Stepping Motor Driver series
High Performance, High Reliability
36V Series Stepping Motor Drivers
BD6387xEFV Series
No.12009EAT10
●Description
BD6387xEFV series are the high-grade type that provides the highest function and highest reliance in the ROHM stepping
motor driver series.
As for its basic function, it is a low power consumption bipolar PWM constant current-drive driver with power
BD63877/BD63875/BD63873EFV are CLK-IN type drivers and BD63876/BD63874/BD63872EFV are PARALLEL-IN type
drivers. There are excitation modes of FULL STEP & HALF STEP (2 kinds), QUARTER STEP mode, and for current decay
mode, the ratio of FAST DECAY & SLOW DECAY can be freely set, so the optimum control conditions for every motor can
be realized. In addition, being able to drive with one system of power supply makes contribution to the set design’s getting
easy.
●Feature
1) Single power supply input (rated voltage of 36V)
2) Rated output current:(DC) 1.0A, 1.5A, 2.0A
3) Low ON resistance DMOS output
4) CLK-IN drive mode (BD63877/63875/63873EFV)
5) PARALLEL-IN drive mode (BD63876/63874/63872EFV)
6) PWM constant current control (other oscillation)
7) Built-in spike noise cancel function (external noise filter is unnecessary)
8) Full-, half (two kinds)-, quarter-step functionality
9) Current decay mode switching function (linearly variable FAST/SLOW DECAY ratio)
10) Normal rotation & reverse rotation switching function (BD63877/63875/63873EFV)
11) Power save function
12) Built-in logic input pull-down resistor
13) Power-on reset function (BD63877/63875/63873EFV)
14) Thermal shutdown circuit (TSD)
15) Over current protection circuit (OCP)
16) Under voltage lock out circuit (UVLO)
17) Over voltage lock out circuit (OVLO)
18) Ghost Supply Prevention (protects against malfunction when power supply is disconnected)
19) Electrostatic discharge: 8kV (HBM specification)
20) Adjacent pins short protection
21) Inverted mounting protection
22) Microminiature, ultra-thin and high heat-radiation (exposed metal type) HTSSOP-B28 package
23) Pin-compatible line-up (BD63877/63875/63873EFV, BD63876/63874/63872EFV)
●Application
PPC, multi-function printer, laser beam printer, ink jet printer, monitoring camera, WEB camera, sewing machine, photo
printer, FAX, scanner, mini printer, toy, and robot etc.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
1/8
2012.02 - Rev.A
Technical Note
BD6387xEFV Series
●Absolute maximum ratings(Ta=25℃)
Item
Symbol
VCC1,2
Supply voltage
Power dissipation
Pd
Input voltage for control pin
RNF maximum voltage
Maximum output current
Maximum output current (PEAK)※4
Operating temperature range
Storage temperature range
Junction temperature
※1
※2
※3
※4
BD63877/63876EFV
VIN
VRNF
IOUT
BD63875/63874EFV
-0.2～+36.0
1
1.45※
※2
4.70
-0.2～+5.5
0.7
1.5※3
2.0※3
-25～+85
-55～+150
+150
2.0※3
2.5※3
IOUTPEAK
Topr
Tstg
Tjmax
BD63873/63872EFV
1.0※3
1.5※3
Unit
V
W
W
V
V
A/phase
A/phase
℃
℃
℃
70mm×70mm×1.6mm glass epoxy board. Derating in done at 11.6mW/℃ for operating above Ta=25℃.
4-layer recommended board. Derating in done at 37.6mW/℃ for operating above Ta=25℃.
Do not, however exceed Pd, ASO and Tjmax=150℃.
Pulse width tw≦1ms, duty 20%.
●Operating conditions(Ta= -25～+85℃)
Item
Supply voltage
MaximumOutput current (DC)
※5
Symbol
VCC1,2
IOUT
BD63877/63876EFV
1.7※5
BD63875/63874EFV
19~28
1.2※5
BD63873/63872EFV
Unit
V
A/phase
0.7※5
Do not, however exceed Pd, ASO and .
●Electrical characteristics (Unless otherwise specified Ta=25℃, VCC1,2=24V)
Min.
Limit
Typ.
Max.
ICCST
ICC
-
1.0
2.5
2.5
5.0
mA
mA
PS=L
PS=H, VREF=3V
VINH
VINL
IINH
IINL
2.0
35
-10
50
0
0.8
100
-
V
V
μA
μA
VIN=5V
VIN=0V
Output ON resistance (BD63877/63876EFV)
RON
-
0.65
0.85
Ω
Output ON resistance (BD63875/63874EFV)
RON
-
1.00
1.30
Ω
Output ON resistance (BD63873/63872EFV)
RON
-
1.90
2.47
Ω
Output leak current
ILEAK
-
-
10
μA
IRNFS
IRNF
IVREF
VREF
IMTH
VMTH
tONMIN
-2.0
-40
-2.0
0
-2.0
0
0.3
-0.1
-20
-0.1
-0.1
0.8
3.0
3.5
1.5
μA
μA
μA
V
μA
V
μs
VCTH
0.57
0.60
0.63
V
VREF=3V
0.57
0.60
0.63
V
VREF=3V, (I0X,I1X)=(L,L)
Item
Whole
Circuit current at standby
Circuit current
Control input
H level input voltage
L level input voltage
H level input current
L level input current
Output (OUT1A, OUT1B, OUT2A, OUT2B)
Current control
RNFXS input current
RNFX input current
VREF input current
VREF input voltage range
MTH input current
MTH input voltage range
Minimum on time (Blank time)
BD63877EFV/63875EFV/63873EFV
Comparator threshold
BD63876EFV/63874EFV/63872EFV
Comparator threshold 100%
Symbol
VCTH10
Unit
Conditions
IOUT=1.5A,
Sum of upper and lower
IOUT=1.0A,
Sum of upper and lower
IOUT=0.5A,
Sum of upper and lower
RNFXS=0V
RNFX=0V
VREF=0V
MTH=0V
C=1000pF, R=39kΩ
0
Comparator threshold 67%
VCTH67
0.38
0.40
0.42
V
Comparator threshold 33%
VCTH33
0.18
0.20
0.22
V
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
2/8
VREF=3V,
(I0X,I1X)=(H,L)
VREF=3V,
(I0X,I1X)=(L,H)
2012.02 - Rev.A
Technical Note
BD6387xEFV Series
●Terminal function and Application circuit diagram
CLK-IN type (BD63877/63875/63873EFV)
Pin
Pin name
Function
No.
1
GND
2
OUT1B
Pin
No.
Pin name
Function
Ground terminal
15
CLK
Clock input terminal for advancing the
electrical angle.
H bridge output terminal
16
CW_CCW
Connection terminal of resistor for output
current detection
17
TEST
Motor rotating direction setting terminal
Terminal for testing
(used by connecting with GND)
3
RNF1
4
RNF1S
Input terminal of current limit comparator
18
MODE0
Motor excitation mode setting terminal
5
OUT1A
H bridge output terminal
19
MODE1
Motor excitation mode setting terminal
Non connection
20
ENABLE
Power supply terminal
Power supply terminal
21
NC
6
NC
7
VCC1
8
NC
Non connection
22
VCC2
9
GND
Ground terminal
23
NC
24
OUT2A
H bridge output terminal
Input terminal of current limit comparator
10
CR
Connection terminal of CR for setting
chopping frequency
11
NC
Non connection
25
RNF2S
12
MTH
Current decay mode setting terminal
26
RNF2
13
VREF
Output current value setting terminal
27
OUT2B
14
PS
Power save terminal
28
NC
Non connection
Power supply terminal
Non connection
Connection terminal of resistor for output
current detection
H bridge output terminal
Non connection
Logic input terminal.
Refer to P.6 for detail.
CLK
CW_CCW
Power save terminal
Refer to P.6 for detail.
15
Regulator
9 GND
16
Translator
MODE0 18
MODE1
19
ENABLE
14 PS
RESET
UVLO
20
OVLO
2bit DAC
OCP
Set the output currenet.
Input by resistor divison.
Refer to P.8 for detail.
7 VCC1
＋
－
2
＋
－
Predriver
Blank time
PWM control
3
Control logic
RNF2S
CR 10
4
22
24
OSC
1000pF
27
MTH 12
Set the current decay mode.
①SLOW DECAY
⇒Connect to GND.
②MIX DECAY
⇒Input by resistor divison.
Refer to P.8, 10 for detail.
5
RNF1S
Set
the
chopping
frequency.
Setting range is
C:470pF～1500pF
R:10kΩ～200kΩ
Refer to P.8, 9 for detail.
39kΩ
Bypass capacitor.
Setting range is
100uF～470uF(electrolytic)
0.01uF～0.1uF(multilayer ceramic etc.)
Refer to P.7 for detail.
Be sure to short VCC1 & VCC2.
TSD
＋
－
VREF 13
TEST
26
Mix decay
control
25
17
1
OUT1A
OUT1B
RNF1
0.2Ω
100uF
0.1uF
RNF1S
VCC2
OUT2A
OUT2B
RNF2
0.2Ω
Resistor for current. detecting.
Setting range is
0.1Ω～0.3Ω.
Refer to P.7 for detail.
RNF2S
GND
Resistor for current. detecting.
Setting range is
0.1Ω～0.3Ω.
Refer to P.7 for detail.
Terminal for testing.
Connect to GND.
Fig.1Block diagram & Application circuit diagram of BD63877EFV/BD63875EFV/BD63873EFV
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
3/8
2012.02 - Rev.A
Technical Note
BD6387xEFV Series
PARALLEL-IN type (BD63876/63874/63872EFV)
Pin
Pin name
Function
No.
1
GND
2
OUT1B
3
RNF1
Pin
No.
Pin name
Ground terminal
15
PHASE1
H bridge output terminal
16
I01
VREF division ratio setting terminal
Connection terminal of resistor for output
current detection
17
I11
VREF division ratio setting terminal
Phase selection pin
VREF division ratio setting terminal
Function
Phase selection terminal
4
RNF1S
Input terminal of current limit comparator
18
PHASE2
5
OUT1A
H bridge output terminal
19
I02
6
NC
Non connection
20
I12
VREF division ratio setting terminal
7
VCC1
Power supply terminal
21
NC
Non connection
8
NC
Non connection
22
VCC2
9
GND
Ground terminal
23
NC
10
CR
Connection terminal of CR for setting
chopping frequency
24
OUT2A
H bridge output terminal
11
NC
Non connection
25
RNF2S
Input terminal of current limit comparator
12
MTH
Current decay mode setting terminal
26
RNF2
13
VREF
Output current value setting terminal
27
OUT2B
14
PS
Power save terminal
28
NC
Power supply terminal
Non connection
Connection terminal of resistor for output
current detection
H bridge output terminal
Non connection
Logic input terminal.
Refer to P.7 for detail.
Power save terminal
Refer to P.7 for detail.
PHASE1
PHASE2
15
Regulator
9 GND
18
16
I01 17
I11
19
UVLO
I02
I12 20
OVLO
14 PS
2bit DAC
OCP
Set the output currenet.
Input by resistor divison.
Refer to P.8 for detail.
7 VCC1
＋
5
－
RNF1S
Set
the
chopping
frequency.
Setting range is
C:470pF～1500pF
R:10kΩ～200kΩ
です。
R f t P 8 9 f d t il
2
＋
3
Blank time
PWM control
Predriver
RNF2S
Control logic
－
CR 10
39kΩ
Bypass capacitor.
Setting range is
100uF～470uF(electrolytic)
0.01uF～0.1uF(multilayer ceramic etc.)
Refer to P.7 for detail.
Be sure to short VCC1 & VCC2.
TSD
＋
－
VREF 13
4
22
24
OSC
1000pF
27
MTH 12
26
Mix decay
control
25
Set the current decay mode.
①SLOW DECAY
⇒Connect to GND.
②MIX DECAY
⇒Input by resistor divison.
Refer to P.8, 10 for detail.
1
OUT1A
OUT1B
RNF1
0.2Ω
100uF
0.1uF
RNF1S
VCC2
OUT2A
OUT2B
RNF2
0.2Ω
Resistor for current. detecting.
Setting range is
0.1Ω～0.3Ω.
Refer to P.7 for detail.
RNF2S
GND
Resistor for current. detecting.
Setting range is
0.1Ω～0.3Ω.
Refer to P.7 for detail.
Fig.2Block diagram & Application circuit diagram of BD63876FV/BD63874FV/BD63872FV
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
4/8
2012.02 - Rev.A
Technical Note
BD6387xEFV Series
●Points to notice for terminal description
○CLK／Clock input terminal for advancing the electrical angle(BD63877/BD63875/BD63873EFV)
CLK is reflected at rising edge. The Electrical angle advances by one for each CLK input.
Motor’s misstep will occur if noise is picked up at the CLK terminal, so please design the pattern in such a way that
there is no noise plunging.
○MODE0,MODE1／Motor excitation mode setting terminal (BD63877/BD63875/BD63873EFV)
Set the motor excitation mode.
MODE0
MODE1
Excitation mode
L
L
FULL STEP
H
L
HALF STEP A
L
H
HALF STEP B
H
H
QUARTER STEP
○CW_CCW Terminal／Motor rotating direction setting terminal (BD63877/BD63875/BD63873EFV)
Set the motor’s rotating direction. Change in setting is reflected at the CLK rising edge immediately after the change in
setting
CW_CCW
Rotating direction
L
Clockwise (CH2’s current is outputted with a phase lag of 90°in regard to CH1’s current)
Counter Clockwise(CH2’s current is outputted with a phase lead of 90°in regard to CH1’s
H
current)
○ENABLE Terminal／Output enable terminal (BD63877/BD63875/BD63873EFV)
Turn off forcibly all the output transistors (motor output is open).
At the time of ENABLE=L, electrical angle or operating mode is maintained even if CLK is inputted.
Please be careful because the electrical angle at the time of ENABLE being released (ENABLE=L→H) is different from
the released occasion at the section of CLK=H and from the released occasion at the section of CLK＝L
ENABLE
Motor output
L
OPEN (electrical angle maintained)
H
ACTIVE
○PS／Power save terminal (BD63877/BD63875/BD63873EFV)
PS can make circuit standby state and make motor output OPEN. In standby state, translator circuit is reset (initialized)
and electrical angle is initialized.
Please be careful because there is a delay of 40μs(max.) before it is returned from standby state to normal state and
the motor output becomes ACTIVE
PS
State
L
Standby state (RESET)
H
ACTIVE
The electrical angle (initial electrical angle) of each excitation mode immediately after RESET is as follows Please be
careful because the initial state at the time of FULL STEP is different from those of other excitation modes.
Excitation mode
Initial electrical angle
FULL STEP
45°
HALFSTEP A
0°
HALFSTEP B
0°
QUARTER
0°
STEP
●Protection Circuits
○Thermal Shutdown (TSD)
This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises above
175℃ (Typ.), the motor output becomes OPEN. Also, when the temperature returns to under 150℃ (Typ.), it
automatically returns to normal operation. However, even when TSD is in operation, if heat is continued to be added
externally, heat overdrive can lead to destruction.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
5/8
2012.02 - Rev.A
Technical Note
BD6387xEFV Series
○Over Current Protection (OCP)
This IC has a built in over current protection circuit as a provision against destruction when the motor outputs are
shorted each other or VCC-motor output or motor output-GND is shorted. This circuit latches the motor output to OPEN
condition when the regulated threshold current flows for 4μs (Typ.). It returns with power reactivation or a reset of the
PS terminal. The over current protection circuit’s only aim is to prevent the destruction of the IC from irregular situations
such as motor output shorts, and is not meant to be used as protection or security for the set. Therefore, sets should
not be designed to take into account this circuit’s functions. After OCP operating, if irregular situations continues and
the return by power reactivation or a reset of the PS terminal is carried out repeatly, then OCP operates repeatly and
the IC may generate heat or otherwise deteriorate. When the L value of the wiring is great due to the wiring being long,
after the over current has flowed and the output terminal voltage jumps up and the absolute maximum values may be
exceeded and as a result, there is a possibility of destruction. Also, when current which is over the output current rating
and under the OCP detection current flows, the IC can heat up to over Tjmax=150℃ and can deteriorate, so current
which exceeds the output rating should not be applied.
○Under Voltage Lock Out (UVLO)
This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply
under voltage. When the applied voltage to the VCC terminal goes under 15V (Typ.), the motor output is set to OPEN.
This switching voltage has a 1V (Typ.) hysteresis to prevent false operation by noise etc. Please be aware that this
circuit does not operate during power save mode. Also, the electrical angle is reset when the UVLO circuit operates
during CLK-IN drive mode.
○Over Voltage Lock Out (OVLO)
This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply over
voltage. When the applied voltage to the VCC terminal goes over 32V (Typ.), the motor output is set to OPEN. This
switching voltage has a 1V (Typ.) hysteresis and a 4μs (Typ.) mask time to prevent false operation by noise etc.
Although this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum
value for power supply voltage is exceeded, therefore the absolute maximum value should not be exceeded. Please be
aware that this circuit does not operate during power save mode.
○Ghost Supply Prevention (protects against malfunction when power supply is disconnected)
If a signal (logic input, VREF, MTH) is input when there is no power supplied to this IC, there is a function which
prevents the false operation by voltage supplied via the electrostatic destruction prevention diode from these input
terminals to the VCC to this IC or to another IC’s power supply. Therefore, there is no malfunction of the circuit even
when voltage is supplied to these input terminals while there is no power supply.
●Usage Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If
any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,
such as fuses.
(2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply
lines. An external direction diode can be added.
(3) Power supply Lines
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line,
separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals
to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the
circuit, not that capacitance characteristic values are reduced at low temperatures.
(4) GND Potential
The potential of GND pin must be minimum potential in all operating conditions.
(5) Metal on the backside (Define the side where product markings are printed as front)
The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND. Be aware that
there is a possibility of malfunction or destruction if it is shorted with any potential other than GND.
(6) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
Users should be aware that these products have been designed to expose their frames at the back of the package, and
should be used with suitable heat dissipation treatment in this area to improve dissipation. As large a dissipation pattern
should be taken as possible, not only on the front of the baseboard but also on the back surface. It is important to
consider actual usage conditions and to take as large a dissipation pattern as possible.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
6/8
2012.02 - Rev.A
Technical Note
BD6387xEFV Series
(7) Inter-pin shorts and mounting errors
When attaching to a printed circuit board, pay close attention to the direction of the IC and displacement. Improper
attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be
caused by foreign matter entering between outputs or an output and the power supply or GND.
(8) Operation in a strong electric field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
(9) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(10) Thermal shutdown circuit
The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃, and higher,
coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal
operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect
peripheral equipment.
TSD on temperature [℃] (Typ.)
175
Hysteresis Temperature [℃]
25
(Typ.)
(11) Inspection of the application board
During inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility
that it could cause stress to the IC, therefore an electrical discharge should be performed after each process. Also, as a
measure again electrostatic discharge, it should be earthed during the assembly process and special care should be
taken during transport or storage. Furthermore, when connecting to the jig during the inspection process, the power
supply should first be turned off and then removed before the inspection.
(12) Input terminal of IC
This IC is a monolithic IC, and between each element there is a P+ isolation for element partition and a P substrate.
This P layer and each element’s N layer make up the P-N junction, and various parasitic elements are made up.
For example, when the resistance and transistor are connected to the terminal as shown in figure 3,
○When GND＞(Terminal A) at the resistance and GND＞(Terminal B) at the transistor (NPN),
the P-N junction operates as a parasitic diode.
○Also, when GND＞(Terminal B) at the transistor (NPN)
The parasitic NPN transistor operates with the N layers of other elements close to the aforementioned
parasitic diode.
Because of the IC’s structure, the creation of parasitic elements is inevitable from the electrical potential relationship. The
operation of parasitic elements causes interference in circuit operation, and can lead to malfunction and destruction.
Therefore, be careful not to use it in a way which causes the parasitic elements to operate, such as by applying voltage
that is lower than the GND (P substrate) to the input terminal.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin A
N
P+
N
P
P+
E
N
N
Pin B
B
Parasitic
element
P+
N
GND
P+
P
B
N
E
P substrate
P substrate
Parasitic element
C
Parasitic element
GND
GND
GND
Parasitic
element
Other adjacent elements
Fig. 3 Pattern Diagram of Parasitic Element
(13) Ground Wiring Patterns
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change
the GND wiring pattern potential of any external components, either.
(14) TEST Terminal (BD63877/BD63875/BD63873EFV)
Be sure to connect TEST pin to GND.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
7/8
2012.02 - Rev.A
Technical Note
BD6387xEFV Series
●Ordering part number
B
D
6
3
8
7
2
E
F
V
パッケージ
EFV=HTSSOP-B28
形名
-
E2
包装、フォーミング仕様
E2: リール状エンボステーピング
HTSSOP-B28
9.7±0.1
(MAX 10.05 include BURR)
(5.5)
1
Tape
Embossed carrier tape (with dry pack)
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
14
+0.05
0.17 -0.03
1PIN MARK
1.0MAX
0.625
1.0±0.2
(2.9)
0.5±0.15
15
4.4±0.1
6.4±0.2
28
+6°
4° −4°
0.08±0.05
0.85±0.05
S
0.08 S
0.65
+0.05
0.24 -0.04
0.08
1pin
M
Reel
(Unit : mm)
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
8/8
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2012.02 - Rev.A
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
工商网监
湘ICP备2023018690号
