RP604x Series
Ultra-low Quiescent Current (IQ = 0.3 µA), 300 mA, Buck-Boost
DC/DC Converter
No. EA-415-201216
OVERVIEW
The RP604x is a buck-boost converter featuring a minimum supply current and a high efficiency at low-load. The device
operates at the low operating quiescent current (IQ = 0.3 µA) to make the most of battery life for the battery driver
operated intermittently.
KEY BENEFITS
●
The low supply current (IQ = 0.3 µA) can achieve making battery life longer and battery’s size-reduction.
●
Wide range of input voltage (1.8 V to 5.5 V) can support for every battery from a coin-type battery to a USB port.
●
Selectable package: WLCSP-20-P2 or DFN(PLP)2730-12
KEY SPECIFICATIONS
•
•
•
•
•
TYPICAL CHARACTERISTICS
Input Voltage: 1.8 V to 5.5 V
Output Voltage: 1.6 V to 5.2 V, 0.1 V step
Output Voltage Accuracy: ±1.5%
Maximum Output Current: 300 mA at Buck
Built-in Driver On-resistance (RP604Z, VIN = 3.6 V):
PMOS = Typ.0.12 Ω, NMOS = Typ. 0.12 Ω
•
•
•
Operating Quiescent Current (IQ ): 0.3 µA
Standby Current: 0.01 µA
Protection Features: UVLO, OVP, LX Peak Current,
VOUT = 3.3 V
and Thermal Shutdown
PACKAGES
OPTIONAL FUNCTIONS
The auto-discharge function and the set output voltage
(VSET) are user-selectable options.
WLCSP-20-P2
1.71 x 2.315 x 0.40(1) mm
(1) maximum dimension
DFN(PLP)2730-12
2.70 x 3.00 x 0.6(1) mm
(1) maximum dimension
Product Name
Auto-discharge
Function
RP604xxx1A
Disable
RP604xxx1B
Enable
VSET
1.6 V to 5.2 V
(0.1 V step)
APPLICATIONS
•
•
•
•
Wearable Appliances: SmartWatch, SmartBand, Healthcare
Li-ion/Coin Battery-used Equipment
Low-power Wireless Communication Equipment: Bluetooth® Low Energy, ZigBee, WiSunm, ANT
Low-power Devices for CPU, Memory, Sensor Device, Energy Harvesting
1
RP604x
No. EA-415-201216
SELECTION GUIDE
The set output voltage, the auto-discharge function(1) and the package are user-selectable options.
Selection Guide
Product Name
Package
Quantity per Reel
Pb Free
Halogen Free
RP604Zxx1$-E2-F
WLCSP−20−P2
5,000 pcs
Yes
Yes
DFN(PLP)2730-12
5,000 pcs
Yes
Yes
RP604Kxx1$-TR
xx: Specify the set output voltage (VSET) within the range of 1.6 V (16) to 5.2 V (52) in 0.1 V steps.
$: Specify the auto-discharge function.
Version
Auto-discharge
Function
VSET
A
B
Disable
Enable
1.6 V to 5.2 V
BLOCK DIAGRAM
PVIN
BULX
BOLX
VOUT
AVIN
VFB
PGND
CE
CE
UVLO
TSHUT
Buck/Boost
CTRL
AGND
RP604xxx1A/ RP604xxx1B Block Diagram
(1)
Auto-discharge function quickly lowers the output voltage to 0 V, when the chip enable signal is switched from the
active mode to the standby mode, by releasing the electrical charge accumulated in the external capacitor.
2
RP604x
No. EA-415-201216
PIN DESCRIPTIONS
Bottom View
Top View
1
2
3
4
1
2
3
4
5
5
A B C D
D C B A
WLCSP-20-P2 Pin Configuration
WLCSP-20-P2 Pin Description
Pin No.
Pin Name
Description
A5, B5, C5
VOUT
Output Voltage Pin
A4, B4, C4
BOLX
Boost Switching Output Pin
A3, B3, C3, D3
PGND
Power GND Pin
A2, B2, C2
BULX
Buck Switching Output Pin
A1, B1, C1
PVIN
Power Input Voltage Pin
D1
AVIN
Analog Power Input Voltage Pin
D2
CE
D4
AGND
D5
VFB
Chip Enable Pin, Active-high
Analog GND Pin
Output Voltage Feedback Pin
3
RP604x
No. EA-415-201216
Bottom View
Top View
12 11 10 9 8 7
7
8
9 10 11 12
*
6 5 4
1 2 3 4 5 6
3 2 1
DFN(PLP)2730-12 Pin Configuration
DFN(PLP)2730-12 Pin Description
Pin No.
Pin Name
Description
1
AVIN
2
CE
3
PGND
Power GND Pin
4
PGND
Power GND Pin
5
AGND
Analog GND Pin
6
VFB
7
VOUT
Output Voltage Pin
8
BOLX
Boost Switching Output Pin
9
PGND
Power GND Pin
10
PGND
Power GND Pin
11
BULX
Buck Switching Output Pin
12
PVIN
Power Input Voltage Pin
Analog Power Input Voltage Pin
Chip Enable Pin, Active-high
Output Voltage Feedback Pin
* The tab on the bottom of the package shown by blue circle is a substrate potential (GND). It is recommended that this
tab be connected to the ground plane on the board but it is possible to leave the tab floating.
4
RP604x
No. EA-415-201216
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings
(GND = 0 V)
Symbol
VIN
Parameter
A/PVIN Pin Voltage
Rating
Unit
−0.3 to 6.5
V
VBULX
BULX Pin Voltage
−0.3 to VIN + 0.3
V
VBOLX
BOLX Pin Voltage
−0.3 to VOUT + 0.3
V
VCE
CE Pin Voltage
−0.3 to 6.5
V
VOUT
VOUT Pin Voltage
−0.3 to 6.5
V
VFB
VFB Pin Voltage
−0.3 to 6.5
V
ILX
BULX/BOLX Pin Output Current
900
mA
PD
Power
Dissipation(1)
WLCSP-20-P2
JEDEC STD. 51-9
1490
mW
DFN(PLP)2730-12
JEDEC STD. 51-7
3100
mW
Tj
Junction Temperature Range
−40 to 125
°C
Tstg
Storage Temperature Range
−55 to 125
°C
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause permanent damage
and may degrade the life time and safety for both device and system using the device in the field.
The functional operation at or over these absolute maximum ratings are not assured.
RECOMMENDED OPERATING CONDITIONS
Recommended Operating Conditions
Symbol
Parameter
Rating
Unit
VIN
Input Voltage
1.8 to 5.5
V
Ta
Operating Temperature Range
−40 to 85
°C
RECOMMENDED OPERATING CONDITIONS
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the recommended
operating conditions, even if they are used over such conditions by momentary electronic noise or surge. And the
semiconductor devices may receive serious damage when they continue to operate over the recommended operating
conditions.
(1)
Refer to POWER DISSIPATION for detailed information.
5
RP604x
No. EA-415-201216
ELECTRICAL CHARACTERISTICS
The specifications surrounded by
RP604Z/K Electrical Characteristics
Symbol
Parameter
VOUT
Output Voltage
IQ
Operating Quiescent Current
are guaranteed by design engineering at −40°C ≤ Ta ≤ 85°C.
(Ta = 25°C)
Test Conditions/Comments
VIN = VCE = 3.6 V
VIN = VCE = VOUT = 3.6 V,
VSET = 3.3V at rest
Min.
Typ. Max. Unit
x 0.985
x 1.015
V
µA
0.3
0.01
1
µA
−0.025
0
0.025
µA
VIN = 5.5 V, VCE = 0 V
−0.025
0
0.025
µA
VFB Pin Input Current, High
VIN = VFB = 5.5 V, VCE = 0 V
−0.025
0
0.025
µA
IVOUTL
VFB Pin Input Current, Low
VIN = 5.5 V, VCE = VFB = 0 V
−0.025
0
0.025
µA
VOVP
OVP Threshold Voltage
VIN = 3.6 V, rising (detection)
VIN = 3.6 V, falling (release)
6.0
5.5
V
V
RDISN
Auto-discharge
NMOS On-resistance(1)
VIN = 3.6 V, VCE = 0 V
100
Ω
VCEH
CE Pin Input Voltage, High
VIN = 5.5 V
VCEL
CE Pin Input Voltage, Low
VIN = 2.0 V
ISTANDBY
Standby Current
VIN = 5.5 V, VCE = 0 V
ICEH
CE Pin Input Current, High
VIN = VCE = 5.5 V
ICEL
CE Pin Input Current, Low
IVOUTH
RONP
RONN
1.0
V
0.4
V
RP604Z
VIN = 3.6 V,
ILX = −100 mA
0.12
Ω
RP604K
VIN = 3.6 V,
ILX = −100 mA
0.15
Ω
RP604Z
VIN = 3.6 V,
ILX = −100 mA
0.12
Ω
RP604K
VIN = 3.6 V,
ILX = −100 mA
0.15
Ω
140
100
20
°C
°C
ms
mA
PMOS On-resistance
NMOS On-resistance
TTSD
TTSR
Thermal Shutdown Threshold
Temperature
tSTART
Soft-start Time
Tj, rising (detection)
Tj, falling (release)
VIN = VCE = 3.6 V
ILXLIM
LX Current Limit
VIN = VCE = 3.6 V
600
900
VIN = VCE, falling (detection)
1.40
1.50
1.65
V
VIN = VCE, rising (release)
1.55
1.65
1.80
V
VUVLOF
VUVLOR
UVLO Threshold Voltage
All test items listed under Electrical Characteristics are done under the pulse load condition (Tj ≈ Ta = 25°C). Unless
otherwise noted, the test runs with “Open-loop Control” (GND = 0 V).
(1)
6
RP604xxx1B only
RP604x
No. EA-415-201216
THEORY OF OPERATION
Soft-start Time
Starting-up with CE Pin
The IC starts to operate when the CE pin voltage (VCE) exceeds the threshold voltage. The threshold voltage
is preset between CE “H” input voltage (VCEH) and CE “L” input voltage (VCEL). After the start-up of the IC, softstart circuit starts to operate. Then, after a certain period of time, the reference voltage (VREF) in the IC gradually
increases up to the specified value. Switching starts when VREF reaches the preset voltage, and after that the
output voltage rises accompanying VREF’s increase. Soft-start time (tSTART) starts when soft-start circuit is
activated, and ends when the reference voltage reaches the specified voltage. Soft start time is not always
equal to the turn-on speed of the DC/DC converter. Note that the turn-on speed could be affected by the power
supply capacity, the output current, the inductance value and the COUT value.
VCEH
Threshold Level
CE Pin Input Voltage
VCEL
Soft-start Time
(VCE)
IC Internal Reference Voltage
(VREF)
Lx Voltage
Soft-start Circuit
operation starts.
(VLX)
Output Voltage
(VOUT)
Depending on Power Supply,
Load Current, External Components
Timing Chart: Starting-up with CE Pin
Starting-up with Power Supply
After the power-on, when VIN exceeds the UVLO released voltage (VUVLOR), the IC starts to operate. Then,
soft-start circuit starts to operate and after a certain period of time, VREF gradually increases up to the specified
value. Switching starts when VREF reaches the preset voltage, and after that the output voltage rises
accompanying VREF’s increase. Soft-start time starts when soft-start circuit is activated, and ends when VREF
reaches the specified voltage. Note that the turn-on speed of VOUT could be affected by the power supply
capacity, the output current, the inductance value, the COUT value and the turn-on speed of VIN determined by
CIN.
Input Voltage
VSET
VUVLOR
VUVLOF
(VIN)
Soft-start Time
IC Internal Reference Voltage
(VREF)
Lx Voltage
(VLX)
VOUT
Output Voltage
(VOUT)
Depending on Power Supply,
Load Current, External Components
Timing Chart: Starting-up with Power Supply
7
RP604x
No. EA-415-201216
Undervoltage Lockout (UVLO) Circuit
If the VIN becomes lower than the UVLO detector threshold (VUVLOF), the UVLO circuit starts to operate, VREF
stops, and P-channel and N-channel built-in switch transistors turn “OFF”. As a result, VOUT drops according
to the COUT capacitance value and the load. To restart the operation, VIN needs to be higher than VUVLOR.
Overvoltage Protection (OVP) Circuit
If the VOUT becomes higher than the OVP detector threshold (VOVP), the OVP circuit starts to operate, P-channel
and N-channel built-in switch transistors turn “OFF”. As a result, VOUT drops according to the COUT capacitance
value and the load.
Overcurrent Protection Circuit
Overcurrent protection circuit supervises the inductor peak current (the peak current flowing through Pch Tr
(SW1) in each switching cycle, and if the current exceeds the BULX current limit (ILXLIM), it turns off Pch Tr
(SW1). ILXLIM of the RP604x is set to Typ. 0.9 A.
BULX
PVIN
BOLX
L
SW1
SW2
SW4
VOUT
SW3
PGND
Simplified Diagram of Output Switches
8
RP604x
No. EA-415-201216
VFM Mode
The VFM (Variable Frequency Modulation) mode is adopted as a switching method to achieve a high efficiency
under light load conditions. A switching frequency varies depending on values of input voltage (VIN), output
voltage (VOUT), and output current (IOUT). Check the actual characteristics to avoid the switching noise.
A switching starts when VOUT drops below the lower-limit reference voltage (VREFL). When VOUT exceeds the
upper-limit reference voltage (VREFH), a constant voltage is output by a hysteresis control which stops the
switching.
In order to operate within the rated characteristic of inductor and avoid the deteriorated band frequency of
DC superimposed characteristics, when the inductor current (IL) exceeds LX current limit (ILXLIM), the
operation shifts to off-cycle. And when IL drops below the valley current limit (ILXVAL), the operation shifts to
on-cycle.
VOUT
VREFH
VOUT
VREFL
ILXLIM
VREFH
VREFL
ILXLIM
I L
I L
0
0
No Load
Light Load
VREFH
VREFH
VOUT
VOUT
VREFL
ILXLIM
VREFL
ILXLIM
I L
I L
ILXVAL
0
Medium Load
ILXVAL
0
Heavy Load
9
RP604x
No. EA-415-201216
APPLICATION INFORMATION
BULX
L
Control
CE
BOLX
PVIN
CIN
RP604x
AVIN
VFB
GND
PGND
RP604x Typical Application Circuit
Recommended External Components
Symbol
CIN
COUT
L
10
Load
VOUT
Description
10 µF or more, Ceramic Capacitor
22 µF, Ceramic Capacitor
2.2 µH, Inductor
COUT
RP604x
No. EA-415-201216
TECHNICAL NOTES
The performance of a power source circuit using this device is highly dependent on a peripheral circuit. A
peripheral component or the device mounted on PCB should not exceed a rated voltage, a rated current or a
rated power. When designing a peripheral circuit, please be fully aware of the following points. Refer to PCB
Layout below.
•
Use ceramic capacitors with a low equivalent series resistance (ESR), considering the bias characteristics
and input/ output voltage.
•
When the built-in switches are turned off, the inductor may generate a spike-shaped high voltage. Use the
high-breakdown voltage capacitor (COUT) which output voltage is 1.5 times or more than the set output
voltage.
•
Use an inductor that has a low DC resistance, has an enough tolerable current and is less likely to cause
magnetic saturation. If the inductance value is extremely small, the peak current of LX may increase. When
the peak current of LX reaches to the LX limit current (ILXLIM), overcurrent protection circuit starts to operate.
When selecting the inductor, consider the peak current of LX pin (ILXMAX).
•
When an intermediate voltage other than VIN or GND is input to the CE pin, a supply current may be
increased with a through current of a logic circuit in the IC. The CE pin is neither pulled up nor pulled down,
therefore an operation is not stable at open.
11
RP604x
No. EA-415-201216
PCB Layout
RP604Z (Package: WLCSP-20-P2) PCB Layout
Topside
Backside
RP604K (Package: DFN(PLP)2730-12) PCB Layout
Topside
12
Backside
RP604x
No. EA-415-201216
TYPICAL CHARACTERISTICS
Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed.
1) Output Current vs. Efficiency with Different Input Voltages
RP604Z331x
2) Output Current vs. Output Voltage with Different Input Voltages
RP604Z331x
3) Temperature vs. Standby Current
RP604Z331x,VIN = 5.5 V
13
RP604x
No. EA-415-201216
4) Input Voltage vs. Output Current
RP604Z161x, IOUT = (IIN = 300 mA)
RP604Z521x, IOUT = (IIN = 300 mA)
5) Output Ripple vs. Output Current
RP604Z331x
14
RP604Z331x, IOUT = (IIN = 300 mA)
RP604x
No. EA-415-201216
6) Input Voltage vs. Output Voltage
RP604Z331X, IOUT = 1 mA
7) Starting-up/ Shutting-down Waveform with CE Pin
RP604Z331x, IOUT = 0 mA
8) VOUT Waveform
RP604Z331x, VIN = 3.6 V, IOUT = 10 mA
RP604Z331X, IOUT = 100 mA
RP604Z331x, IOUT = 0 mA
RP604Z331x, VIN = 3.6 V, IOUT = 100 mA
15
RP604x
No. EA-415-201216
9) Load Transient Response
RP604Z331x, VIN = 3.6 V, IOUT = 0.01 mA ←→ 100 mA
10) Input Transient Response
RP604Z331x, VIN = 2.5 V ←→ 4.5 V, IOUT = 1 mA
11) Temperature vs. Supply Current
16
RP604Z331x, VIN = 2.5 V ←→ 4.5 V, IOUT = 100 mA
POWER DISSIPATION
WLCSP-20-P2
Ver. A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-9.
Measurement Conditions
Item
Measurement Conditions
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions
101.5 mm x 114.5 mm x 1.6 mm
Copper Ratio
Outer Layers (First and Fourth Layers): 60%
Inner Layers (Second and Third Layers): 100%
(Ta = 25°C, Tjmax = 125°C)
Measurement Result
Item
Measurement Result
Power Dissipation
1490 mW
Thermal Resistance (ja)
ja = 67 °C/W
ja: Junction-to-Ambient Thermal Resistance
101.5
114.5
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
i
PACKAGE DIMENSIONS
WLCSP-20-P2
Ver. A
WLCSP-20-P2 Package Dimensions (Unit: mm)
i
Visual Inspection Criteria
WLCSP
VI-160823
No.
1
Inspection Items
Package chipping
2
Si surface chipping
3
No bump
Marking miss
4
Inspection Criteria
Figure
A≥0.2mm is rejected
B≥0.2mm is rejected
C≥0.2mm is rejected
And, Package chipping to Si surface
and to bump is rejected.
A≥0.2mm is rejected
B≥0.2mm is rejected
C≥0.2mm is rejected
But, even if A≥0.2mm, B≤0.1mm is
acceptable.
No bump is rejected.
To reject incorrect marking, such as
another product name marking or
5
6
7
No marking
Reverse direction of
marking
Defective marking
8
Scratch
9
Stain and Foreign
material
another lot No. marking.
To reject no marking on the package.
To reject reverse direction of marking
character.
To reject unreadable marking.
(Microscope: X15/ White LED/ Viewed
from vertical direction)
To reject unreadable marking
character by scratch.
(Microscope: X15/ White LED/ Viewed
from vertical direction)
To reject unreadable marking
character by stain and foreign material.
(Microscope: X15/ White LED/ Viewed
from vertical direction)
i
POWER DISSIPATION
DFN(PLP)2730-12
Ver. A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Measurement Conditions
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions
76.2 mm × 114.3 mm × 0.8 mm
Copper Ratio
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
Through-holes
0.3 mm × 23 pcs
(Ta = 25°C, Tjmax = 125°C)
Measurement Result
Item
Measurement Result
Power Dissipation
3100 mW
Thermal Resistance (ja)
ja = 32°C/W
Thermal Characterization Parameter (ψjt)
ψjt = 8°C/W
ja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
i
PACKAGE DIMENSIONS
DFN(PLP)2730-12
Ver. A
7
2.700.05
0.50.05
6
0.250.05
0.575±0.025
INDEX
12
C 0.05
0.250.05
B
1.700.05
3.000.05
2.700.05
A
1
0.50
0.250.05
0.05 M AB
Bottom View
S
0.05 S
DFN(PLP)2730-12 Package Dimensions (Unit: mm)
*
∗The tab on the bottom of the package shown by blue circle is a substrate potential (GND). It is recommended that this
tab be connected to the ground plane on the board but it is possible to leave the tab floating.
i
1. The products and the product specifications described in this document are subject to change or discontinuation of
production without notice for reasons such as improvement. Therefore, before deciding to use the products, please
refer to Ricoh sales representatives for the latest information thereon.
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consent of Ricoh.
3. Please be sure to take any necessary formalities under relevant laws or regulations before exporting or otherwise
taking out of your country the products or the technical information described herein.
4. The technical information described in this document shows typical characteristics of and example application circuits
for the products. The release of such information is not to be construed as a warranty of or a grant of license under
Ricoh's or any third party's intellectual property rights or any other rights.
5. The products listed in this document are intended and designed for use as general electronic components in standard
applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products,
amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality
and reliability, for example, in a highly specific application where the failure or misoperation of the product could result
in human injury or death (aircraft, spacevehicle, nuclear reactor control system, traffic control system, automotive and
transportation equipment, combustion equipment, safety devices, life support system etc.) should first contact us.
6. We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products
are likely to fail with certain probability. In order to prevent any injury to persons or damages to property resulting from
such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy
feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or
damage arising from misuse or inappropriate use of the products.
7. Anti-radiation design is not implemented in the products described in this document.
8. The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and
characteristics in the evaluation stage.
9. WLCSP products should be used in light shielded environments. The light exposure can influence functions and
characteristics of the products under operation or storage.
10. There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the
case of recognizing the marking characteristic with AOI, please contact Ricoh sales or our distributor before attempting
to use AOI.
11. Please contact Ricoh sales representatives should you have any questions or comments concerning the products or
the technical information.
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Ricoh is committed to reducing the environmental loading materials in electrical devices
with a view to contributing to the protection of human health and the environment.
Ricoh has been providing RoHS compliant products since April 1, 2006 and Halogen-free products since
April 1, 2012.
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