwidth % vs VDD 30 4 50 Temp (C) 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 VDD (volts) FRSEL=M 4.0MHz 7 8MHz MK5811C REV F 121409 MK5811C LOW EMI CLOCK GENERATOR SSCG SSCG Profiles . Min: 5.925 MHz Max: 6.075 MHz Min: 23.67 MHz Max: 24.33 MHz Rate: 46.88 kHz Pk-Pk: Jitter: 130 ps Rate: 46.89 kHz Pk-Pk: Jitter: 365 ps Xin = 6.0 MHz SSCLK1 = 6.0 MHz Xin = 24.0 MHz SSCLK1 = 24.0 MHz S1, S0 = 0 S1, S0 = 0 FRSEL = 0 FRSEL = M P/N: MK5811C P/N: MK5811C Application Schematic VDD C3 7 VDD C2 27 pF C1 0.1 uF 1 SSCLK Y1 25 MHz 8 27 pF MK5811C MK5812 MK5814C S1 N/C 6 S0 FRSEL 5 25 MHz (MK5811C) 50 MHz (MK5812) 100 MHz (MK5814C) 3 4 GND 2 IDT™ LOW EMI CLOCK GENERATOR 8 MK5811C REV F 121409 MK5811C LOW EMI CLOCK GENERATOR SSCG Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Body) Package dimensions are kept current with JEDEC Publication No. 95 Millimeters 8 Symbol E Min A A1 B C D E e H h L α H INDEX AREA 1 2 D A Inches Max Min 1.35 1.75 0.10 0.25 0.33 0.51 0.19 0.25 4.80 5.00 3.80 4.00 1.27 BASIC 5.80 6.20 0.25 0.50 0.40 1.27 0° 8° Max .0532 .0688 .0040 .0098 .013 .020 .0075 .0098 .1890 .1968 .1497 .1574 0.050 BASIC .2284 .2440 .010 .020 .016 .050 0° 8° h x 45 A1 C -Ce B SEATING PLANE L .10 (.004) C Ordering Information Part / Order Number Marking Shipping Packaging Package Temperature MK5811CMLF MK5811CMLFT MK5811CMILF MK5811CMILFT 5811CML 5811CML 5811CMIL 5811CMIL Tubes Tape and Reel Tubes Tape and Reel 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC 0 to +85° C 0 to +85° C -40 to +85° C -40 to +85° C “LF” suffix to the part number are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology, Inc. (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. IDT™ LOW EMI CLOCK GENERATOR 9 MK5811C REV F 121409 MK5811C LOW EMI CLOCK GENERATOR SSCG Innovate with IDT and accelerate your future networks. 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