BD7790KVT-E2

1/4 Structure Silicon Monolithic Integrated Circuit Product series PWM Driver for combi drive Type BD7790KVT Function ・3-phase-sensor-less system, therefore don’t need three hall sensors for spindle motor driver. ・Stability high-speed start from the state of the stop for spindle motor driver. 特 長 ○Absolute maximum ratings Parameter Power MOS supply voltage Control circuit power supply voltage Maximum driver output current Power dissipation Symbol Limits Unit PVcc 6 V Vcc 6 V IoMAX 3 ＃1 A Pd 1.37 ＃2 W Operating temperature range Topr -30～85 ℃ Storage temperature range Tstg -55～150 ℃ Tjmax 150 ℃ Joint part temperature #1 The current is guaranteed 3.0A in case of the current is turned on/off in a duty-ratio of less than 1/10 with a maximum on-time of 5ms and when short brake. #2 PCB (70mm×70mm×1.6mm,occupied copper foil is less than 3%,glass epoxy standard board) mounting. Reduce power by 11.0mW for each degree above 25℃. ○Recommended operating conditions(Ta=-30～+85℃) 〔Set the power supply voltage taking allowable dissipation into considering〕 Parameter Power MOS supply voltage Control circuit power supply voltage This product isn’t designed for protection against radioactive rays. REV. B Symbol MIN TYP MAX Unit PVcc 4.0 5.0 5.5 V Vcc 4.0 5.0 5.5 V 2/4 ○Electrical characteristics (Unless otherwise noted Ta=25℃, Vcc=PVcc=5V, Vref=1.25V, RL(ACT,STP,LOAD)=8Ω+47μH, RL(SP)=2Ω+47μH, RNF=0.2Ω, CTL1,2=3.3V, GVSW=0V, VIN1,2,3,4,5,6=OPEN, VCOM=OPEN, VCCOM=OPEN, VCOUT=OPEN) Parameter Symbol MIN. TYP. MAX. Unit Condition Quiescent current ICC － 8 20 mA CTL1,2=H Circuit current Current in standby mode IST － － 0.2 mA CTL1,2=L Input dead zone (one side) VDZACT1,2,3 － － 3 mV Output offset voltage VOO1,2,3 -50 － 50 mV Actuator driver Voltage gain (CH1,2,3) GVC1,2,3 15.5 17.5 19.5 dB External input resistor 10kΩ block Output On resistor（top and bottom） RON1,2,3 － 1.2 1.8 Ω Io=500mA PWM frequency f1,2,3CH 215 310 405 kHz Input dead zone (one side) VDZ4,5 10 30 50 mV Output offset voltage VOO4,5 -50 － 50 mV Stepping driver Voltage gain GVC4,5 15.5 17.5 19.5 dB block Output On resistor（top and bottom） RON4,5 － 1.6 2.4 Ω Io=500mA PWM frequency f4,5CH 215 310 405 kHz Input dead zone (one side) VDZ6 20 60 100 mV CTL1=H, CTL2=L Output offset voltage VOO6 -50 － 50 mV CTL1=H, CTL2=L Loading driver Voltage gain GVC6 15.5 17.5 19.5 dB CTL1=H, CTL2=L block Output On resistor（top and bottom） RON6 － 1.8 2.7 Ω Io=500mA, CTL1=H, CTL2=L PWM frequency f6CH 215 310 405 kHz CTL1=H, CTL2=L Input dead zone of gm1(one side) VDZSP1 2 30 100 mV Input dead zone of gm2(one side) VDZSP2 6 90 300 mV GVSW=M Input dead zone of gm3(one side) VDZSP3 10 150 500 mV GVSW=H Input output gain 1 gm1 0.88 1.1 1.32 A/V Spindle driver Input output gain 2 gm2 0.28 0.36 0.44 A/V GVSW=M block Input output gain 3 gm3 0.17 0.22 0.27 A/V GVSW=H Output On resistor（top and bottom） RONSP － 0.6 1.4 Ω Io=500mA Output limit voltage VLIMSP 0.18 0.22 0.26 V PWM frequency fSP － 167 － kHz Vref drop mute ON threshold voltage VMVref － 0.7 1.0 V Vcc drop mute ON threshold voltage VMVccD 3.2 3.6 4.0 V CTL1 L voltage VCTL1L 0 － 1.0 V Others CTL1 H voltage VCTL1H 2.0 － 3.3 V CTL2, GVSW L voltage VCTL2L, VGVL 0 － 1.0 V CTL2, GVSW M(Hi-z) voltage VCTL2M, VGVM 1.6 － 2.0 V OPEN（Hi-z）is also available. CTL2, GVSW H voltage VCTL2H, VGVH 2.6 － 3.3 V GVSW Gain mode L gm1 M（Hi-z） gm2 H gm3 CTL1 CTL2 Brake mode SPINDLE Output CH1,2,3 Output CH4,5 Output L ― Hi-Z Hi-Z Hi-Z L M ACTIVE Hi-Z Hi-Z Short brake H ACTIVE ACTIVE ACTIVE L Hi-Z Hi-Z ACTIVE H M（Hi-z） Reverse brake ACTIVE Hi-Z Hi-Z H ACTIVE ACTIVE ACTIVE Please supply the middle level voltage for CTL2 when using it in the mode of CTL1=L and CTL2=M. CH6 Output Hi-Z Hi-Z Hi-Z ACTIVE Hi-Z Hi-Z ○Package outlines BD7790 (UNIT : mm) REV. B 3/4 34 35 19 20 21 5V GND Vcc RNF1 24 23 27 25 26 29 RNF2 PVcc22 U V W COM PVcc21 COUT 30 22μF RNF=0.2Ω 5V 32 PGND3 VO5R VO5F VO4R 31 28 18 17 POWER MOS 33 Vref 36 5V TEST2 16 TEST3 15 14 TEST1 5 CTL2 4 CTL1 22 GVSW 47 INSP 48 FG CNF5 100kΩ 37 0.033μF 0.033μF IN5 CNF4 45 IN4 1 IN6 CNF3 470Ω 39 0.047μF IN3 10kΩ 470Ω CNF2 0.047μF 470Ω IN2 10kΩ 0.047μF 10kΩ IN1 42 CNF1 GVSW STBY/BMSW LIMIT OSC BEMF DETECTER T.S.D. Logic OSC NF amp Pre driver Logic NF amp Pre driver 46 Logic 38 OSC Logic NF amp Pre driver 44 NF amp Pre driver 40 Logic NF amp Pre driver 43 Logic NF amp 41 Logic Pre driver Pre driver POWER MOS 8 VO4F PGND1 PVcc3 VO6R 3 2 POWER MOS 13 POWER MOS 12 POWER MOS 10 VO6F VO3R VO3F VO2R 9 POWER MOS 7 POWER MOS 6 VO2F VO1R VO1F PVcc1 11 CCOM 1000pF M 5V 5V ○Block diagram / Application circuit ◎ PIN DESCRIPTION Pin No. Symbol 1 IN6 Pin No. Symbol PWM Driver (CH6) input Description 25 U Spindle driver output U Spindle driver output V 2 VO6F PWM Driver(CH6) positive output 26 V 3 VO6R PWM Driver(CH6) negative output 27 PVcc22 Description Spindle driver power supply22 4 CTL1 Driver logic control input1 28 RNF2 5 CTL2 Driver logic control input2 29 W 6 VO1F PWM Driver(CH1) positive output 30 PGND3 7 VO1R PWM Driver(CH1) negative output 31 VO4F PWM Driver(CH4) positive output 8 PGND1 PWM driver power ground1 32 VO4R PWM Driver(CH4) negative output Spindle driver current sense output2 Spindle driver output W PWM driver power ground3 9 VO2F PWM Driver(CH2) positive output 33 PVcc3 PWM driver power supply3 10 VO2R PWM Driver(CH2) negative output 34 VO5F PWM Driver(CH5) positive output 11 PVcc1 PWM driver power supply1 35 VO5R PWM Driver(CH5) negative output 12 VO3F PWM Driver(CH3) positive output 36 Vref 13 VO3R PWM Driver(CH3) negative output 37 CNF5 PWM driver (CH5) feedback filter 14 TEST1 Test terminal1 38 CNF4 PWM driver (CH4) feedback filter 15 TEST2 Test terminal2 39 CNF3 PWM driver (CH3) feedback filter 16 TEST3 Test terminal3 40 CNF2 PWM driver (CH2) feedback filter 17 GND Pre unit ground 41 CNF1 PWM driver (CH1) feedback filter 18 19 Vcc COUT Pre unit power supply 42 43 IN1 IN2 PWM driver (CH1) input Smoothing capacitor connection terminal(Output side) 20 CCOM Smoothing capacitor connection terminal(COM side) 44 IN3 PWM driver (CH3) input Reference voltage input PWM driver (CH2) input 21 COM Motor coil center point input terminal 45 IN4 PWM driver (CH4) input 22 GVSW Control for gain of spindle 46 IN5 PWM driver (CH5) input 23 PVcc21 Spindle driver power supply21 47 INSP Spindle driver input 24 RNF1 Spindle driver current sense output1 48 FG Frequency generator output Positive/Negative of the output terminals are determined in reference to those of the input terminals. REV. B 4/4 ●Cautions on use 1．Absolute maximum ratings This IC might be destroyed when the absolute maximum ratings, such as impressed voltage (PVcc, Vcc) or the operating temperature range (Topr), is exceeded, and whether the destruction is short circuit mode or open circuit mode cannot be specified. Please take into consideration the physical countermeasures for safety, such as fusing, if a particular mode that exceeds the absolute maximum rating is assumed. 2．Reverse polarity connection Connecting the power line to the IC in reverse polarity (from that recommended) will damage the part. Please utilize the direction protection device as a diode in the supply line. 3．GND line The ground line is where the lowest potential and transient voltages are connected to the IC. 4．Thermal design Do not exceed the power dissipation (Pd) of the package specification rating under actual operation, and please design enough temperature margins. 5．Short circuit mode between terminals and wrong mounting Do not mount the IC in the wrong direction and be careful about the reverse-connection of the power connector. Moreover, this IC might be destroyed when the dust short the terminals between them or GND. 6．Radiation Strong electromagnetic radiation can cause operation failures. 7．ASO (Area of Safety Operation) When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. 8．TSD (Thermal Shut-Down) 0 0 The TSD is activated when the junction temperature (Tj) reaches 175 C (with +/-25 C hysteresis), and the output terminal is switched to Hi-z. The TSD circuit designed to shut the IC off to prevent runaway thermal operation. It is not designed to protect or guarantee its operation. Do not continue to use the IC after operating this circuit. 9．Vcc, GND and RNF wiring layout Vcc, GND and RNF layout should be as wide as possible and at minimum distance. Wire to ground to prevent Vcc-PVcc and GND-PGND-GND side of RNF resistor from having common impedance. Connect a capacitor between Vcc and GND to stabilize. 10．Regarding input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements to keep them isolated. PN junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the PN junction operates as a parasitic diode. When Pin B > GND > Pin A, the PN junction operates as a parasitic transistor. Parasitic diodes can occur inevitably in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used. Simplified structure of IC 11．Capacitor between Vcc and GND This IC has steep change of the voltage and current because of PWM driver. Therefore, the capacitor controls Vcc voltage by attaching a capacitor between Vcc and GND. Wiring impedance decreases the capacitors capabilities if the capacitor is far from the IC. Therefore, a capacitor should be placed between Vcc and GND, close to the IC. 12．Supply fault, ground fault and short-circuit between output terminals Do not short-circuit between any output terminal and supply terminal (supply fault) or ground (ground fault), or between any output terminals (load short-circuit). When mounting the IC on the circuit board, be extremely cautious about the orientation of the IC. If the orientation is mistaken, the IC may break down and produce smoke in some cases. 13．Inspection by the set circuit board When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to, or removing it from a jig or fixture, during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting and storing the IC. 14．Reverse-rotation braking High-speed rotation may cause reverse-rotation braking. Monitor the voltage applied to the output terminal and consider the revolutions applied to the reversed-rotation brake. 15．Application circuit It is one sample that explains standard operation and usage of this IC about the described example of the application circuit and information on the constant etc. Therefore, please be sure to consult with our sales representative in advance before mass production design, when a circuit different from application circuit is composed of external. REV. B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. 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