BD6904FP

1/4 STRUCTURE PRODUCT SERIES TYPE FUNCTION Silicon monolithic integrated circuits 2-in-1 motor driver for VTR BD6904FP ・VTR cylinder motor driver (Sensorless 3-phase full-wave soft switching drive system) ・VTR loading motor driver ○Absolute maximum ratings (Ta=25℃) Parameter Supply voltage Power dissipation Operating temperature range Storage temperature range Maximum output current (cylinder block) Maximum output current (loading block) Junction temperature ※1 ※2 Symbol Limit 7 15 20 1450※ 1 Unit VCC VM VG Pd Topr Tstg Iomax1 Iomax2 Tjmax V V V mW ℃ ℃ mA mA ℃ -20～+75 -55～+150 800※ 800※ 2 2 +150 90mm×90mm×1.6mm glass epoxy board. Derating in done at 11.6mW/℃ for operating above Ta=25℃. Do not, however exceed Pd, ASO and Tjmax=150℃. ○Recommended operating conditions (Ta= -25～+75℃) Parameter Supply voltage COM input in-phase voltage range PG amp in-phase input voltage range Symbol Min Typ Max Unit VCC VM VG VCOMD VPD 4.5 9 VM+2 0 1.5 5 12 17 - 5.5 14 19 VM-2.5 3.7 V V V V V This product described in this specification isn’t judged whether it applies to COCOM regulations. Please confirm in case of export. This product isn’t designed for protection against radioactive rays. REV. B 2/4 ○Electrical characteristics (Unless otherwise specified, Ta=25℃, VCC=5V, VM1=VM2=12V, VG=17V) Parameter Overall VCC total supply current Output High-side output saturation voltage Low-side output saturation voltage BEMF comparator BEMF comparator hysteresis width + VHYSB+ BEMF comparator hysteresis width Torque reference Torque reference start voltage Torque reference I/O gain Current limit voltage Soft switch CT1, CT2 charge current CT1, CT2 discharge current High CT1, CT2 clamp voltage Low CT1, CT2 clamp voltage Startup control logic CST charge current CST discharge current High CST clamp voltage Low CST clamp voltage CST off voltage PG amp Input bias current Input offset voltage DC bias voltage Voltage gain 1 High output voltage Low output voltage PFG output PG detection level High output voltage Middle output voltage Low output voltage Loading High-level FIN input High-level RIN input Low-level FIN input Low-level RIN input Output saturation voltage VFINH VRINH VFINL VRINL VCE 3.5 3.5 0.3 1.5 1.5 0.6 V V V V IO=200mA, V total of output transistor high-side and low-side voltage ※Source currents are treated as negative while sinking currents are treated as positive. VPGTH VBP-0.075 VPFGH VPFGM VPFGL 3.5 2.1 VBP-0.1 VBP-0.125 2.9 0.9 V V V V IO=-30μA IO=±10μA IO=30μA IPGVIOP VBP AV1 VOHP VOLP -8 2.25 50 3.4 1 2.5 71 3.75 1.2 3 +8 2.75 1.6 μA mV V dB V V f=1kHz IOH=-1mA IOL=1mA PG-=2.5V ICSTO ICSTI VCSTH VCSTL VCSTO -20 2 2.4 0.8 3.6 -14 5.5 2.8 1.0 3.8 -8 9 3.2 1.2 4.0 μA μA V V V ICTD ICTI VCTH VCTL -53 29 3.4 0.85 -39 45 3.8 1.05 -25 61 4.2 1.25 μA μA V V VECR Gio VCL 2.35 0.80 239 2.5 1.06 295 2.65 1.33 345 V A/V mV EC=2.3V-2.2V Gain output (HLM) RRNF=0.68 RRNF=0.68Ω VHYSB+24 -59 +36 -43 +48 -27 mV mV VOH VOL 0.4 0.55 0.7 0.85 V V Io=-300mA Io=300mA ICC 9 13 mA Symbol Limit Min. Typ. Max. Unit Conditions REV. B 3/4 ○Package outline Product No. BD6904FP Lot No. HSOP-25 (Unit:mm) ○Block diagram ○Pin No. / Pin name Pin No. 1 2 Back EMF detection comparator output VM1 Pin name VM2 OUT1 LGND OUT2 FIN RIN VG GND CST CT1 CT2 PCI CNF EC PG+ PGPGOUT PFGOUT VCC COM VM1 U V RNF W VCC U 3 4 5 6 Drive signal Pre-drive selector V 7 8 9 10 11 12 13 14 15 16 17 18 19 20 COM W RNF CST Startup Control logic TSD Low-side saturation prevention Control logic VG PCI CT1 CT2 Soft switch waveform ERR Amp FIN RIN EC CS Amp Pre-drive VM2 CNF VCC PG Amp Hysteresis comparator PG FG synthesis LGND 21 22 23 24 25 PG+ PG- PGOUT PFGOUT GND OUT2 OUT1 REV. B 4/4 ○Operation Notes (1) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range (Topr) may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. The implementation of a physical safety measure such as a fuse should be considered when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. (2) Power supply lines Regenerated current may flow as a result of the motor's back electromotive force. Insert capacitors between the power supply and ground pins to serve as a route for regenerated current. Determine the capacitance in full consideration of all the characteristics of the electrolytic capacitor, because the electrolytic capacitor may loose some capacitance at low temperatures. If the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp diode between the power supply and GND pins. (3) Ground potential Ensure a minimum GND pin potential in all operating conditions. (4) Setting of heat Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. (5) Actions in strong magnetic field Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction. (6) ASO When using the IC, set the output transistor for the motor so that it does not exceed absolute maximum ratings or ASO. (7) Thermal shutdown circuit This IC incorporates a TSD (thermal shutdown) circuit (TSD circuit). If the temperature of the chip reaches the following temperature, the motor coil output will be opened.The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed. TSD on temperature [°C] (typ.) 170 (8) Ground Wiring Pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. Hysteresis temperature [°C] (typ.) 20 REV. B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). 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