2SAR553P FRA
Datasheet
Middle Power Transistor (-50V / -2A)
AEC-Q101 Qualified
l Outline
Parameter
Value
VCEO
-50V
IC
-2A
SOT-89
SC-62
MPT3
l Features
l Inner circuit
1) Low saturation voltage
VCE(sat) = -400mV (Max.)
(IC/ I B=-700mA/-35mA)
2) High speed switching
l Application
LOW FREQUENCY AMPLIFIER, HIGH SPEED SWITCHING
l Packaging specifications
Part No.
Package
Package
size
2SAR553P FRA
SOT-89
(MPT3)
4540
Taping
code
T100
Basic
Reel size Tape width ordering
(mm)
(mm)
unit.(pcs)
180
12
1000
Marking
MG
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20160920 - Rev.001
2SAR553P FRA
Datasheet
l Absolute maximum ratings (Ta = 25°C)
Parameter
Symbol
VCBO
VCEO
VEBO
IC
ICP*1
PD*2
PD*3
Tj
Tstg
Collector-base voltage
Collector-emitter voltage
Emitter-base voltage
Collector current
Power dissipation
Junction temperature
Range of storage temperature
Values
-50
-50
-6
-2
-4
0.5
2.0
150
-55 to +150
Unit
V
V
V
A
A
W
W
℃
℃
l Electrical characteristics (Ta = 25°C)
Min.
Values
Typ.
Max.
IC = -100μA
-50
-
-
V
IC = -1mA
-50
-
-
V
IE = -100μA
VCB = -50V
VEB = -4V
VCE(sat)*4 IC = -700mA, IB = -35mA
-6
-
-
-1.0
-1.0
V
μA
μA
-
-200
-400
mV
VBE(sat)*4 IC = -700mA, IB = -35mA
hFE
VCE = -2V, IC = -50mA
VCE = -10V, IE = 300mA,
f T*4
f = 100MHz
VCB = -10V, IE = 0A,
Cob
f = 1MHz
180
-0.9
-
-1.3
450
V
-
-
320
-
MHz
-
22
-
pF
IC = -1A,
IB1 = -100mA,
IB2 = 100mA,
VCC ⋍ -10V,
RL = 10Ω
See test circuit
-
45
-
ns
-
220
-
ns
-
35
-
ns
Parameter
Symbol
Collector-base breakdown
voltage
Collector-emitter breakdown
voltage
Emitter-base breakdown voltage
Collector cut-off current
Emitter cut-off current
BVCBO
BVCEO
Collector-emitter saturation voltage
Base-emitter saturation voltage
DC current gain
Transition frequency
Output capacitance
Conditions
BVEBO
ICBO
IEBO
Turn-On time
ton
Storage time
tstg
Fall time
tf
Unit
*1 Pw=10ms, Single pulse
*2 Each terminal mounted on a reference land.
*3 Mounted on a ceramic board.(40×40×0.7mm)
*4 Pulsed
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20160920 - Rev.001
2SAR553P FRA
Datasheet
l Electrical characteristic curves(Ta = 25°C)
Fig.1 Ground Emitter Propagation
Characteristics
Fig.2 Typical Output Characteristics
Fig.3 DC Current Gain vs. Collector
Current (I)
Fig.4 DC Current Gain vs. Collector
Current (II)
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© 2015 ROHM Co., Ltd. All rights reserved.
3/6
20160920 - Rev.001
2SAR553P FRA
Datasheet
l Electrical characteristic curves(Ta = 25°C)
Fig.5 Collector-Emitter Saturation
Voltage vs. Collector Current (I)
Fig.6 Collector-Emitter Saturation
Voltage vs. Collector Current (II)
Fig.7 Base-Emitter Saturation Voltage
vs. Collector Current
Fig.8 Gain Bandwidth Product vs.
Emitter Current
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4/6
20160920 - Rev.001
2SAR553P FRA
Datasheet
l Electrical characteristic curves(Ta = 25°C)
Fig.9 Emitter Input Capacitance vs.
Emitter-Base Voltage
Collector Output Capacitance vs.
Collector-Base Voltage
Fig.10 Safe Operating Area
SWITCHING TIME TEST CIRCUIT
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2SAR553P FRA
Datasheet
l Dimensions
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Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
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[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
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incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
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Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003