BD5431EFS-E2

1/4 STRUCTURE: PRODUCT: Silicon monolithic integrated circuits Stereo Class-D Power Amplifier For Speaker TYPE: PACKAGE: FEATURES: HTSSOP-A44 BD5431EFS 1) 2) 3) 4) 5) 6) Differential Analog / PWM inputs High efficiency and low heat generation eliminates external heat-sinks Eliminates pop noise generated when the power supply goes on/off, or when the power supply is suddenly shut off High quality muting performance is realized by using the soft-switching technology Incorporates a master/slave function that enables synchronous operation when several units are used simultaneously Allows the internal PWM sampling clock frequency to be adjusted ○Absolute maximum ratings (Ta=25℃) Item Symbol Limit Unit Supply voltage Vcc +20 V Power dissipation Pd 2.0 W ※3 4.5 W ※4 Input voltage for signal pin VIN -0.2 ～ +7.2 V Pin1、2、3、4 ※1 Input voltage for control pin VCONT -0.2 ～ Vcc+0.2 V Pin20、24 ※1 Input voltage for clock pin VOSC -0.2 ～ +7.2 V Pin23 ※1 Operating temperature range Topr -40 ～ +85 ℃ Storage temperature range Tstg -55 ～ +150 ℃ Tjmax +150 ℃ Maximum junction temperature Conditions Pin7、8、15、16、29、30、37、38、40 ※1 ※2 ※1 The voltage that can be applied, based on GND(Pin11, 12, 33, 34, 43) ※2 Do not, however exceed Pd and Tjmax=150℃. ※3 70mm×70mm×1.6mm, FR4, 1-layer glass epoxy board (Copper on bottom layer 0%) Derating in done at 16mW/℃ for operating above Ta＝25℃. There are thermal vias on the board. ※4 70mm×70mm×1.6mm, FR4, 2-layer glass epoxy board (Copper on bottom layer 100%) Derating in done at 36mW/℃ for operating above Ta＝25℃. There are thermal vias on the board. ○Operating conditions (Ta＝25℃) Item Supply voltage Load impedance ※5 ※ Symbol Limit Unit Conditions Vcc +10 ～ +16.5 V Pin7、8、15、16、29、30、37、38、40 ※1 RL 4 ～ 16 Ω ※5 Do not, however exceed Pd. No radiation-proof design REV. B 2/4 ○Electrical characteristics （Unless otherwise specified Ta=25℃, Vcc=12V, f=1kHz differential analog input、 Rg=0Ω, RL=8Ω, MUTEX=H, MS=L） Limit Item Symbol Unit Conditions Min Typ Max Whole circuit Circuit current 1 (Sampling mode) ICC1 25 50 mA Circuit current 2 (Mute mode) ICC2 10 20 mA MUTEX=L Control circuit H level input voltage VIH 2.3 - 12 V MUTEX, MS L level input voltage VIL 0 - 0.8 V MUTEX, MS Gv PO1 PO2 THD CT VNO VNOM FOSC 22 60 180 23.5 10 17 0.1 75 60 1 250 25 160 10 320 dB W W % dB μVrms μVrms kHz Audio circuit Voltage gain Maximum output power 1 Maximum output power 2 Total harmonic distortion Crosstalk Output noise voltage (Sampling mode) Residual noise voltage (Mute mode) Internal sampling clock frequency ※1 Po=1W, 20log(Vout/Vin) RL=8Ω, THD+n=10% ※1 RL=4Ω, THD+n=10% ※1 PO=1W, BW=20Hz～20kHz ※1 PO=1W, Rg=0Ω, BW=IHF-A Rg=0Ω, BW=IHF-A MUTEX=L, Rg=0Ω, BW=IHF-A These items show the typical performance of device and depend on board layout, parts, power supply. The standard value is in mounting device and parts on surface of ROHM’s board directly. ○Package outline Type BD5431EFS Lot No. (UNIT: mm) PKG: HTSSOP-A44 Drawing No.: EX195-5002 REV. B 3/4 ○Block diagram ○Pin No. / Pin name N.C. 44 1 2 GNDA 3 4 5 FILA 42 FILP 41 VCCA N.C. PWM1 43 PWM2 40 6 39 7 38 8 37 9 DRIVER 1P 10 DRIVER 2P 36 35 11 34 12 33 13 DRIVER 1N 14 DRIVER 2N 32 31 15 30 16 29 17 18 19 20 21 N.C. 22 N.C. 28 Protection & Logic WARNING Under Voltage Protection High Temperature Protection ERROR MUTE CONTROL Output Short Protection Power-off Detector 27 SOFT MUTE 26 Ramp Generator 25 Clock Control 24 23 REV. B Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 Pin name IN2N IN2P IN1N IN1P N.C. BSP1P VCCP1P OUT1P GNDP1 OUT1N VCCP1N BSP1N WARNING ERROR MUTEX N.C. N.C. N.C. ： Non Connection. Pin No. 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 Pin name N.C. GNDA FILA FILP VCCA BSP2P VCCP2P OUT2P GNDP2 OUT2N VCCP2N BSP2N VHOLD TM ROSC MS OSC 4/4 ○Operation Notes （1） Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. （2） Power supply lines As return of current regenerated by back EMF of output coil happens, take steps such as putting capacitor between power supply and GND as a electric pathway for the regenerated current. Be sure that there is no problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp diode between the power supply and GND pins. （3） GND potential Ensure a minimum GND pin potential in all operating conditions. （4） Setting of heat Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. This IC exposes its frame of the backside of package. Note that this part is assumed to use after providing heat dissipation treatment to improve heat dissipation efficiency. Try to occupy as wide as possible with heat dissipation pattern not only on the board surface but also the backside. Class-D power amplifier is High efficiency and low heat generation by comparison with conventional Analog power amplifier. However, In case it is operated continuously by maximum output power, Power dissipation(Pdiss) may exceed package dissipation. Please consider about heat design that Power dissipation(Pdiss) does not exceed Package dissipation(Pd) in average power(Poav). （Tjmax ：Maximum junction temperature=150℃、Ta ：Peripheral temperature[℃]、θja ：Thermal resistance of package[℃/W]、Poav：Average power[W]、η：Efficiency） Package dissipation: Pd （W） = （Tjmax - Ta）／θja Power dissipation: Pdiss（W） = Poav * （1／η- 1） （5） Actions in strong magnetic field Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction. （6） Thermal shutdown circuit This product is provided with a built-in thermal shutdown circuit. When the thermal shoutdown circuit operates, the output transistors are placed under open status. The thermal shutdown circuit is primarily intended to shut down the IC avoiding thermal runaway under abnormal conditions with a chip temperature exceeding Tjmax = 150℃, and is not intended to protect and secure an electrical appliance. （7） Shorts between pins and misinstallation When mounting the LSI on a board, pay adequate attention to orientation and placement discrepancies of the LSI. If it is misinstalled and the power is turned on, the LSI may be damaged. It also may be damaged if it is shorted by a foreign substance coming between pins of the LSI or between a pin and a power supply or a pin and a GND. （8） Power supply on/off In case power supply is started up, MUTEX（Pin20）always should be set LOW, And in case power supply is shut down, it should be set LOW likewise. Then it is possible to eliminate pop noise when power supply is turned on/off. And also, all power supply terminals should start up and shut down together. （9） WARNING terminal(Pin18), ERROR terminal(Pin19) A WARNING flag is outputted when Under Voltage Protection and High Temperature Protection are operated. A Error flag is outputted when Output Short Protection and Output DC Voltage Protection are operated. These flags are the function which the condition of this product is shown in. The use which aimed at the protection except for this product is prohibition. （10） N.C. terminal(Pin5, 21, 22, 44) N.C. terminal(Non Connection Pin) does not connect to the inside circuit. Therefore, please open or connect to GND. REV. B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. 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