Datasheet
CXPI Transceiver for Automotive
BD41000FJ-C
General Description
Key Specifications
Power Supply Voltage:
+7V to +18V
Absolute Maximum Rating of BAT: -0.3V to +40V
Absolute Maximum Rating of BUS: -27V to +40V
3 μA (Typ)
Power OFF Mode Current:
Operating Temperature Range: -40°C to +125°C
BD41000FJ-C is a transceiver for the CXPI (Clock
Extension
Peripheral
Interface)
communication.
Switching between Master/Slave Mode can be done
using external pin (MS pin).
Low
power
consumption
during
standby
(non-communication) using Power Saving function.
Arbitration function stops the data output upon detection
of BUS data collision. Also Fail-safe function stops
outputs upon detection of under voltage or temperature
abnormality.
Features
Package
W(Typ) x D(Typ) x H(Max)
4.90mm x 6.00mm x 1.65mm
SOP-J8
(Note1)
AEC-Q100 Qualified
CXPI standards Qualified
Transmission speed range from 5kbps to 20kbps
Master/Slave switching function
Microcontroller interface corresponds to 3.3V/5.0V
Built-in terminator (30kΩ)
Power saving function
Data arbitration function
Built-in Under Voltage Lockout (UVLO) function
Built-in Thermal Shutdown (TSD) function
Low EME(Electromagnetic Emission)
High EMI(Electromagnetic Immunity)
High ESD(Electrostatic Discharge) robustness
(Note1: Grade 1)
SOP-J8
Applications
Automotive networks
Typical Application Circuit
CXPI BUS VECU
Master node
Regulator
10kΩ
2.7kΩ
VDD
MS(8)
INT
BAT(7)
RXD(1)
RXD
Micro
TXD
Controller
(Note 1) CLK
TXD(4)
100nF
BD41000FJ-C
1kΩ
CLK(3)
BUS(6)
NSLP(2)
I/O
GND
1nF
GND(5)
Slave node
Regulator
2.7kΩ
VDD
2.7kΩ(Note 2)
10kΩ
MS(8)
INT
RXD
BAT(7)
RXD(1)
Micro
TXD
Controller
(Note 1) CLK
TXD(4)
100nF
BD41000FJ-C
CLK(3)
BUS(6)
NSLP(2)
I/O
GND
GND(5)
220pF
Note 1 INT: Interrupt, RXD: UART RXD, TXD: UART TXD, CLK: Clock, I/O: General Purpose I/O
Note 2 While using slave, It is no problem that CLK is opened in the case of non-using CLK output.
Figure 1. Typical Application Circuit
〇Product structure : Silicon monolithic integrated circuit
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BD41000FJ-C
Pin Configuration
(TOP VIEW)
RXD 1
8
MS
NSLP 2
7
BAT
CLK
3
6
BUS
TXD
4
5
GND
Figure 2. Pin Configuration
Pin Description
Table 1. Pin Description
Function
Pin No.
Pin Name
1
RXD
2
NSLP
3
CLK
Clock signal input/output pin
(Master setting: Input, Slave setting: Output)
4
TXD
Transmission data input pin
5
GND
Ground
6
BUS
CXPI BUS pin
7
BAT
Power supply pin
8
MS
Master/Slave switching pin
(“H”: Master, “L”: Slave)
Received data output pin
Power saving control input pin
(“H”:Change to “Codec mode”,
“L”:Change to “Power OFF mode”)
Block Diagram
7
BAT
6
BUS
5
GND
BAT
MS
Thermal
Shutdown
(TSD)
8
Under Voltage
Lockout
(UVLO)
Power on
Reset
(POR)
Regulator
To each block
30kΩ
LOGIC
RXD
Low Pass
Filter
1
Decoder
Wakeup
Timer
Slope Control
TXD
4
Arbiter
Encoder
Dominant
Timeout Counter
(DTC)
Controller
NSLP
2
CLK
3
Slope
Timer
Timing
Generator
Oscillator
Figure 3. Block Diagram
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BD41000FJ-C
Description of Blocks
State Transition Diagram
BD41000FJ-C is built-in “Power OFF Mode”, “Through Mode”, “RX Through Mode” other than “CODEC Mode” for power
saving control. Each mode is controlled by NSLP, BUS, and TXD pins.
Non-power Supply
When VBAT Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 21. Example of Monolithic IC Structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within
the Area of Safe Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls
below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
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BD41000FJ-C
Ordering Information
B
D
4
1
0
0
0
Part Number
F
J
-
Package
FJ: SOP-J8
C
G
E
2
Product Rank
C: for Automotive
G: Halogen free
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
SOP-J8 (TOP VIEW)
Part Number Marking
4 1 0 0 0
LOT Number
1PIN MARK
Part Number Marking
41000
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© 2016 ROHM Co., Ltd. All rights reserved.
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Package
SOP-J8
Orderable Part Number
BD41000FJ-CGE2
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BD41000FJ-C
Physical Dimension, Tape and Reel Information
Package Name
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SOP-J8
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BD41000FJ-C
Revision History
Date
Revision
15.Dec.2015
001
5.Aug.2016
002
Changes
New Release
P1 General Desciption, Features Modified Power saving mode to Power saving
P1 Key Specifications Modified Power Saving Mode to Power OFF Mode
P1 Typical Application Circuit Delete redundant diode
P1 Typical Application Circuit Modified VBAT to VECU
P2 Pin Description Modified Functon explanation of NSLP
P2 Pin Desctiption Modified Function explanation of CLK
P2 Block Diagram Modified pin number of GND
P3 State Transition Chart Modified CLK output (slave) of RX through mode
P7 Figure12 Modified CLK signal from H to L while “Power OFF mode”
P7 Figure12 Modified Trx_wakeup_master to Ttx_wakeup
P9 Fail Safe Mode Modified BUS output explanation of DTC abnormality
P12 Electrical Characteristics Modified explanation of Note2
P12 Figure18 Added arrow of Ttx_1_dom_m
P12 Figure18 Added Note1
P13 Figure19 Delete redundant diode
P13 Figure19 Modified VBAT to VECU
P13 Figure19 Modified explanation of Note2
P15 Operational Notes Modified explanation of 2.Power Supply Lines
P16 Figure21 Modified Figure Number from 20 to 21
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Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
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Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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