RF3397PCBA-41X

RF3397 0 RoHS Compliant & Pb-Free Product Typical Applications • Basestation Applications • Broadband, Low-Noise Gain Blocks • IF or RF Buffer Amplifiers Product Description The RF3397 is a general purpose, low-cost RF amplifier IC. The device is manufactured on an advanced Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process, and has been designed for use as an easily-cascadable 50 Ω gain block. Applications include IF and RF amplification in wireless voice and data communication products operating in frequency bands up to 6000MHz. The device is self-contained with 50 Ω input and output impedances and requires only two external DC-biasing elements to operate as specified. The device is designed for cost effective high reliability in a plastic package. The 3mmx3mm footprint is compatible with standard ceramic and plastic Micro-X packages. 2 PLCS 0.10 C A GENERAL PURPOSE AMPLIFIER • Driver Stage for Power Amplifiers • Final PA for Low-Power Applications • High Reliability Applications 0.05 C -A3 1 3.00 2 PLCS 0.10 C B 0.20 REF. 0.90 0.85 0.05 0.00 3.00 0.10 C B 2 PLCS 12° MAX SEATING PLANE 0.10 C A 2 PLCS 2.75 SQ -B- Dimensions in mm. -C- Shaded lead is pin 1. 0.10 M C A B 0.60 0.24 TYP 0.35 0.30 PIN 1 ID R0.20 1.90 1.60 0.45 0.35 0.375 0.275 1.15 0.85 0.65 Optimum Technology Matching® Applied Si BJT Si Bi-CMOS InGaP/HBT GaAs HBT SiGe HBT GaN HEMT GaAs MESFET Si CMOS SiGe Bi-CMOS Package Style: QFN, 12-Pin, 3x3 Features • DC to >6000MHz Operation • Internally Matched Input and Output • 15.5dB Small Signal Gain GND GND GND • +25.5dBm Output IP3 • +12.5dBm Output P1dB 9 NC 12 NC 1 RF IN 2 NC 3 4 GND 11 10 • Footprint Compatible with Micro-X 8 RF OUT 7 NC 5 GND 6 GND Ordering Information RF3397 General Purpose Amplifier RF3397PCBA-41X Fully Assembled Evaluation Board Functional Block Diagram RF Micro Devices, Inc. 7628 Thorndike Road Greensboro, NC 27409, USA Tel (336) 664 1233 Fax (336) 664 0454 http://www.rfmd.com Rev A6 061016 4-607 RF3397 Absolute Maximum Ratings Parameter Input RF Power Operating Ambient Temperature Storage Temperature ICC Rating +13 -40 to +85 -60 to +150 60 Unit dBm °C °C mA Caution! ESD sensitive device. RF Micro Devices believes the furnished information is correct and accurate at the time of this printing. RoHS marking based on EUDirective2002/95/EC (at time of this printing). However, RF Micro Devices reserves the right to make changes to its products without notice. RF Micro Devices does not assume responsibility for the use of the described product(s). Parameter Overall Frequency Range 3dB Bandwidth Gain Specification Min. Typ. Max. DC to >6000 4.4 16.4 16.3 15.5 14.5 14.0 13.5 2.8 1.7:1 2:1 25.5 +25.5 +13.0 +12.5 19 208 113 Unit MHz GHz dB dB dB dB Condition T=25 °C, ICC =40mA (See Note 1.) 15.4 15.3 13.5 17.3 17.5 Noise Figure Input VSWR Output VSWR Output IP3 Output P1dB Reverse Isolation dB 24.5 +24.5 +12.0 +11.5 dBm dBm dBm dBm dB °C/W °C Thermal ThetaJC Maximum Measured Junction Temperature at DC Bias Conditions Mean Time To Failures Freq=500MHz Freq=850MHz Freq=2000MHz Freq=3000MHz Freq=4000MHz Freq=6000MHz Freq=2000MHz In a 50 Ω system, DC to 6000MHz In a 50 Ω system, DC to 6000MHz Freq=850MHz Freq=2000MHz Freq=850MHz Freq=2000MHz Freq=2000MHz ICC =40mA, PDISS =135mW. (See Note 3.) VPIN =3.38V TAMB =+85°C TAMB =+85°C With 22 Ω bias resistor Power Supply Device Operating Voltage 3.55 3.65 3.7 V At pin 8 with ICC =40mA 4.2 4.5 4.8 V At evaluation board connectors, ICC =40mA Operating Current 40 60 mA See Note 2. Note 1: All specification and characterization data has been gathered on standard FR-4 evaluation boards. These evaluation boards are not optimized for frequencies above 2.5GHz. Performance above 2.5GHz may improve if a high performance PCB is used. Note 2: The RF3397 must be operated at or below 60mA in order to achieve the thermal performance stated above. Operating at 40mA will ensure the best possible combination of reliability and electrical performance. Note 3: Because of process variations from part to part, the current resulting from a fixed bias voltage will vary. As a result, caution should be used in designing fixed voltage bias circuits to ensure the worst case bias current does not exceed 60mA over all intended operating conditions. 51,709 years 4-608 Rev A6 061016 RF3397 Pin 1 2 Function NC RF IN Description No internal connections. It is not necessary to ground this pin. RF input pin. This pin is NOT internally DC blocked. A DC blocking capacitor, suitable for the frequency of operation, should be used in most applications. DC coupling of the input is not allowed, because this will override the internal feedback loop and cause temperature instability. No internal connections. It is not necessary to ground this pin. Ground connection. Ground connection. Ground connection. No internal connections. It is not necessary to ground this pin. RF output and bias pin. Biasing is accomplished with an external series resistor and choke inductor to VCC. The resistor is selected to set the DC current into this pin to a desired level. The resistor value is determined by the following equation: RF OUT Interface Schematic 3 4 5 6 7 8 NC GND GND GND NC RF OUT ( V SUPPLY – V DEVICE ) R = -----------------------------------------------------I CC Care should also be taken in the resistor selection to ensure that the current into the part never exceeds 60mA over the planned operating temperature. This means that a resistor between the supply and this pin is always required, even if a supply near 3.6V is available, to provide DC feedback to prevent thermal runaway. Because DC is present on this pin, a DC blocking capacitor, suitable for the frequency of operation, should be used in most applications. The supply side of the bias network should also be well bypassed. No internal connections. It is not necessary to ground this pin. Ground connection. Ground connection. Ground connection. Ground connection. To ensure best performance, avoid placing ground vias directly beneath the part. RF IN 9 10 11 12 Die Flag NC GND GND GND GND Rev A6 061016 4-609 RF3397 Application Schematic VCC 10 nF 22 pF 47 nH 12 1 22 pF RF IN 2 3 4 5 6 8 22 pF 7 11 10 9 RBIAS RF OUT Evaluation Board Schematic (Download Bill of Materials from www.rfmd.com.) P1 P1-1 1 2 P1-3 3 CON3 12 C1 100 pF 1 2 3 4 5 6 11 10 9 8 7 VCC GND NC R1 22 Ω L1 100 nH C3 100 pF C4 1 μF VCC P1-1 J1 RF IN 50 Ω μstrip C2 100 pF 50 Ω μstrip J2 RF OUT NOTE: Evaluation board optimized for frequencies above 300 MHz and below 2.5 GHz. For operation below 300 MHz the value of inductor L1 and capcitors C1 and C2 should be increased. 4-610 Rev A6 061016 RF3397 Evaluation Board Layout Board Size 1.195" x 1.000" Board Thickness 0.033”, Board Material FR-4 Note: A small amount of ground inductance is required to achieve datasheet performance. The necessary inductance may be generated by ensuring that no ground vias are placed directly below the footprint of the part. Overlay of Suggested Micro-X and 3mmx3mm Layouts Showing Compatibility Rev A6 061016 4-611 RF3397 Gain versus Frequency Across Temperature 17.0 Output P1dB versus Frequency Across Temperature 16.0 -40°C +25°C +85°C 14.0 ICC=40mA ICC=40mA -40°C +25°C +85°C 16.0 15.0 14.0 Output P1dB (dBm) 1100.0 2100.0 3100.0 4100.0 5100.0 6100.0 12.0 Gain (dB) 10.0 13.0 8.0 12.0 11.0 6.0 10.0 100.0 4.0 100.0 600.0 1100.0 1600.0 2100.0 2600.0 3100.0 3600.0 4100.0 Frequency (MHz) Frequency (MHz) Output IP3 versus Frequency Across Temperature 30.0 Noise Figure versus Frequency Over Temperature 5.0 ICC=40mA -40°C +25°C +85°C ICC=40mA -40°C +25°C +85°C 4.5 25.0 OIP3 (dBm) 20.0 Noise Figure (dB) 600.0 1100.0 1600.0 2100.0 2600.0 3100.0 3600.0 4100.0 4.0 3.5 15.0 3.0 10.0 2.5 5.0 100.0 2.0 500.0 1000.0 1500.0 2000.0 2500.0 3000.0 Frequency (MHz) Frequency (MHz) Input VSWR versus Frequency Across Temperature 5.0 Output VSWR versus Frequency Across Temperature 5.0 ICC=40mA -40°C +25°C +85°C ICC=40mA -40°C +25°C +85°C 4.5 4.5 4.0 4.0 3.5 3.5 VSWR 3.0 VSWR 1100.0 2100.0 3100.0 4100.0 5100.0 6100.0 3.0 2.5 2.5 2.0 2.0 1.5 1.5 1.0 100.0 1.0 100.0 1100.0 2100.0 3100.0 4100.0 5100.0 6100.0 Frequency (MHz) Frequency (MHz) 4-612 Rev A6 061016 RF3397 Reverse Isolation versus Frequency Across Temperature, ICC=40mA 21.5 -40°C +25°C +85°C 60.0 55.0 50.0 20.5 45.0 20.0 40.0 Current versus Voltage (At Evaluation Board Connector, RBIAS=22Ω ) 21.0 Reverse Isolation (dB) 19.5 ICC (mA) 35.0 30.0 25.0 19.0 18.5 20.0 18.0 15.0 10.0 1100.0 2100.0 3100.0 4100.0 5100.0 6100.0 4.0 4.2 4.4 4.6 4.8 5.0 -40°C +25°C +85°C 17.5 100.0 Frequency (MHz) VCC (V) Current versus Voltage (At Pin 8 of the RF3397) 60.0 0.25 Power Dissipated versus Voltage at Pin 8 TAMB=85°C 50.0 0.20 40.0 Power Dissipated (W) -40°C +25°C +85°C Vcc= 4.5V 0.15 ICC (mA) 30.0 0.10 20.0 0.05 10.0 0.0 3.4 3.5 3.6 3.7 3.8 3.9 4.0 0.00 3.38 3.43 3.48 3.53 3.58 3.63 VPIN (V) VPIN (V) Junction Temperature versus Power Dissipated 140.00 TAMB=+85°C 135.00 130.00 125.00 TMAX (°C) 120.00 115.00 110.00 105.00 100.00 0.09 0.11 0.13 0.15 0.17 0.19 0.21 PDISS (W) Rev A6 061016 4-613 RF3397 PCB Design Requirements PCB Surface Finish The PCB surface finish used for RFMD’s qualification process is Electroless Nickel, immersion Gold. Typical thickness is 3 μinch to 8 μinch Gold over 180 μinch Nickel. PCB Land Pattern Recommendation PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances. PCB Metal Land Mask Pattern A = 0.59 x 0.32 (mm) Typ. 0.80 (mm) Typ. 1.00 (mm) 0.40 (mm) Typ. Pin 1 0.70 (mm) 1.00 (mm) Typ. Typ. A A A A 2.20 (mm) Typ. 3.20 (mm) Typ. 0.65 (mm) Typ. 0.95 (mm) Typ. A A 0.30 (mm) Typ. 0.65 (mm) Typ. 1.30 (mm) Typ. 2.60 (mm) Figure 1. PCB Metal Land Pattern (Top View) 4-614 Rev A6 061016 RF3397 PCB Solder Mask Pattern Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier. A = 0.72 x 0.45 (mm) Typ. 0.72 (mm) Typ. 1.15 (mm) 0.41 (mm) Typ. Pin 1 0.75 (mm) Typ. 1.05 (mm) Typ. A A A A 2.27 (mm) Typ. 3.32 (mm) Typ. 0.65 (mm) Typ. 1.01 (mm) Typ. A A 0.45 (mm) Typ. 0.65 (mm) Typ. 1.30 (mm) Typ. 2.60 (mm) Figure 2. PCB Solder Mask (Top View) Thermal Pad and Via Design The PCB metal land pattern has been designed with a thermal pad that matches the exposed die paddle size on the bottom of the device. Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing strategies. The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. NOTE: A small amount of ground inductance is required to achieve data sheet performance. The necessary inductance may be generated by ensuring that no ground vias are placed directly below the footprint of the part. Rev A6 061016 4-615 RF3397 4-616 Rev A6 061016