Datasheet
Constant Current LED Drivers for Automotive
Constant Current Controller
for Automotive LED Lamps
BD18340FV-M BD18341FV-M
General Description
Key Specifications
BD18340FV-M/BD18341FV-M are 70V-withstanding
Constant Current Controller for Automotive LED Lamps.
It is able to drive at maximum 10 rows of PNP transistors.
It can also contribute to reduction in the consumption
power of the set as it has the integrated standby function.,
The IC also incorporates a highly reliable, in-built
de-rating function, LED Open Detection, Short Circuit
Protection and Over Voltage Mute function and LED
failure input/output function.
Input Voltage Range:
FB Terminal Voltage Accuracy:
4.5V to 19V
650mV ±3%
@Ta = 25°C to 125°C
Stand-by Current:
0µA(Typ)
LED Current De-rating Accuracy:
BD18340FV-M: ±5% @VDCDIM=0.5 to 0.75V
BD18341FV-M: ±12% @VDCDIM=0.5 to 0.75V
Operating Temperature Range:
-40°C to +125°C
Features
AEC-Q100 Qualified(Note1)
LED Constant-Current Controller
PWM Dimming Function
LED Current De-rating Function
LED Open Detection
Short Circuit Protection(SCP)
Over Voltage Mute Function(OVM)
Disable LED Open Detection Function at
Reduced-Voltage
Abnormal Output Detection and Output Functions
Package
W(Typ) x D(Typ) x H(Max)
5.00mm x 6.40mm x 1.35mm
SSOP-B16
(Note1: Grade1)
Applications
SSOP-B16
Automotive LED Exterior Lamp
(Rear Lamp, Turn Lamp, DRL/Position Lamp,
Fog Lamp etc.)
Automotive LED Interior Lamp
(Air Conditioner Lamp, Interior Lamp,
Cluster Light etc.)
Typical Application Circuit
RFB1
RFB2
PWM_in
VIN
FB
D1
ZD1
CVIN1
CVIN2
EN
RLIM
BASE
D2
CRT
DC_in
D3
CCRT
OP
RCRT
DISC
RDCIN
D
BD18340FV-M
BD18341FV-M
SCP
CLED
VREG
CD
CVREG
PWMOUT
OPM
ROPM
PBUS
GND
RDCDIM
DCDIM
NTC
〇Product structure : Silicon monolithic integrated circuit
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〇This product has no designed protection against radioactive rays
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BD18340FV-M BD18341FV-M
Pin Configuration
(TOP VIEW)
FB
1
16
VIN
BASE
2
15
EN
N.C.
3
14
DISC
OP
4
13
CRT
SCP
5
12
D
GND
6
11
DCDIM
PBUS
7
10
VREG
PWMOUT
8
9
OPM
Pin Description
Pin
No.
Pin
Name
1
FB
2
BASE
3
N.C.
4
OP
5
SCP
6
GND
7
PBUS
8
PWMOUT
Pin
No.
Pin
Name
Function
Input terminal for feedback voltage
9
OPM
The terminal to set
Disable LED open detection voltage
The terminal for connecting
PNP Tr. BASE
10
VREG
Internal reference voltage
Pin not connected internally. (Note 1)
11
DCDIM
12
D
13
CRT
GND
14
DISC
The terminal
Abnormal Output Detection and Output
15
EN
Enable input
CR timer signal output
16
VIN
Power supply input
Function
The terminal
for LED open detection
The terminal
for short circuit protection
The terminal to set
DC dimming
The terminal to set
Disable LED open detection time
The terminal to set
CR timer
Discharge terminal for
CR timer
(Note 1) Please be sure to floating at N.C. pin
Block Diagram
VREG
VIN
FB
EN
VREG
PBUS
BASE
Over
Voltage
Mute
VREF
PBUS
OPENLOAD
V RE G
OP
VI N
V RE G
OPEN
MASK
Control
Logic
SCP
D
V IN
1.2V
1mA
OPM
SCP
DELAY
20µs
D COMP
1.2V⇔1.25V
DELAY
Rise 1µs
1.0V
DC Dimming
V RE G
CRT
DCDIM
1.0V
CR
TIMER
DISC
PWMOUT
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BD18340FV-M BD18341FV-M
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
VIN
-0.3 to +70
V
VEN, VCRT, VDISC
-0.3 to +70
V
VFB, VBASE, VOP,VSCP
-0.3 to VIN+0.3V
V
VIN-VFB,VIN-VBASE
-0.3 to +5.0
V
VPBUS, VREG, VDCDIM
-0.3 to +7.0
V
VPWMOUT, VOPM, VD
-0.3 to VREG+0.3
V
Operating Temperature Range
Topr
-40 to 125
°C
Storage Temperature Range
Tstg
-55 to 150
°C
Junction Temperature
Tjmax
150
°C
Supply Voltage
EN,CRT, DISC Terminal Voltage
FB,BASE,OP,SCP Terminal Voltage
VIN-FB, VIN-BASE
Voltage across Terminals
PBUS,VREG
DCDIM Terminal Voltage
PWMOUT, OPM, D Terminal Voltage
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Thermal Resistance (Note2)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s(Note4)
2s2p(Note5)
θJA
140.9
77.2
°C/W
ΨJT
6
5
°C/W
SSOP-B16
Junction to Ambient
Junction to Top Characterization Parameter
(Note 3)
(Note2) Based on JESD51-2A (Still-Air),
(Note3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of
the outside surface of the component package.
(Note4) Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3mm x 76.2mm x
1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
(Note5) Using a PCB board based on JESD51-7
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
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Recommended Operating Conditions (Ta=-40°C to +125°C)
Parameter
Symbol
Min
Typ
Max
Unit
VIN
4.5
13
19
V
CRTIMER Frequency Range
f PW M
100
-
5000
Hz
PWM Minimum Pulse Width(Note3)
t MIN
10
-
-
µs
Supply Voltage(Note1) (Note2)
(Note1) ASO should not be exceeded
(Note2) At start-up time, please apply a voltage above 5V once. The value is the voltage range after the temporary rise to 5V.
(Note3) At connecting the External PNP Tr.(2SAR573D3FRA(ROHM) ,1pcs), That is the same when the Pulse input to CRT terminal.
Operating Conditions
Parameter
Symbol
Min
Max
Unit
C VIN1
1.0
-
μF
C VIN2 (Note4)
0.047
-
μF
C VREG (Note5)
1.0
4.7
μF
C LED
0.1
0.68
μF
C CRT
0.01
0.22
μF
The Capacitor
connecting VIN Terminal1
The Capacitor
connecting VIN Terminal2
The Capacitor
connecting VREG Terminal
The Capacitor
connecting LED Anode
The Capacitor
connecting CRT Terminal
The Resistor
connecting CRT Terminal
The Resistor
for setting LED Current LED
The Resistor
for setting Disable LED Open
Detection Voltage
The Resistor
for setting DC Dimming
The Resistor
for DCIN pull-down
The Capacitor
for setting Disable LED Open
Detection Time
The Resistor for limiting
Base Terminal Current
R CRT
0.1
50
kΩ
R FB1 , R FB2 (Note6)
0.8
6.5
Ω
R OPM
25
55
kΩ
R DCD IM
4.7
50
kΩ
R DCIN
-
10
kΩ
C D (Note5)
0.001
0.1
μF
R LIM
See Features
Description 5
Ω
The External PNP Transistor
Q1
(Note7)
-
(Note4) ROHM Recommended Value (0.1μF GCM155R71H104KE37 murata)
(Note5) Ceramic capacitor recommended. Please setting the Disable LED Open Detection Time less than PWM minimum pulse width.
(Note6) At connecting the External PNP Tr. (2SAR573D3FRA (ROHM), 1pcs)
(Note7) For external PNP transistor, please use the recommended device 2SAR573D3FRA for this IC.
While using non-recommended part device, validate the design on actual board.
Please check hfe of the part to design base current limit resistor. (See Features Description, section 5).
As for parasitic capacitance, please evaluate over shoot of ILED on actual board. (See Features Description, Section 8 -Evaluation example, ILED pulse
width at PWM Dimming operation).
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Electrical Characteristics1
(Unless otherwise specified Ta = -40 to +125°C, VIN = 13V, CVREG = 1.0µF, Transistor PNP = 2SAR573D3FRA)
Parameter
Symbol
Limit
Min
Typ
Max
Unit
Conditions
[ Circuit Current IVIN ]
Circuit Current
at Stand-by Mode
IVIN1
-
0
10
μA
VEN = 0V
VFB=VIN
Circuit Current
at Normal Mode
IVIN2
-
2.0
5.0
mA
VEN = VIN, VFB=VIN-1.0V
Base current subtracted
Circuit Current
at LED Open Detection
IVIN3
-
2.0
5.0
mA
VEN = VIN, VFB=VIN-1.0V
at LED Open Detection
Circuit Current
at PBUS=Low
IVIN4
-
2.0
5.0
mA
VEN = VIN, VFB=VIN-1.0V
VPBUS = 0V
VREG
4.85
5.00
5.15
V
IVREG
-1.0
-
-
mA
630
650
670
mV
617
650
683
mV
IFB
7.5
15
30
μA
VFB = VIN
BASE Terminal Sink
Current Capability
IBASE
10
-
-
mA
VFB = VIN, VBASE = VIN - 1.5V
Ta = 25°C
BASE Terminal
Pull-up Resistor
RBASE
0.5
1.0
1.5
kΩ
VCRT = 0V
VFB = VIN, VBASE = VIN - 1.0V
[ VREG Voltage ]
VREG Terminal Voltage
VREG Terminal
Current Capability
[ DRV ]
FB Terminal Voltage
VFBREG
FB Terminal
Input Current
IVREG = -100μA
VFBREG = VIN - VFB
RFB1 = RFB2 = 1.8Ω,
Ta = 25 to 125°C
VFBREG = VIN - VFB
RFB1 = RFB2 = 1.8Ω,
Ta = -40 to 125°C
[ LED Current De-rating Function (DC Dimming Function) ]
DDG
688
725
762
mV /
V
FB Terminal Voltage
VDCDIM = 0.75V
VFB_DC1
443
466
489
mV
FB Terminal Voltage
VDCDIM = 0.50V
VFB_DC2
270
284
298
mV
FB Terminal Voltage
VDCDIM = 0.35V
VFB_DC3
161
175
189
mV
FB Terminal Voltage
VDCDIM = 0.75V
VFB_DC1
413
466
522
mV
FB Terminal Voltage
VDCDIM = 0.50V
VFB_DC2
250
284
318
mV
FB Terminal Voltage
VDCDIM = 0.35V
VFB_DC3
155
175
196
mV
DC Dimming Gain
ΔVFBREG / ΔVDCDIM
VDCDIM: 0.75V -> 0.35V
BD18340FV-M
BD18341FV-M
[ Over Voltage Mute Function(OVM) ]
Over Voltage Mute
Start Voltage
VOVMS
20.0
22.0
24.0
V
Over Voltage Mute
Gain
VOVMG
-
-25
-
mV /
V
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ΔVFB = 10.0mV
ΔVFB = VFB(@VIN = 13V) –
VFB(@VIN = VOVM)
ΔVFB / ΔVIN
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2019.02.28 Rev.003
BD18340FV-M BD18341FV-M
Electrical Characteristics2
(Unless otherwise specified Ta = -40 to +125°C, VIN = 13V, CVREG = 1.0µF, Transistor PNP = 2SAR573D3FRA)
Parameter
Symbol
Limit
Min
Typ
Max
Unit
Conditions
[ CRTIMER ]
CRT Terminal Charge Current
ICRT
36
40
44
μA
CRT Terminal Charge Voltage
VCRT_CHA
0.72
0.80
0.88
V
CRT Terminal
Discharge Voltage 1
VCRT_DIS1
1.80
2.00
2.20
V
CRT Terminal
Discharge Voltage 2
VCRT_DIS2
2.10
2.40
3.00
V
When VCRT > VCRT_DIS2,
RD1 -> RD2
CRT Terminal Charge Resistor
RCHA
28.5
30.0
31.5
kΩ
RCHA=
(VCRT_DIS1- VCRT_CHA)/ ICRT
CR Timer Discharge Constant
VCRT_CHA /
VCRT_DIS1
0.38
0.40
0.42
V/V
DISC Terminal ON Resistor 1
RDISC1
20
50
100
Ω
IDISC = 10mA
DISC Terminal ON Resistor 2
RDISC2
2.5
5.0
10
kΩ
IDISC = 100μA
PWMOUT Terminal
Output High Voltage
VPWMOUTH
4.0
-
5.5
V
IPWMOUT = -100μA
PWMOUT Terminal
Output Low Voltage
VPWMOUTL
-
-
0.5
V
IPWMOUT = 100μA
-
-
0.5
mA
-0.5
-
-
mA
PWMOUT Terminal
Sink Current Capability
IPWMOUT
PWMOUT Terminal
Source Current Capability
IPWMOUT
CRT Terminal Leakage Current
ICRT_LEAK
-
-
10
μA
VOPD
1.1
1.2
1.3
V
VOPD = VIN - VOP
IOP
19
21
23
μA
VOP = VIN - 0.5V
_SINK
_SOURCE
VCRT = 70V
[ LED Open Detection ]
LED Open Detection Voltage
OP Terminal
Input Current
[ Disable LED Open Detection Function at Reduced-Voltage]
OPM Terminal Source Current
VIN Terminal Disable LED Open
Detection Voltage
at Reduced-Voltage
OPM Terminal
Input Voltage Range
IOPM
38
40
42
μA
VIN_OPM
VOPM
× 5.9
VOPM
× 6.0
VOPM
× 6.1
V
VOPM_R
1.0
-
2.2
V
VDH
0.9
1.0
1.1
V
IDSOURCE
100
230
400
μA
RD
-
-
950
Ω
VIN terminal Voltage
[ Disable LED Open Detection Time Setting ]
Input Threshold Voltage
D Terminal Source Current
D Terminal ON Resistor
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ID_EXT = 100μA
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BD18340FV-M BD18341FV-M
Electrical Characteristics3
(Unless otherwise specified Ta = -40 to +125°C, VIN = 13V, CVREG = 1.0µF, Transistor PNP = 2SAR573D3FRA)
Parameter
Symbol
Limit
Min
Typ
Max
Unit
Conditions
[ Short Circuit Protection(SCP) ]
Short Circuit Protection
Voltage
VSCP1
1.1
1.2
1.3
V
Short Circuit Protection
Release Voltage
VSCPR
1.15
1.25
1.35
V
Short Circuit Protection
Hysteresis Voltage
VSCPHYS
-
50
-
mV
SCP Terminal Source Current
ISCP
0.2
1.0
2.0
mA
SCP Terminal Source Current
ON Voltage
VSCP2
1.15
1.30
1.45
V
SCP Delay Time
tSCP2
10
20
45
µs
Input High Voltage
VPBUSH
2.40
-
-
V
Input Low Voltage
VPBUSL
-
-
0.6
V
Hysteresis Voltage
VPBUSHYS
-
200
-
mV
PBUS Terminal Source Current
IPBUS
75
150
300
μA
VEN = 5V
PBUS Terminal
Output Low Voltage
RPBUS
-
-
0.6
V
IPBUS_EXT = 3mA
PBUS Terminal
Output High Voltage
VPBUS_OH
3.5
4.5
5.5
V
IPBUS_EXT = -10μA
PBUS Terminal
Leakage Current
IPBUS_LEAK
-
-
10
μA
VPBUS = 7V
Input High Voltage
VENH
2.4
-
-
V
Input Low Voltage
VENL
-
-
0.6
V
Hysteresis Voltage
VENHYS
-
60
-
mV
IEN
-
7
15
μA
VEN = 5V
UVLO Detection Voltage
VUVLOD
3.88
4.10
4.32
V
VIN: Sweep down
UVLO Release Voltage
VUVLOR
4.25
4.50
4.75
V
VIN: Sweep up,
VREG > 3.75V
VHYS
-
0.4
-
V
[ PBUS ]
[ EN ]
Terminal Input Current
[ UVLO VIN ]
UVLO Hysteresis Voltage
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Typical Performance Curves (Reference Data)
(Unless otherwise specified Ta = 25°C, VIN = 13V, CVREG = 1.0µF, Transistor PNP = 2SAR573D3FRA)
5.0
6.0
4.5
5.5
4.0
5.0
3.0
4.0
VREG[V]
IVIN2[mA]
4.5
Ta=125°C
Ta= 25°C
Ta=-40°C
3.5
2.5
2.0
3.5
Ta=125°C
Ta= 25°C
Ta=-40°C
3.0
2.5
1.5
2.0
1.0
1.5
1.0
0.5
0.5
0.0
0
2
4
6
8
0.0
10 12 14 16 18 20
VIN[V]
0
2
4
Figure 1. IVIN2 vs VIN
6
8
10 12 14 16 18 20
VIN[V]
Figure 2. VREG vs VIN
500
5.25
5.20
400
5.15
5.05
ILED[mA]
VREG[V]
5.10
5.00
4.95
300
200
4.90
4.85
100
4.80
4.75
0
-50
-25
0
25 50 75
Temp[°C]
100 125 150
0
Figure 3. VREG vs Temp
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2
4
6
8
10
RFB1+RFB2[Ω]
12
14
Figure 4. ILED vs RFB1+RFB2
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BD18340FV-M BD18341FV-M
Typical Performance Curves (Reference Data)
(Unless otherwise specified Ta = 25°C, VIN = 13V, CVREG = 1.0µF, Transistor PNP = 2SAR573D3FRA)
5
690
4
680
3
670
VFBREG[mV]
⊿ILED[%]
2
1
0
-1
660
650
640
-2
630
ΔILED = (ILED / (0.65V / RFB1+RFB2))-1)x100[%]
-3
620
-4
-5
610
0
2
4
6
8
10
RFB1+RFB2[Ω]
12
14
-50
Figure 5. ΔILED vs RFB1+RFB2
25 50 75
Temp[°C]
100 125 150
760
Ta= 25°C
Ta=-40°C
750
600
740
500
730
DDG[mV/V]
VFBREG[mV]
0
Figure 6. VFBREG vs Temp
800
700
-25
400
Ta=125°C
300
720
710
700
200
690
100
680
0
-50
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
VDCDIM[V]
Figure 7. VFBREG vs VDCDIM
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-25
0
25 50 75
Temp[°C]
100 125 150
Figure 8. DDG vs Temp
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BD18340FV-M BD18341FV-M
Typical Performance Curves (Reference Data)
(Unless otherwise specified Ta = 25°C, VIN = 13V, CVREG = 1.0µF, Transistor PNP = 2SAR573D3FRA)
800
45
700
40
600
35
500
VFBREG[mV]
IBASE[mA]
50
30
25
Ta=125°C
Ta= 25°C
Ta=-40°C
20
Ta= 25°C
Ta=-40°C
400
Ta=125°C
300
200
15
100
10
0
4.0
6.0
8.0 10.0 12.0 14.0 16.0 18.0 20.0
VIN[V]
6
Figure 10. VFBREG vs VIN
42.0
42.0
41.5
41.5
41.0
41.0
40.5
40.5
IOPM[μA]
ICRT [μA]
Figure 9. IBASE vs VIN
11 16 21 26 31 36 41 46 51 56
VIN[V]
40.0
40.0
39.5
39.5
39.0
39.0
38.5
38.5
38.0
38.0
-50
-25
0
25
50
75
100 125 150
-50
Temp[℃]
0
25
50
75
100 125 150
Temp[℃]
Figure 11. ICRT vs Temp
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Figure 12. IOPM vs Temp
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BD18340FV-M BD18341FV-M
Features Description
(Unless otherwise specified, Ta=25°C, VIN=13V, Transistor PNP = 2SAR573D3FRA, and numbers are “Typical” values.)
1.
LED Current Setting
LED current ILED can be defined by setting resistances RFB1 and RFB2.
𝐼𝐿𝐸𝐷 =
𝑉𝐹𝐵𝑅𝐸𝐺
[ 𝐴]
𝑅𝐹𝐵1 + 𝑅𝐹𝐵2
where:
VFBREG is the FB Terminal Voltage 650mV (Typ)
• How to connect LED current setting resistors
LED current setting resistors must always be connected at least in pair arranged in series as below.
If only one current setting resistor is used, then in case of a possible resistor short, the external PNP Tr. and LED
may be broken due to large current flow.
PNP Tr. rating current, LED rating current, RFB1 and RFB2 must have the following relations:
𝐼𝐿𝐸𝐷_𝑀𝑎𝑥 > 𝐼𝑃𝑁𝑃_𝑀𝑎𝑥 >
𝑉𝐹𝐵𝑅𝐸𝐺
[ 𝐴]
𝑀𝑖𝑛(𝑅𝐹𝐵1 , 𝑅𝐹𝐵2 )
where:
ILED_Max is the LED Rating Current
IPNP_Max is the PNP Tr. Rating Current
VFBREG is the FB Terminal Voltage 650mV(Typ)
Min(RFB1,RFB2) is the Lowest value of RFB1 and RFB2
RFB1
VIN
RFB2
FB
+B
EN
VREG
VREG
BASE
VCE(SAT)
VREF
GND
CVREG
ILED
Figure 13. LED Current Setting
• Constant current control dynamic range
Constant current control dynamic range of LED current I LED can be calculated as follows.
𝑉𝐼𝑁 ≥ 𝑉𝑓_𝐿𝐸𝐷 ∙ 𝑁 + 𝑉𝐶𝐸_𝑃𝑁𝑃 + 𝑉𝐹𝐵𝑅𝐸𝐺 [𝑉 ]
where:
VIN is the VIN Terminal Voltage
Vf_LED is the LED Vf
N is the Number of Rows of LED
VCE(sat) is the External PNP Tr. Collector-Emitter Saturation Voltage
VFBREG is the FB Terminal Voltage 650mV(Typ)
2.
Reference-Voltage (VREG)
VIN terminal generates 5.0V (Typ). This voltage is used as power source for the internal circuit, and also used to fix the
voltage of terminals outside LSI to HIGH side. VREG terminal must be connected with CVREG = 1.0μF to 4.7μF to ensure
capacity for the phase compensation. If CVREG is not connected, the circuit behavior would become extraordinarily unstable,
for example with the oscillation of the reference-voltage.
VREG terminal voltage must not be used as power source for other devices than this LSI.
VREG circuit has a built-in UVLO function. The IC is activated when the VREG terminal voltage rises to 4.0V (Typ) or higher,
and shut down when the VREG terminal voltage drops to 3.75V(Typ) or lower.
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3.
Table of Operations
The PWM dimming mode switches to DC control depending on CRT terminal voltage.
When VIN > 22.0V (Typ), LED current is limited to reduce the heat dissipation of external PNP Tr.
Depending on OP/SCP terminal voltage status, output current is turned OFF. Output current is also turned OFF
when Low signal is input to PBUS terminal.
In addition, UVLO, TSD further increases system reliability
For each functions, please refer to Features Description.
Detecting Condition
Operation
Mode
CRT
Terminal
[Release]
LED Current
(ILED)
PBUS Terminal
[Detect]
Stand-by
Mode(Note1)
-
VEN ≤ 0.6V
VEN ≥ 2.4V
OFF(Note3)
Hi-Z
DC
VCRT ≥
2.0V(Typ)
-
-
50mA to 400mA
High
(4.5V(Typ))
-
-
See Features
Description, 4.
High
(4.5V(Typ))
PWM Dimming
See Features
Description, 4.
DC Dimming
-
VDCDIM ≤
1.0V(Typ)
VDCDIM > 1.25V
See Features
Description, 9.
High
(4.5V(Typ))
Over Voltage
Mute
-
VIN >
22.0V(Typ)
VIN ≤
22.0V(Typ)
See Features
Description, 11.
High
(4.5V(Typ))
LED Open
Detection(Note2)
-
VOP ≥
VIN –1.2V(Typ)
VOP <
VIN – 1.2V(Typ)
OFF(Note3)
Low
Short Circuit
Protection
(SCP)
-
VSCP ≤
1.2V(Typ)
VSCP ≥
1.25V(Typ)
OFF(Note3)
Low
PBUS Control
OFF
-
VPBUS ≤ 0.6V
VPBUS ≥ 2.4V
OFF(Note3)
Input
VPBUS ≤ 0.6V
UVLO
-
VIN ≤ 4.1V(Typ)
or
VREG ≤ 3.75V(Typ)
VIN ≥ 4.5V(Typ)
or
VREG ≥ 4.0V(Typ)
OFF(Note3)
High
(4.5V(Typ))
TSD
-
Tj ≥
175C(Typ)
Tj ≤
150C(Typ)
OFF(Note3)
Hi-Z
(Note1) Circuit Current 0μA(Typ)
(Note2) In regard to the sequence of LED current OFF, see Features Description, 5.
(Note3) BASE Terminal Current: OFF, and LED Current (ILED): OFF.
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4.
PWM Dimming Operation using external RC network
PWM Dimming is performed with the following circuit.
The ramp up/down time of the CRT voltage, and therefore the dimming cycle and Duty, can be set by values of the external
components (CCRT, RCRT).
Please connect CRT to VIN and DISC to GND or open if it is not used.
The CR timer function is activated if DC SW is OPEN. To perform PWM light control of LED current, a triangular
waveform is generated at CRT terminal. The LED current (ILED) is turned OFF while CRT voltage is ramping up,
and LED current(ILED) is turned ON while CRT voltage is ramping down.
When VCRT > V CRT_D IS1 (2.0V(Typ)), Dimming mode turns to DC Control. When VCRT > V CRT_D IS2 (2.4V(Typ)),
discharge resistance of DISC terminal changes from RDISC1(50Ω(Typ)) to RDISC2(5kΩ(Typ)).
PWM SW
ON
VIN
EN
VREG
DC SW
OPEN
FB
Control
Logic
VREG
BASE
I CRT
VREF
CRT
CCRT
RCRT
ILED
VCRT_DIS1
GND
VCRT_DIS2
DISC
RDISC1
R DISC2
PWMOUT
Figure 14. PWM Dimming Operation
CRT Voltage
Ramp-up
CRT Voltage
Ramp-down
VCRT_DIS1
2.0V(Typ)
CRT Terminal
Waveform
⊿VCRT
VCRT_CHA
0.8V(Typ)
t OFF
tOFF =
⊿VCRT×CCRT
ICRT
t ON
=RCHA×CCRT
tON= - (R CRT + RDISC1)×CCRT×ln
VCRT_CHA
VCRT_DIS1
5V
PWMOUT Terminal
Waveform
0V
LED Current
ILED
ILED
OFF
ILED
ON
ILED
OFF
I LED
ON
I LED
OFF
I LED
ON
Figure 15. PWM Dimming Operation
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(1) CRT Ramp up Time tOFF and CRT Ramp down Time tON
CRT Ramp up Time tOFF and CRT Ramp down Time tON can be defined from the following equations.
Make sure that tON is set > PWM Minimum Pulse Width tMIN:10μs (Min).
𝑡𝑂𝐹𝐹 =
∆𝑉𝐶𝑅𝑇 × 𝐶𝐶𝑅𝑇
= 𝑅𝐶𝐻𝐴 × 𝐶𝐶𝑅𝑇 [𝑠]
𝐼𝐶𝑅𝑇
𝑡𝑂𝑁 = −(𝑅𝐶𝑅𝑇 + 𝑅𝐷𝐼𝑆𝐶1 ) × 𝐶𝐶𝑅𝑇 × 𝐼𝑛 (
𝑉𝐶𝑅𝑇_𝐶𝐻𝐴
) [𝑠 ]
𝑉𝐶𝑅𝑇_𝐷𝐼𝑆1
where:
ICRT is the CRT Terminal Charge Current
RCHA is the CRT Terminal Charge Resistor
RDISC1 is the DISC Terminal ON Resistor1
VCRT_CHA is the CRT Terminal Charge Voltage
VCRT_DIS1 is the CRT Terminal Discharge Voltage1
40μA(Typ)
30kΩ(Typ)
50Ω(Typ)
0.8V(Typ)
2.0V(Typ)
(2) PWM Dimming Frequency fPWM
PWM frequency is defined by tON and tOFF.
𝑓𝑃𝑊𝑀 =
1
[𝐻𝑧]
𝑡𝑂𝑁 + 𝑡𝑂𝐹𝐹
(3) ON Duty(DON)
Like the above, PWM ON duty is defined by tON and tOFF.
𝐷𝑂𝑁 =
𝑡𝑂𝑁
[%]
𝑡𝑂𝑁 + 𝑡𝑂𝐹𝐹
(Example) In case of RCRT=3.6kΩ, CCRT=0.1μF (Typ)
tOFF = RCHA × CCRT = 30kΩ × 0.1μF = 3.0ms
tON = - (RCRT + RDISC1) × CCRT × ln(VCRT_CHA / VCRT_DIS1)= - (3.6kΩ + 50Ω) × 0.1μF × ln(0.8V / 2.0V) = 0.334ms
fPWM = 1 / (tON + tOFF) = 1 / (3.0ms + 0.334ms) = 300Hz
DON = tON / (tON + tOFF) = 0.334ms / (3.0ms + 0.334ms) =10.0%
[PWM Dimming Operation using external signal]
In case external PWM input to CRT terminal,
Make sure that input pulse High voltage >2.2V and
pulse Low voltage VIN - 1.2V
(Typ). As soon as VOP > VIN - 1.2 V (Typ) condition is achieved, D terminal source current (230μA (Typ)) turns on and starts
charging the disable LED open detection time setting capacitor (CD).
Once the D terminal voltage (VD) becomes higher than 1.0 V (Typ) and 1μs (Typ) elapses, the BASE terminal sink current
(IBASE) is latched OFF and PBUS terminal voltage (VPBUS) is switched to Low.
[Base Current Limit Resistance (RLIM)]
The OP terminal voltage VOP is defined by the following formula:
(Note that the external PNP Tr. goes into the saturation mode when the collector is open)
𝑉𝑂𝑃 = 𝑉𝐼𝑁 − {(𝑅𝐹𝐵1 + 𝑅𝐹𝐵2 ) × 𝐼𝐵𝐴𝑆𝐸_𝑀𝑎𝑥 + 𝑉𝐶𝐸_𝑃𝑁𝑃 } [𝑉 ]
𝐼𝐵𝐴𝑆𝐸_𝑀𝑎𝑥 = 6.0𝑉/𝑅𝐿𝐼𝑀 [𝐴]
(𝐼𝐵𝐴𝑆𝐸_𝑀𝑎𝑥 < 80𝑚𝐴)
where:
RFB1, RFB2 is the LED Current Setting Resistance
IBASE_Max is the Maximum BASE Terminal Sink Current
RLIM is the BASE Terminal Sink Current Limit Resistance
VCE_PNP is the External PNP Tr. Collector-Emitter Voltage (Note: ICE=IOP (23 μA (Max)))
Please determine the BASE current limit resistance RLIM to ensure that the OP terminal voltage when the LED is open should
meet the following condition: VOP > VIN - 1.2 V (Typ).
Also note that the BASE current limit resistance must meet the following condition in order to obtain the BASE current to be
needed during normal LED operation.
4.0/𝑅𝐿𝐼𝑀 > 𝐼𝐿𝐸𝐷 /ℎ𝑓𝑒_𝑀𝐼𝑁 [𝐴]
where:
hfe_MIN is the Minimum External PNP Tr. hfe
Disable LED open detection time tD, or the length of time from the moment the OP terminal voltage meets the condition “V OP
> VIN - 1.2 V (Typ)” until the moment the BASE terminal sink current (IBASE) is latched OFF, can be defined by the following
formula. Note that the disable time must be shorter than the ON pulse width of the PWM dimming.
𝑡𝑂𝑁 > 𝑡𝐷 =
𝐶𝐷 × 𝑉𝐷𝐻
[𝑠 ]
𝐼𝐷
where:
tON is the ON pulse width of the PWM dimming(CRT Ramp down Time)
CD is the disable LED open detection time setting capacitor
VDH is the D Terminal Input Threshold Voltage 1.0V (Typ)
ID is the D Terminal Source Current 230μA (Typ)
To reset the latched off LED current, EN must be turned-on again (The time when EN Terminal is ”L”: more than 50μs )
or the condition “UVLO (VIN < 4.1 V or VREG < 3.75 V)” must be fulfilled.
VIN
LED
OPEN
R FB1
FB
PBUS
DRV
R FB2
IBASE
R LIM
VCE_PNP
OPEN
LED OPEN
OP
1.2V
VOP
21μA
VIN
230uA
D
D COMP
ILED
DELAY
1μs
CD
VF_LED
LED Open
Detection
Comparator
Output
D Termina l
Voltage
VD
C LED
VD
Discharge Co
by OP terminal input current(21μA)
VIN
VIN - 1.2V(Typ)
BASE
PBUS
Control
Logic
OP Termina l
Voltage
VOP
1.0V
(Typ)
1μs
(Typ)
C D ×1.0V
230μA
PBUSTerminal
Voltage
VPBUS
1.0V
GND
IB A S E：ON
(DRV：ON)
IB A S E：OFF(DRV：OFF)
Latch Release Condtion :
EN：H →L or UVLO：detect
Figure 18. LED Open Detection Timing Chart
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6.
Disable LED Open Detection Function at Reduced-Voltage
The disable LED open detection function serves to prevent false detection of LED open at the reduced-voltage during the
ramp-up/ramp-down of the VIN terminal voltage. LED open will not be detected until the VIN terminal Disable Open
Detection Voltage at Reduced-Voltage (VIN_OPM). Once VIN_OPM is surpassed, the LED current will be latched OFF (BASE
terminal sink current (IBASE) is latched OFF) and the PBUS voltage will be switched to Low following the sequence explained
in Description of Functions 5.
VIN_OPM must be defined by the following formula. (The OPM terminal voltage must be set between 1.0 V to 2.2 V.)
VIN
𝑉𝐼𝑁_𝑂𝑃𝑀 ≥ 𝑉𝐼𝑁_𝑂𝑃𝐸𝑅𝑅 [𝑉 ]
FB
where:
VIN_OPM is the VIN Terminal Disable Open Detection Voltage
at Reduced-Voltage
VIN_OPERR is the VIN Terminal Open Erroneous Detection Voltage
V RE G
at Reduced-Voltage
𝑉𝐼𝑁_𝑂𝑃𝑀 = 𝑉𝑂𝑃𝑀
OPM
𝑉𝑂𝑃𝑀 = 𝐼𝑂𝑃𝑀 × 𝑅𝑂𝑃𝑀 [𝑉 ]
OPEN
MASK
VCE_PNP
OPENLOAD
OP
Vf_LED ×N
VI N
ROPM
BASE
VREF
I OP M
× 6.0(𝑇𝑦𝑝) [𝑉 ]
VOP D =1.2V
𝑉𝐼𝑁_𝑂𝑃𝐸𝑅𝑅 = 𝑉𝑓_𝐿𝐸𝐷 × 𝑁 + 𝑉𝑂𝑃𝐷 [𝑉 ]
GND
where:
VOPM is the OPM Terminal Voltage
IOPM is the Terminal Source Current 40 μA (Typ)
ROPM is the OPM Terminal Connection Resistance
Vf_LED is the LED Vf
N is the Number of Rows of LED
VOPD is the LED Open-Circuit Detection Voltage 1.2 V (Typ)
VIN_OPERR
Control
Logic
Figure 19. Disable LED Open Detection Function
at Reduced-Voltage
VIN_OPM
VIN__OPM
VIN_OPERR
VIN >
Vf_LED × N + VCE_PNP + VFBREG
VIN
Controllable Range of
constant current
Disable
LED Open
Detection
Area
VIN
Disable
LED Open
Detection
Area
VOPD =VIN -1.2V
LED Open
Detection
Area
LED Open
Detection
Area
VOP
VOP = Vf_LED × N
ILED
ILED
4.5V
VPBUS
Figure 20. VIN Terminal Disable LED Open Detection Voltage and LED Open Erroneous Detection Voltage
at Reduced-Voltage
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7.
Short Circuit Protection (SCP)
Short Circuit Protection function lowers the SCP terminal voltage when the collector of the external PNP Tr. is grounded.
After a lapse of the short circuit protection delay time (t SCP )(20μs(Typ)) following the drop of the SCP terminal
voltage (VSCP) under 1.2V(Typ), the external PNP Tr. is turned OFF to prevent its thermal destruction, and the PBUS
terminal is switched to Low to communicate the faulty condition.
In order to avoid malfunction, the Short Circuit Protection function will not be activated until CRT > 2.0 V(Typ)
after UVLO is reset.
In case where the short circuit (VSCP < 1.2V(Typ)) is present from the beginning when the power is turned on,
the short circuit protection function will be activated 60µs(Typ) after VCRT > 2.0V(Typ) condition is reached.
VIN
FB
EN
VREG
BASE
VREF
PBUS
VIN
ILED
1mA
Control
Logic
PBUS
SCP
GND
SCP
20µs
Filter
SHORT
1.2V ⇔1.25V
Short
Circuit
Short Circuit
4.5V
VIN
2.0V
VCRT
1.25V
1.25V
1.2V
VSCP
ON
ILED
60 μs
OFF
ON
ON
20μs
OFF
OFF
High
High
High
Low
VPBUS
Low
Figure 21. Short Circuit Protection (SCP)
• SCP Terminal Source Current
The SCP terminal sources the SCP terminal source current (1mA (Typ)) once its voltage (VSCP) drops under 1.3V in order to
prevent the malfunction of the short circuit protection.
VIN
FB
EN
1.3V(Typ)
VREG
BASE
VSCP
VREF
0V
PBUS
PBUS
SCP
1.25V ⇔1.3V
1mA
Control
Logic
VIN
1.0mA(Typ)
GND
SCP
20µs
Filter
1.2V⇔1.25V
ISCP
ISCP
0mA
Figure 22. SCP Terminal Source Current
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8.
About the capacitor of connecting LED anode
During PWM Mode, the output (LED anode) will be high impedance (‘Hi-Z’). During this time noise (Note1) can couple on
to this pin and cause false detection of SHORT condition.
To prevent this it is necessary to connect a Capacitor (0.1µF to 0.68µF) between LED anode and GND terminal nearby
terminal
(Note1) Conducted noise, Radiated noise, Crosstalk of connecter and PCB pattern etc…
Make sure that the capacitor of connecting LED anode is the following equation:
0.1 ≤ 𝐶𝐿𝐸𝐷 ≤ 0.68 [𝜇𝐹 ]
In case above range is exceeded, the ILED current becomes dull, so please evaluate ILED waveform in PWM mode operation.
(Please refer to the following waveform).
About the example of evaluation, please see to the following waveform.
In case a capacitor exceeding the recommended range (above 0.68μF) is connected to LED anode, there is a
possibility that delay time of start-up will reach about several decades ms, so special attention is needed.
VIN
EN
VREG
FB
Control
Logic
VREG
BASE
ICRT
VREF
CRT
CLED
GND
DISC
ILED
PWMOUT
Figure 23. About the capacitor of connecting LED anode
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Evaluation example (ILED pulse width at PWM Dimming operation)
Condition: +B = 13V
Ta = 25°C
LED = 1 Strings
CCRT = 0.01μF
RDISC = 1.0kΩ
PWM Dimming Mode
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9.
LED Current De-rating Function (DC Dimming Function)
The LED current (ILED) will be cut down once the DCDIM terminal voltage goes under 1.0 V (Typ).
If LED de-rating function is not used, please DCDIM terminal must be kept 1.25V or more always and as stable as possible.
Any ripples at DCDIM terminal will cause oscillations in output current I LED .It is recommended to insert a capacitor at
DCDIM terminal.
Steep changes in the DCDIM terminal voltage also might affect the ability of the output amplifier to keep up with the
changes. So Please evaluate ILED waveform on actual board.
The LED current de-rating function can be defined by the following formula:
𝑉𝐷𝐶𝐷𝐼𝑀 = 𝑉𝑅𝐸𝐺 ∙
𝑅𝑁𝑇𝐶
[𝑉 ]
𝑅𝑁𝑇𝐶 + 𝑅𝐷𝐶𝐷𝐼𝑀
𝑉𝐹𝐵𝑅𝐸𝐺 (𝑉𝐷𝐶𝐷𝐼𝑀 < 1.0𝑉 ) = 𝑉𝐹𝐵𝑅𝐸𝐺 − (1.0𝑉 − 𝑉𝐷𝐶𝐷𝐼𝑀 ) × 𝐷𝐷𝐺 [𝑉 ]
where:
RDCDIM is The Resistor for setting DC Dimming
RNTC is the NTC Thermistor Resistance
VFBREG is the FB Terminal Voltage VIN – 650 mV (Typ)
DDG is the DCDIM Dimming Gain 725 mV/V (Typ)
VIN
EN
FB
BASE
VREG
VREF
VREG
DC Dimming
DCDIM
RDCDIM
ILED
GND
RNTC
1.0V
ILED
for Prevention
Chattering
VFBREG
(VIN-VFB)
[mV]
650
466
284
175
0
0.35 0.5
0.75
1.0
1.25
VDCDIM [V]
Figure 24. LED Current De-rating Function (DC Dimming Function)
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10. PBUS Function
The PBUS terminal has two functions. When the IC detects OPEN/SHORT of LED’s the PBUS is pulled LOW.
It is also possible to turn OFF I LED current by externally pulling the PBUS to LOW voltage. This feature is useful when
multiple this IC’s are used to drive LED loads. An OPEN/SHORT detection by one IC can be used to turn OFF current of
other driver IC’s. (Please refer connection diagram below)
Caution of using PBUS terminal
Do not connect to the PBUS terminal other than below items list due to the difference of ratings, internal threshold
voltages, and so on. (BD18340FV-M, BD18341FV-M, BD18342FV-M, BD18343FV-M, BD18345EFV-M, BD18337EFV-M,
BD18347EFV-M)
FB
VIN
EN
BD18340FV-M
BD18341FV-M
FB
VIN
BASE
EN
OP
BD18340FV-M
BD18341FV-M
CH 1
BASE
OP
CH 2
PBUS
GND
LED
OPEN
PBUS
GND
LED
OFF
communication each other by PBUS
Figure 25. PBUS Function
▼Example of Protective Operation due to LED Open Circuit
①CH1 LED
Open
CH1 PNP Tr.
Collector
Voltage
ON
CH1 ILED
OFF
②After CH1LED Open Detection Mask time
I LE D： Latch OFF
VP B US：High→ Low
VPBUS
CH2 PNP Tr.
Collector
Voltage
③V P B US：High →Low
CH2 PNP Tr. : OFF
ON
CH2 ILED
OFF
Figure 26. Example of Protective Operation
If LED OPEN occurs, PBUS of CH1 is switched from Hi-Z to Low output. As PBUS becomes Low, LED drivers of
other CH detect the condition and turns OFF their own LEDs. LED anode clamps to 1.3V (Typ) during
the OFF period, in order to prohibit ground fault detection.
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11. Over Voltage Mute Function (OVM)
Once the VIN terminal voltage (VIN) goes above 22.0 V (Typ), the over voltage mute function is activated to decrease the
LED current (ILED) in order to suppress heat generation from the external PNP Tr.
The FB terminal voltage VFBREG which controls the LED current (ILED) will decay at -25 mV/V (Typ).
VIN
FB
EN
VREG
BASE
Over
Voltage
Mute
VREF
GND
VIN-VFB [mV]
22.0V(Typ)
650
-25mV/V(Typ)
Output current is
muted by power
supply overvoltage
0
VOVMS
VIN [V]
Figure 27. Overvoltage Mute Function (OVM)
12. Under voltage Lockout (UVLO)
UVLO is a protection circuit to prevent malfunction of the IC when the power is turned on or then the power is suddenly shut
off.
This IC has two UVLO circuits; UVLO VIN for VIN and UVLO VREG for VREG.
As soon as UVLO status is detected, BASE terminal sink current will be turned off to switch OFF the LED current (ILED).
The following shows the threshold conditions of both UVLO circuits.
Detection Conditions
[Detect]
[Release]
LED Current
(ILED)
UVLO VIN
VIN ≤ 4.1 V(Typ)
VIN ≥ 4.5 V(Typ)
OFF(Note1)
High output
(4.5 V (Typ))
UVLO VREG
VREG ≤ 3.75V(Typ)
VREG ≥ 4.0 V(Typ)
OFF(Note1)
High output
(4.5 V (Typ))
Operating Mode
PBUS Terminal
(Note 1) BASE terminal sink current is turned OFF to switch OFF the LED current ILED.
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BD18340FV-M BD18341FV-M
Timing Chart
(Unless otherwise specified Ta=25°C, VIN=13V, Transistor PNP=2SAR573D3FRA, LED2strings, Value is Typical.)
PWM Dimming Mode
DC Mode
EN
reclosing
EN
reclosing
OUTPUT
GND
SHORT
LED
OPEN
OUTPUT
GND
SHORT
LED
OPEN
13V
VIN
4.5V
4.1V
13V
VEN
0.6V
2.4V
0.6V
4.0V
2.4V
4.0V
VREG
13V
VCRT
1.0V
1.0V
VD
VIN-1.2V
VIN-1.2V
1.25V
VOP
VSC P
1.2V
1.25V
1.25V
20μs
1.2V
1.25V
20μs
VPBU S
VFBREG
ILED
Output
Latch OFF
Output
Latch OFF
Figure 28. Timing Chart
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BD18340FV-M BD18341FV-M
Recommended Application Circuit
(1) ILED=120mA
RFB1
DC_in
RFB2
VIN
FB
D1
ZD1
CVIN1
CVIN2
EN
BASE
CRT
OP
U1
DISC
D
Q1
SCP
BD18340FV-M
BD18341FV-M
CLED
VREG
CD
CVREG
PWMOUT
OPM
ROPM
PBUS
GND
DCDIM
Figure 29. Recommended Application Circuit1 (ILED 120mA, LED white 2strings)
Recommended Parts List1 (ILED 120mA, LED white 2strings)
Parts
No
Parts Name
Value
UNIT
Product Maker
IC
U1
BD18340FV-M/BD18341FV-M
-
-
ROHM
D1
RFN2LAM6STF
-
-
ROHM
ZD1
TND12H-220KB00AAA0
-
-
NIPPON CHEMICON
Q1
2SAR573D3FRA
-
-
ROHM
RFB1
LTR10EVHFL2R70
2.7
Ω
ROHM
RFB2
LTR10EVHFL2R70
2.7
Ω
ROHM
ROPM
MCR03EZPFX3902
39
kΩ
ROHM
CVIN1
GCM32ER71H475KA40
4.7
μF
murata
CVIN2
GCM155R71H104KE37
0.1
μF
murata
CVREG
GCM188R71E105KA49
1.0
μF
murata
CD
GCM155R11H103KA40
0.01
μF
murata
CLED
GCM155R71H104KE37
0.1
μF
murata
Diode
PNP Tr.
Resistor
Capacitor
(About ZD1, please place according to Test Standard of Battery line.)
Please note the following
1. External PNP transistor
For external PNP transistor, please use the recommended device 2SAR573D3FRA for this IC.
While using non-recommended device, validate the design on actual board.
Please check hfe of the part to design base current limit resistor. (See Features Description, section 5). As for parasitic
capacitance (CLED connected at LED anode), The more it is small overshoot will be smaller. Please use devices that parasitic
capacitance smaller than recommended device, also parasitic capacitance is possible to variation by PCB layout.
So please evaluate over shoot of ILED on actual board. (See Features Description, Section 8 -Evaluation example, ILED
pulse width at PWM Dimming operation).
2. Power supply steep variation
This IC is validated with test conditions as per ISO7637-2 standards.
There is possibility of unexpected LED regulation due to sudden transients outside the specification range standards in input
power supply.Please check the maximum ratings of LED and evaluate on actual board for any unexpected LED regulation.
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(2) ILED=120mA, PWM ON Duty=10%
RFB1
RFB2
PWM_in
VIN
FB
D1
ZD1
CVIN1
CVIN2
EN
BASE
Q1
D2
CRT
DC_in
D3
CCRT
OP
RCRT
U1
DISC
RDCIN
D
BD18340FV-M
BD18341FV-M
SCP
CLED
VREG
CD
CVREG
PWMOUT
OPM
ROPM
PBUS
GND
DCDIM
Figure 30. Recommended Application Circuit 2
(ILED 120mA , LED white 2strings, PWM ON Duty: 10%(Pulse width: 0.334ms), PWM frequency: 300Hz)
Recommended Parts List 2
(ILED 120mA, LED white 2strings, PWM ON Duty: 10%(Pulse width: 0.334ms),PWM frequency: 300Hz)
Parts
No
Parts Name
Value
UNIT
Product Maker
IC
U1
BD18340FV-M/BD18341FV-M
-
-
ROHM
D1,D2
RFN2LAM6STF
-
-
ROHM
D3
RFN1LAM6STF
-
-
ROHM
ZD1
TND12H-220KB00AAA0
-
-
NIPPON CHEMICON
Q1
2SAR573D3FRA
-
-
ROHM
RFB1
LTR10EVHFL2R70
2.7
Ω
ROHM
Diode
PNP Tr.
Resistor
Capacitor
RFB2
LTR10EVHFL2R70
2.7
Ω
ROHM
RCRT
MCR03EZPFX3601
3.6
kΩ
ROHM
ROPM
MCR03EZPFX3902
39
kΩ
ROHM
RDCIN
ESR10EZPF2001
2
kΩ
ROHM
CVIN1
GCM32ER71H475KA40
4.7
μF
murata
CVIN2
GCM155R71H104KE37
0.1
μF
murata
CVREG
GCM188R71E105KA49
1.0
μF
murata
CCRT
GCM155R71H104KE37
0.1
μF
murata
CD
GCM155R11H103KA40
0.01
μF
murata
CLED
GCM155R71H104KE37
0.1
μF
murata
(About ZD1, please place according to Test Standard of Battery line.)
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(3) ILED=524mA, PWM ON Duty=10%, LED Current De-rating function
RFB1
RFB2
VIN
PWM_in
FB
D1
ZD1
CVIN1
CVIN2
EN
BASE
Q1 to Q3
D2
CRT
DC_in
D3
CCRT
OP
RCRT
U1
DISC
RDCIN
D
SCP
BD18340FV-M
BD18341FV-M
CLED
VREG
CD
CVREG
PWMOUT
OPM
ROPM
PBUS
GND
RDCDIM
DCDIM
NTC
Figure 31. Recommended Application Circuit 3
(ILED 524mA, LED white 2strings, PWM ON Duty: 10%(pulse width: 0.334ms), PWM frequency: 300Hz)
Recommended Parts List 3
(ILED 524mA, LED white 2strings, PWM ON Duty: 10%(pulse width: 0.334ms), PWM frequency: 300Hz)
Parts
No
Parts Name
Value
Unit
Product Maker
IC
U1
BD18340FV-M/BD18341FV-M
-
-
ROHM
D1,D2
RFN2LAM6STF
-
-
ROHM
D3
RFN1LAM6STF
-
-
ROHM
ZD1
TND12H-220KB00AAA0
-
-
NIPPON CHEMICON
2SAR573D3FRA
-
-
ROHM
Diode
PNP Tr.
Resistor
Capacitor
Q1 to Q3
RFB1
LTR10EVHFLR620
0.62
Ω
ROHM
RFB2
LTR10EVHFLR620
0.62
Ω
ROHM
RCRT
MCR03EZPFX3601
3.6
kΩ
ROHM
ROPM
MCR03EZPFX3902
39
kΩ
ROHM
RDCDIM
MCR03EZPFX4302
43
kΩ
ROHM
NTC
NTCG104LH154JTDS
150
kΩ
TDK
RDCIN
ESR10EZPF2001
2
kΩ
ROHM
CVIN1
GCM32ER71H475KA40
4.7
μF
murata
CVIN2
GCM155R71H104KE37
0.1
μF
murata
CVREG
GCM188R71E105KA49
1.0
μF
murata
CCRT
GCM155R71H104KE37
0.1
μF
murata
CD
GCM155R11H103KA40
0.01
μF
murata
0.1
μF
murata
CLED
GCM155R71H104KE37
(About ZD1, please place according to Test Standard of Battery line.)
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BD18340FV-M BD18341FV-M
(4) ILED=120mA, Three rows drive, PWM ON Duty=10%, LED Current De-rating function
VIN
PWM_in
FB
D1
ZD1
CVIN1
CVIN2
EN
BASE
RFB11
RFB21
RFB3 1
RFB12
RFB22
RFB3 2
R1
RLIM
R2
Q1
D2
Q2
D4
CRT
DC_in
D3
CCRT
RCRT
DISC
RDCIN
D
R3
D5
Q3
D6
OP
SCP
U1
BD18340FV-M
BD18341FV-M VREG
CD
CLED1
CLED2
CLED3
CVREG
PWMOUT
OPM
ROPM
PBUS
GND
RDCDIM
DCDIM
ILED1
NTC
ILED2
ILED3
Figure 32. Recommended Application Circuit 4
(ILED1~3 120mA, LED white 2strings×3, PWM ON Duty: 10%( pulse width: 0.334ms), PWM frequency: 300Hz)
Recommended Parts List 4
(ILED 120mA, LED white 2strings, PWM ON Duty: 10%(pulse width: 0.334ms), PWM frequency: 300Hz)
Parts
No
Parts Name
Value
UNIT
Product Maker
IC
U1
BD18340FV-M/BD18341FV-M
-
-
ROHM
D1,D2
RFN2LAM6STF
-
-
ROHM
D3
RFN1LAM6STF
-
-
ROHM
Diode
PNP Tr.
Resistor
D4 to D6
DA228UFH
Q1 to Q3
2SAR573D3FRA
-
-
ROHM
RLIM
MCR03EZPFX1000
100
Ω
ROHM
RFB11, RFB21, RFB31
LTR10EVHFL2R70
2.7
Ω
ROHM
RFB12, RFB22, RFB32
LTR10EVHFL2R70
2.7
Ω
ROHM
RCRT
MCR03EZPFX3601
3.6
kΩ
ROHM
ROPM
MCR03EZPFX3902
39
kΩ
ROHM
RDCIN
ESR10EZPF2001
2
kΩ
ROHM
MCR03EZPFX51R0
51
Ω
ROHM
CVIN1
GCM32ER71H475KA40
4.7
μF
murata
CVIN2
GCM155R71H104KE37
0.1
μF
murata
CVREG
GCM188R71E105KA49
1.0
μF
murata
CCRT
GCM155R71H104KE37
0.1
μF
murata
CD
GCM155R11H103KA40
0.01
μF
murata
CLED1 to CLED3
GCM155R71H104KE37
0.1
μF
murata
R1 to R3
Capacitor
ROHM
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Thermal Loss
Thermal design should meet the following equation:
𝑃𝑑 > 𝑃𝐶
𝑃𝑑 = (1/𝜃𝐽𝐴 ) ∙ (𝑇𝑗𝑚𝑎𝑥 − 𝑇𝑎 )𝑜𝑟(1/𝛹𝐽𝑇 ) ∙ (𝑇𝑗𝑚𝑎𝑥 − 𝑇𝑇 )
𝑃𝐶 = 𝑉𝐼𝑁 ∙ 𝐼𝑉𝐼𝑁2 + 𝑉𝐵𝐴𝑆𝐸 ∙ 𝐼𝐵𝐴𝑆𝐸
where:
Pd is the Power Dissipation
Pc is the Power Consumption
VIN is the VIN Terminal Voltage
IVIN2 is the Circuit Current at Normal Mode
VBASE is the BASE Terminal Voltage
IBASE is the BASE Terminal Sink Current
ΘJA is the Thermal Resistance of Junction to Ambient
ΨJT is the thermal Characterization Parameter of Junction to centerCase Surface
Tjmax is the Max Joint Temperature (150 °C)
Ta is the Ambient Temperature
TT is the Case Surface Temperature
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I/O equivalence circuits
No.
Terminal
Name
I/O Equivalent Circuit
No.
Terminal
Name
VIN
(16Pin )
1
FB
VREG
(10Pin )
FB
(1Pin)
1kΩ(Typ)
9
5.6kΩ(Typ)
OPM
VIN
(16Pin )
BASE
BASE
(2Pin)
10
VREG
OP
11
OP
(4Pin)
DCDIM
SCP
SCP
(5Pin )
D
100kΩ(Typ)
GND
100kΩ(Typ)
GND
(6Pin )
-
100kΩ(Typ)
13
PBUS
(7Pin )
CRT
10Ω
(Typ)
DISC
(14Pin )
14
VREG
(10Pin )
PWMOUT
(8Pin )
CRT
(13Pin )
GND
(6Pin )
100kΩ(Typ)
GND
(6Pin )
PWM
OUT
D
(12Pin )
VREG
(10Pin )
VREG
(10Pin )
8
10kΩ(Typ)
VREG
(10Pin )
GND
(6Pin )
PBUS
DCDIM
(11Pin )
GND
(6Pin )
12
7
10kΩ(Typ)
92.5kΩ
(Typ)
100kΩ(Typ)
VIN
(16Pin )
6
370kΩ
(Typ)
N.C
GND
(6Pin )
5
VREG
(10Pin )
GND
(6Pin )
VIN
(16Pin )
4
10kΩ(Typ)
VIN
(16Pin )
1kΩ
(Typ)
GND
(6Pin )
3
OPM
(9Pin )
GND
(6Pin )
GND
(6Pin )
2
I/O Equivalent Circuit
DISC
10Ω
(Typ)
GND
(6Pin )
380Ω
(Typ)
EN
(15Pin )
GND
(6Pin )
15
16
30/35
VIN
260kΩ
(Typ )
150kΩ
(Typ)
1kΩ(Typ)
EN
GND
(6Pin )
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TSZ22111 • 15 • 001
5kΩ
(Typ)
5.2V
(Typ)
5.2V
(Typ )
1080kΩ
(Typ )
143kΩ
(Typ )
1kΩ(Typ)
1333kΩ
(Typ)
5.2V
(Typ)
-
TSZ02201-0T1T0C700180-1-2
2019.02.28 Rev.003
BD18340FV-M BD18341FV-M
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
OR
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may
result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the
board size and copper area to prevent exceeding the maximum junction temperature rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
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Operational Notes – continued
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 33. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within
the Area of Safe Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls
below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
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BD18340FV-M BD18341FV-M
Ordering Information
B
D
1
8
3
4
Product Name
B
D
1
0
F
V
-
Package
FV: SSOP-B16
8
3
4
Product Name
1
F
V
Package
FV: SSOP-B16
ME2
Packaging and forming specification
M: High Reliability Design
E2: Embossed tape and reel
-
ME2
Packaging and forming specification
M: High Reliability Design
E2: Embossed tape and reel
Marking Diagrams
SSOP-B16(TOP VIEW)
Part Number Marking
18340
LOT Number
1PIN MARK
SSOP-B16(TOP VIEW)
Part Number Marking
18341
LOT Number
1PIN MARK
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BD18340FV-M BD18341FV-M
Physical Dimension, Tape and Reel Information
Package Name
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©2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
SSOP-B16
34/35
TSZ02201-0T1T0C700180-1-2
2019.02.28 Rev.003
BD18340FV-M BD18341FV-M
Revision History
Date
Revision
2016.03.29
001
Changes
New Release
Page.3
2016.04.21
002
Footprints and Traces
74.2mm2 (Square) ⇒ 74.2mm x 74.2mm
Page.12 Table of Operations
Operation Mode: TSD
PBUS Terminal: High(4.5V(Typ)) to Hi-z
Page.5
Electrical Characteristics1
VREG Terminal Voltage
±3%(Ta= 25 to 125°C) ⇒ ±3%(Ta=-40 to 125°C)
±5%(Ta=-40 to 125°C)
Page.16
Formula
𝑉𝑂𝑃 = (𝑅𝐹𝐵1 + 𝑅𝐹𝐵2 ) × 𝐼𝐵𝐴𝑆𝐸_𝑀𝑎𝑥 + 𝑉𝐶𝐸_𝑃𝑁𝑃 [𝑉]
↓
𝑉𝑂𝑃 = 𝑉𝐼𝑁 − {(𝑅𝐹𝐵1 + 𝑅𝐹𝐵2 ) × 𝐼𝐵𝐴𝑆𝐸_𝑀𝑎𝑥 + 𝑉𝐶𝐸_𝑃𝑁𝑃 } [𝑉]
Page. 17 Delete the description of when installing heat sink resistor, or connecting
resistor or diodes between OP terminal and LED anode
2019.02.28
003
Page. 21
DCDIM terminal must be kept below 1.25V
↓
DCDIM terminal must be kept 1.25V or more
Page. 22
Caution of using PBUS terminal
Revise the description and the items list
Page.25, 26, 27 Recommended Parts List
Update discontinued parts to latest parts number
Page. 28 Recommended Application Circuit 4
ILED: 150mA ⇒ 120mA
Add recommended parts list 4 and delete the description
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Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
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