P9028AC-EVK

DRAFT Dual-Mode WPC/PMA 5 Watt Wireless Power Receiver IC P9028AC Features             Product Datasheet Introduction Single Chip Receiver (Rx) Solution WPC v1.1.2 Compliant PMA v1, v3 Pre-Release Compatible with Options Advanced WPC v1.1.2 Foreign Object Detection (FOD) Programmable FOD setting via external resistor and I2C registers Programmable current limit via external resistor Integrated Full-Bridge Synchronous Rectifier Integrated 5V @ 1A LDO Regulator Output Closed-loop power transfer control between TX and RX I2C interface provides VRECT, Iout and switching frequency values Open-Drain LED Indicator Output Over-Temperature/Voltage/Current Protection The P9028AC is an integrated single-chip, dual-mode WPC v1.1.2-compliant and PMA v1.0-compatible, wireless power receiver IC with advanced WPC v1.1.2 Foreign Object Detection (FOD). The device operates with an AC power signal from a resonant tank and converts it into a regulated 5V output voltage, which can be used to supply power to a mobile application. It includes a high efficiency Synchronous Full Bridge Rectifier and 5V tracking LDO output stage. The P9028AC dual-mode operation automatically detects the transmitter type and initiates either WPC or PMA AC modulation communication protocols with optimal efficiency. The device includes the control circuit required to modulate the load to transmit WPC-compliant or PMA-compatible message packets to the base station. It uses minimal external components to reduce overall solution area. The P9028AC employs advanced programmable WPC FOD techniques to detect foreign metallic objects placed on the transmitter base station derived from a transmitted and received power transfer algorithm. The P9028AC is available in a 36 ball 3mm X 3mm WLCSP or 32 pin 5mm X 5mm TQFN package. Applications  WPC-Compliant and PMA-Compatible Wireless Chargers for Mobile Applications.  Cellular Mobile Phones  Tablets, DSC, DVC and Handhelds Typical Application Circuit Packages: WLCSP-36 6x6 balls (3.06mm x 2.9mm) (See page 33) TQFN-32 5x5mm (See page 35) Ordering information: (See page 38) Revision 1.0.3 1 © 2015 Integrated Device Technology, Inc. P9028AC Product Datasheet SIMPLIFIED APPLICATION DIAGRAM Figure 1. Simplified Applications Schematic. Revision 1.0.3 2 © 2015 Integrated Device Technology, Inc. P9028AC Product Datasheet ABSOLUTE MAXIMUM RATINGS These absolute maximum ratings are stress ratings only. Stresses greater than those listed below (Table 1 and Table 2) may cause permanent damage to the device. Functional operation of the P9028AC at absolute maximum ratings is not implied. Application of the absolute maximum rating conditions affects device reliability. Table 1. Absolute Maximum Ratings Summary. Description Value Units -0.3 to 20 V -0.3 to (AC1, AC2 + 6) V EN, STAT, SCL, SDA, OUT, SNS, TEOP, RLIM, CS100, FOD1, FOD2, VDD -0.3 to 6 V PGND, PGND1, PGND2, AGND -0.3 to 0.3 V 1.5 A 2 ARMS AC1, AC2, VRECT, ACM1, ACM2, CLAMP1, CLAMP2 BST1, BST2 Output Current OUT Input Current AC1, AC2 Table 2. Package Thermal Information.1,2,3,4 TQFN Rating WLCSP Rating (7 thermal vias) Units 35 70 C/W Thermal Resistance Junction to Case 29.6 0.9 C/W JB Thermal Resistance Junction to Board 2.4 47.3 C/W TJ Operating Junction Temperature 0 to +125 0 to +125 C TA Operating Ambient Temperature 0 to +85 0 to +85 C TSTG Storage Temperature -55 to +150 -55 to +150 C TLEAD Maximum Soldering Temperature (at Leads, 10s) 300 300 C Symbol Description JA Thermal Resistance Junction to Ambient JC Note 1: The maximum power dissipation is PD(MAX) = (TJ(MAX) - TA) / θJA where TJ(MAX) is 125°C. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the device will enter thermal shutdown. Note 2: This thermal rating was calculated on JEDEC 51 standard 4-layer board with dimensions 3” x 4.5” in still air conditions. Note 3: Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted variables. Note 4: For the NBG32 package, connecting the 5 mm X 5 mm EP to internal/external ground planes with a 5x5 matrix of PCB plated-through-hole (PTH) vias, from top to bottom sides of the PCB, is recommended for improving the overall thermal performance. For the WLCSP (AWG36) package, connecting the 7 thermal balls to internal/external ground planes from top to bottom sides of the PCB, is recommended for improving the overall thermal performance. Table 3. ESD Information. Test Model Pins Rating Units HBM All ±1500 V CDM All ±500 V Revision 1.0.3 3 © 2015 Integrated Device Technology, Inc. P9028AC Product Datasheet ELECTRICAL SPECIFICATION TABLE VRECT=6V, COUT=1uF, CVRECT=20uF, VEN=0V, TA = 0C to 85C, unless otherwise noted. Typical values are at 25°C, unless otherwise noted. Table 4. Device Characteristics. Symbol Description Under-voltage Lock-out Under-voltage lockout VUVLO UVLO hysteresis VUVLO-HYS Over-voltage Protection Over-voltage VRECT VOVP Over-voltage hysteresis VOVP-HYS Power Supply Current IRECT Quiescent current Conditions Min Typ Max Units Rising voltage on VRECT 2.3 2.5 50 2.7 V mV Rising voltage on VRECT 12.8 13.3 1.5 13.8 V V 14 2 16 3 18 4 mA mA 1.15 1.6 1.95 2.0 A 5.04 5.3 5.56 V 4.44 4.54 4.64 V IOUT = 0mA, with internal load IOUT = 0mA, no internal load Low-drop-out Regulator RLIM=30kΩ Output current limit ILIM OUT RLIM