R1526S301B-E2-KE

R1526x Series AEC-Q100 Compliant 300 mA, 42 V Voltage Regulator with High Noise Immunity for Automotive Applications No. EC-527-211022 OVERVIEW The R1526x is a voltage regulator featuring 300mA output current and 42 V maximum input voltage. Since this device has excellent noise immunity to external electromagnetic interference, it is suitable for use in environments where electromagnetic waves may cause malfunctions. KEY BENEFITS ● Excellent noise immunity. Refer to Noise Immunity Test in Typical Characteristics. ● Pin configuration considering functional safety KEY SPECIFICATIONS • • • • • • • • • • Input Voltage Range (Maximum Rating): 3.5 V to 42 V (50 V) Noise Immunity Test Operating temperature range: -40°C to 125°C 6 Standby Current: Typ. 0.1 µA 5 Dropout Voltage: Typ. 0.4 V (IOUT = 300 mA, VSET = 5.0 V) 4 Output Voltage: 1.8 V to 9.0 V (in 0.1 V step) Output Voltage Accuracy: ±0.6 % (Ta = 25°C) ±1.6 % (-40°C ≤ Ta ≤ 125°C) Short-circuit Protection: Limit at Typ. 100 mA Overcurrent Protection: Limit at Typ. 450 mA Thermal Shutdown: Detection Temperature. Typ. 160°C VOUT [V] • TYPICAL CHARACTERISTICS 3 2 Product without 未対応製品 Noise Immunity 1 0 10 100 1000 Frequency [MHz] Output capacitor: COUT ≥ 10 μF Ripple Rejection: Typ. 50 dB (f = 100 Hz) PACKAGE R1526 DPI method TYPICAL APPLICATION VDD HSOP-8E 5.2 x 6.2 x 1.45 mm CIN CE Control R1526x CE VOUT VOUT COUT GND CIN = Ceramic 0.1 µF COUT = Ceramic 10 µF APPLICATIONS • In-vehicle electrical equipment such as EPSECU, ADAS/autonomous driving system ECU, meter ECU, telematics ECU. 1 R1526x No. EC-527-211022 SELECTION GUIDE The set output voltage and the quality class are user-selectable. Selection Guide Product Name R1526Sxx1B-E2-#E Package Quantity per Reel Pb Free Halogen Free HSOP-8E 1,000 pcs Yes Yes xx: Specify the set output voltage (VSET) 1.8 V (18) to 9.0 V (90) in 0.1 V step Refer to Product-specific Electrical Characteristics for details. #: Quality Class # Operating Temperature Range Test Temperature A −40°C to 125°C 25°C, High K −40°C to 125°C Low, 25°C, High BLOCK DIAGRAM Thermal Shutdown Circuit VDD VOUT Vref Short Protection Current Limit CE GND R1526x Block Diagram 2 R1526x No. EC-527-211022 PIN DESCRIPTIONS 8 Top View 7 6 Bottom View 5 5 1 1 2 3 4 6 7 8 2 1 (1) 4 3 HSOP-8E Pin Configuration HSOP-8E Pin Descriptions Pin No. Pin Name Description 1 VOUT Output Pin 2 NC(2) No Connection 3 NC(2) No Connection 4 CE 5 GND(3) Ground Pin 6 GND(3) Ground Pin 7 NC(2) No Connection 8 VDD Input Pin Chip Enable Pin (Active-high) Pin Equivalent Circuit Diagrams Driver CE VOUT VOUT Pin Equivalent Circuit Diagram CE Pin Equivalent Circuit Diagram (1) The tab on the bottom of the package is substrate level (GND). The tab must be connected to the ground plane on the board. (2) NC pin should be set to “Open”. (3) GND pins should be connected together when mounted on a board. 3 R1526x No. EC-527-211022 ABSOLUTE MAXIMUM RATINGS Absolute Maximum Ratings Symbol Parameter Rating Unit −0.3 to 50 V 60 V −0.3 to 50 V 60 V −0.3 to VIN + 0.3 ≤ 50 V 500 mA VIN VIN Pin Input Voltage VIN VIN Pin Peak Voltage( 1) VCE CE Pin Input Voltage VCE CE Pin Peak Voltage (1) VOUT VOUT Pin Voltage IOUT Output Current PD Power Dissipation Tj Junction Temperature Range −40 to 150 °C Tstg Storage Temperature Range −55 to 150 °C Refer to Appendix “Power Dissipation” ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause permanent damage and may degrade the lifetime and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings is not assured. RECOMMENDED OPERATING CONDITIONS Recommended Operating Conditions Symbol Parameter VIN Operating Input Voltage Ta Operating Temperature Range Rating Unit 3.5 to 42 V −40 to 125 °C RECOMMENDED OPERATING CONDITIONS All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions. (1) Duration time: within 200 ms 4 R1526x No. EC-527-211022 ELECTRICAL CHARACTERISTICS VIN = 14 V, VCE = VIN, unless otherwise specified. are guaranteed by design engineering at −40°C ≤ Ta ≤ 125°C. The specifications surrounded by R1526x-AE Electrical Characteristics Symbol Parameter ISS Supply Current Istandby Standby Current VOUT ∆VOUT /∆IOUT Output Voltage Load Regulation (2) Conditions VDIF Line Regulation ( 3) Dropout Voltage ( 5) 55 μA VIN = 42 V, VCE = 0 V 0.1 2.0 μA 8 V( 1) ≤ VIN ≤ 16 V, IOUT = 1 mA Ta = 25°C ×0.994 ×1.006 −40°C ≤ Ta ≤ 125°C ×0.984 ×1.016 -5 45 -5 40 -5 72 1.8 V ≤ VSET ≤ 2.8 V -5 68 -5 60 -5 108 -30 30 mV -0.02 0.02 %/V VSET +1V(4)≤ VIN≤42V, 1.8 V ≤ VSET ≤ 2.8 V IOUT = 1 mA 2.8 V < VSET ≤ 9.0 V IOUT = 300 mA VIN = VSET + 3.0 V ISC Short-circuit Current VIN = 3.5 V, VOUT = 0 V VCEL CE Pin Input Voltage, Low IPD V 1.8 V ≤ VSET ≤ 2.8 V VIN = VSET + 2.0 V, 2.8 V < VSET ≤ 5.4 V 1 mA ≤ IOUT ≤ 100 mA 5.4 V < VSET ≤ 9.0 V Output Current Limit CE Pin Input Voltage, High (Ta = 25°C) Max. Unit 32 ILIM VCEH Typ. VIN = 14 V, IOUT = 0 mA VIN = VSET + 2.0 V, 2.8 V < VSET ≤ 5.4 V 1 mA ≤ IOUT ≤ 300 mA 5.4 V < VSET ≤ 9.0 V ∆VOUT /∆VIN Min. 1.8 V ≤ VSET ≤ 2.4 V 1.73 1.76 2.4 V < VSET ≤ 2.8 V 0.75 1.35 2.8 V < VSET < 5.0 V 0.71 1.23 5.0 V ≤ VSET < 8.0 V 0.40 0.74 8.0 V ≤ VSET ≤ 9.0 V 0.35 0.65 300 V 450 mA 100 mA 2.0 VIN = 42 V CE Pull-down Current VIN = 42 V, VCE = 2 V mV 0.2 42 V 1.0 V 0.6 μA All parameters are tested under the pulse load condition (Tj ≈ Ta = 25°C). (1) When VSET > 7 V, VIN = VSET + 1 V voltage change amount when 1 mA ≤ IOUT ≤ 100 mA and 1 mA ≤ IOUT ≤ 300 mA, ⊿VOUT /⊿IOUT = VOUT (@ IOUT = 100 mA) - VOUT (@ IOUT = 1 mA) or ⊿VOUT /⊿IOUT = VOUT (@ IOUT = 300 mA) - VOUT (@ IOUT = 1 mA) (3) Output voltage change amount when V SET +1V ≤ VIN ≤ 42 V, in case VSET ≤ 2.8 V, ⊿VOUT /⊿VIN = VOUT (@VIN = 42 V) - VOUT (@VIN = VSET + 1 V) or in case VSET > 2.8 V, ⊿VOUT /⊿VIN = (VOUT (@VIN = 42 V) - VOUT (@VIN = VSET + 1 V)) / (42 – (VSET + 1)) / VSET x 100 (4) When V SET ≤ 2.5 V, VIN = 3.5 V. (5) Dropout voltage is defined as the minimum value of the difference between the input and output voltages in order to supply a regulated output voltage with the specified load current. (2) Output 5 R1526x No. EC-527-211022 VIN = 14 V, VCE = VIN, unless otherwise specified. R1526x-KE Electrical Characteristics Symbol Parameter ISS Supply Current Istandby Standby Current VOUT ∆VOUT /∆IOUT ∆VOUT /∆VIN VDIF Output Voltage Load Regulation (2) Conditions VIN = 14 V, IOUT = 0 mA 32 55 μA VIN = 42 V, VCE = 0 V 0.1 2.0 μA 8 V( 1) ≤ VIN ≤ 16 V IOUT = 1 mA Ta = 25°C ×0.994 ×1.006 −40°C ≤ Ta ≤ 125°C ×0.984 ×1.016 Dropout Voltage ( 5) V 1.8 V ≤ VSET ≤ 2.8 V VIN = VSET + 2.0 V, 2.8 V < VSET ≤ 5.4 V 1 mA ≤ IOUT ≤ 100 mA 5.4 V < VSET ≤ 9.0 V -5 45 -5 40 -5 72 1.8 V ≤ VSET ≤ 2.8 V -5 68 -5 60 -5 108 -30 30 mV -0.02 0.02 %/V VIN = VSET + 2.0 V, 2.8 V < VSET ≤ 5.4 V 1 mA ≤ IOUT ≤ 300 mA 5.4 V < VSET ≤ 9.0 V Line Regulation ( 3) Min. (−40°C ≤ Ta ≤ 125°C) Typ. Max. Unit VSET +1V(4) ≤ VIN≤42V 1.8 V ≤ VSET ≤ 2.8 V IOUT = 1 mA 2.8 V < VSET ≤ 9.0 V IOUT = 300 mA ILIM Output Current Limit VIN = VSET + 3.0 V ISC Short-circuit Current VIN = 3.5 V, VOUT = 0 V VCEH CE Pin Input Voltage, High VCEL CE Pin Input Voltage, Low VIN = 42 V IPD CE Pull-down Current VIN = 42 V, VCE = 2 V 1.8 V ≤ VSET ≤ 2.4 V 1.73 1.76 2.4 V < VSET ≤ 2.8 V 0.75 1.35 2.8 V < VSET < 5.0 V 0.71 1.23 5.0 V ≤ VSET < 8.0 V 0.40 0.74 8.0 V ≤ VSET ≤ 9.0 V 0.35 0.65 300 mV V 450 mA 100 mA 2.0 42 V 0 1.0 V 0.6 μA 0.2 (1) When VSET > 7 V, VIN = VSET + 1 V voltage change amount when 1 mA ≤ IOUT ≤ 100 mA and 1 mA ≤ IOUT ≤ 300 mA, ⊿VOUT /⊿IOUT = VOUT (@ IOUT = 100 mA) - VOUT (@ IOUT = 1 mA) or ⊿VOUT /⊿IOUT = VOUT (@ IOUT = 300 mA) - VOUT (@ IOUT = 1 mA) (3) Output voltage change amount when V SET +1V ≤ VIN ≤ 42 V, in case VSET ≤ 2.8 V, ⊿VOUT /⊿VIN = VOUT (@VIN = 42 V) - VOUT (@VIN = VSET + 1 V) or in case VSET > 2.8 V, ⊿VOUT /⊿VIN = (VOUT (@VIN = 42 V) - VOUT (@VIN = VSET + 1 V)) / (42 – (VSET + 1)) / VSET x 100 (4) When V SET ≤ 2.5 V, VIN = 3.5 V. (5) Dropout voltage is defined as the minimum value of the difference between the input and output voltages in order to supply a regulated output voltage with the specified load current. (2) Output 6 R1526x No. EC-527-211022 The specifications surrounded by are guaranteed by design engineering at -40°C ≤ Ta ≤ 125°C. R1526x (-AE) Product-specific Electrical Characteristics Product name R1526S181B R1526S251B R1526S281B R1526S301B R1526S331B R1526S341B R1526S501B R1526S551B R1526S601B R1526S641B R1526S751B R1526S801B R1526S851B R1526S901B Product name R1526S181B R1526S251B R1526S281B R1526S301B R1526S331B R1526S341B R1526S501B R1526S551B R1526S601B R1526S641B R1526S751B R1526S801B R1526S851B R1526S901B MIN. 1.7892 2.4850 2.7832 2.9820 3.2802 3.3796 4.9700 5.4670 5.9640 6.3616 7.4550 7.9520 8.4490 8.9460 VOUT (V) (Ta = 25°C) TYP. 1.80 2.50 2.80 3.00 3.30 3.40 5.00 5.50 6.00 6.40 7.50 8.00 8.50 9.00 MAX. 1.8108 2.5150 2.8168 3.0180 3.3198 3.4204 5.0300 5.5330 6.0360 6.4384 7.5450 8.0480 8.5510 9.0540 ∆VOUT/∆IOUT (mV) (1 mA ≤ IOUT ≤ 100 mA) MIN. MAX. (Ta = 25°C) VOUT (V) (−40°C ≤ Ta ≤ 125°C) MIN. TYP. MAX. 1.7712 1.80 1.8288 2.4600 2.50 2.5400 2.7552 2.80 2.8448 2.9520 3.00 3.0480 3.2472 3.30 3.3528 3.3456 3.40 3.4544 4.9200 5.00 5.0800 5.4120 5.50 5.5880 5.9040 6.00 6.0960 6.2976 6.40 6.5024 7.3800 7.50 7.6200 7.8720 8.00 8.1280 8.3640 8.50 8.6360 8.8560 9.00 9.1440 ∆VOUT/∆IOUT (mV) (1 mA ≤ IOUT ≤ 300 mA) MIN. MAX. -5 45 -5 68 -5 40 -5 60 -5 72 -5 VDIF (V) TYP. 1.73 MAX. 1.76 0.75 1.35 0.71 1.23 0.40 0.74 0.35 0.65 ∆VOUT/∆VIN MIN. MAX. -30 (mV) 30 (mV) -0.02 (%/V) 0.02 (%/V) 108 7 R1526x No. EC-527-211022 R1526x (-KE) Product-specific Electrical Characteristics Product name R1526S181B R1526S251B R1526S281B R1526S301B R1526S331B R1526S341B R1526S501B R1526S551B R1526S601B R1526S641B R1526S751B R1526S801B R1526S851B R1526S901B Product name R1526S181B R1526S251B R1526S281B R1526S301B R1526S331B R1526S341B R1526S501B R1526S551B R1526S601B R1526S641B R1526S751B R1526S801B R1526S851B R1526S901B MIN. 1.7892 2.4850 2.7832 2.9820 3.2802 3.3796 4.9700 5.4670 5.9640 6.3616 7.4550 7.9520 8.4490 8.9460 VOUT (V) (Ta = 25°C) TYP. 1.80 2.50 2.80 3.00 3.30 3.40 5.00 5.50 6.00 6.40 7.50 8.00 8.50 9.00 MAX. 1.8108 2.5150 2.8168 3.0180 3.3198 3.4204 5.0300 5.5330 6.0360 6.4384 7.5450 8.0480 8.5510 9.0540 ∆VOUT/∆IOUT (mV) (1 mA ≤ IOUT ≤ 100 mA) MIN. MAX. (−40°C ≤ Ta ≤ 125°C) VOUT (V) (−40°C ≤ Ta ≤ 125°C) MIN. TYP. MAX. 1.7712 1.80 1.8288 2.4600 2.50 2.5400 2.7552 2.80 2.8448 2.9520 3.00 3.0480 3.2472 3.30 3.3528 3.3456 3.40 3.4544 4.9200 5.00 5.0800 5.4120 5.50 5.5880 5.9040 6.00 6.0960 6.2976 6.40 6.5024 7.3800 7.50 7.6200 7.8720 8.00 8.1280 8.3640 8.50 8.6360 8.8560 9.00 9.1440 ∆VOUT/∆IOUT (mV) (1 mA ≤ IOUT ≤ 300 mA) MIN. MAX. -5 45 -5 68 -5 40 -5 60 -5 72 -5 VDIF (V) TYP. 1.73 MAX. 1.76 0.75 1.35 0.71 1.23 0.40 0.74 0.35 0.65 ∆VOUT/∆VIN MIN. MAX. -30 (mV) 30 (mV) -0.02 (%/V) 0.02 (%/V) 108 8 R1526x No. EC-527-211022 TYPICAL APPLICATION CIRCUIT VDD R1526x CIN CE Control CE VOUT VOUT COUT GND CIN = Ceramic 0.1 µF COUT = Ceramic 10 µF R1526x Typical Application Circuit Component examples ±10% Voltage resistance 50 V Temperature characteristics X7R ±10% 50 V X7S Symbol Capacitance Tolerance CIN 0.1 μF COUT 10 μF 9 R1526x No. EC-527-211022 THEORY OF OPERATION Thermal Shutdown Function When the junction temperature exceeds the thermal shutdown detection temperature (Typ.160°C), R1526x goes into standby state and suppresses its self-heating. When the junction temperature falls below the thermal shutdown release temperature (Typ.135°C), this device becomes active. Chip Enable Function By inputting "High" and "Low" to the CE pin, R1526x can be set to active or standby state. The CE pin is pulled down with a constant current of Typ. 0.2 µA inside the IC. If the chip enable function is not needed, connect the CE pin directly to the VDD pin. R1526x can apply a voltage to the CE pin even when no voltage is applied to VDD pin. 10 R1526x No. EC-527-211022 TECHNICAL NOTES The performance of a power source circuit using this device is highly dependent on a peripheral circuit. A peripheral component or the device mounted on PCB should not exceed a rated voltage, a rated current or a rated power. When designing a peripheral circuit, please be fully aware of the following points. Phase Compensation R1526x uses the output capacitor capacitance and equivalent series resistance (ESR) for phase compensation, to secure stable operation even when the load current is varied. For this purpose, make sure to use an output capacitor (COUT) of 10 μF or more as close as possible to the VOUT pin. Since the output may oscillate depending on the ESR, select a low ESR capacitor with reference to the series equivalent resistance vs. output current characteristics in the datasheet. In addition, Make the power supply and GND lines sufficient. Connect a capacitor (CIN) of 0.1 μF or more between the VDD pin and GND, and keep the wiring as short as possible. Behavior below the minimum operating voltage When VSET ≤ 2.8 V and the power supply voltage is below the recommended operating voltage, the output voltage may become unstable and exceed the set output voltage of LDO. To avoid this behavior at power-on, turn on the voltage of both VDD and CE pins at a slew rate of 35 V/ms or more when both pins are turned on at the same time. When turning on the VDD pin at a slew rate of 35 V/ms or less, change the CE pin from “Low” to “High” after the power supply voltage exceeds 3.5 V. To avoid this behavior at power-off, turn off the voltage of both VDD and CE pins at a steeper slew rate than -35 V/ms when both pins are turned off at the same time. When turning off the VDD pin at a slower slew rate than -35 V/ms, change the CE pin from “High” to “Low” before the power supply voltage falls below 3.5 V. Thermal Shutdown Function The thermal shutdown function prevents the IC from fuming and ignition but does not ensure the IC’s reliability or keep the IC below the absolute maximum ratings. The thermal shutdown function does not operate on the heat generated by other than the normal IC operation such as latch-up and overvoltage application. The thermal shutdown function operates in a state over the absolute maximum ratings, therefore the thermal shutdown function should not be used for a system design. 11 R1526x No. EC-527-211022 TYPICAL CHARACTERISTICS Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed. 1) Output Voltage vs. Output Current CIN = none, COUT = 10μF, Ta = 25°C R1526S181B R1526S501B R1526S331B R1526S901B 12 R1526x No. EC-527-211022 2) Output Voltage vs. Input Voltage CIN = none, COUT = 10μF, Ta = 25°C R1526S181B R1526S501B 3) Output Voltage vs. Temperature IOUT = 1mA, CIN = none, COUT = 10μF R1526S181B R1526S331B R1526S901B R1526S331B 13 R1526x No. EC-527-211022 R1526S501B R1526S901B 4) Supply Current vs. Input Voltage CIN = none, COUT = 10μF R1526S181B R1526S331B 5) Supply Current vs. Temperature CIN = none, COUT = 10μF R1526S181B R1526S331B 14 R1526x No. EC-527-211022 R1526S501B 6) Dropout Voltage vs. Output Current CIN = none, COUT = 10μF R1526S181B R1526S501B R1526S901B R1526S331B R1526S901B 15 R1526x No. EC-527-211022 7) Dropout Voltage vs. Output Voltage CIN = none, C = 10μF, Ta = 25°C 8) Ripple Rejection vs. Frequency VIN = VSET+2V, Ripple = 0.2Vpp, CIN = none, COUT = 10μF, Ta = 25°C R1526S181B R1526S501B R1526S331B R1526S901B 16 R1526x No. EC-527-211022 9) Ripple Rejection vs. Input Voltage Ripple = 0.2Vpp, IOUT = 50mA, CIN = none, COUT = 10μF, Ta = 25°C R1526S181B R1526S501B 10) Input Transient Response IOUT = 1mA, CIN = none, COUT = 10μF, Ta = 25°C, tr = tf = 1μs R1526S181B R1526S331B R1526S901B R1526S331B 17 R1526x No. EC-527-211022 R1526S501B 11) Load Transient Response VIN = 14V, CIN = 0.1μF, COUT = 10μF, Ta = 25°C, tr = tf = 0.5μs R1526S181B R1526S501B R1526S901B R1526S331B R1526S901B 18 R1526x No. EC-527-211022 12) CE Transient Response VIN = 14V, VCE = 0V → 14V, CIN = 0.1μF, COUT = 10μF, Ta = 25°C, tr = tf = 1μs R1526S181B R1526S331B R1526S501B 19 R1526x No. EC-527-211022 R1526S901B 13) Power-on Transient Response IOUT = 1mA, CIN = none, COUT = 10μF, Ta = 25°C, tr = 1μs R1526S181B R1526S501B R1526S331B R1526S901B 20 R1526x No. EC-527-211022 14) Load Dump IOUT = 50mA, CIN = 0.1μF, COUT = 10μF, Ta = 25°C R1526S181B R1526S501B 15) Cold Crank IOUT = 1mA, CIN = 0.1μF, COUT = 10μF, Ta = 25°C R1526S501B R1526S331B R1526S901B R1526S901B 21 R1526x No. EC-527-211022 16) ESR (Equivalent Series Resistance) CIN = 0.1μF, COUT = 10μF, Ta = -40°C, 25°C, 125°C R1526S181B R1526S501B R1526S331B R1526S901B 17) Noise Immunity DPI method, VIN = 14V, VCE = 3V, VOUT = 1W, CIN = CCE = 0.1μF, COUT = 10μF, Ta = 25°C R1526S301B R1526S501B 22 R1526x No. EC-527-211022 Test Circuit VOUT VDD VOUT R1526x CIN CE Control CE COUT GND CIN = Ceramic 0.1 µF COUT = Ceramic 10 µF Test Circuit for Typical Characteristics Measurement Components Symbol Specification Measurement Item Manufacturer Parts Number CIN 0.1μF 11,12,14,15,16,17 TDK CGA4J2X7R1H104K COUT 10μF All Items TDK CGA4J1X7S1C106K Measurement Components of Typical Characteristics 23 POWER DISSIPATION HSOP-8E PD-HSOP-8E-(125150)-JE-B The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Measurement Conditions Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 76.2 mm × 114.3 mm × 0.8 mm Copper Ratio Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square Through-holes  0.3 mm × 21 pcs Measurement Result (Ta = 25°C, Tjmax = 150°C) Item Measurement Result Power Dissipation 3600 mW Thermal Resistance (ja) ja = 34.5°C/W Thermal Characterization Parameter (ψjt) ψjt = 10°C/W ja: Junction-to-Ambient Thermal Resistance ψjt: Junction-to-Top Thermal Characterization Parameter 4000 3600 Power Dissipation (mW) 3500 3000 2500 2000 1500 1000 500 0 0 25 50 75 100 Ambient Temperature (°C) 125 150 Power Dissipation vs. Ambient Temperature Measurement Board Pattern i PACKAGE DIMENSIONS HSOP-8E DM-HSOP-8E-JE-B HSOP-8E Package Dimensions i 1. 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