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X9250TS24T1

X9250TS24T1

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    SOIC24

  • 描述:

    IC DGT POT 100KOHM 256TAP 24SOIC

  • 详情介绍
  • 数据手册
  • 价格&库存
X9250TS24T1 数据手册
DATASHEET X9250 FN8165 Rev.3.00 August 29, 2006 Low Noise/Low Power/SPI Bus/256 Taps Quad Digitally Controlled Potentiometers (XDCP™) FEATURES DESCRIPTION • • • • • • • • The X9250 integrates 4 digitally controlled potentiometers (XDCP) on a monolithic CMOS integrated circuit. • • • • • Four potentiometers in one package 256 resistor taps/pot - 0.4% resolution SPI serial interface Wiper resistance, 40 typical @ VCC = 5V Four nonvolatile data registers for each pot Nonvolatile storage of wiper position Standby current < 5µA max (total package) Power supplies —VCC = 2.7V to 5.5V —V+ = 2.7V to 5.5V —V– = -2.7V to -5.5V 100k, 50k total pot resistance High reliability —Endurance – 100,000 data changes per bit per register —Register data retention - 100 years 24 Ld SOIC, 24 Ld TSSOP Dual supply version of X9251 Pb-free plus anneal available (RoHS compliant) The digitally controlled potentiometer is implemented using 255 resistive elements in a series array. Between each element are tap points connected to the wiper terminal through switches. The position of the wiper on the array is controlled by the user through the SPI bus interface. Each potentiometer has associated with it a volatile Wiper Counter Register (WCR) and 4 nonvolatile Data Registers (DR0:DR3) that can be directly written to and read by the user. The contents of the WCR controls the position of the wiper on the resistor array though the switches. Power up recalls the contents of DR0 to the WCR. The XDCP can be used as a three-terminal potentiometer or as a two-terminal variable resistor in a wide variety of applications including control, parameter adjustments, and signal processing. BLOCK DIAGRAM VCC VSS V+ V- Pot 0 R0 R1 R2 R3 HOLD CS SCK SO SI A0 A1 Interface and Control Circuitry WP VL0/RL0 R0 R1 R2 R3 Wiper Counter Register (WCR) Resistor Array Pot 2 VH2/RH2 VL2/RL2 VW0/RW0 VW2/RW2 VW1/RW1 VW3/RW3 8 Data R0 R1 R2 R3 FN8165 Rev.3.00 August 29, 2006 VH0/RH0 Wiper Counter Register (WCR) Wiper Counter Register (WCR) Resistor Array Pot1 VH1/RH1 VL1/RL1 R0 R1 R2 R3 Wiper Counter Register (WCR) Resistor Array Pot 3 VH3/RH3 VL3/RH3 Page 1 of 20 X9250 Ordering Information PART NUMBER PART MARKING VCC LIMITS (V) POTENTIOMETER ORGANIZATION (k) TEMP. RANGE (°C) PACKAGE 5 ±10% 100 -40 to +85 24 Ld SOIC (300 mil) M24.3 PKG. DWG. # X9250TS24I X9250TS I X9250TS24IZ (Note) X9250TS ZI -40 to +85 24 Ld SOIC (300 mil) (Pb-free) M24.3 X9250TV24I X9250TV I -40 to +85 24 Ld TSSOP (4.4mm) MDP0044 X9250TV24IZ (Note) X9250TV ZI -40 to +85 24 Ld TSSOP (4.4mm) (Pb-free) MDP0044 X9250US24 X9250US 0 to +70 24 Ld SOIC (300 mil) M24.3 X9250US24Z (Note) X9250US Z 0 to +70 24 Ld SOIC (300 mil) (Pb-free) M24.3 X9250US24I X9250US I -40 to +85 24 Ld SOIC (300 mil) M24.3 X9250US24IZ (Note) X9250US ZI -40 to +85 24 Ld SOIC (300 mil) (Pb-free) M24.3 X9250UV24I X9250UV I -40 to +85 24 Ld TSSOP (4.4mm) MDP0044 X9250UV24IZ (Note) X9250UV ZI -40 to +85 24 Ld TSSOP (4.4mm) (Pb-free) MDP0044 X9250TS24-2.7 X9250TS F 0 to +70 24 Ld SOIC (300 mil) M24.3 0 to +70 24 Ld SOIC (300 mil) (Pb-free) M24.3 50 -2.7 to 5.5 100 X9250TS24Z-2.7 (Note) X9250TS ZF X9250TS24I-2.7* X9250TS G -40 to +85 24 Ld SOIC (300 mil) M24.3 X9250TS24IZ-2.7* (Note) X9250TS ZG -40 to +85 24 Ld SOIC (300 mil) (Pb-free) M24.3 X9250TV24I-2.7 X9250TV G -40 to +85 24 Ld TSSOP (4.4mm) MDP0044 -40 to +85 24 Ld TSSOP (4.4mm) (Pb-free) MDP0044 0 to +70 24 Ld SOIC (300 mil) M24.3 0 to +70 24 Ld SOIC (300 mil) (Pb-free) M24.3 -40 to +85 24 Ld SOIC (300 mil) M24.3 -40 to +85 24 Ld SOIC (300 mil) (Pb-free) M24.3 0 to +70 24 Ld TSSOP (4.4mm) MDP0044 0 to +70 24 Ld TSSOP (4.4mm) (Pb-free) MDP0044 -40 to +85 24 Ld TSSOP (4.4mm) MDP0044 -40 to +85 24 Ld TSSOP (4.4mm) (Pb-free) MDP0044 X9250TV24IZ-2.7 (Note) X9250TV ZG X9250US24-2.7* X9250US F X9250US24Z-2.7* (Note) X9250US ZF X9250US24I-2.7 X9250US G X9250US24IZ-2.7 (Note) X9250US ZG X9250UV24-2.7 X9250UV F X9250UV24Z-2.7 (Note) X9250UV ZF X9250UV24I-2.7 X9250UV G X9250UV24IZ-2.7 (Note) X9250UV ZG 50 *Add "T1" suffix for tape and reel. NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. FN8165 Rev.3.00 August 29, 2006 Page 2 of 20 X9250 PIN DESCRIPTIONS VW/RW (VW0/RW0 - VW3/RW3) Serial Output (SO) The wiper pins are equivalent to the wiper terminal of a mechanical potentiometer. SO is a serial data output pin. During a read cycle, data is shifted out on this pin. Data is clocked out by the falling edge of the serial clock. Serial Input SI is the serial data input pin. All opcodes, byte addresses and data to be written to the pots and pot registers are input on this pin. Data is latched by the rising edge of the serial clock. Serial Clock (SCK) Hardware Write Protect Input (WP) The WP pin when LOW prevents nonvolatile writes to the Data Registers. Analog Supplies (V+, V-) The analog supplies V+, V- are the supply voltages for the XDCP analog section. PIN CONFIGURATION The SCK input is used to clock data into and out of the X9250. SOIC/TSSOP S0 1 24 HOLD A0 2 23 SCK VW3/RW3 3 22 VL2/RL2 VH3/RH3 4 21 VH2/RL2 VL3/RL3 5 20 VW2/RW2 19 V– 18 VSS Chip Select (CS) When CS is HIGH, the X9250 is deselected and the SO pin is at high impedance, and (unless an internal write cycle is underway) the device will be in the standby state. CS LOW enables the X9250, placing it in the active power mode. It should be noted that after a power-up, a HIGH to LOW transition on CS is required prior to the start of any operation. Hold (HOLD) HOLD is used in conjunction with the CS pin to select the device. Once the part is selected and a serial sequence is underway, HOLD may be used to pause the serial communication with the controller without resetting the serial sequence. To pause, HOLD must be brought LOW while SCK is LOW. To resume communication, HOLD is brought HIGH, again while SCK is LOW. If the pause feature is not used, HOLD should be held HIGH at all times. Device Address (A0 - A1) V+ 6 VCC 7 VL0/RL0 8 17 VW1/RW1 X9250 VH0/RH0 9 16 VH1/RH1 VW0/RW0 10 15 VL1/RL1 CS 11 14 A1 WP 12 13 SI PIN NAMES Symbol Description SCK Serial Clock SI, SO Serial Data The address inputs are used to set the least significant 2 bits of the 8-bit slave address. A match in the slave address serial data stream must be made with the address input in order to initiate communication with the X9250. A maximum of 4 devices may occupy the SPI serial bus. A0-A1 Device Address VH0/RH0–VH3/RH3, VL0/RL0–VL3/RL3 Potentiometer Pins (terminal equivalent) VW0/RW0–VW3/RW3 Potentiometer Pins (wiper equivalent) Potentiometer Pins WP Hardware Write Protection V+,V- Analog Supplies VCC System Supply Voltage VSS System Ground NC No Connection VH/RH (VH0/RH0 - VH3/RH3), VL/RL (VL0/RL0 - VL3/RL3) The RH and RL pins are equivalent to the terminal connections on a mechanical potentiometer. FN8165 Rev.3.00 August 29, 2006 Page 3 of 20 X9250 DEVICE DESCRIPTION Serial Interface The X9250 supports the SPI interface hardware conventions. The device is accessed via the SI input with data clocked in on the rising SCK. CS must be LOW and the HOLD and WP pins must be HIGH during the entire operation. The SO and SI pins can be connected together, since they have three state outputs. This can help to reduce system pin count. Array Description The X9250 is comprised of four resistor arrays. Each array contains 255 discrete resistive segments that are connected in series. The physical ends of each array are equivalent to the fixed terminals of a mechanical potentiometer (VH/RH and VL/RL inputs). At both ends of each array and between each resistor segment is a CMOS switch connected to the wiper (VW/RW) output. Within each individual array only one switch may be turned on at a time. These switches are controlled by a Wiper Counter Register (WCR). The 8 bits of the WCR are decoded to select, and enable, one of 256 switches. Wiper Counter Register (WCR) The X9250 contains four Wiper Counter Registers, one for each XDCP potentiometer. The WCR is equivalent to a serial-in, parallel-out register/counter with its outputs decoded to select one of 256 switches along its resistor array. The contents of the WCR can be altered in four ways: it may be written directly by the host via the write Wiper Counter Register instruction (serial load); it may be written indirectly by transferring the contents of one of four associated Data Registers via the XFR Data Register or Global XFR Data Register instructions (parallel load); it can be modified one step at a time by the increment/decrement instruction. Finally, it is loaded with the contents of its Data Register zero (DR0) upon power-up. The Wiper Counter Register is a volatile register; that is, its contents are lost when the X9250 is powered-down. Although the register is automatically loaded with the value in R0 upon power-up, this may be different from the value present at power-down. Data Registers Each potentiometer has four 8-bit nonvolatile Data Registers. These can be read or written directly by the host. Data can also be transferred between any of the four Data Registers and the associated Wiper Counter Register. All operations changing data in one of the Data Registers is a nonvolatile operation and will take a maximum of 10ms. If the application does not require storage of multiple settings for the potentiometer, the Data Registers can be used as regular memory locations for system parameters or user preference data. Data Register Detail (MSB) FN8165 Rev.3.00 August 29, 2006 (LSB) D7 D6 D5 D4 D3 D2 D1 D0 NV NV NV NV NV NV NV NV Page 4 of 20 X9250 Figure 1. Detailed Potentiometer Block Diagram (One of Four Arrays) Serial Data Path VH/RH Serial Bus Input From Interface Circuitry Register 0 8 Register 2 8 Parallel Bus Input Wiper Counter Register (WCR) Register 3 If WCR = 00[H] then VW/RW = VL/RL If WCR = FF[H] then VW/RW = VH/RH C o u n t e r Register 1 UP/DN Modified SCK D e c o d e Inc/Dec Logic UP/DN VL/RL CLK VW/RW Write in Process The contents of the Data Registers are saved to nonvolatile memory when the CS pin goes from LOW to HIGH after a complete write sequence is received by the device. The progress of this internal write operation can be monitored by a write in process bit (WIP). The WIP bit is read with a read status command. Figure 2. Identification Byte Format Device Type Identifier 0 1 0 1 0 The first byte sent to the X9250 from the host, following a CS going HIGH to LOW, is called the Identification byte. The most significant four bits of the slave address are a device type identifier, for the X9250 this is fixed as 0101[B] (refer to Figure 2). The two least significant bits in the ID byte select one of four devices on the bus. The physical device address is defined by the state of the A0 - A1 input pins. The X9250 compares the serial data stream with the address input state; a successful compare of both address bits is required for the X9250 to successfully continue the command sequence. The A0 - A1 inputs can be actively driven by CMOS input signals or tied to VCC or VSS. The remaining two bits in the slave byte must be set to 0. The four high order bits of the instruction byte specify the operation. The next two bits (R1 and R0) select one of the four registers that is to be acted upon when a FN8165 Rev.3.00 August 29, 2006 A1 A0 Device Address INSTRUCTIONS Identification (ID) Byte 0 Instruction Byte The next byte sent to the X9250 contains the instruction and register pointer information. The four most significant bits are the instruction. The next four bits point to one of the four pots and, when applicable, they point to one of four associated registers. The format is shown below in Figure 3. Figure 3. Instruction Byte Format Register Select I3 I2 I1 Instructions I0 R1 R0 P1 P0 Pot Select register oriented instruction is issued. The last two bits (P1 and P0) selects which one of the four potentiometers is to be affected by the instruction. Page 5 of 20 X9250 Four of the ten instructions are two bytes in length and end with the transmission of the instruction byte. These instructions are: – XFR Data Register to Wiper Counter Register—This transfers the contents of one specified Data Register to the associated Wiper Counter Register. – XFR Wiper Counter Register to Data Register—This transfers the contents of the specified Wiper Counter Register to the specified associated Data Register. – Global XFR Data Register to Wiper Counter Regiter— This transfers the contents of all specified Data Registers to the associated Wiper Counter Registers. – Global XFR Wiper Counter Register to Data Regiter— This transfers the contents of all Wiper Counter Registers to the specified associated Data Registers. The basic sequence of the two byte instructions is illustrated in Figure 4. These two-byte instructions exchange data between the WCR and one of the Data Registers. A transfer from a Data Register to a WCR is essentially a write to a static RAM, with the static RAM controlling the wiper position. The response of the wiper to this action will be delayed by tWRL. A transfer from the WCR (current wiper position), to a Data Register is a write to nonvolatile memory and takes a minimum of tWR to complete. The transfer can occur between one of the four potentiometers and one of its associated registers; or it may occur globally, where the transfer occurs between all potentiometers and one associated register. FN8165 Rev.3.00 August 29, 2006 Five instructions require a three-byte sequence to complete. These instructions transfer data between the host and the X9250; either between the host and one of the data registers or directly between the host and the Wiper Counter Register. These instructions are: – Read Wiper Counter Register—read the current wiper position of the selected pot, – Write Wiper Counter Register—change current wiper position of the selected pot, – Read Data Register—read the contents of the selected data register; – Write Data Register—write a new value to the selected data register. – Read Status—This command returns the contents of the WIP bit which indicates if the internal write cycle is in progress. The sequence of these operations is shown in Figure 5 and Figure 6. The final command is Increment/Decrement. It is different from the other commands, because it’s length is indeterminate. Once the command is issued, the master can clock the selected wiper up and/or down in one resistor segment steps; thereby, providing a fine tuning capability to the host. For each SCK clock pulse (tHIGH) while SI is HIGH, the selected wiper will move one resistor segment towards the VH/RH terminal. Similarly, for each SCK clock pulse while SI is LOW, the selected wiper will move one resistor segment towards the VL/RL terminal. A detailed illustration of the sequence and timing for this operation are shown in Figure 7 and Figure 8. Page 6 of 20 X9250 Figure 4. Two-Byte Instruction Sequence CS SCK SI 0 1 0 1 0 0 A1 A0 I3 I2 I1 I0 R1 R0 P1 P0 Figure 5. Three-Byte Instruction Sequence (Write) CS SCL SI 0 1 0 0 1 0 A1 A0 I3 I2 I1 I0 R1 R0 P1 P0 D7 D6 D5 D4 D3 D2 D1 D0 Figure 6. Three-Byte Instruction Sequence (Read) CS SCL SI Don’t Care 0 1 0 0 1 0 A1 A0 I3 I2 I1 I0 R1 R0 P1 P0 S0 D7 D6 D5 D4 D3 D2 D1 D0 Figure 7. Increment/Decrement Instruction Sequence CS SCK SI 0 1 FN8165 Rev.3.00 August 29, 2006 0 1 0 0 A1 A0 I3 I2 I1 I0 0 0 P1 P0 I N C 1 I N C 2 I N C n D E C 1 D E C n Page 7 of 20 X9250 Figure 8. Increment/Decrement Timing Limits tWRID SCK SI Voltage Out VW/RW INC/DEC CMD Issued Table 1. Instruction Set Instruction Read Wiper Counter Register Write Wiper Counter Register Read Data Register I3 1 I2 0 Instruction Set I1 I0 R1 R0 0 1 0 0 P1 P1 P0 P0 1 0 1 0 0 0 P1 P0 1 0 1 1 R1 R0 P1 P0 Write Data Register 1 1 0 0 R1 R0 P1 P0 XFR Data Register to Wiper Counter Register 1 1 0 1 R1 R0 P1 P0 XFR Wiper Counter Register to Data Register 1 1 1 0 R1 R0 P1 P0 Global XFR Data Register to Wiper Counter Register 0 0 0 1 R1 R0 0 0 Global XFR Wiper Counter Register to Data Register 1 0 0 0 R1 R0 0 0 Increment/Decrement Wiper Counter Register Read Status (WIP bit) 0 0 1 0 0 0 P1 P0 0 1 0 1 0 0 0 1 FN8165 Rev.3.00 August 29, 2006 Operation Read the contents of the Wiper Counter Register pointed to by P1- P0 Write new value to the Wiper Counter Register pointed to by P1- P0 Read the contents of the Data Register pointed to by P1- P0 and R1- R0 Write new value to the Data Register pointed to by P1- P0 and R1- R0 Transfer the contents of the Data Register pointed to by R1- R0 to the Wiper Counter Register pointed to by P1- P0 Transfer the contents of the Wiper Counter Register pointed to by P1- P0 to the Register pointed to by R1- R0 Transfer the contents of the Data Registers pointed to by R1- R0 of all four pots to their respective Wiper Counter Register Transfer the contents of all Wiper Counter Registers to their respective data Registers pointed to by R1- R0 of all four pots Enable Increment/decrement of the Wiper Counter Register pointed to by P1- P0 Read the status of the internal write cycle, by checking the WIP bit. Page 8 of 20 X9250 Instruction Format Notes: (1) (2) (2) (3) “A1 ~ A0”: stands for the device addresses sent by the master. WPx refers to wiper position data in the Counter Register “I”: stands for the increment operation, SI held HIGH during active SCK phase (high). “D”: stands for the decrement operation, SI held LOW during active SCK phase (high). Read Wiper Counter Register(WCR) device type device identifier addresses CS Falling Edge 0 1 0 1 0 0 A A 1 0 instruction opcode 1 0 0 1 WCR addresses 0 0 P 1 wiper position (sent by X9250 on SO) CS Rising W W W W W W W W P P P P P P P P P Edge 0 7 6 5 4 3 2 1 0 Write Wiper Counter Register (WCR) device type device identifier addresses CS Falling Edge 0 1 0 1 0 0 A A 1 0 instruction opcode 1 0 1 0 WCR addresses 0 0 P 1 Data Byte (sent by Host on SI) CS Rising W W W W W W W W P P P P P P P P P Edge 0 7 6 5 4 3 2 1 0 Read Data Register (DR) device type identifier device addresses CS Falling Edge 0 1 0 1 0 0 A 1 A 0 instruction opcode DR and WCR addresses 1 0 1 1 R 1 R 0 P 1 Data Byte (sent by X9250 on SO) CS W W W W W W W W Rising P P P P P P P P P Edge 0 7 6 5 4 3 2 1 0 Write Data Register (DR) device type identifier device addresses CS Falling Edge 0 1 0 1 0 0 A 1 A 0 instruction opcode DR and WCR addresses 1 1 0 0 R 1 R 0 P 1 Data Byte (sent by host on SI) CS W W W W W W W W Rising P P P P P P P P P Edge 0 7 6 5 4 3 2 1 0 HIGH-VOLTAGE WRITE CYCLE Transfer Data Register (DR) to Wiper Counter Register (WCR) device type device instruction DR and WCR CS CS identifier addresses opcode addresses Falling Rising Edge 0 1 0 1 0 0 A A 1 1 0 1 R1 R0 P1 P0 Edge 1 0 FN8165 Rev.3.00 August 29, 2006 Page 9 of 20 X9250 Transfer Wiper Counter Register (WCR) to Data Register (DR) device type device CS identifier addresses Falling Edge 0 1 0 1 0 0 A A 1 0 instruction opcode DR and WCR addresses 1 1 1 0 R 1 R 0 P 1 CS Rising P Edge 0 HIGH-VOLTAGE WRITE CYCLE Increment/Decrement Wiper Counter Register (WCR) device type device instruction WCR increment/decrement CS CS identifier addresses opcode addresses (sent by master on SI) Falling Rising Edge 0 1 0 1 0 0 A A 0 0 1 0 X X P P I/D I/D . . . . I/D I/D Edge 1 0 1 0 Global Transfer Data Register (DR) to Wiper Counter Register (WCR) device type device instruction DR CS CS identifier addresses opcode addresses Falling Rising Edge 0 1 0 1 0 0 A A 0 0 0 1 R R 0 0 Edge 1 0 1 0 Global Transfer Wiper Counter Register (WCR) to Data Register (DR) device type device instruction DR CS CS identifier addresses opcode addresses Falling Rising Edge 0 1 0 1 0 0 A A 1 0 0 0 R R 0 0 Edge 1 0 1 0 HIGH-VOLTAGE WRITE CYCLE Read Status device type identifier device addresses instruction opcode Data Byte (sent by X9250 on SO) CS CS Falling W Rising Edge 0 1 0 1 0 0 A A 0 1 0 1 0 0 0 1 0 0 0 0 0 0 0 I Edge 1 0 P FN8165 Rev.3.00 August 29, 2006 Page 10 of 20 X9250 ABSOLUTE MAXIMUM RATINGS COMMENT Temperature under bias ........................ -65 to +135C Storage temperature ............................. -65 to +150C Voltage on SCK, SCL or any address input with respect to VSS ................................. -1V to +7V Voltage on V+ (referenced to VSS)........................ 10V Voltage on V- (referenced to VSS)........................-10V (V+) - (V-) .............................................................. 12V Any VH/RH ..............................................................V+ Any VL/RL.................................................................VLead temperature (soldering, 10s) .................. +300C IW (10s) ............................................................±15mA Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only; functional operation of the device (at these or any other conditions above those listed in the operational sections of this specification) is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS Temp Commercial Industrial Min. 0C -40C Max. +70C +85C Device X9250 X9250-2.7 Supply Voltage (VCC) Limits(4) 5V 10% 2.7V to 5.5V POTENTIOMETER CHARACTERISTICS (Over recommended operating conditions unless otherwise stated.) Limits Symbol Parameter Min. Typ. End to end resistance tolerance Max. Unit ±20 % Power rating 50 mW IW Wiper current ±7.5 mA RW Wiper resistance 250  Vv+ Voltage on V+ pin V VvVTERM Voltage on V- pin 150 X9250 +4.5 +5.5 X9250-2.7 +2.7 +5.5 X9250 -5.5 -4.5 X9250-2.7 -5.5 -2.7 V- V+ Voltage on any VH/RH or VL/RL pin Noise Resolution (4) Temperature coefficient of RTOTAL dBV % Ratiometric Temperature Coefficient CH/CL/CW Potentiometer Capacitances ±1 MI(3) ±0.6 MI(3) 300 Ref: 1kHz Vw(n)(actual) - Vw(n)(expected) Vw(n + 1 - [Vw(n) + MI] ppm/°C ±20 10/10/25 Wiper current =  1mA V 0.6 Relative linearity (2) +25°C, each pot V -120 Absolute linearity (1) Test Conditions ppm/°C pF See Circuit #3 Notes: (1) Absolute linearity is utilized to determine actual wiper voltage versus expected voltage as determined by wiper position when used as a potentiometer. (2) Relative linearity is utilized to determine the actual change in voltage between two successive tap positions when used as a potentiometer. It is a measure of the error in step size. (3) MI = RTOT/255 or (VH/RH - VL/RL)/255, single pot (4) Individual array resolutions. FN8165 Rev.3.00 August 29, 2006 Page 11 of 20 X9250 D.C. OPERATING CHARACTERISTICS (Over the recommended operating conditions unless otherwise specified.) Limits Symbol Parameter Min. Typ. Max. Unit Test Conditions ICC1 VCC supply current (active) 400 µA fSCK = 2MHz, SO = Open, Other Inputs = VSS ICC2 VCC supply current (nonvolatile write) 1 mA fSCK = 2MHz, SO = Open, Other Inputs = VSS ISB VCC current (standby) 5 µA SCK = SI = VSS, Addr. = VSS ILI Input leakage current 10 µA VIN = VSS to VCC ILO Output leakage current 10 µA VOUT = VSS to VCC VIH Input HIGH voltage VCC x 0.7 VCC + 0.1 V VIL Input LOW voltage -0.5 VCC x 0.3 V VOL Output LOW voltage 0.4 V IOL = 3mA ENDURANCE AND DATA RETENTION Parameter Min. Unit Minimum endurance 100,000 Data changes per bit per register Data retention 100 Years CAPACITANCE Symbol COUT (5) CIN(5) Test Max. Unit Test Conditions Output capacitance (SO) 8 pF VOUT = 0V Input capacitance (A0, A1, SI, and SCK, CS) 6 pF VIN = 0V POWER-UP TIMING Symbol tPUR(6) tPUW(6) tR VCC(7) Parameter Min. Power-up to initiation of read operation Power-up to initiation of write operation VCC power up ramp rate 0.2 Max. Unit 1 ms 5 ms 50 V/msec POWER UP AND DOWN REQUIREMENT The are no restrictions on the sequencing of the bias supplies VCC, V+, and V- provided that all three supplies reach their final values within 1msec of each other. At all times, the voltages on the potentiometer pins must be less than V+ and more than V-. The recall of the wiper position from nonvolatile memory is not in effect until all supplies reach their final value. The VCC ramp rate spec is always in effect. Notes: (5) This parameter is periodically sampled and not 100% tested (6) tPUR and tPUW are the delays required from the time the third (last) power supply (VCC, V+ or V-) is stable until the specific instruction can be issued. These parameters are periodically sampled and not 100% tested. (7) Sample tested only. A.C. TEST CONDITIONS Input pulse levels VCC x 0.1 to VCC x 0.9 Input rise and fall times 10ns Input and output timing level VCC x 0.5 FN8165 Rev.3.00 August 29, 2006 Page 12 of 20 X9250 Circuit #3 SPICE Macro Model EQUIVALENT A.C. LOAD CIRCUIT 5V RTOTAL RH CH CW RL CL 2.7V 1533 10pF SDA Output 10pF 25pF 100pF 100pF RW AC TIMING Symbol Parameter Min. Max. Unit 2.0 MHz fSCK SSI/SPI clock frequency tCYC SSI/SPI clock cycle time 500 ns tWH SSI/SPI clock high time 200 ns tWL SSI/SPI clock low time 200 ns tLEAD Lead time 250 ns tLAG Lag time 250 ns tSU SI, SCK, HOLD and CS input setup time 50 ns tH SI, SCK, HOLD and CS input hold time 75 ns tRI SI, SCK, HOLD and CS input rise time 2 µs tFI SI, SCK, HOLD and CS input fall time 2 µs 500 ns 100 ns tDIS SO output disable Time 0 tV SO output valid time tHO SO output hold time tRO SO output rise time 50 ns tFO SO output fall time 50 ns tHOLD 0 ns HOLD time 400 ns tHSU HOLD setup time 100 ns tHH HOLD hold time 100 ns tHZ HOLD low to output in high Z 100 ns tLZ HOLD high to output in low Z 100 ns TI Noise suppression time constant at SI, SCK, HOLD and CS inputs tCS TBD ns CS deselect time 2 µs tWPASU WP, A0 and A1 setup time 0 ns tWPAH WP, A0 and A1 hold time 0 ns FN8165 Rev.3.00 August 29, 2006 Page 13 of 20 X9250 HIGH-VOLTAGE WRITE CYCLE TIMING Symbol Parameter tWR High-voltage write cycle time (store instructions) Typ. Max. Unit 5 10 ms XDCP TIMING Symbol Max. Unit Wiper response time after the third (last) power supply is stable 10 µs tWRL Wiper response time after instruction issued (all load instructions) 10 µs tWRID Wiper response time from an active SCL/SCK edge (increment/decrement instruction) 40 µs tWRPO Parameter Min. SYMBOL TABLE WAVEFORM INPUTS OUTPUTS Must be steady Will be steady May change from Low to High Will change from Low to High May change from High to Low Will change from High to Low Don’t Care: Changes Allowed Changing: State Not Known N/A Center Line is High Impedance TIMING DIAGRAMS Input Timing tCS CS tCYC tLEAD SCK tSU SI SO FN8165 Rev.3.00 August 29, 2006 tH MSB tWL tLAG ... tWH ... tRI tFI LSB High Impedance Page 14 of 20 X9250 Output Timing CS SCK ... tV tDIS ... MSB SO SI tHO LSB ADDR Hold Timing CS tHSU tHH SCK ... tRO tFO SO tHZ tLZ SI tHOLD HOLD XDCP Timing (for all Load Instructions) CS SCK ... MSB SI ... tWRL LSB VWx SO High Impedance FN8165 Rev.3.00 August 29, 2006 Page 15 of 20 X9250 XDCP Timing (for Increment/Decrement Instruction) CS SCK ... tWRID ... VWx SI SO ADDR Inc/Dec Inc/Dec ... High Impedance Write Protect and Device Address Pins Timing (Any Instruction) CS WP tWPASU tWPAH A0 A1 FN8165 Rev.3.00 August 29, 2006 Page 16 of 20 X9250 APPLICATIONS INFORMATION Basic Configurations of Electronic Potentiometers +VR VR VW/RW I Three terminal Potentiometer; Variable voltage divider Two terminal Variable Resistor; Variable current Application Circuits Noninverting Amplifier VS Voltage Regulator + VO – VIN VO (REG) 317 R1 R2 Iadj R1 R2 VO = (1+R2/R1)VS VO (REG) = 1.25V (1+R2/R1)+Iadj R2 Offset Voltage Adjustment R1 Comparator with Hysterisis R2 VS VS – + 100k – VO + +12V FN8165 Rev.3.00 August 29, 2006 10k R1 } 10k } TL072 10k VO R2 VUL = {R1/(R1+R2) VO(max) VLL = {R1/(R1+R2) VO(min) -12V Page 17 of 20 X9250 Application Circuits (continued) Attenuator Filter C VS R2 R1 – VS + R VO + VO – R3 R4 R2 R1 = R2 = R3 = R4 = 10k R1 GO = 1 + R2/R1 fc = 1/(2RC) V O = G VS -1/2  G +1/2 R1 R2 } VS } Inverting Amplifier Equivalent L-R Circuit R2 C1 – VS VO + + – R1 ZIN V O = G VS G = - R2/R1 R3 ZIN = R2 + s R2 (R1 + R3) C1 = R2 + s Leq (R1 + R3) >> R2 C R2 – + R1 – } RA + } RB frequency  R1, R2, C amplitude  RA, RB FN8165 Rev.3.00 August 29, 2006 Page 18 of 20 X9250 Thin Shrink Small Outline Package Family (TSSOP) MDP0044 0.25 M C A B D THIN SHRINK SMALL OUTLINE PACKAGE FAMILY A SYMBOL 14 LD 16 LD 20 LD 24 LD 28 LD TOLERANCE (N/2)+1 N PIN #1 I.D. E E1 0.20 C B A 1 (N/2) B 2X N/2 LEAD TIPS TOP VIEW 0.05 e C H A 1.20 1.20 1.20 1.20 1.20 Max A1 0.10 0.10 0.10 0.10 0.10 ±0.05 A2 0.90 0.90 0.90 0.90 0.90 ±0.05 b 0.25 0.25 0.25 0.25 0.25 +0.05/-0.06 c 0.15 0.15 0.15 0.15 0.15 +0.05/-0.06 D 5.00 5.00 6.50 7.80 9.70 ±0.10 E 6.40 6.40 6.40 6.40 6.40 Basic E1 4.40 4.40 4.40 4.40 4.40 ±0.10 e 0.65 0.65 0.65 0.65 0.65 Basic L 0.60 0.60 0.60 0.60 0.60 ±0.15 L1 1.00 1.00 1.00 1.00 1.00 Reference Rev. E 12/02 NOTES: SEATING PLANE 0.10 M C A B b 0.10 C N LEADS SIDE VIEW 1. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per side. 2. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm per side. 3. Dimensions “D” and “E1” are measured at dAtum Plane H. SEE DETAIL “X” c 4. Dimensioning and tolerancing per ASME Y14.5M-1994. END VIEW L1 A A2 GAUGE PLANE 0.25 L A1 0° - 8° DETAIL X FN8165 Rev.3.00 August 29, 2006 Page 19 of 20 X9250 Small Outline Plastic Packages (SOIC) M24.3 (JEDEC MS-013-AD ISSUE C) N 24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M MIN MAX MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 - A1 0.0040 0.0118 0.10 0.30 - B 0.013 0.020 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 - D 0.5985 0.6141 15.20 15.60 3 E 0.2914 0.2992 7.40 7.60 4 e  B S 0.05 BSC 1.27 BSC - H 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 N  NOTES: MILLIMETERS 24 0° 24 8° 0° 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 7 8° Rev. 1 4/06 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. © Copyright Intersil Americas LLC 2005-2006. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN8165 Rev.3.00 August 29, 2006 Page 20 of 20
X9250TS24T1
物料型号:X9250 - 器件简介:X9250是一款集成了4个数字控制电位器(XDCP)的单片CMOS集成电路。每个电位器通过SPI串行接口控制,具有256个电阻抽头,提供0.4%的分辨率。 - 引脚分配:文档提供了详细的引脚描述和配置,包括串行时钟(SCK)、串行数据输入(SI)、片选(CS)等控制引脚,以及与电位器相关的端点引脚(VH/RH、VL/RL)和滑块引脚(VW/RW)。 - 参数特性:X9250的主要特性包括非易失性存储器,可存储电位器位置,待机电流小于5µA,以及多种封装选项,如24引脚SOIC和TSSOP。 - 功能详解:X9250的数字控制电位器通过255个电阻元件实现,每个元件之间有抽头点,通过开关连接到滑块端。用户可以通过SPI接口控制滑块在电阻阵列上的位置。 - 应用信息:X9250可用作三端电位器或两端可变电阻,在控制、参数调整和信号处理等多种应用中使用。 - 封装信息:X9250提供24引脚SOIC和24引脚TSSOP封装,具有不同的温度范围和电压限制。
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