BD82001FVJ

Power Management Switch ICs for PCs and Digital Consumer Products 1ch High Side Switch ICs for USB Devices and Memory Cards BD82000FVJ, BD82001FVJ No.11029EBT20 ●Description Single channel high side switch IC for USB port is a high side switch having over-current protection used in power supply line of universal serial bus (USB). N-channel power MOSFET of low on resistance and low supply current are realized in this IC. And, over-current detection circuit, thermal shutdown circuit, under-voltage lockout and soft start circuit are built in. ●Features 1) Low On-Resistance 70mΩ MOSFET Switch 2) Current limit threshold 1.5A 3) Control Input Logic Active “Low” Control Logic : BD82000FVJ Active “High” Control Logic : BD82001FVJ 4) Soft-Start Circuit 5) Over-Current Protection 6) Thermal Shutdown 7) Under-Voltage Lockout 8) Open-Drain Error Flag Output 9) Power Supply Voltage Range 2.7V~5.5V 10) TTL Enable Input 11) 0.8ms Typical Rise Time 12) 1μA Max Standby Current ●Applications PC, PC peripheral equipment, USB hub in consumer appliances, Car accessory, and so forth ●Line Up Matrix Parameter Current limit threshold (A) Control input logic Number of channels Package BD82000FVJ 1.5 Low 1ch TSSOP-B8J BD82001FVJ 1.5 High 1ch TSSOP-B8J www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/16 2011.05 - Rev.B BD82000FVJ, BD82001FVJ ●Absolute maximum ratings (Ta=25℃) Parameter Supply voltage Enable input voltage /OC voltage /OC sink current OUT voltage Storage temperature Power dissipation *1 * Technical Note Symbol VIN VEN V/OC IS/OC VOUT TSTG Pd Ratings -0.3 ~ 6.0 -0.3 ~ 6.0 -0.3 ~ 6.0 ~5 -0.3 ~ 6.0 -55 ~ 150 587.5*1 Unit V V V mA V ℃ mW Mounted on 70mm*70mm*1.6mm glass-epoxy PCB. Derating : 4.7mW/℃ above Ta=25 ℃. This product is not designed for protection against radioactive rays. ●Operating conditions Parameter Operating voltage Operating temperature Symbol VIN TOPR Ratings Min. 2.7 -40 Typ. Max. 5.5 85 Unit V ℃ www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/16 2011.05 - Rev.B BD82000FVJ, BD82001FVJ ●Electrical Characteristics ○BD82000FVJ (Unless otherwise specified VIN = 5.0V, Ta = 25℃) Limits Parameter Symbol Min. Typ. Max. IDD ISTB V/EN V/EN I/EN V/OCL IL/OC T/OC RON ILSW ITH ISC TON1 TON2 TOFF1 T OFF2 VTUVH VTUVL 2.0 -1.0 10 1.0 0.7 2.1 2.0 110 0.01 0.01 0.01 15 70 1.5 1.0 0.8 1.1 5 10 2.3 2.2 160 1 0.8 1.0 0.5 1 20 110 1.0 2.0 1.4 10 20 20 40 2.5 2.4 Technical Note Unit μA μA V V μA V μA ms mΩ μA A A ms ms μs μs V V Condition V/EN = 0V , OUT=OPEN V/EN = 5V , OUT=OPEN High input Low input V/EN = 0V or V/EN = 5V I/OC = 0.5mA V/OC = 5V Operating current Standby current /EN input voltage /EN input current /OC output low voltage /OC output leak current /OC delay time On-resistance Switch leak current Current limit threshold Short circuit current Output rise time Output turn-on time Output fall time Output turn-off time UVLO threshold IOUT = 500mA V/EN = 5V, VOUT = 0V VOUT = 0V CL = 47μF (RMS) RL = 10Ω RL = 10Ω RL = 10Ω RL = 10Ω Increasing VIN Decreasing VIN www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 3/16 2011.05 - Rev.B BD82000FVJ, BD82001FVJ ● ○BD82001FVJ (Unless otherwise specified VIN = 5.0V, Ta = 25℃) Limits Parameter Symbol Min. Typ. Max. IDD ISTB VEN VEN IEN V/OCL IL/OC T/OC RON ILSW ITH ISC TON1 TON2 TOFF1 T OFF2 VTUVH VTUVHL 2.0 -1.0 10 1.0 0.7 2.1 2.0 110 0.01 0.01 0.01 15 70 1.5 1.0 0.8 1.1 5 10 2.3 2.2 160 1 0.8 1.0 0.5 1 20 110 1.0 2.0 1.4 10 20 20 40 2.5 2.4 Technical Note Unit μA μA V V μA V μA ms mΩ μA A A ms ms μs μs V V Condition VEN = 5V , OUT=OPEN VEN = 0V , OUT=OPEN High input Low input VEN = 0V or VEN = 5V I/OC = 0.5mA V/OC = 5V Operating current Standby current EN input voltage EN input current /OC output low voltage /OC output leak current /OC delay time On-resistance Switch leak current Current limit threshold Short circuit current Output rise time Output turn-on time Output fall time Output turn-off time UVLO threshold IOUT = 500mA VEN = 0V, VOUT = 0V VOUT = 0V CL = 47μF (RMS) RL = 10Ω RL = 10Ω RL = 10Ω RL = 10Ω Increasing VIN Decreasing VIN www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 4/16 2011.05 - Rev.B BD82000FVJ, BD82001FVJ ●Measurement Circuit VIN A 1µF GND IN IN EN(/EN) VEN(V/EN) OUT OUT OUT /OC VEN(V/EN) 1µF GND IN IN EN(/EN) OUT OUT OUT /OC A VIN Technical Note VIN 10kΩ RL CL Operating current Inrush current EN, /EN input voltage, Output rise, fall time VIN VIN 10kΩ VIN VIN I/OC 1µF GND IN IN EN(/EN) VEN(V/EN) OUT OUT OUT /OC CL A IOUT 1µF GND IN IN EN(/EN) VEN(V/EN) OUT OUT OUT /OC On-resistance Over-current detection Fig.1 Measurement circuit ●Timing diagram ○BD82000FVJ TOFF1 TON1 90% VOUT 10% TOFF2 TON2 V/EN 50% 50% VEN 90% VOUT 10% /OC output low voltage ○BD82001FVJ TOFF1 TON1 90% 90% TOFF2 TON2 50% 50% Fig.2 Timing diagram www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/16 2011.05 - Rev.B BD82000FVJ, BD82001FVJ ●Electrical characteristic curves (Reference data) 140 Ta=25°C Operating Current : I DD[µA] Operating Current : I DD[µA] 120 100 80 60 40 20 0 2 3 4 5 Supply Voltage : VIN[V] 6 120 100 80 60 40 20 0 -50 140 VIN=5.0V STANDBY Current : I STB [µA] 0.8 1.0 Ta=25°C Technical Note 0.6 0.4 0.2 0.0 0 50 Ambient Temperature : Ta[℃] 100 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 Fig.3 Operating current EN, /EN enable 1.0 Fig.4 Operating current EN, /EN enable 2.0 Enable Input Voltage : V EN [V] 0 [V] 2.0 Fig.5 Standby current EN,/EN disable VIN=5.0V STANDBY Current : I STB[µA] 0.8 Ta=25°C 1.5 Low to High High to Low 1.0 VIN=5.0V EN Low to High 1.5 Enable Input Voltage : V 0.6 High to Low 1.0 0.4 0.2 0.5 0.5 0.0 -50 0 50 Ambient Temperature : Ta[℃] 100 0.0 2 3 4 5 Supply Voltage : VIN[V] 6 0.0 -50 0 50 Ambient Temperature : Ta[℃] 100 Fig.6 Standby current EN,/EN disable 200 Fig.7 EN, /EN input voltage Fig.8 EN, /EN input voltage 200 Ta=25°C VIN=5.0V Current Limit Threshold : I TH [A] 2.0 Ta=25°C 1.8 ON Resistance : R ON [mO] ON Resistance : R ON [mO] 150 150 1.6 100 100 1.4 50 50 1.2 0 2 3 4 5 Supply Voltage : VIN[V] 6 0 -50 0 50 Ambient Temperature : Ta[℃] 100 1.0 2 3 4 5 Supply Voltage : VIN[V] 6 Fig.9 On-resistance Fig.10 On-resistance Fig.11 Current limit threshold 2.0 VIN=5.0V Current Limit Threshold : I TH [A] 1.4 Ta=25°C Short-Circuit Current : I SC [A] SC [A] 1.4 VIN=5.0V 1.2 1.8 1.2 Short-Circuit Current : I 1.6 1.0 1.0 1.4 0.8 0.8 1.2 0.6 0.6 1.0 -50 0 50 Ambient Temperature : Ta[℃] 100 0.4 2 3 4 5 Supply Voltage : VIN [V] 6 0.4 -50 0 50 Ambient Temperature : Ta[℃] 100 Fig.12 Current limit threshold Fig.13 Short circuit current Fig.14 Short circuit current www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/16 2011.05 - Rev.B BD82000FVJ, BD82001FVJ Technical Note 100 /OC Output Low Voltage : V /OC [mV] 100 2.5 VIN=5.0V UVLO Threshold : V TUVH,VTUVL[V] Ta=25°C /OC Output Low Voltage :V /OC[mV] 80 80 2.4 60 60 2.3 VTUVH 2.2 VTUVL 2.1 40 40 20 20 0 2 3 4 5 Supply Voltage : VIN[V] 6 0 -50 0 50 Ambient Temperature : Ta[℃] 100 2.0 -50 0 50 Ambient Temperature : Ta[℃] 100 Fig.15 /OC output low voltage Fig.16 /OC output low voltage Fig.17 UVLO threshold voltage 1.0 HYS[V] 5.0 5.0 Ta=25°C 0.8 Rise Time : TON1[ms] 4.0 VIN=5.0V 4.0 Rise Time : TON1[ms] UVLO Hysteresis Voltage : V 0.6 3.0 3.0 0.4 2.0 2.0 0.2 1.0 1.0 0.0 -50 0 50 100 Ambient Temperature : Ta[℃] 0.0 2 3 4 5 Supply Voltage : VIN[V] 6 0.0 -50 0 50 Ambient Temperature : Ta[℃] 100 Fig.18 UVLO hysteresis voltage Fig.19 Output rise time Fig.20 Output rise time 5.0 5.0 5.0 Ta=25°C Turn ON Time : TON2[ms] Turn ON Time : TON2[ms] 4.0 4.0 VIN=5.0V 4.0 Fall Time : TOFF1[µs] Ta=25°C 3.0 3.0 3.0 2.0 2.0 2.0 1.0 1.0 1.0 0.0 2 3 4 5 Supply Voltage : VIN[V] 6 0.0 -50 0.0 0 50 Ambient Temperature : Ta[℃] 100 2 3 4 5 Supply Voltage: VIN[V] 6 Fig.21 Output turn-on time Fig.22 Output turn-on time Fig.23 Output fall time 5.0 10 10 VIN=5.0V Turn OFF Time : TOFF2[µs] 4.0 Fall Time : TOFF1[µs] 8 Ta=25°C Turn OFF Time : TOFF2[µs] 8 VIN=5.0V 3.0 6 6 2.0 4 4 1.0 2 2 0.0 -50 0 50 AMBIENT TEMPERATURE : Ta[℃] 100 0 2 3 4 5 Supply Voltage : VIN[V] 6 0 -50 0 50 Ambient Temperature : Ta[℃] 100 Fig.24 Output fall time Fig.25 Output turn-off time Fig.26 Output turn-off time www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 7/16 2011.05 - Rev.B BD82000FVJ, BD82001FVJ Technical Note 20 Ta=25°C /OC Delay Time : T /OC[ms] / /OC Delay Time : TOC[ms] 20 VIN=5.0V 18 18 16 16 14 14 12 12 10 2 3 4 5 Supply Voltage : VIN[V] 6 10 -50 0 50 Ambient Temperature : Ta[℃] 100 Fig.27 /OC delay time Fig.28 / OC delay time www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 8/16 2011.05 - Rev.B BD82000FVJ, BD82001FVJ ●Waveform Data(BD82001FVJ) VEN (5V/div.) VEN (5V/div.) VEN (5V/div.) V/OC (5V/div.) V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VIN=5V IIN RL=10Ω CL=100μF (0.5A/div.) Technical Note CL=147µF CL=100µF CL=47µF IIN (0.5A/div.) VIN=5V RL=10Ω CL=100μF TIME (1ms/div.) IIN (0.5A/div.) VIN=5V RL=10Ω TIME (1ms/div.) TIME (1ms/div.) Fig.29 Output rise characteristic VOUT (5V/div.) VOUT (5V/div.) Fig.30 Output rise characteristic Fig.31. Inrush current response V/OC (5V/div.) V/OC (5V/div.) IOUT (0.5A/div.) IOUT (0.5A/div.) VIN=5V CL=100μF TIME (10ms/div.) TIME (2ms/div.) VIN=5V CL=100μF Fig.32 Over-current response ramped load VEN (5V/div.) V/OC (5V/div.) Fig.33 Over-current response ramped load V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VOUT (5V/div.) Thermal Shutdown IOUT (0.5A/div.) VIN=5V CL=100μF TIME (5ms/div.) IOUT (1.0A/div.) VIN=5V CL=100μF TIME (5ms/div.) IOUT (1.0A/div.) VIN=5V CL=100μF TIME (200ms/div.) Fig.34 Over-current response enable to shortcircuit VIN (5V/div.) VIN (5V/div.) Fig.35 Over-current response 1Ωload connected at enable Fig.36 Thermal shutdown 1Ωload connected at enable VOUT (5V/div.) VOUT (5V/div.) V/OC (5V/div.) V/OC (5V/div.) IOUT (0.5A/div.) RL=10Ω CL=100μF TIME (10ms/div.) IOUT (0.5A/div.) RL=10Ω CL=100μF TIME (10ms/div.) Fig.37 UVLO response increasing VIN www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. Fig.38 UVLO response decreasing VIN 9/16 2011.05 - Rev.B BD82000FVJ, BD82001FVJ ●Block Diagram GND OUT Technical Note IN UVLO Charge Pump OCD OUT GND OUT 1 2 3 4 8 7 6 5 OUT OUT OUT /OC IN Gate Logic IN IN Top View EN /EN /OC TSD EN(/EN) Fig.39 Block diagram ●Pin Configuration Pin No. Symbol 1 GND Fig.40 Pin configuration I/O Ground. Pin function 2, 3 IN - Power supply input. Input terminal to the power switch and power supply input terminal of the internal circuit. At use, connect each pin outside. Enable input. Power switch on at Low level.(BD82000FVJ) Power switch on at High level.(BD82001FVJ) High level input > 2.0V, Low level input < 0.8V. Error flag output. Low at over-current, thermal shutdown. Open drain output. Power switch output. At use, connect each pin outside. 4 EN , /EN I 5 /OC O 6, 7, 8 OUT O ●I/O Circuit Symbol Pin No Equivalent circuit EN(/EN) 4 /OC 5 OUT 6,7,8 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 10/16 2011.05 - Rev.B BD82000FVJ, BD82001FVJ ●Functional Descriptions 1. Switch operation Technical Note IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. And the IN terminal is used also as power source input to internal control circuit. When the switch is turned on from EN, /EN control input, IN terminal and OUT terminal are connected by a 70mΩ switch. In on status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of IN terminal, current flows from OUT terminal to IN terminal. 2. Thermal shutdown circuit (TSD) If over-current would continue, the temperature of the IC would increase drastically. If the junction temperature were beyond 170°C (typ.) in the condition of over-current detection, thermal shutdown circuit operates and makes power switch turn off and outputs error flag (/OC). Then, when the junction temperature decreases lower than 150°C (typ.), power switch is turned on and error flag (/OC) is cancelled. Unless the fact of the increasing chips temperature is removed or the output of power switch is turned off, this operation repeats. The thermal shutdown circuit operates when the switch is on (EN, /EN signal is active). 3. Over-current detection (OCD) The over-current detection circuit limits current (ISC) and outputs error flag (/OC) when current flowing in each switch MOSFET exceeds a specified value. There are three types of response against over-current. The over-current detection circuit works when the switch is on (EN, /EN signal is active). 3-1. When the switch is turned on while the output is in shortcircuit status When the switch is turned on while the output is in shortcircuit status or so, the switch gets in current limit status soon. 3-2. When the output shortcircuits while the switch is on When the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the over-current limit circuit reacts. When the current detection, limit circuit works, current limitation is carried out. 3-3. When the output current increases gradually When the output current increases gradually, current limitation does not work until the output current exceeds the over-current detection value. When it exceeds the detection value, current limitation is carried out. 4. Under-voltage lockout (UVLO) UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V (Typ.). If the VIN drops below 2.2V (Typ.) while the switch turns on, then UVLO shuts off the power switch. UVLO has hysteresis of a 100mV (Typ.). Under-voltage lockout circuit works when the switch is on (EN, /EN signal is active). 5. Error flag (/OC) output Error flag output is N-MOS open drain output. At detection of over-current, thermal shutdown, low level is output. Over-current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at switch on, hot plug from being informed to outside. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 11/16 2011.05 - Rev.B BD82000FVJ, BD82001FVJ Technical Note V/EN VOUT Output shortcircuit Thermal shut down IOUT V/OC delay Fig.41 Over-current detection, thermal shutdown timing (BD82000FVJ) VEN VOUT Output shortcircuit Thermal shut down IOUT V/OC delay Fig.42 Over-current detection, thermal shutdown timing (BD82001FVJ) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 12/16 2011.05 - Rev.B BD82000FVJ, BD82001FVJ ●Typical application circuit 5V(typ.) IN Regulator OUT Technical Note Ferrite Beads 10k~ 100kΩ CIN GND IN IN OUT OUT OUT + CL Ferrite Beads VBUS D+ DGND USB Controller EN(/EN) /OC Fig.43 Typical application circuit ●Application information When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC, and may cause bad influences upon IC actions. In order to avoid this case, connect a bypath capacitor by IN terminal and GND terminal of IC. 1μF or higher is recommended. Pull up /OC output by resistance 10kΩ ~ 100kΩ. Set up value which satisfies the application as CL and Ferrite Beads. This system connection diagram doesn’t guarantee operating as the application. The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account external parts or dispersion of IC including not only static characteristics but also transient characteristics. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 13/16 2011.05 - Rev.B BD82000FVJ, BD82001FVJ ●Power dissipation character (TSSOP-B8J) Technical Note 600 500 POWER DISSIPATION: Pd[mW] 400 300 200 100 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE: Ta [℃] Fig.44 Power dissipation curve (Pd-Ta Curve) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 14/16 2011.05 - Rev.B BD82000FVJ, BD82001FVJ ●Notes for use Technical Note (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) Thermal shutdown circuit (TSD) When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit is aimed at isolating the LSI from thermal runaway as much as possible. Do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (13) Thermal design Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 15/16 2011.05 - Rev.B BD82000FVJ, BD82001FVJ ●Ordering part number Technical Note B D 8 Part No. 82000 82001 2 0 0 0 F V J - E 2 Part No. Package FVJ : TSSOP-B8J Packaging and forming specification E2: Embossed tape and reel TSSOP-B8J 3.0 ± 0.1 (MAX 3.35 include BURR) 8 7 6 5 4±4 Tape Quantity Embossed carrier tape 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold 4.9 ± 0.2 3.0 ± 0.1 Direction of feed 0.45 ± 0.15 0.95 ± 0.2 ( reel on the left hand and you pull out the tape on the right hand ) 1 2 3 1PIN MARK S 4 0.85±0.05 1.1MAX 0.525 +0.05 0.145 −0.03 0.1±0.05 0.08 S +0.05 0.32 −0.04 0.65 0.08 M 1pin (Unit : mm) Direction of feed Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 16/16 2011.05 - Rev.B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. 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