UPC4081G2-E1-A

To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. 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The key features of this op amp is very low input bias current and high slew rate ten times faster than conventional general purpose op amps. By these features µPC4081 is excellent choice for wide variety of applications including integrator, active filter, pulse amp etc. FEATURES • Low noise: en = 25 nV/ Hz (TYP.) • Very low input bias and offset currents • Output short circuit protection • High input impedance...J-FET Input stage • Internal frequency compensation • High slew rate...13 V/µs (TYP.) ORDERING INFORMATION Part Number Package µPC4081C 8-pin plastic DIP (7.62 mm (300)) µPC4081G2 8-pin plastic SOP (5.72 mm (225)) PIN CONFIGURATION (Top View) EQUIVALENT CIRCUIT V (7) R1 Q14 Q1 Q2 Q8 Q16 R8 II 2 IN 3 7 V+ Q10 IN (3) C1 Q6 Q7 OFFSET NULL 8 NC Q12 (2) II (1) OFFSET 1 NULL Q9 Q5 µ PC4081C, 4081G2 + R2 R3 R4 Q13 D1 Q4 (5) Q3 R9 R6 R10 Q15 OUT (6) Q11 R5 OFFSET NULL R11 V D2 _ _ + 6 OUT OFFSET 5 NULL 4 R7 V (4) – Remark NC : No Connection The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. G15343EJ3V0DS00 (3rd edition) (Previous No. IC-1974) Date Published February 2001 NS CP(K) Printed in Japan The mark ★ shows major revised points. © 1987 µPC4081 ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Parameter + Voltage between V and V Symbol – Note 1 V+ – V– Differential Input Voltage VID Note 2 Input Voltage Output Voltage C Power Dissipation Note 4 Package Unit –0.3 to +36 V ±30 V – + – + V –0.3 to V +0.3 VI Note 3 Ratings V VO V –0.3 to V +0.3 V PT 350 mW 440 mW Indefinite sec Note 5 G2 Package Note 6 Output Short Circuit Duration Operating Ambient Temperature TA –20 to +80 °C Storage Temperature Tstg –55 to +125 °C Notes 1. Reverse connection of supply voltage can cause destruction. 2. The input voltage should be allowed to input without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destructive. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical characteristics. 4. Thermal derating factor is –5.0 mV/°C when operating ambient temperature is higher than 55°C. 5. Thermal derating factor is –4.4 mV/°C when operating ambient temperature is higher than 25°C. 6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. Supply Voltage V± ±5 ★ Output Current ★ Capacitive Load (AV = +1, Rf = 0 Ω) TYP. MAX. Unit ±16 V IO ±10 mA CL 100 pF OFFSET VOLTAGE NULL CIRCUIT 2 _ ★ Remark The OFFSET NULL pins should be left 6 3 5 + 1 – open or connected to V via a resistor as shown in the left figure. Don't connect to – 100 kΩ VR1 any lines other than V , otherwise mulfunction, degradation, or failure may occur. V 2 _ Data Sheet G15343EJ3V0DS µPC4081 ELECTRICAL CHARACTERISTICS (TA = 25°C, V± = ±15 V) Parameter Input Offset Voltage Input Bias Current TYP. MAX. Unit ±5 ±15 mV IIO ±5 ±200 pA IB 30 400 pA 2.8 mA VIO Note 7 Input Offset Current Symbol Note 7 Conditions MIN. RS ≤ 50 Ω Large Signal Voltage Gain AV RL ≥ 2 kΩ , VO = ±10 V Supply Current ICC IO = 0 A Common Mode Rejection Ratio CMR 70 76 dB Supply Voltage Rejection Ratio SVR 70 76 dB Output Voltage Swing Vom RL ≥ 10 kΩ ±12 ±13.5 V RL ≥ 2 kΩ ±10 ±12 V ±10 +15 V Common Model Input Voltage Range VICM 25000 200000 2.0 –12.7 V/µs 3 MHz 25 nV/√Hz SR Unity Gain Frequency funity Input Equivalent Noise Voltage Density en RS = 100 Ω, f = 1 kHz Input Offset Voltage VIO RS ≤ 50 Ω, TA = –20 to +70°C Average VIO Temperature Drift ∆VIO/∆T TA = –20 to +70°C IIO TA = –20 to +70°C ±5 nA IB TA = –20 to +70°C 10 nA Input Offset Current Input Bias Current Note 7 Note 7 AV = 1 13 Slew Rate ±20 mV µV/°C ±10 Notes 7. Input bias currents flow into IC. Because each currents are gate leak current of P-channel J-FET on input stage. And that are temperature sensitive. Short time measuring method is recommendable to maintain the junction temperature close to the operating ambient temperature. Data Sheet G15343EJ3V0DS 3 µPC4081 TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C, TYP.) POWER DISSIPATION OPEN LOOP FREQUENCY RESPONSE 120 500 400 AV - Open Loop Voltage Gain - dB PT - Total Power Dissipation - mW 600 µ PC4081G2 µ PC4081C 200˚C/W 300 200 227˚C/W 100 20 0 40 60 80 V ± = ±15 V RL = 2 kΩ 100 80 60 40 20 0 100 1 10 100 TA - Operating Ambient Temperature - ˚C 4 2 0 -2 -4 100 ± V = ±15 V IB - Input Bias Current - nA VIO - Input Offset Voltage - mV 6 10 M INPUT BIAS CURRENT V ± = ±15 V The characteristic of the optional sample. (Quantity:five) 8 10 k 100 k 1 M f - Frequency - Hz INPUT OFFSET VOLTAGE 10 1k 10 1.0 0.1 -6 0.01 -20 -8 -10 -40 0 -20 20 40 60 0 20 40 60 80 TA - Operating Ambient Temperature - ˚C 80 TA - Operating Ambient Temperature - ˚C LARGE SIGNAL FREQUENCY RESPONSE OUTPUT VOLTAGE SWING 40 30 Vom - Output Voltage Swing - Vp-p Vom - Output Voltage Swing - Vp-p 20 V ± = ±10 V 10 ± V = ±5 V 0 100 1k 10 k RL = 10 kΩ RL = 10 kΩ ± V = ±15 V 100 k 1M 10 M 30 20 10 ± f - Frequency - Hz 4 ±10 0 V - Supply Voltage - V Data Sheet G15343EJ3V0DS ±20 µPC4081 OUTPUT VOLTAGE SWING V ± = ±15 V ICC - Supply Current - mA Vom - Output Voltage Swing - Vp-p 30 SUPPLY CURRENT 3.5 20 10 0 100 3.0 2.5 2.0 1.5 1.0 0.5 300 1K 3k 10 k ±5 0 V± = ±15 V RS = 100 Ω 103 102 10 10 k 100 k VI - Input Voltage - V / VO - Output Voltage - V en - Input Equivalent Noise Voltage Density - nV/ Hz 104 1k ±20 VOLTAGE FOLLOWER PULSE RESPONSE INPUT EQUIVALENT NOISE VOLTAGE DENSITY 100 ±15 V ± - Supply Voltage - V RL - Load Resistance -Ω 0 10 ±10 AV = +1 RL = 2 kΩ CL = 100 pF V ± = ±15 V 5 0 -5 5 0 -5 0 f - Frequency - Hz 1 2 3 4 t - Time - µs Data Sheet G15343EJ3V0DS 5 µPC4081 ★ PACKAGE DRAWINGS (Unit : mm) 8-PIN PLASTIC DIP (7.62mm(300)) 8 5 1 4 A K J L P I C H G B M R F D N M NOTES 1. Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition. 2. ltem "K" to center of leads when formed parallel. ITEM MILLIMETERS A B 10.16 MAX. 1.27 MAX. C 2.54 (T.P.) D 0.50±0.10 F 1.4 MIN. G H 3.2±0.3 0.51 MIN. I J 4.31 MAX. 5.08 MAX. K 7.62 (T.P.) L 6.4 M 0.25 +0.10 −0.05 N 0.25 P 0.9 MIN. R 0∼15° P8C-100-300B,C-2 6 Data Sheet G15343EJ3V0DS µPC4081 8-PIN PLASTIC SOP (5.72 mm (225)) 8 5 detail of lead end P 4 1 A H F I G J S B C D M L N K S M E NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 5.2 +0.17 −0.20 B 0.78 MAX. C 1.27 (T.P.) D 0.42 +0.08 −0.07 E 0.1±0.1 F 1.59±0.21 G 1.49 H 6.5±0.3 I 4.4±0.15 J 1.1±0.2 K 0.17 +0.08 −0.07 L 0.6±0.2 M 0.12 N 0.10 P 3° +7° −3° S8GM-50-225B-6 Data Sheet G15343EJ3V0DS 7 µPC4081 ★ RECOMMENDED SOLDERING CONDITIONS When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL"(C10535E). Type of Surface Mount Device µPC4081G2: 8-pin plastic SOP (5.72 mm (225)) Process Infrared Ray Reflow Conditions Symbol Peak temperature: 230°C or below (Package surface temperature), IR30-00-1 Reflow time: 30 seconds or less (at 210°C or higher), Maximum number of reflow processes: 1 time. Vapor Phase Soldering Peak temperature: 215°C or below (Package surface temperature), VP15-00-1 Reflow time: 40 seconds or less (at 200°C or higher), Maximum number of reflow processes: 1 time. Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less, WS60-00-1 Maximum number of flow processes: 1 time, Pre-heating temperature: 120°C or below (Package surface temperature). Partial Heating Method Pin temperature: 300°C or below, – Heat time: 3 seconds or less (Per each side of the device). Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. Type of Through-hole Device µPC4081C: 8-pin plastic DIP (7.62 mm (300)) Process Conditions Wave Soldering Solder temperature: 260°C or below, (only to leads) Flow time: 10 seconds or less. Partial Heating Method Pin temperature: 300°C or below, Heat time: 3 seconds or less (per each lead). Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. 8 Data Sheet G15343EJ3V0DS µPC4081 [MEMO] Data Sheet G15343EJ3V0DS 9 µPC4081 [MEMO] 10 Data Sheet G15343EJ3V0DS µPC4081 [MEMO] Data Sheet G15343EJ3V0DS 11 µPC4081 • The information in this document is current as of February, 2001. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. • NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. • NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4